CN210467829U - Novel heat dissipation formula emitting diode illumination structure - Google Patents
Novel heat dissipation formula emitting diode illumination structure Download PDFInfo
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- CN210467829U CN210467829U CN201921808136.XU CN201921808136U CN210467829U CN 210467829 U CN210467829 U CN 210467829U CN 201921808136 U CN201921808136 U CN 201921808136U CN 210467829 U CN210467829 U CN 210467829U
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Abstract
The utility model provides a novel heat dissipation formula emitting diode lighting structure, belongs to emitting diode technical field, this novel heat dissipation formula emitting diode lighting structure, including LED component and radiator unit, radiator unit includes heat conduction insulating layer and the circuit layer that sets gradually from bottom to top on heat pipe unit and the heat pipe unit, circuit layer and LED component electrical connection, still are provided with radiating fin on the heat pipe unit, the beneficial effects of the utility model are that, this emitting diode lighting structure overall structure is simple stable, and preparation simple process, the cost of manufacture is low, can transmit the heat pipe unit with the heat that the LED component produced fast and dispel the heat, has improved the radiating efficiency, has improved the luminous efficacy and the life of LED component.
Description
Technical Field
The utility model relates to a light emitting diode technical field especially relates to a novel heat dissipation formula light emitting diode lighting structure.
Background
The light emitting diode LED is a high-efficiency light emitting element which converts electric energy into light energy and is also a micro solid-state light source, a main body part of the LED element is of a semiconductor p-n junction structure, and after voltage is applied to two ends of the junction, photon energy is emitted through combination of electrons and holes, and light rays in a specific wavelength range are emitted. Because the LED element has the characteristics of good color reproducibility and single wavelength, the LED has become the mainstream technology for improving the spectrum of the backlight source of the Liquid Crystal Display (LCD), and the LED element is also widely applied to outdoor large-sized displays and will gradually replace the current lighting equipment.
When an LCD adopts an LED as a backlight source, two common relative position relationships between the LED and an illumination surface are a direct type and an edge type, and a large LCD usually adopts a lighting manner in which the direct type is used as a backlight source. However, the conventional LED has the same heat dissipation path, i.e., heat is transferred to the heat pipe through the PCB, and the coating layer or the insulating layer of the PCB is made of a material with low thermal conductivity, such as solder mask or resin, which results in large thermal resistance of the PCB, so that heat generated by the LED element cannot be quickly and effectively transferred to the heat pipe. Even if the PCB is changed to a metal core PCB with low thermal resistance, the heat generated by the LED still needs to pass through each layer of the PCB material, through the adhesive or solder at the interface, and to reach the heat pipe. Therefore, an LED lighting structure with a shortened thermal conduction path and a reduced total thermal resistance is urgently needed in the field of LED applications, and heat generated by an LED element can be directly and rapidly transferred to a heat pipe, so that the reliability and the light emitting efficiency of the LED element are improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a novel heat dissipation formula emitting diode lighting structure has mainly solved current emitting diode lighting structure radiating effect poor to influence the problem of LED component luminous efficacy and reliability, aim at, through designing a novel heat dissipation formula emitting diode lighting structure, can directly transmit the heat that the LED component produced for the heat pipe unit fast and dispel the heat, can improve the radiating efficiency and the reliability of LED component, can improve the life of LED component.
In order to achieve the above object, the present invention provides a technical solution for solving the technical problem: novel heat dissipation formula emitting diode lighting structure, including LED component and radiator unit, radiator unit includes heat conduction insulation layer and the circuit layer that sets gradually from bottom to top on heat pipe unit and the heat pipe unit, the circuit layer with LED component electrical connection, still be provided with radiating fin on the heat pipe unit.
Further, the heat pipe unit is arranged to be a sealed metal pipe fitting structure and comprises a pipe shell, a pipe core and a steam cavity, wherein the pipe core and the steam cavity are arranged inside the pipe shell, the pipe core is arranged on the inner wall of the pipe shell and is arranged to be a capillary pipe, working liquid for realizing phase change heat transfer between liquid and steam is arranged in the pipe core, and the steam cavity is arranged in the middle of the pipe shell.
Furthermore, the heat conducting insulating layer is made of ceramic materials or metal oxides, the heat conducting insulating layer covers the surface of the heat pipe unit, the circuit layer is formed by copper foils formed through evaporation by a hot pressing method and is formed in an etching processing mode, and the circuit layer is arranged on two sides of the heat conducting insulating layer.
Further, the heat pipe unit is arranged into a flat pipe structure, and one end of the flat pipe structure is provided with the radiating fin; the flat pipe fitting structure is provided with a plurality of flat pipe fitting structures, and each flat pipe fitting structure is provided with 1 line or more of LED elements along the length direction of the flat pipe fitting structure; a reflecting plate for guiding light emitted by the LED elements upwards is arranged between two adjacent flat pipe structures.
Further, the heat pipe unit is a flat pipe structure, a plurality of strip-shaped heat conduction insulation layers and circuit layers are arranged on the flat pipe structure from bottom to top in a covering mode, a plurality of LED elements are connected onto each circuit layer, the lower end of the flat pipe structure is provided with the radiating fins in a covering mode, and a reflecting plate which guides light emitted by the LED elements upwards is arranged between every two adjacent circuit layers 23.
Further, the LED element comprises an LED chip comprising two electrodes, the two electrodes of the LED chip are electrically connected with the circuit layers on the two sides of the heat conducting insulation layer respectively, a transparent protective cover is arranged outside the LED chip, and the transparent protective cover is arranged on the surface of the heat dissipation assembly.
Furthermore, the electrodes of the LED chips are electrically connected with the circuit layer through metal wires respectively, and the lower ends of the LED chips are connected with the heat conduction insulating layer in a contact mode.
Furthermore, a metal bump is arranged on an electrode of the LED chip, and the metal bump is electrically connected with the circuit layer.
The utility model has the advantages that:
the utility model discloses a through set up heat conduction insulating layer and circuit layer in proper order from bottom to top on the surface of heat pipe unit, make circuit layer and LED component electrical connection form the control circuit of luminous control unit, the circuit layer directly electrically contacts with LED component, make the heat that the LED component produced loop through the circuit layer, heat conduction insulating layer transmits to the heated area of heat pipe unit fast, after absorbing heat through the working fluid in the heat pipe unit, rapid phase transition evaporation takes place, heat shifts to the condensation area of heat pipe unit through the rapid movement of steam, and dispel the heat through the radiating fin, compare with current heat radiation structure, circuit layer in the utility model does not set up heat preservation or coating outward, heat conduction insulating layer wherein has played better heat conduction effect when realizing electrical isolation, has improved radiating efficiency, has improved the reliability and the luminous efficiency of LED component, the service life of the LED element is prolonged.
In addition, the reflecting plate is arranged among the heat pipe units or on the heat pipe units, so that light emitted by the LED element is more concentrated, and the brightness of the LED element is increased; the heat pipe unit in a flat plate shape is used, so that the LED lighting structure is of an integral structure, the manufacturing procedures are reduced, and the stability of the structure is improved; the electrodes of the LED chip are directly and electrically connected with the circuit layer on the heat pipe unit, and the transparent protective cover is arranged outside the LED chip, so that the packaging cost is saved, the thermal resistance caused by packaging materials is eliminated, and the heat dissipation efficiency is further improved.
To sum up, the utility model provides a light emitting diode lighting structure overall structure is simple stable, and preparation simple process, the cost of manufacture is low, can dispel the heat with the heat rapid transit who produces the LED component to the heat pipe unit, has improved the radiating efficiency, has improved the luminous efficacy and the life of LED component.
Drawings
The contents of the various figures of the specification and the labels in the figures are briefly described as follows:
FIG. 1 is a top view of one embodiment of an LED lighting structure of the present invention;
FIG. 2 is a sectional view taken along line A-A of FIG. 1;
FIG. 3 is a cross-sectional view of a heat pipe unit;
FIG. 4 is a schematic structural diagram of one structure of an LED element;
FIG. 5 is a schematic structural view of another structure of an LED element;
FIG. 6 is a top view of another embodiment of an LED lighting structure of the present invention;
FIG. 7 is a front view of FIG. 6;
the labels in the above figures are: the LED lamp comprises an LED element 1, an LED chip 11, a transparent protective cover 12, a metal wire 13, a metal bump 14, a heat dissipation assembly 2, a heat pipe unit 21, a heat pipe shell 211, a pipe core 212, a steam cavity 213, a heat conduction and insulation layer 22, a circuit layer 23, a heat dissipation fin 24 and a reflecting plate 3.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments, and the following embodiments are used for illustrating the present invention, but do not limit the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses specific embodiment does: as shown in fig. 1, fig. 2, fig. 6 and fig. 7, a novel heat dissipation type light emitting diode lighting structure includes an LED element 1 and a heat dissipation assembly 2, the heat dissipation assembly 2 includes a heat pipe unit 21, and a heat conduction insulating layer 22 and a circuit layer 23 sequentially disposed on the heat pipe unit 21 from bottom to top, the circuit layer 23 is electrically connected to the LED element 1, a heat dissipation fin 24 is further disposed on the heat pipe unit 21, the heat pipe unit 21 is an existing heat pipe structure, as shown in fig. 3, the structure of the heat pipe unit is a sealed metal pipe structure, and includes a pipe shell 211, and a pipe core 212 and a steam cavity 213 which are arranged inside the pipe shell 211, the pipe core 212 is arranged on the inner wall of the pipe shell 211, the pipe core 212 is arranged as a capillary, a working liquid (water) for realizing phase change heat transfer between liquid and steam is arranged in the pipe core 212, the working liquid (water) is injected before sealing after the inside of the pipe shell 211 is vacuumized, and the steam cavity 213 is arranged in the middle of the pipe shell 211. The heat dissipation principle of the heat pipe unit 21 is that the working liquid in the pipe core 212 is heated and vaporized, the vaporized saturated vapor flows to the cold end, the saturated vapor is condensed at the cold end to release heat, and the condensed liquid flows back to the hot end under the capillary force of the pipe core 212 to continue heat absorption and vaporization, thereby completing the circulation heat dissipation. The heat dissipation principle of the light emitting diode lighting structure is as follows: the heat that LED component 1 work produced loops through circuit layer 23, heat conduction insulating layer 22 transmits heat pipe unit 21 fast to receive the heated area, after working fluid through among the heat pipe unit 21 absorbed the heat, takes place the phase transition evaporation rapidly, and the heat shifts to heat pipe unit 21's condensation zone through the rapid migration of steam, and dispel the heat through radiating fin 24, compares with current heat radiation structure, the utility model provides a circuit layer 23 does not set up heat preservation or coating outward, and heat conduction insulating layer 22 wherein has played better heat conduction effect when realizing electrical isolation, has improved radiating efficiency, has improved LED component's reliability and luminous efficiency, has improved LED component's life.
Specifically, as shown in fig. 2, 4 and 5, the heat conducting insulating layer 22 is made of a ceramic material or a metal oxide, the heat conducting insulating layer 22 may be covered on the surface of the heat pipe unit 21 by eutectic connection, welding, bonding or other methods (the above methods all belong to the existing methods of connecting metal and ceramic materials, and the specific implementation form is not described again), the circuit layer 23 is formed by using a copper foil formed by evaporation by a hot pressing method, and is formed by etching, and the circuit layers 23 are disposed on two sides of the heat conducting insulating layer 22, so as to be electrically connected to two electrodes of the LED chip 11 of the LED element.
Specifically, as shown in fig. 4 and 5, the LED element 1 includes an LED chip 11 having two electrodes, the two electrodes of the LED chip 11 are electrically connected to the circuit layers 23 on the two sides of the heat-conducting insulating layer 22, respectively, so as to realize electrical control of the LED chip 11, the circuit layers 23 replace the PCB in the original structure, thereby improving the heat dissipation effect, and of course, the LED element 1 includes the following structure: as shown in fig. 2, the first structure is a package type structure, which belongs to the structure of the conventional LED element 1, and two electrodes of the LED chip 11 are electrically connected to the circuit layer 23 through leads. As shown in fig. 4 and 5, the second structure is a structure without encapsulation, and its specific structure includes the following two structural modes: one structure is that, as shown in fig. 4, the electrodes of the LED chip 11 are electrically connected to the circuit layer 23 through the metal wires 13, respectively, and the lower end of the LED chip 11 is connected to the heat conducting insulating layer 22 in a contact manner, and may be connected by soldering, eutectic connection, or the like, so that the heat generated by the LED chip 11 can be directly transmitted to the heat pipe unit 21 through the heat conducting insulating layer 22, thereby improving the heat dissipation effect; in another structure, as shown in fig. 5, metal bumps 14 are disposed on the electrodes of the LED chip 11, and the metal bumps 14 are electrically connected to the circuit layer 23 by soldering, so that heat generated by the LED chip 11 is transmitted to the circuit layer 23, the heat conducting insulation layer 22, and the heat pipe unit 21 through the metal bumps 14. The structure without encapsulation not only saves the encapsulation cost, but also eliminates the thermal resistance brought by the encapsulation material and improves the heat dissipation effect. Further optimally, a transparent protective cover 12 can be arranged outside the LED chip 11, and the transparent protective cover 12 is arranged on the surface of the heat dissipation assembly 2 in a clamping or bonding manner to protect the heat dissipation assembly 2.
Specifically, as shown in fig. 1, 6 and 7, the heat pipe unit 21 may be configured in different shapes, including two structures, one structure is that, as shown in fig. 1, the heat pipe unit 21 is configured as a flat pipe structure, so that the heat conducting insulating layer 22 and the circuit layer 23 are conveniently disposed thereon, and a heat dissipation fin 24 is disposed at one end of the flat pipe structure to play a role in assisting heat dissipation, or a fan may be additionally disposed around the heat dissipation fin 24 to generate a forced convection effect, so as to further improve heat dissipation efficiency; the flat pipe fitting structure can be provided with a plurality of flat pipe fitting structures according to the requirement, each flat pipe fitting structure is provided with 1 line or a plurality of lines of LED elements 1 (the lines of LED elements 1 are not shown in figure 1) along the length direction of the flat pipe fitting structure, the LED elements 1 are arranged in an array mode, the LED elements 1 capable of emitting different colors (such as red light, blue light and green light) are arranged in a dispersed and staggered mode, and the LED elements 1 are spaced at a certain distance to achieve the colorful light-emitting effect; set up the ascending reflecting plate 3 of light guide that sends LED component 1 between two adjacent flat pipe structures, the cross-section of this reflecting plate 3 sets up to isosceles triangle, makes the light that LED component 1 sent concentrate upwards, has improved the utilization ratio of light, the luminance of multiplicable emitting diode illumination structure. Wherein the heat pipe unit 21 and the reflection plate 3 can be fixed on one substrate to form a lighting structural unit of a desired size.
Another structure is that, as shown in fig. 6 and 7, the heat pipe unit 21 is a flat pipe structure, which is an integral structure, and the size of the heat pipe unit can be set according to the need, so that the manufacturing processes are reduced, and the stability of the structure is improved, the flat pipe structure is covered with a plurality of strip-shaped heat-conducting insulating layers 22 and circuit layers 23 from bottom to top (the circuit layers 23 are not shown in the figure), each circuit layer 23 is connected with a plurality of LED elements 1, the lower end of the flat pipe structure is covered with a heat-dissipating fin 24, so that the overall heat-dissipating efficiency is improved, a reflecting plate 3 for guiding light emitted by the LED elements 1 upwards is arranged between the adjacent circuit layers 23, the reflecting plate 3 can be fixed on the heat-conducting insulating layer 22 of the heat pipe unit 21 by means of adhesion, the cross section of the reflecting plate 3 is set to be an isosceles triangle, so that the light emitted by the, the brightness of the LED lighting structure can be increased.
The manufacturing method of the novel heat dissipation type light-emitting diode lighting structure sequentially comprises the following steps of:
1) manufacturing the heat dissipation assembly 2: covering the heat pipe unit 21 with a heat conducting insulating layer 22 by eutectic connection, welding, bonding, or the like, depositing copper foil on the heat conducting insulating layer 22 by hot pressing on both sides of the heat conducting insulating layer 22, and forming a circuit layer 23 by etching;
2) mounting of LED element 1: two electrodes of the LED chip 11 are electrically connected to the circuit layers 23 on both sides of the heat conductive insulating layer 22, respectively, and a plurality of LED elements 1 are mounted along the length direction of the heat pipe unit 21;
3) mounting of the reflection plate 3: installing a reflection plate 3 between adjacent heat pipe units 21 or on the heat pipe units 21;
4) mounting of the heat dissipation fins 24: a heat radiation fin 24 is welded to one end or the bottom of the heat pipe unit 21.
To sum up, the utility model provides a light emitting diode lighting structure overall structure is simple stable, and preparation simple process, the cost of manufacture is low, can dispel the heat with the heat rapid transit who produces the LED component to the heat pipe unit, has improved the radiating efficiency, has improved the luminous efficacy and the life of LED component.
The foregoing is merely illustrative of some of the principles of the present invention and the description is not intended to limit the invention to the specific constructions and applications shown, so that all modifications and equivalents that may be utilized are within the scope of the invention.
Claims (8)
1. The utility model provides a novel heat dissipation formula emitting diode lighting structure, its characterized in that, includes LED component (1) and radiator unit (2), radiator unit (2) include heat pipe unit (21) and heat conduction insulation layer (22) and circuit layer (23) that set gradually from bottom to top on heat pipe unit (21), circuit layer (23) with LED component (1) electrical connection, still be provided with radiating fin (24) on heat pipe unit (21).
2. The novel heat dissipating light emitting diode illumination structure of claim 1, wherein: the heat pipe unit (21) is arranged to be a sealed metal pipe fitting structure and comprises a pipe shell (211) and a pipe core (212) and a steam cavity (213) which are arranged inside the pipe shell (211), wherein the pipe core (212) is arranged on the inner wall of the pipe shell (211), the pipe core (212) is arranged to be a capillary pipe, working liquid for realizing phase change heat transfer between liquid and steam is arranged in the pipe core (212), and the steam cavity (213) is arranged in the middle of the pipe shell (211).
3. The novel heat dissipating light emitting diode illumination structure of claim 1, wherein: the heat conduction insulating layer (22) is arranged to be ceramic materials or metal oxides, the heat conduction insulating layer (22) covers the surface of the heat pipe unit (21), the circuit layer (23) is formed by copper foils formed through vapor deposition by a hot pressing method and is formed through etching processing, and the circuit layer (23) is arranged on two sides of the heat conduction insulating layer (22).
4. The novel heat dissipating light emitting diode illumination structure of claim 3, wherein: the heat pipe unit (21) is arranged into a flat pipe structure, and one end of the flat pipe structure is provided with the radiating fin (24); the flat pipe fitting structure is provided with a plurality of flat pipe fitting structures, and each flat pipe fitting structure is provided with 1 or more rows of LED elements (1) along the length direction of the flat pipe fitting structure; a reflecting plate (3) which guides light emitted by the LED elements (1) upwards is arranged between two adjacent flat pipe structures.
5. The novel heat dissipating light emitting diode illumination structure of claim 3, wherein: the heat pipe unit (21) is arranged to be a flat pipe fitting structure, a plurality of strip-shaped heat conduction insulating layers (22) and circuit layers (23) are arranged on the flat pipe fitting structure from bottom to top in a covering mode, a plurality of LED elements (1) are connected to each circuit layer (23), the lower end of the flat pipe fitting structure is arranged in a covering mode and provided with heat dissipation fins (24), and a light guide upward reflection plate (3) which is used for emitting the LED elements (1) is arranged between the adjacent circuit layers (23).
6. The novel heat dissipation type LED lighting structure as recited in claim 4 or 5, wherein: LED component (1) including LED chip (11) that contains two electrodes, two electrodes of LED chip (11) respectively with circuit layer (23) electrical connection of thermal insulation layer (22) both sides, the outside of LED chip (11) is provided with transparent safety cover (12), transparent safety cover (12) set up the surface of radiator unit (2).
7. The novel heat dissipating light emitting diode illumination structure of claim 6, wherein: the electrodes of the LED chips (11) are electrically connected with the circuit layer (23) through metal wires (13), and the lower ends of the LED chips (11) are in contact connection with the heat-conducting insulating layer (22).
8. The novel heat dissipating light emitting diode illumination structure of claim 6, wherein: the LED chip is characterized in that a metal bump (14) is arranged on an electrode of the LED chip (11), and the metal bump (14) is electrically connected with the circuit layer (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201921808136.XU CN210467829U (en) | 2019-10-25 | 2019-10-25 | Novel heat dissipation formula emitting diode illumination structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921808136.XU CN210467829U (en) | 2019-10-25 | 2019-10-25 | Novel heat dissipation formula emitting diode illumination structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110707079A (en) * | 2019-10-25 | 2020-01-17 | 国网安徽省电力有限公司南陵县供电公司 | Novel heat dissipation type light-emitting diode lighting structure and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110707079A (en) * | 2019-10-25 | 2020-01-17 | 国网安徽省电力有限公司南陵县供电公司 | Novel heat dissipation type light-emitting diode lighting structure and manufacturing method thereof |
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