CN101586795B - Light source device - Google Patents
Light source device Download PDFInfo
- Publication number
- CN101586795B CN101586795B CN2008103017583A CN200810301758A CN101586795B CN 101586795 B CN101586795 B CN 101586795B CN 2008103017583 A CN2008103017583 A CN 2008103017583A CN 200810301758 A CN200810301758 A CN 200810301758A CN 101586795 B CN101586795 B CN 101586795B
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- Prior art keywords
- light
- insulator
- heat carrier
- supply apparatus
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Abstract
The invention relates to a light source device with light emitting diode chips, which comprises an insulator, a heat conductor, a metal conductive layer, a plurality of light emitting diode chips, a metal wire and a transparent encapsulating body, wherein the insulator is provided with a first surface, a second surface and a plurality of first through holes; the heat conductor is closely jointed with the first surface of the insulator, and the heat conductor is provided with a part exposed on the first through holes of the insulator; the metal conductive layer is arranged on the second surfaceof the insulator, and is provided with second through holes which run through the first through holes; the light emitting diode chips are arranged on the part of the heat conductor exposed on the fir st through holes of the insulator so as to be connected with the heat conductor; the light emitting diode chips are electrically connected with the metal conductive layer through the metal wire respectively; and the transparent encapsulating body is arranged on the second surface of the insulator so as to cover the light emitting diode chips and the metal wire.
Description
Technical field
The present invention relates to a kind of light supply apparatus, particularly a kind of light supply apparatus with solid-state light emitting elements such as light-emitting diode chip for backlight unit.
Background technology
Now, light emitting diode (Light Emitting Diode, LED) a lot of fields have been widely applied to, at this, a kind of novel light-emitting diode can be referring to people such as Daniel A.Steigerwald at document IEEE Journal on Selected Topics inQuantum Electronics, Vol.8, No.2, Illumination With Solid State Lighting Technology one literary composition among the March/April 2002.Light emitting diode generally can send the light of specific wavelength, visible light for example, but the major part of light emitting diode institute received energy is converted into heat, and the energy of remainder is a luminous energy by true translation.Therefore, the heat that lumination of light emitting diode produced must be evacuated to guarantee the normal operation of light emitting diode.
As shown in Figure 1, a kind of light supply apparatus 10, it comprises 11, one light source modules 12 of a housing and a lampshade 13.This light source module 12 is arranged in this housing 11, and this lampshade 13 is arranged on the top of this light source module 12 to protect this light source module 12.This light source module 12 comprises: a printed circuit board (PCB) (Printed Circuit Board, PCB) 121, be arranged on a metallic circuit layer 122 and a plurality of light-emitting components 123 on this printed circuit board (PCB) 121 (as, and the packaging body 124 that covers this light-emitting component 123 light-emitting diode chip for backlight unit).These a plurality of light-emitting components 123 electrically connect with this metallic circuit layer 122.Yet the heat that these a plurality of light-emitting components 123 are produced can not be got rid of from this housing 11 timely and effectively, and then has reduced the luminous efficiency of these a plurality of light-emitting components 123.This shows, the light supply apparatus that provides a kind of radiating efficiency higher is provided.
Summary of the invention
Below will the light supply apparatus that a kind of radiating efficiency is higher be described with embodiment.
A kind of light supply apparatus with light-emitting diode chip for backlight unit, it comprises: an insulator, a heat carrier, metal conducting layer, a plurality of light-emitting diode chip for backlight unit, metal wire and a transparent encapsulating body.This insulator has a first surface and one and this first surface opposing second surface, is formed with a plurality of first through holes on second surface.The first surface fluid-tight engagement of this heat carrier and this insulator, and this heat carrier has the part of first through hole that is exposed to this insulator.This heat carrier has a upper surface, one and this upper surface opposing lower surface, and be arranged on side between this upper surface and this lower surface, the upper surface of this heat carrier and side and this insulator fluid-tight engagement, the upper surface of this heat carrier has the part of first through hole that is exposed to this insulator.This metal conducting layer is arranged on the second surface of this insulator, and has second through hole that connects with this first through hole.These a plurality of light-emitting diode chip for backlight unit be arranged on the part of first through hole that is exposed to this insulator of this heat carrier with this heat carrier thermally coupled.These a plurality of light-emitting diode chip for backlight unit form with this metal conducting layer by this metal wire respectively and are electrically connected.This transparent encapsulating body is arranged on the second surface of this insulator, in order to cover these a plurality of light-emitting diode chip for backlight unit and this metal wire.Described light supply apparatus also has a through hole that runs through described heat carrier and be positioned at the insulator of heat carrier side, described light supply apparatus also comprises a heat pipe, this heat pipe is arranged in the described through hole, and makes in the evaporation ends of this heat pipe and be embedded in this through hole, and the condensation end of heat pipe stretches out this through hole.
Compared with prior art, light-emitting diode chip for backlight unit in this light supply apparatus is set directly on the heat carrier and with heat carrier and forms good thermally coupled, so the heat that produces when light-emitting diode chip for backlight unit is luminous can be directly conducted to heat carrier, by heat carrier the heat that absorbs is conducted to external system again, thereby reduced the temperature of light-emitting diode chip for backlight unit, improved the radiating efficiency of light supply apparatus, and the luminous efficiency of light-emitting diode chip for backlight unit and service life.In addition, this metal conducting layer is formed on this insulator, makes the external circuit with this light supply apparatus electric connection be positioned at the top of this light supply apparatus; Light-emitting diode chip for backlight unit with its below hot connection of heat carrier, make the heat conduction of this light supply apparatus be directed downwards, thereby effectively avoided external circuit, and then reduced the thermal resistance of this light supply apparatus, improved its heat dissipation.
Description of drawings
Fig. 1 is a kind of schematic cross-section of existing light supply apparatus.
The schematic cross-section of the light supply apparatus that Fig. 2 provides for first embodiment of the invention.
Fig. 3 is the mutual series-parallel schematic diagram of the light-emitting diode chip for backlight unit of light supply apparatus shown in Figure 2.
The schematic cross-section of the light supply apparatus that Fig. 4 provides for second embodiment of the invention.
The schematic cross-section of the light supply apparatus that Fig. 5 provides for third embodiment of the invention.
The schematic cross-section of the light supply apparatus that Fig. 6 provides for fourth embodiment of the invention.
The schematic cross-section of the light supply apparatus that Fig. 7 provides for fifth embodiment of the invention.
The schematic cross-section of the light supply apparatus that Fig. 8 provides for sixth embodiment of the invention.
The schematic cross-section of the light supply apparatus that Fig. 9 provides for seventh embodiment of the invention.
The specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 2, a kind of light supply apparatus 20 that first embodiment of the invention provides, it comprises insulator 21, heat carrier 22, metal conducting layer 23, a plurality of light-emitting diode chip for backlight unit 24, metal wire 25, and transparent encapsulating body 26.
This insulator 21 has first surface 211 opposing second surface 212 of a first surface 211 and and this insulator 21, on second surface 212, be formed with a plurality of first through hole, 2101 these insulator 21 material therefors and can be plastics, for example poly-terephthalate p-phenylenediamine (PPD) (Polyphthalamide, PPA), liquid crystal polymer (Liquidcrystal polymer, LCP) etc.
This heat carrier 22 is a rectangular structure, and it has a upper surface 221, one and these upper surface 221 opposing lower surface 222, and is arranged on the side 223 between this upper surface 221 and the lower surface 222.The upper surface 221 of this heat carrier 22 and side 223 and these insulator 21 fluid-tight engagement.
These insulator 21 local upper surfaces 221 that cover this heat carrier 22 so that the upper surface 221 of this heat carrier 22 has part to be exposed to first through hole 2101 of this insulator 21, and make this heat carrier 22 and this insulator 21 form a plurality of storage tanks 27.The lower surface 222 of this heat carrier 22 is exposed in the air.
These heat carrier 22 material therefors can be the metal that copper, aluminium etc. have better heat conductivility, or nonmetal conduction material such as silicon, pottery.
Metal conducting layer 23 is arranged on the second surface 212 of this insulator 21, and has second through hole 2302 that connects with this first through hole 2101.This metal conducting layer 23 is a tabular, does not promptly have the bending place, thereby makes it do the time spent and can not caused situation generations such as fracture by himself STRESS VARIATION more greatly being subjected to big external force, has improved the reliability of metal conducting layer 23.
This metal conducting layer 23 is separately positioned on the second surface 212 of this insulator 21 by embedded ejection forming technique (insert-molding), and this heat carrier 22, this insulator 21 form integrative-structure with this metal conducting layer 23 by embedded ejection forming technique, guaranteeing having the excellent electric insulating energy between metal conducting layer 23 and the heat carrier 22, and has good heat-conductive characteristic between heat carrier 22 and the insulator 21.
A plurality of light-emitting diode chip for backlight unit 24 are separately positioned in these a plurality of storage tanks 27, and concrete, each light-emitting diode chip for backlight unit 24 is arranged on the part of the second surface that is exposed to this insulator 21 212 of this heat carrier 22, thereby realize and these heat carrier 22 thermally coupleds.At this, the both positive and negative polarity of each light-emitting diode chip for backlight unit 24 forms with metal conducting layer 23 by two metal line 25 and is electrically connected.
Light-emitting diode chip for backlight unit 24 can form thermally coupled by bonding mode and heat carrier 22, for example is provided with viscose glues such as elargol, conducting resinl, non-conductive adhesive between light-emitting diode chip for backlight unit 24 and heat carrier 22.Certainly, light-emitting diode chip for backlight unit 24 also can form thermally coupled, for example eutectic mode (EutecticBonding) by other modes and heat carrier 22.
Be understandable that, in order to make this light supply apparatus 20 send white light, these a plurality of light-emitting diode chip for backlight unit 24 can comprise at least one blue LED chip, at least one red light-emitting diode chip and at least one green light-emitting diode chip for backlight unit, can form white light after the light combination that the light-emitting diode chip for backlight unit 24 of these three kinds of different colours sends.
Transparent encapsulating body 26 is arranged on the second surface 212 of insulator 21, and it is in order to cover this light-emitting diode chip for backlight unit 24 and this metal wire 25, can avoid this this metal wire 25 of light-emitting diode chip for backlight unit 24 usefulness to be contacted by extraneous aqueous vapor and oxidized.The outer surface 260 of this transparent encapsulating body 26 can be plane, convex surface or concave curved surface, changing light that light-emitting diode chip for backlight unit 24 the sends angle via outer surface 260 outgoing, thereby can change the range of exposures and the light type of light supply apparatus 20.Because have a plurality of chip structures in this transparent encapsulating body 26, therefore, this transparent encapsulating body 26 has the mixed light effect.
Also can be provided with the light wavelength conversion material in this transparent encapsulating body 26, make this light supply apparatus 20 produce needed light color, for example fluorescent material.If be doped with yellow fluorescent powder in this transparent encapsulating body 26, the blue light that light-emitting diode chip for backlight unit 24 sends has the part blue light to be converted into gold-tinted during via these transparent encapsulating body 26 outgoing, the blue light that is not converted with will form white light after the gold-tinted that is converted to combines.
If these a plurality of light-emitting diode chip for backlight unit 24 comprise at least one blue LED chip and at least one red light-emitting diode chip, and the collocation yellow fluorescent powder then can produce the white light than high color rendering.In addition, if these a plurality of light-emitting diode chip for backlight unit 24 are black light light emitting diode (near UV LED) chip, three kinds of fluorescent material such as collocation redness, green and blueness then can produce the white light of superelevation color rendering.
These transparent encapsulating body 26 material therefors can be the transparent material of epoxy resin, silicones or other electric insulations.Certainly, also can further be divided in this transparent encapsulating body 26 diffusion particle is arranged, silicon dioxide microparticle for example, the light that sends in order to this light-emitting diode chip for backlight unit 24 of scattering.
Preferably, this light supply apparatus 20 also comprises a reflector 28, this reflector 28 is arranged on the second surface 212 of this insulator 21, and this transparent encapsulating body 26 is contained in this reflector 28, and the sidewall 261 of this transparent encapsulating body 26 contacts with this reflector 28.The light that these a plurality of light-emitting diode chip for backlight unit 24 send penetrates via the opening of this storage tank 27, the light that is incident on the sidewall 261 of this transparent encapsulating body 26 can penetrate via reflector 28 reflections and from the opening 260 of this transparent encapsulating body 26, thereby has improved the light extraction efficiency of light-emitting diode chip for backlight unit 24.
Be understandable that can make this heat carrier 22, insulator 21, metal conducting layer 23 and reflector 28 form integrative-structure by embedded ejection forming technique, it will significantly promote the reliability of this light supply apparatus 20.
Because being set directly on this heat carrier 22 and with this heat carrier 22, light-emitting diode chip for backlight unit 24 forms good thermally coupled, so the heat that this light-emitting diode chip for backlight unit 24 produces when luminous can be directly conducted to this heat carrier 22, by this heat carrier 22 heat that absorbs is conducted to external system again, thereby reduced the temperature of this light-emitting diode chip for backlight unit 24, improved the radiating efficiency of this light supply apparatus 20, and the luminous efficiency of this light-emitting diode chip for backlight unit 24 and service life.
See also Fig. 3, in the present embodiment, the electrical connection between these a plurality of light-emitting diode chip for backlight unit 24 can be series, parallel or series-parallel connection.These a plurality of light-emitting diode chip for backlight unit 24 form with metal conducting layer 23 by two metal line 25 respectively and are electrically connected.And should be divided into a plurality of groups by a plurality of light-emitting diode chip for backlight unit 24, per two light-emitting diode chip for backlight unit 24 are one group.Two light-emitting diode chip for backlight unit 24 in this group are parallel with one another, and the light-emitting diode chip for backlight unit between on the same group 24 is not connected mutually by metal conducting layer 23.Thereby form the hybrid connected structure of back in parallel earlier series connection.
Certainly, the electric connection mode of these a plurality of light-emitting diode chip for backlight unit 24 also is not limited to the hybrid connected structure of back in parallel earlier series connection, also can be series, parallel or other hybrid connected structure, so the circuit design between the light-emitting diode chip for backlight unit 24 has more elasticity.
See also Fig. 4, a kind of light supply apparatus 40 that second embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 41, heat carrier 42, metal conducting layer 43, a plurality of light-emitting diode chip for backlight unit 44, metal wire 45, and transparent encapsulating body 46.
The present embodiment and the first embodiment difference are, this insulator 41 has one first through hole 411, this heat carrier 42 has one and these first through hole, 411 corresponding second through holes 421, and this first through hole 411 is combined into through hole 4120 with this second through hole 421.
Be embedded in this through hole 4120 in the heat pipe (heat pipe) 424, and make in the evaporation ends 4241 of heat pipe 424 and be embedded in this through hole 4120,4242 of the condensation ends of heat pipe 424 are exposed in the air, and setting can make the present invention's light supply apparatus 40 have better thermal conductivity like this.
See also Fig. 5, a kind of light supply apparatus 50 that third embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 51, heat carrier 52, metal conducting layer 53, a plurality of light-emitting diode chip for backlight unit 54, metal wire 55, and transparent encapsulating body 56.
The present embodiment and the first embodiment difference are that this heat carrier 52 has a plurality of upper surface 521 of heat carrier 52 and through holes 590 of lower surface 522 of running through.Each this through hole 590 comprises one first cylindrical hole 5901 and one second cylindrical hole 5902, this first cylindrical hole 5901 is formed on the upper surface 521 of this heat carrier 52 and extends in this heat carrier 52, this second cylindrical hole 5902 is formed on the lower surface 522 of this heat carrier 52 and extends in this heat carrier 52, and the aperture of this second cylindrical hole 5902 is greater than the aperture of this first cylindrical hole 5901.
The part-structure of this insulator 51 is filled this a plurality of through holes 590, and owing to the aperture greater than this first cylindrical hole 5901, the aperture of this second cylindrical hole 5902, and therefore, this set can improve the reliability that contacts of heat carrier 52 and insulator 51.
See also Fig. 6, a kind of light supply apparatus 60 that fourth embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 61, heat carrier 62, metal conducting layer 63, a plurality of light-emitting diode chip for backlight unit 64, metal wire 65, and transparent encapsulating body 66.
The present embodiment and the first embodiment difference are that this heat carrier 62 includes breach 691, and this breach 691 is arranged on the peripheral region of this heat carrier 62, and join with the second surface 622 of this heat carrier 62.
Part-structure in this insulator 61 is filled this breach 691, with the contact reliability of raising heat carrier 62 with insulator 61.And the floor space of this heat carrier 62 is greater than the floor space of insulator, but mat increases the floor space of heat carrier to increase heat transfer efficiency.
See also Fig. 7, a kind of light supply apparatus 70 that fifth embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 71, heat carrier 72, metal conducting layer 73, a plurality of light-emitting diode chip for backlight unit 74, metal wire 75, and transparent encapsulating body 76.
The present embodiment and the first embodiment difference are that this insulator 71 has a plurality of accepting grooves 710.
This heat carrier 72 comprises a plurality of supporting parts 7201 and a support portion 7202 relative with this a plurality of supporting part 7201.This support portion 7202 is arranged in this insulator 71 and is relative with this accepting groove 710, and this supporting part 7201 is embedded in this accepting groove 710 and has the second surface 712 that part is exposed to this insulator 71.
This heat carrier 72 or be embedded or by embedded ejection forming technique and this insulator 71 fluid-tight engagement.
This metal conducting layer 73 is embedded in this insulator 71, and is separated with this heat carrier 72.
Carry a light-emitting diode chip for backlight unit 74 on each this supporting part 721, make this light-emitting diode chip for backlight unit 74 and these heat carrier 72 thermally coupleds.
See also Fig. 8, a kind of light supply apparatus 80 that sixth embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 81, heat carrier 82, metal conducting layer 83, a plurality of light-emitting diode chip for backlight unit 84, metal wire 85, and transparent encapsulating body 86.
The present embodiment and the first embodiment difference are that this heat carrier 82 is combined by a plurality of independently heat carriers unit 8201.
These a plurality of light-emitting diode chip for backlight unit 84 are separately positioned in these a plurality of storage tanks 87, concrete, each light-emitting diode chip for backlight unit 84 is arranged on the part of the second surface that is exposed to this insulator 81 812 of this heat carrier unit 8201, thereby realizes and these heat carrier 82 thermally coupleds.
See also Fig. 9, a kind of light supply apparatus 90 that seventh embodiment of the invention provides, the present embodiment and first example structure are basic identical, it comprises insulator 91, heat carrier 92, metal conducting layer 93, a plurality of light-emitting diode chip for backlight unit 94, metal wire 95, and transparent encapsulating body 96.
The present embodiment and the first embodiment difference are, the part that is exposed to these storage tank 97 bottoms of this heat carrier 92 is provided with a heat conduction paster (Submount) 99, can engage by bonding mode or eutectic mode between this heat conduction paster 99 and this heat carrier 92, these heat conduction paster 99 material therefors can be silicon, aluminium nitride, beryllium oxide, silica, class diamond (Diamond like Carbon), ceramic aluminium base (CeramicAluminim substrate) etc.
Light-emitting diode chip for backlight unit 94 by the metal coupling on the positive and negative electrode that is formed on light-emitting diode chip for backlight unit 94 98 (for example: golden projection, tin ball etc.) chip package (Flip chip) on heat conduction paster 99, and have line layer on this heat conduction paster 99, the line layer of this heat conduction paster 99 is connected with metal conducting layer 93 routings.
Be understandable that, the below of this light supply apparatus 90 can directly be connected with heat sink or radiating fin, reduced printed circuit board (PCB) (Printed Circuit Board, PCB) or the use of glass mat (FR4), thereby reduced the thermal resistance of this light supply apparatus 90, made these light supply apparatus 90 heat-conducting effect better.
In addition, those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (11)
1. light supply apparatus with light-emitting diode chip for backlight unit, it comprises:
An insulator, this insulator have a first surface and one and this first surface opposing second surface, are formed with a plurality of first through holes on second surface;
A heat carrier, the first surface fluid-tight engagement of itself and this insulator, and this heat carrier has the part of first through hole that is exposed to this insulator, this heat carrier has a upper surface, one and this upper surface opposing lower surface, and be arranged on side between this upper surface and this lower surface, the upper surface of this heat carrier and side and this insulator fluid-tight engagement, the upper surface of this heat carrier has the part of first through hole that is exposed to this insulator;
A metal conducting layer, it is arranged on the second surface of this insulator, and has second through hole that connects with this first through hole;
A plurality of light-emitting diode chip for backlight unit, be arranged on the part of first through hole that is exposed to this insulator of this heat carrier with this heat carrier thermally coupled;
Metal wire, these a plurality of light-emitting diode chip for backlight unit form with this metal conducting layer by this metal wire respectively and are electrically connected; And
A transparent encapsulating body, this transparent encapsulating body are arranged on the second surface of this insulator, in order to these a plurality of light-emitting diode chip for backlight unit of covering and this metal wire,
Wherein, described light supply apparatus also has a third through-hole that runs through described heat carrier and be positioned at the insulator of heat carrier side, described light supply apparatus also comprises a heat pipe, this heat pipe is arranged in the described third through-hole, and make in the evaporation ends of this heat pipe to be embedded in this third through-hole, the condensation end of heat pipe stretches out this third through-hole.
2. light supply apparatus as claimed in claim 1 is characterized in that: this heat carrier, insulator and metal conducting layer form integrative-structure by embedded ejection forming technique.
3. light supply apparatus as claimed in claim 1 is characterized in that: this heat carrier is the combination of the heat carrier unit of a cuboid or a plurality of independence.
4. light supply apparatus as claimed in claim 1, it is characterized in that: this heat carrier comprises a plurality of supporting parts and a support portion relative with these a plurality of supporting parts, these a plurality of supporting parts are arranged on the part of the second surface that is exposed to this insulator of this support portion respectively, and these a plurality of light-emitting diode chip for backlight unit are carried on respectively on these a plurality of supporting parts.
5. light supply apparatus as claimed in claim 1 is characterized in that: this heat carrier also has fourth hole, makes the part-structure in this insulator be covered with this fourth hole.
6. light supply apparatus as claimed in claim 1 is characterized in that: this light supply apparatus also comprises a reflector, and this reflector is arranged on the sidewall of this transparent encapsulating body.
7. light supply apparatus as claimed in claim 6 is characterized in that: this heat carrier, insulator, metal conducting layer and reflector form integrative-structure by embedded ejection forming technique.
8. light supply apparatus as claimed in claim 1 is characterized in that: in this transparent encapsulating body diffusion particle is arranged.
9. light supply apparatus as claimed in claim 1 is characterized in that: this light-emitting diode chip for backlight unit be by the metal coupling chip package on the heat conduction paster, this heat conduction paster is connected with this metal conducting layer routing.
10. light supply apparatus as claimed in claim 1 is characterized in that: the electric connection mode of these a plurality of light-emitting diode chip for backlight unit is series-parallel connection.
11. light supply apparatus as claimed in claim 1 is characterized in that: further include breach on this heat carrier, this breach is arranged on the peripheral region of this heat carrier.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103017583A CN101586795B (en) | 2008-05-23 | 2008-05-23 | Light source device |
| US12/419,407 US8067782B2 (en) | 2008-04-08 | 2009-04-07 | LED package and light source device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103017583A CN101586795B (en) | 2008-05-23 | 2008-05-23 | Light source device |
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| Publication Number | Publication Date |
|---|---|
| CN101586795A CN101586795A (en) | 2009-11-25 |
| CN101586795B true CN101586795B (en) | 2011-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008103017583A Expired - Fee Related CN101586795B (en) | 2008-04-08 | 2008-05-23 | Light source device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376697B (en) * | 2010-08-27 | 2015-06-24 | 苏州科医世凯半导体技术有限责任公司 | High color rendering white light LED (Light Emitting Diode) module |
| CN102376698A (en) * | 2010-08-27 | 2012-03-14 | 苏州科医世凯半导体技术有限责任公司 | High-brightness LED colorful optical module for lighting or displaying device |
| CN102095094A (en) * | 2010-11-17 | 2011-06-15 | 象山中翔电子科技有限公司 | Led lamp and manufacturing method thereof |
| CN102593337A (en) * | 2012-03-09 | 2012-07-18 | 苏州玄照光电有限公司 | High-reliability integrated packaging LED (light-emitting diode) chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| EP1439584A1 (en) * | 2001-08-28 | 2004-07-21 | Matsushita Electric Works, Ltd. | Light emitting device using led |
| CN101185174A (en) * | 2005-05-31 | 2008-05-21 | 昭和电工株式会社 | Substrate for LED and LED package |
-
2008
- 2008-05-23 CN CN2008103017583A patent/CN101586795B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| EP1439584A1 (en) * | 2001-08-28 | 2004-07-21 | Matsushita Electric Works, Ltd. | Light emitting device using led |
| CN101185174A (en) * | 2005-05-31 | 2008-05-21 | 昭和电工株式会社 | Substrate for LED and LED package |
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| CN101586795A (en) | 2009-11-25 |
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