CN101799124A - Novel LED lamp tube module group - Google Patents
Novel LED lamp tube module group Download PDFInfo
- Publication number
- CN101799124A CN101799124A CN201010104682A CN201010104682A CN101799124A CN 101799124 A CN101799124 A CN 101799124A CN 201010104682 A CN201010104682 A CN 201010104682A CN 201010104682 A CN201010104682 A CN 201010104682A CN 101799124 A CN101799124 A CN 101799124A
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- China
- Prior art keywords
- iron plate
- layer
- wiring board
- led lamp
- lamp tube
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Abstract
The invention provides a novel LED lamp tube module group, which comprises a piece of iron board and a piece of glass fiber circuit board, wherein the iron board and the glass fiber circuit board are overlapped, the iron board is in a rectangular structure, at least two grooves used for placing chips and fluorescent powder are punched in the middle section of the iron board, a printing circuit layer is arranged on the glass fiber circuit board, the peripheral size of the printing circuit layer is the same as that of the iron board, and in addition, the positions of the printing circuit layer corresponding to the grooves of the iron board are provided with pierced work parts with the same size as the grooves. The invention solves the problems of nonuniform light illumination, difficult heat dissipation and high cost of the existing LED module group.
Description
[technical field]
The present invention relates to a kind of semiconductor lighting assembly, particularly a kind of Novel LED lamp tube module.
[background technology]
Traditional LED tube module structure generally all be utilize tens in addition hundreds of LED components and parts to form dot matrix luminous, if indivedual LED light color temperature or luminous flux are inconsistent, can cause brightness even inadequately.And in process, need to use PCB panel or support, need welding, cause processing cost very high, be difficult to popularize; And circuit is very complicated, is not easy to integrated.
[summary of the invention]
The technical problem to be solved in the present invention is to provide a kind of Novel LED lamp tube module, to solve existing LED module non-uniform light, to be difficult for heat radiation, the high problem of cost.
The technical problem to be solved in the present invention is achieved in that a kind of Novel LED lamp tube module, it is characterized in that: a slice iron plate and a slice glass wiring board that comprise mutual superposition, and this glass wiring board is positioned on the iron plate, described iron plate is a rectangle structure, and its stage casing punching press has at least two in order to place the groove of chip and fluorescent material; Described glass wiring board is provided with a printed circuit layer, and this printed circuit layer Outside Dimensions is consistent with the Outside Dimensions of described iron plate, and this printed circuit layer is provided with and this groove hollow out of the same size corresponding to the position of described iron plate groove.
Further, described iron plate upper groove is by punching press or casting forming.Described iron plate is divided into the two-layer structure of silver coating and iron layer from top to bottom, and described iron layer plays conductive force; Described silver coating is plated on the surface of described groove, plays the effect of prefocus cup.
Further, described glass wiring board comprises from top to bottom: a solder mask, a silver coating, a copper foil layer and a carrier layer; Described solder mask, made for insulating materials, be coated on the surface of described glass wiring board; Described silver coating, dot matrix are symmetrically distributed in the dual-side of described hollow out, connect described chip and described copper foil layer; Described copper foil layer becomes circuit through excessive erosion, forms described printed circuit layer, connects silver coating and power supply; Described carrier layer is the FR-4 glass mat.Can comprise again that also one is located at the character layer on described solder mask surface.
Further, described iron plate and glass wiring board are by the bonding stack of glue.
The invention has the advantages that: adopt directly fixing design, effectively reduced the loss of material, can before encapsulation, carry out beam split and detect, in time carry out fluorescent material automatic detection and repairing, guarantee fluorescent material evenly, make solid colour; Need not use PCB panel or support, also need not welding, give the encapsulation of LED module integrated bringing great convenience, not only easy to use, and also circuit is simple, and in integrated, cost reduces greatly easily, is convenient to popularize.
[description of drawings]
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the structural representation of iron plate of the present invention.
Fig. 2 is the structural representation of glass wiring board of the present invention.
Fig. 3 is the structural representation of LED tube module of the present invention.
[specific embodiment]
See also Fig. 1 to shown in Figure 3, a kind of Novel LED lamp tube module 1 that the present invention will solve comprises mutual superposition and pass through bonding a slice iron plate 11 and a slice glass wiring board 12 of glue, and this glass wiring board 12 is positioned on the iron plate 11.
As shown in Figure 1, described iron plate 11 is a rectangle structure, and its stage casing is provided with at least two in order to place the groove 112 of chip and fluorescent material; And described groove 112 forms by punching press or casting; Described iron plate 11 is divided into two-layer from top to bottom: silver coating and iron layer, and described iron layer plays conductive force; Described silver coating is plated on the surface of described groove, plays the effect of prefocus cup.
As shown in Figure 2, described glass wiring board 12 comprises a solder mask 121, a silver coating 122, a copper foil layer 123 and a carrier layer 124 from top to bottom; Described solder mask 121 is that insulating materials is made, is coated on the surface of described glass wiring board 12; Described copper foil layer 123, become circuit through excessive erosion, form a printed circuit layer, be used to connect silver coating and power supply, play electric action, and this printed circuit layer Outside Dimensions is consistent with the Outside Dimensions of described iron plate, and this printed circuit layer is provided with and this groove hollow out 125 of the same size corresponding to the position of described iron plate groove; Described carrier layer 124 is the FR-4 glass mat; Described silver coating 122, dot matrix is symmetrically distributed in the dual-side of described hollow out 125, and connects described chip and described copper foil layer 123 by both positive and negative polarity lead 126, plays electric action.Described glass wiring board 12 can comprise that also one is located at the character layer (not shown) on described solder mask 121 surfaces again, is used to mark Business Name and model.
Operating process of the present invention or operation principle are as follows:
1, needs by watt level, get a rectangular iron plate 11, at the stage casing punching press or the needed groove 112 of casting, in order to place led chip;
2, get one and iron plate 11 wiring boards 12 of a size, carry out hollow out, and the size that makes this hollow out 125 and iron plate groove 112 is big or small consistent in the position corresponding with iron plate groove 112;
3, glass wiring board 12 is placed on the iron plate 11, use special glue, bonding iron plate 11 and wiring board 12;
4, place special AB glue and chip in iron plate groove 112 bottoms, use gold thread then, both positive and negative polarity is connected to circuit;
5, add fluorescent material then, both positive and negative polarity energising in two ends gets final product.
In sum, the invention has the advantages that: adopt directly fixing design, effectively reduced the loss of material, can before encapsulation, carry out light splitting and detect, in time carry out fluorescent material automatic detection and repairing, guarantee fluorescent material evenly, make solid colour; Need not use PCB panel or support, also need not welding, bring great convenience to the LED module packaging is integrated, not only easy to use, and also circuit is simple, and in integrated, cost reduces greatly easily, is convenient to popularize.
Claims (6)
1. Novel LED lamp tube module, it is characterized in that: a slice iron plate and a slice glass wiring board that comprise mutual superposition, and this glass wiring board is positioned on the iron plate, and described iron plate is a rectangle structure, and its stage casing punching press has at least two in order to place the groove of chip and fluorescent material; Described glass wiring board is provided with a printed circuit layer, and this printed circuit layer Outside Dimensions is consistent with the Outside Dimensions of described iron plate, and this printed circuit layer is provided with and this groove hollow out of the same size corresponding to the position of described iron plate groove.
2. a kind of Novel LED lamp tube module according to claim 1 is characterized in that: described iron plate upper groove is by punching press or casting forming.
3. a kind of Novel LED lamp tube module according to claim 2, it is characterized in that: described iron plate is divided into the two-layer structure of silver coating and iron layer from top to bottom, and described silver coating is plated on the surface of described groove.
4. a kind of Novel LED lamp tube module according to claim 1 is characterized in that: described glass wiring board comprises from top to bottom: a solder mask, a silver coating, a copper foil layer and a carrier layer;
Described solder mask, made for insulating materials, be coated on the surface of described glass wiring board;
Described silver coating, dot matrix are symmetrically distributed in the dual-side of described hollow out, and connect described chip and described copper foil layer;
Described copper foil layer becomes circuit through excessive erosion, forms described printed circuit layer, connects silver coating and power supply;
Described carrier layer is the FR-4 glass mat.
5. a kind of Novel LED lamp tube module according to claim 4 is characterized in that: described glass wiring board comprises that also one is located at the character layer on described solder mask surface.
6. a kind of Novel LED lamp tube module according to claim 1 is characterized in that: described iron plate and glass wiring board are by the bonding stack of glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010104682A CN101799124A (en) | 2010-02-02 | 2010-02-02 | Novel LED lamp tube module group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010104682A CN101799124A (en) | 2010-02-02 | 2010-02-02 | Novel LED lamp tube module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101799124A true CN101799124A (en) | 2010-08-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010104682A Pending CN101799124A (en) | 2010-02-02 | 2010-02-02 | Novel LED lamp tube module group |
Country Status (1)
| Country | Link |
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| CN (1) | CN101799124A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103807628A (en) * | 2012-11-13 | 2014-05-21 | 欧司朗有限公司 | LED (light-emitting diode) illumination device |
| ES2538738A1 (en) * | 2013-12-23 | 2015-06-23 | Francisco José SÁNCHEZ MARTÍNEZ | Laminar lighting device and manufacturing process (Machine-translation by Google Translate, not legally binding) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101137255A (en) * | 2007-10-19 | 2008-03-05 | 石家庄开发区神通机电开发有限公司 | White light LED area lighting source module package method |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201093220Y (en) * | 2007-08-08 | 2008-07-30 | 王元成 | LED light source |
| CN201141564Y (en) * | 2007-12-05 | 2008-10-29 | 王元成 | LED adopting crystal encapsulation |
| CN201330948Y (en) * | 2008-10-17 | 2009-10-21 | 陈凯东 | Novel LED fluorescent lamp |
| CN201638813U (en) * | 2010-02-02 | 2010-11-17 | 福建中科万邦光电股份有限公司 | Novel LED lamp tube module |
-
2010
- 2010-02-02 CN CN201010104682A patent/CN101799124A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201093220Y (en) * | 2007-08-08 | 2008-07-30 | 王元成 | LED light source |
| CN101137255A (en) * | 2007-10-19 | 2008-03-05 | 石家庄开发区神通机电开发有限公司 | White light LED area lighting source module package method |
| CN201141564Y (en) * | 2007-12-05 | 2008-10-29 | 王元成 | LED adopting crystal encapsulation |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201330948Y (en) * | 2008-10-17 | 2009-10-21 | 陈凯东 | Novel LED fluorescent lamp |
| CN201638813U (en) * | 2010-02-02 | 2010-11-17 | 福建中科万邦光电股份有限公司 | Novel LED lamp tube module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103807628A (en) * | 2012-11-13 | 2014-05-21 | 欧司朗有限公司 | LED (light-emitting diode) illumination device |
| CN103807628B (en) * | 2012-11-13 | 2017-12-22 | 欧司朗有限公司 | LED light device |
| ES2538738A1 (en) * | 2013-12-23 | 2015-06-23 | Francisco José SÁNCHEZ MARTÍNEZ | Laminar lighting device and manufacturing process (Machine-translation by Google Translate, not legally binding) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD. Effective date: 20110322 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20110322 Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Applicant after: Fujian Wanban optoelectronic Technology Co., Ltd. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Applicant before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd. |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100811 |