200945619 九、發明說明： ‘ 【發明所屬之技術領域】 • 本發明涉及一種光源裝置，尤其係一種具有發光二極 體晶片等固態發光元件之光源裝置。 【先前技術】 現如今，發光二極體（Light Emitting Diode, LED)已經 被廣泛應用到很多領域，一種新型發光二極體可參見Daniel A. Steigerwald 等人於文獻 IEEE Journal on Selected Topics 〇 in Quantum Electronics，Vol. 8, No.2, March/April 2002 中之 Illumination With Solid State Lighting Technology —文。發 光二極體一般可發出特定波長之光，例如可見光，惟，發 光二極體所接收能量之大部分被轉換為熱量，其餘部分之 能量才被真正轉換為光能。因此，發光二極體發光所產生 之熱量必須被疏散掉以保證發光二極體之正常運作。 如圖1所示，一種光源裝置10,其包括一殼體11，一 光源模組12及一燈罩13。該光源模組12設置於該殼體11 〇 中，且該燈罩13設置於該光源模組12之上方以保護該光 源模組12。該光源模組12包括：一印刷電路板（Printed Circuit Board，PCB) 121、設置於該印刷電路板121上之金 屬線路層122與複數個發光元件123(如，發光二極體晶 片），以及覆蓋該發光元件123之封裝體124。該複數個發 光元件123與該金屬線路層122電性連接。然，該複數個 發光元件123所產生之熱量不能及時有效地從該殼體11中 排除，進而降低了該複數個發光元件123之發光效率。由 6 200945619 此可見’有必要提供一種散熱效率較高之光源裝置。 【發明内容】 以下將以實施例說明一種散熱效率較高之光源裳置。 一種具有發光二極體晶片之光源襞置，其包括：一絕 緣體，該絕緣體具有一容置槽；一導熱體，其設置於該絕 緣體中且與該容置槽相對，該導熱體具有一暴露於該容置 槽底部之承載部；一平板狀第一電極及一平板狀第二電 ❾極，該第一電極與第二電極分別嵌設於該絕緣體中並均延 伸至該容置槽中，並且與該導熱體相分離；一發光二極體 a曰片’其直接設置於該導熱體之承載部上；以及金屬線， 該第一電極與第二電極分別藉由該金屬線與該發光二極體 晶片形成電連接。 與先如技術相比，該光源裝置中之發光二極體晶片直 接设置於導熱體之承載部上並且與導熱體形成良好熱連 接，故發光二極體晶片發光時產生之熱量可直接傳導至導 ❹熱體，再由導熱體將吸收到之熱量傳導至外部空氣，從而 降低了發光二極體晶片之溫度，提高了光源裝置之散熱效 率，以及發光二極體晶片之發光效率及使用壽命。另，該 第一電極與第二電極分別嵌設於該絕緣體中並均延伸至該 容置槽中，使得與該光源裝置電性連接之外部電路位於該 光源裝置之上方；發光二極體晶片與其下方之導熱體熱性 連接，使彳于3亥光源裝置之導熱方向向下，從而有效地避開 了外部電路，進而減小了該光源裝置之熱阻，提高了其散 熱效能。 7 200945619 【實施方式】 下面結合附圖對本發明作進一步地詳細說明。 * 參見圖2與圖3，本發明第一實施例提供之一種光源裝 置20，其包括絕緣體21，導熱體22，第一電極23，第二 電極24，發光二極體晶片25及金屬線26。 絕緣體21包括一支撐部210及一與該支撐部210 —體 成型之反光部212。該反光部212位於該支撐部210之一 侧，本實施例中，反光部212位於支撐部210之上方。該 ®反光部212具有一容置槽2120,該容置槽2120之底部延伸 至該支撐部210，即該支撐部210與該容置槽2120相對之 部分暴露於該容置槽2120之底部。該容置槽2120具有一 圓錐形侧壁2102，該圓錐形侧壁2102上可設置反射層 2104。絕緣體21所用材料可為塑膠，例如聚對苯二醯對苯 二胺（Polyphthalamide，PPA)，液晶聚合物（Liquid crystal polymer, LCP)等。 q 導熱體22沿靠近該反光部212之方向嵌設於絕緣體21 之支撐部210中且與該容置槽2120相對。導熱體22具有 一暴露於該容置槽2120底部之承載部220及一與該承載部 220相對之底部221，該承載部220用以承載該發光二極體 晶片25。本實施例中，該承載部220之寬度d小於該底部 221之寬度D。導熱體22所用材料可為銅、鋁等具有較好 導熱性能之金屬，或矽膠、陶瓷等導熱物質。 第一電極23與第二電極24均為平板狀，即二者均不 具有彎折處，從而使其於受到較大外力作用時不會由其自 8 200945619 身應力變化較大導致斷裂等情況發生，提高了第一電極23 與第二電極24之可靠度。第一電極23之一端與第二電極 24之一端分別嵌設於該絕緣體21之支撐部210與反光部 212之結合處並均延伸至該容置槽2120中，且分別具有暴 露於該容置槽2120底部之部分。第一電極23之另一端與 第二電極24之另一端均延伸出該容置槽2120,用以與外部 電路（圖未示）相連。第一電極23及第二電極24均與導熱體 22電絕緣。另，第一電極23與第二電極24分別設置於該 發光二極體晶片25之左右兩側，在此，該發光二極體晶片 25藉由兩條金屬線26分別與第一電極23與第二電極24 之暴露於該容置槽2120底部之部分形成電連接。 發光二極體晶片25設置於導熱體22之承載部220上， 在此，發光二極體晶片25可藉由黏合方式與導熱體22形 成熱連接，例如於發光二極體晶片25與導熱體22之承載 部220之間設置有銀膠、導電膠等黏膠。可理解的是，發 0光二極體晶片25也可藉由其他方式與導熱體22形成熱連 接，例如共晶方式（Eutectic Bonding)。發光二極體晶片25 發出之光線經由該容置槽2120之開口射出，入射至該容置 槽2120之側壁2102上之光線可經由該侧壁2102上之反射 層2104反射並從該容置槽2120之開口射出，從而提高了 發光二極體晶片25之出光效率。 光源裝置20還包括一封裝體27，封裝體27設置於絕 緣體21之容置槽2120中用以覆蓋發光二極體晶片25及金 屬線26，以避免發光二極體晶片25及金屬線26與水氣相 9 200945619 •接觸而被氧化。封裝體27之外表面270可為凸曲面或凹曲 面以改變發光二極體晶片25發出之光線經由外表 面270 出射之角度，從而可改變光源裝置2〇之照射範圍。封裝體 中還可°又置有光波長轉換物質，例如螢光粉。若封裝體 27中捧雜有黃色螢光粉，發光二極體晶片25發出之藍光經 由封裝體27出射時，有部分藍光被轉換為黃光，未被轉換 之藍光與轉換得到之黃光結合後將形成白光。封裝體27所 〇用材料為環氧樹脂、石夕樹脂或其他電絕緣之透明材料。 +本實施例中，導熱體22，第-電極23及第二電極24 藉由嵌入式射出成型技術（insert-molding)設置於絕緣體21 中’保證了第一電極23及第二電極24與導熱體22之間具 有良好之電絕緣性能，以及導熱體22與絕緣體之間具 有良好之熱傳導性能。 由於發光一極體晶片25直接設置於導熱體22之承載 部220上並且與導熱體22形成良好熱連接，故發光二極體 ❾晶片25發光時產生之熱量可直接傳導至導熱體22,再由導 熱體22將吸收到之熱量傳導至外部空氣，從而降低了發光 二極體晶片25之溫度，提高了光源裝置2〇之散熱效率， 以及發光二極體晶片25之發光效率與使用壽命。 另，第一電極23及第二電極24位於光源裝置2〇之上 半部分，並延伸出該容置槽2120以與外部電路（圖未示）相 連，使得外部電路位於該光源裝置2〇之上方；而發光二極 體晶片25與其下方之導熱體22熱性連接，使得該光源褒 置20之導熱方向向下，從而有效地避開了外部電路，進而 200945619 減小了該光源裝置20之熱阻，提高了其散熱效能。 t· 請參見圖4，導熱體22之底部221還可具有一通孔 '2210,藉由嵌入式射出成型技術使導熱體22設置於絕緣體 21之支撐部210中時可使該支撐部210中之部分結構佈滿 該通孔2210,提高了導熱體22與支撐部210之接觸面積及 接觸可靠度。導熱體22之底部221之寬度Η大於該第一電 極23與第二電極24之總寬度h，有效地提高了導熱體22 之散熱效率。 V 請參見圖5,導熱體22具有一長方體結構，其有部分 暴露於該容置槽2120底部，發光二極體晶片25設置於導 熱體22上並與該導熱體22熱連接，在此，發光二極體晶 片25位於該容置槽2120之底部。 請參見圖6與圖7,本發明第二實施例提供之一種光源 裝置30，其與上述第一實施例提供之光源裝置20基本相 同，不同之處在於：第一電極33與第二電極34均為長條 ❹形，二者分別設置於發光二極體晶片25之相對之兩側，第 一電極33之中部330與第二電極34之中部340均有暴露 於絕緣體31之容置槽310之部分，該第一電極33之兩端 及該第二電極34之兩端分別延伸出該容置槽310 ;導熱體 32之底部321為一 “T”型結構，提高了導熱體32與絕緣 體31之接觸面積與接觸可靠度。在此，該長條形第一電極 33之兩端及該長條形第二電極34之兩端分別延伸出該容 置槽310,有利於與外接電路板串聯或並聯，提高了光源裝 置30之實用性以及與該光源裝置30相連之電路板之佈線 11 200945619 設計靈活性。 請參見圖8,本發明第三實施例提供之一種光源裝置 40，其與上述第一實施例提供之光源裝置20基本相同，不 同之處在於： 導熱體42之承載部420上設置有一導熱貼片 (Submount)48，該導熱貼片48與該承載部420之間可藉由 黏合方式或共晶方式接合，該導熱貼片48所用材料可為 矽、氮化鋁、氧化鈹、二氧化矽、類鑽石（Diamond like Ο200945619 IX. Description of the invention: ‘Technical field to which the invention pertains. The present invention relates to a light source device, and more particularly to a light source device having a solid-state light-emitting element such as a light-emitting diode wafer. [Prior Art] Nowadays, Light Emitting Diode (LED) has been widely used in many fields. A new type of light-emitting diode can be found in Daniel A. Steigerwald et al. in the IEEE Journal on Selected Topics 〇in Quantum. Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. A light-emitting diode generally emits light of a specific wavelength, such as visible light. However, most of the energy received by the light-emitting diode is converted into heat, and the rest of the energy is actually converted into light energy. Therefore, the heat generated by the illuminating diode must be evacuated to ensure the normal operation of the illuminating diode. As shown in FIG. 1, a light source device 10 includes a housing 11, a light source module 12 and a lamp cover 13. The light source module 12 is disposed in the casing 11 , and the lamp cover 13 is disposed above the light source module 12 to protect the light source module 12 . The light source module 12 includes a printed circuit board (PCB) 121, a metal circuit layer 122 disposed on the printed circuit board 121, and a plurality of light emitting elements 123 (eg, light emitting diode chips), and The package 124 of the light-emitting element 123 is covered. The plurality of light emitting elements 123 are electrically connected to the metal wiring layer 122. However, the heat generated by the plurality of light-emitting elements 123 cannot be removed from the casing 11 in a timely and effective manner, thereby reducing the luminous efficiency of the plurality of light-emitting elements 123. From 6 200945619 It can be seen that it is necessary to provide a light source device with higher heat dissipation efficiency. SUMMARY OF THE INVENTION Hereinafter, a light source with high heat dissipation efficiency will be described by way of an embodiment. A light source device having a light-emitting diode chip, comprising: an insulator having a receiving groove; a heat conducting body disposed in the insulating body opposite to the receiving groove, the heat conducting body having an exposure The first electrode and the second electrode are respectively embedded in the insulator and extend into the accommodating groove; the first electrode and the second electrode are respectively embedded in the accommodating groove; Separating from the heat conductor; a light-emitting diode a' is disposed directly on the bearing portion of the heat conductor; and a metal wire, the first electrode and the second electrode are respectively separated by the metal wire The light emitting diode wafers form an electrical connection. Compared with the prior art, the light-emitting diode wafer in the light source device is directly disposed on the bearing portion of the heat conductor and forms a good thermal connection with the heat conductor, so the heat generated when the light-emitting diode wafer emits light can be directly transmitted to Conducting the heat body, and then transferring the absorbed heat to the outside air by the heat conductor, thereby reducing the temperature of the light emitting diode chip, improving the heat dissipation efficiency of the light source device, and the luminous efficiency and service life of the light emitting diode chip . In addition, the first electrode and the second electrode are respectively embedded in the insulator and extend into the accommodating groove, so that an external circuit electrically connected to the light source device is located above the light source device; the light emitting diode chip The thermal connection with the thermal conductor below the thermal conduction device causes the heat conduction direction of the light source device to be downward, thereby effectively avoiding the external circuit, thereby reducing the thermal resistance of the light source device and improving the heat dissipation performance. 7 200945619 [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 2 and FIG. 3, a light source device 20 according to a first embodiment of the present invention includes an insulator 21, a heat conductor 22, a first electrode 23, a second electrode 24, a light emitting diode chip 25, and a metal line 26. . The insulator 21 includes a support portion 210 and a reflective portion 212 integrally formed with the support portion 210. The light reflecting portion 212 is located on one side of the supporting portion 210. In the present embodiment, the light reflecting portion 212 is located above the supporting portion 210. The refracting portion 212 has a accommodating groove 2120. The bottom portion of the accommodating portion 2120 extends to the bottom of the accommodating groove 2120. The accommodating groove 2120 has a conical sidewall 2102, and a reflective layer 2104 is disposed on the conical sidewall 2102. The material used for the insulator 21 may be a plastic such as polyphthalamide (PPA), liquid crystal polymer (LPP) or the like. The heat conductor 22 is embedded in the support portion 210 of the insulator 21 in a direction close to the light reflecting portion 212 and faces the receiving groove 2120. The heat conductor 22 has a carrying portion 220 exposed to the bottom of the receiving groove 2120 and a bottom portion 221 opposite to the carrying portion 220. The carrying portion 220 is used to carry the LED chip 25. In this embodiment, the width d of the carrying portion 220 is smaller than the width D of the bottom portion 221 . The material used for the heat conductor 22 may be a metal having good thermal conductivity such as copper or aluminum, or a heat conductive material such as silicone or ceramic. The first electrode 23 and the second electrode 24 are both flat, that is, neither of them has a bent portion, so that when subjected to a large external force, the stress does not change due to a large change in the body stress from 8 200945619. Occurs, the reliability of the first electrode 23 and the second electrode 24 is improved. One end of the first electrode 23 and one end of the second electrode 24 are respectively embedded in the joint of the support portion 210 and the light reflecting portion 212 of the insulator 21 and extend into the receiving groove 2120, respectively, and have exposure to the receiving portion The portion of the bottom of the slot 2120. The other end of the first electrode 23 and the other end of the second electrode 24 extend out of the receiving groove 2120 for connection with an external circuit (not shown). The first electrode 23 and the second electrode 24 are both electrically insulated from the heat conductor 22. In addition, the first electrode 23 and the second electrode 24 are respectively disposed on the left and right sides of the LED substrate 25, and the LED body 25 is respectively connected to the first electrode 23 by two metal wires 26 The portion of the second electrode 24 exposed to the bottom of the accommodating groove 2120 forms an electrical connection. The light-emitting diode chip 25 is disposed on the bearing portion 220 of the heat conductor 22. The light-emitting diode chip 25 can be thermally connected to the heat conductor 22 by bonding, for example, the light-emitting diode wafer 25 and the heat conductor. Adhesives such as silver glue and conductive glue are disposed between the load-bearing portions 220 of 22. It can be understood that the photodiode wafer 25 can also be thermally connected to the heat conductor 22 by other means, such as Eutectic Bonding. The light emitted from the LED chip 25 is emitted through the opening of the accommodating groove 2120, and the light incident on the sidewall 2102 of the accommodating groove 2120 can be reflected from the reflective layer 2104 on the sidewall 2102 and from the accommodating groove. The opening of 2120 is emitted, thereby improving the light extraction efficiency of the LED chip 25. The light source device 20 further includes a package body 27, and the package body 27 is disposed in the receiving groove 2120 of the insulator 21 for covering the LED chip 25 and the metal wire 26 to prevent the LED chip 25 and the metal wire 26 from being Water vapor phase 9 200945619 • Oxidized by contact. The outer surface 270 of the package body 27 may be a convex curved surface or a concave curved surface to change the angle at which the light emitted from the light-emitting diode wafer 25 exits through the outer surface 270, so that the illumination range of the light source device 2 can be changed. A light wavelength converting substance such as phosphor powder may also be placed in the package. If the yellow phosphor powder is mixed in the package 27, and the blue light emitted from the LED chip 25 is emitted through the package 27, part of the blue light is converted into yellow light, and the unconverted blue light is combined with the converted yellow light. White light will be formed later. The material used for the package 27 is epoxy resin, Shishi resin or other electrically insulating transparent material. In the present embodiment, the heat conductor 22, the first electrode 23 and the second electrode 24 are disposed in the insulator 21 by insert-molding technology to ensure the first electrode 23 and the second electrode 24 and the heat conduction. The body 22 has good electrical insulation properties and good thermal conductivity between the thermal conductor 22 and the insulator. Since the light-emitting diode wafer 25 is directly disposed on the bearing portion 220 of the heat conductor 22 and forms a good thermal connection with the heat conductor 22, the heat generated when the light-emitting diode wafer 25 emits light can be directly transmitted to the heat conductor 22, and then The heat absorbed by the heat conductor 22 is conducted to the outside air, thereby lowering the temperature of the light-emitting diode wafer 25, improving the heat dissipation efficiency of the light source device 2, and the luminous efficiency and service life of the light-emitting diode wafer 25. In addition, the first electrode 23 and the second electrode 24 are located in the upper half of the light source device 2, and extend out of the receiving groove 2120 to be connected to an external circuit (not shown), so that the external circuit is located in the light source device 2 The light-emitting diode chip 25 is thermally connected to the heat-conducting body 22 underneath, so that the heat-conducting direction of the light-emitting device 20 is downward, thereby effectively avoiding the external circuit, and thus the heat of the light source device 20 is reduced by 200945619. Resistance, improve its heat dissipation performance. Referring to FIG. 4, the bottom portion 221 of the heat conductor 22 may further have a through hole '2210. When the heat conductor 22 is disposed in the support portion 210 of the insulator 21 by the embedded injection molding technique, the support portion 210 can be disposed. The partial structure fills the through hole 2210, which improves the contact area and contact reliability between the heat conductor 22 and the support portion 210. The width Η of the bottom portion 221 of the heat conductor 22 is greater than the total width h of the first electrode 23 and the second electrode 24, which effectively improves the heat dissipation efficiency of the heat conductor 22. Referring to FIG. 5 , the heat conductor 22 has a rectangular parallelepiped structure partially exposed to the bottom of the accommodating groove 2120 , and the LED chip 25 is disposed on the heat conductor 22 and thermally connected to the heat conductor 22 . The LED wafer 25 is located at the bottom of the accommodating groove 2120. Referring to FIG. 6 and FIG. 7 , a light source device 30 according to a second embodiment of the present invention is substantially the same as the light source device 20 provided in the first embodiment, except that the first electrode 33 and the second electrode 34 are provided. The two sides of the first electrode 33 and the middle portion 340 of the second electrode 34 are exposed to the accommodating groove 310 of the insulator 31. The two ends of the first electrode 33 and the two ends of the second electrode 34 respectively extend out of the accommodating groove 310. The bottom portion 321 of the heat conductor 32 has a "T" structure, and the heat conductor 32 and the insulator are improved. 31 contact area and contact reliability. Here, the two ends of the elongated first electrode 33 and the two ends of the elongated second electrode 34 respectively extend out of the accommodating groove 310, which is beneficial to be connected in series or in parallel with the external circuit board, thereby improving the light source device 30. The utility and wiring of the circuit board connected to the light source device 30 200945619 Design flexibility. Referring to FIG. 8, a light source device 40 according to a third embodiment of the present invention is substantially the same as the light source device 20 provided in the first embodiment, except that a heat conducting sticker is disposed on the bearing portion 420 of the heat conductor 42. Submount 48, the heat conducting patch 48 and the carrying portion 420 can be joined by bonding or eutectic. The material of the heat conducting patch 48 can be tantalum, aluminum nitride, tantalum oxide or cerium oxide. Diamond-like (Diamond like Ο
Carbon)、陶竟銘基板（Ceramic Aluminim substrate)等； 發光二極體晶片45藉由兩個形成於發光二極體晶片 45之正負電極上之金屬凸塊49(例如金凸塊、錫球等）覆晶 封裝（Flip chip)於導熱貼片48上，該兩個金屬凸塊49分別 與第一電極43及第二電極44打線連接。 請參見圖9,本發明第四實施例提供之一種光源裝置 50，其包括一電路板500，複數個第一實施例提供之光源裝 〇置20，及一散熱鰭片510。 電路板500具有複數個通孔501及設置於該電路板500 一侧並位於兩相鄰通孔501之間之金屬連接層502,每個光 源裝置20之反光部212分別穿設於該複數個通孔501中。 第一電樟23與第二電極24與該電路板500之金屬連接層 502電連接。 散熱鰭片510設置於該複數個光源裝置20之與該電路 板500相對之一侧，並與每個光源裝置20之導熱體22熱 性連接用以對該光源裝置20進行散熱。 12 200945619 • 由於該複數個光源裝置20設置於該電路板5〇〇與該散 熱鰭片510之間，每個光源裝置20之第一電極23及第二 電極24與該電路板500之金屬連接層502電連接。故，該 電路板500位於該複數個光源裝置2〇之上方，而每個光源 裝置20之導熱體22均與散熱，鰭片510熱性連接，使得該 複數個光源裝置20之導熱方向向下，從而有效地避開了該 電路板500 ’進而減小了光源裝置5〇之熱阻，提高了其散 熱效能。 ❹ 可理解的是，上述第二、第三實施例所提供之光源裝 置同樣可應用到上述第四實施例中。 综上所述’本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 〇 【圖式簡單說明】 圖1為一種現有光源裝置之截面示意圖。 圖2為本發明第一實施例提供之光源裝置之俯視示意 圖。 圖3為圖2所示光源裝置中沿m_in之截面示意圖。 圖4為圖2所示光源裝置之導熱體之底部具有通孔之 截面示意圖。 圖5為圖2所示光源裝置之導熱體具有長方體結構之 戴面示意圖。 13 200945619 圖6為本發明第二實施例提供之光源裝置之俯視示意 圖。 圖7為圖6所示光源裝置中沿VII-VII之截面示意圖。 圖8為本發明第三實施例提供之光源裝置之截面示意 圖。 圖9為本發明第四實施例提供之光源裝置之截面示意Carbon), a ceramic Aluminim substrate, etc.; the light-emitting diode wafer 45 is covered by two metal bumps 49 (for example, gold bumps, solder balls, etc.) formed on the positive and negative electrodes of the light-emitting diode wafer 45. The Flip chip is mounted on the heat conductive patch 48, and the two metal bumps 49 are connected to the first electrode 43 and the second electrode 44, respectively. Referring to FIG. 9, a light source device 50 according to a fourth embodiment of the present invention includes a circuit board 500, a plurality of light source devices 20 provided in the first embodiment, and a heat dissipation fin 510. The circuit board 500 has a plurality of through holes 501 and a metal connection layer 502 disposed on one side of the circuit board 500 and located between two adjacent through holes 501. The light reflecting portions 212 of each light source device 20 are respectively disposed in the plurality of light shielding portions 212. In the through hole 501. The first electrode 23 and the second electrode 24 are electrically connected to the metal connection layer 502 of the circuit board 500. The heat dissipation fins 510 are disposed on one side of the plurality of light source devices 20 opposite to the circuit board 500, and are thermally connected to the heat conductors 22 of each of the light source devices 20 for dissipating heat from the light source device 20. 12 200945619 • Since the plurality of light source devices 20 are disposed between the circuit board 5 and the heat dissipation fins 510, the first electrode 23 and the second electrode 24 of each light source device 20 are connected to the metal of the circuit board 500. Layer 502 is electrically connected. Therefore, the circuit board 500 is located above the plurality of light source devices 2, and the heat conductors 22 of each of the light source devices 20 are thermally coupled to the heat dissipation fins 510, so that the heat conduction direction of the plurality of light source devices 20 is downward. Therefore, the circuit board 500' is effectively avoided, thereby reducing the thermal resistance of the light source device 5, and improving the heat dissipation performance. ❹ It is understood that the light source device provided by the second and third embodiments described above can also be applied to the fourth embodiment described above. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, which is not intended to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. 〇 [Simplified illustration of the drawings] Fig. 1 is a schematic cross-sectional view of a conventional light source device. Fig. 2 is a top plan view showing a light source device according to a first embodiment of the present invention. 3 is a schematic cross-sectional view along m_in of the light source device of FIG. 2. Fig. 4 is a schematic cross-sectional view showing a through hole at the bottom of the heat conductor of the light source device shown in Fig. 2. Fig. 5 is a schematic view showing the wearing of the heat conductor of the light source device shown in Fig. 2 having a rectangular parallelepiped structure. 13 200945619 Figure 6 is a top plan view of a light source device according to a second embodiment of the present invention. Figure 7 is a schematic cross-sectional view of the light source device of Figure 6 taken along line VII-VII. Fig. 8 is a schematic cross-sectional view showing a light source device according to a third embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of a light source device according to a fourth embodiment of the present invention;
【主要元件符號說明】 光源裝置 10、 20 ' 30、40 ' 50 殼體 11 光源模組 12 燈罩 13 印刷電路板 121 金屬線路層 122 發光元件 123 封裝體 124 、27 絕緣體 21、 31 導熱體 22、 32 > 42 第一電極 23、 33、43 第二電極 24 > 34、44 發光二極體晶片 25、 45 金屬線 26 支撐部 210 反光部 212 200945619 容置槽 2120、310 侧壁 2102 反射層 2104 承載部 220 、 420 導熱體之底部 221 ' 321 外表面 270 通孔 2210、501 第一電極之中部 330 第二電極之中部 340 導熱貼片 48 金屬凸塊 49 電路板 500 散熱鰭片 510 金屬連接層 502[Description of main component symbols] Light source device 10, 20' 30, 40' 50 Housing 11 Light source module 12 Lamp cover 13 Printed circuit board 121 Metal wiring layer 122 Light-emitting element 123 Package 124, 27 Insulator 21, 31 Thermal conductor 22, 32 > 42 first electrode 23, 33, 43 second electrode 24 > 34, 44 light-emitting diode wafer 25, 45 metal wire 26 support portion 210 light-reflecting portion 212 200945619 accommodating groove 2120, 310 side wall 2102 reflective layer 2104 The bearing part 220, 420 The bottom part of the heat conductor 221 ' 321 The outer surface 270 The through hole 2210, 501 The middle part of the first electrode 330 The middle part of the second electrode 340 The heat conductive patch 48 The metal bump 49 The circuit board 500 The heat sink fin 510 The metal connection Layer 502
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