CN100568558C - Electroluminescent module - Google Patents

Electroluminescent module Download PDF

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Publication number
CN100568558C
CN100568558C CNB2006101717642A CN200610171764A CN100568558C CN 100568558 C CN100568558 C CN 100568558C CN B2006101717642 A CNB2006101717642 A CN B2006101717642A CN 200610171764 A CN200610171764 A CN 200610171764A CN 100568558 C CN100568558 C CN 100568558C
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CN
China
Prior art keywords
substrate
module
light
heat conduction
electroluminescent module
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Expired - Fee Related
Application number
CNB2006101717642A
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Chinese (zh)
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CN101212007A (en
Inventor
薛清全
廖学国
陈煌坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Delta Energy Technology Co., Ltd.
Original Assignee
Delta Optoelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Optoelectronics Inc filed Critical Delta Optoelectronics Inc
Priority to CNB2006101717642A priority Critical patent/CN100568558C/en
Publication of CN101212007A publication Critical patent/CN101212007A/en
Application granted granted Critical
Publication of CN100568558C publication Critical patent/CN100568558C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A kind of electroluminescent module, it comprises module substrate, heat conduction bearing substrate and light-emitting component.Module substrate has perforate, first surface and is arranged at first patterned electrodes of first surface; The heat conduction bearing substrate has bearing part and is arranged at second patterned electrodes of bearing part, and wherein the first surface of bearing part and module substrate is relative and establish, and second patterned electrodes is relative with first patterned electrodes and establish and be electrically connected mutually; Light-emitting component is arranged in the perforate of module substrate, and be arranged on the heat conduction bearing substrate, wherein, light-emitting component has first electrode and second electrode, it is electrically connected with the corresponding part of second patterned electrodes of heat conduction bearing substrate respectively, and wherein this module substrate also has second surface and reflector, and this second surface is relative with this first surface and establish, and this reflector is formed at this second surface, and reflects the light that this light-emitting component produces.

Description

Electroluminescent module
Technical field
The present invention relates to a kind of light emitting module, particularly relate to a kind of electroluminescent module.
Background technology
In recent years, because electroluminescence (electroluminescence) development of technology, also brought up light-emitting diode (light-emitting diode, LED) material and technology technology is constantly progressive, its range of application has contained the indicator light of computer or household appliances, backlight and even the traffic signals or the automobile-used indicator light of liquid crystal indicator, even also has an opportunity as illumination light source in the future.Yet along with the luminous power of light-emitting diode constantly improves, the heat energy that it produced is also soaring thereupon, if can't effectively handle, will reduce the luminous efficiency of light-emitting diode for the heat energy of light-emitting diode.
Please refer to shown in Figure 1ly, existing a kind of light-emitting diode (LED) module 1 comprises LED package (LED package) 11 and module substrate 12.Wherein, LED package 11 has light-emitting diode 111, bearing substrate 112 and encapsulation material 113.
Light-emitting diode 111 has p type doped layer P01, luminescent layer I01 and n type doped layer N01 successively, and it stacks gradually moulding.In addition, light-emitting diode 111 also has p type contact electrode E01 and n type contact electrode E02, and wherein, p type contact electrode E01 contacts with p type doped layer P01, and n type contact electrode E02 contacts with n type doped layer N01.
Bearing substrate 112 has first surface S01, second surface S02 and patterned conductive layer PC1, wherein first surface S01 and second surface S02 establish relatively, and patterned conductive layer PC1 is extended to form to second surface S02 by first surface S01, and divides into the first conductive area B01 and the second conductive area B02.
Light-emitting diode 111 is arranged at the first surface S01 of bearing substrate 112, and the p type contact electrode E01 of light-emitting diode 111 and n type contact electrode E02 are electrically connected by scolder SO1 with the patterned conductive layer PC1 of part respectively.
Encapsulation material 113 covers the patterned conductive layer PC1 of light-emitting diode 111 and part, with protection light-emitting diode 111.
Module substrate 12 has surperficial S11, its second surface S02 with bearing substrate 12 is relative and establish, and be provided with at least one electrical connection pad 121 in the surperficial S11 of module substrate 12, it also is to be electrically connected with the partially patterned conductive layer PC1 of the second surface S02 that is positioned at bearing substrate 12 by scolder SO1.
From the above, because light-emitting diode (LED) module 1 does not provide an effective heat dissipation path, with the heat energy that guides light-emitting diode 111 to be produced, therefore, when the long-time high-temperature operation of light-emitting diode 111, will cause its material accelerated deterioration and reduce its reliability and luminous efficiency.
Therefore, how to provide a kind of and can have good heat dissipation path, improve the electroluminescent module of luminous efficiency, real one of the current important topic that belongs to.
Summary of the invention
Therefore, for addressing the above problem, the present invention proposes a kind of good heat radiating usefulness that has, to improve the electroluminescent module of luminous efficiency.
According to purpose of the present invention, a kind of electroluminescent module is proposed, comprise module substrate, heat conduction bearing substrate and light-emitting component.Module substrate has perforate, first surface and is arranged at first patterned electrodes of first surface; The heat conduction bearing substrate has bearing part and is arranged at second patterned electrodes of bearing part, and wherein the first surface of bearing part and module substrate is relative and establish, and second patterned electrodes is relative with first patterned electrodes and establish and be electrically connected mutually; Light-emitting component is arranged in the perforate of module substrate, and be arranged on the heat conduction bearing substrate, wherein, light-emitting component has first electrode and second electrode, it is electrically connected with the corresponding part of second patterned electrodes of heat conduction bearing substrate respectively, and wherein this module substrate also has second surface and reflector, and this second surface is relative with this first surface and establish, and this reflector is formed at this second surface, and reflects the light that this light-emitting component produces.
The material of heat conduction bearing substrate can be selected from pottery, copper, aluminium, CuAl 2O 4And comprise pottery, copper, aluminium, CuAl 2O 4The group that combination in any constituted, therefore can provide light-emitting component a good heat dissipation path.In addition, electroluminescent module also can comprise heat dissipation element, and it can be radiating fin or heat pipe.Heat dissipation element contacts with the heat conduction bearing substrate, so that the heat energy that light-emitting component was produced is got rid of effectively.
From the above, module substrate according to a kind of electroluminescent module of the present invention has perforate, therefore the light that light-emitting component produced can directly be penetrated by opening, the heat energy that light-emitting component produced then can provide heat dissipation path to heat dissipation element by the heat conduction bearing substrate with high thermal conductivity coefficient, so that the heat energy that light-emitting component was produced is effectively conducted to the external world, to improve the luminous efficiency of electroluminescent module.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and in conjunction with the accompanying drawings, be described in detail below:
Description of drawings
Fig. 1 is a kind of schematic diagram of existing light-emitting diode (LED) module.
Fig. 2 is the schematic diagram according to a kind of electroluminescent module of the preferred embodiment of the present invention.
Fig. 3 A is another schematic diagram according to a kind of electroluminescent module of the preferred embodiment of the present invention.
Fig. 3 B is the another schematic diagram according to a kind of electroluminescent module of the preferred embodiment of the present invention.
The simple symbol explanation
1: light-emitting diode (LED) module 11: LED package
111: light-emitting diode 112: bearing substrate
113: encapsulation material 12: module substrate
121: electrical connection pad S01: first surface
S02: second surface S11: surface
SO1: scolder P01:p type doped layer
I01: luminescent layer N01:n type doped layer
The E01:p type contacts electric E02:n type contact electrode
PC1: patterned conductive layer B01: first conductive area
B02: second conductive area 2: electroluminescent module
21: module substrate 211: first surface
212: 213: the first patterned electrodes of perforate
214: scolder 215: reflector
216: second surface 216A: inclined-plane
22: heat conduction bearing substrate 221: bearing part
2210: 222: the second patterned electrodes in the bottom surface of bearing part
223: heat conductive insulating layer 23: light-emitting component
Semiconductor layer 232 in 231: the first: luminescent layer
Semiconductor layer 234 in 233: the second: the encapsulation material
E11: the first electrode E12: second electrode
24: heat dissipation element
Embodiment
Hereinafter with reference to relevant drawings, illustrate according to electroluminescent module of the present invention.
Please refer to shown in Figure 2ly, comprise module substrate 21, heat conduction bearing substrate 22 and light-emitting component 23 according to a kind of electroluminescent module 2 of the preferred embodiment of the present invention.In the present embodiment, light-emitting component 23 is such as but not limited to light-emitting diode.
Module substrate 21 has first surface 211, perforate 212 and first patterned electrodes 213.Wherein first patterned electrodes 213 is provided with or is formed on the first surface 211.In the present embodiment, module substrate 21 can be plastic substrate, flexible PCB (Flexible printed circuit, FPC), ceramic substrate or printed circuit board (PCB).In addition, perforate 212 is through module substrate 21, and its can be rounded, square, triangle, polygon or other shapes.
Heat conduction bearing substrate 22 has the bearing part 221 and second patterned electrodes 222, its setting or be formed on the bearing part 221.Wherein, the first surface 211 of bearing part 221 and module substrate 21 is relative and establish (being provided with face-to-face), and first patterned electrodes 213 of second patterned electrodes 222 and module substrate 21 is relative and establish (being provided with face-to-face), and is electrically connected mutually by for example scolder 214.In the present embodiment, heat conduction bearing substrate 22 can be composite substrate, metal substrate or ceramic substrate.Wherein, the material of composite substrate is such as but not limited to pottery/CuAl 2O 4/ copper, and the material of metal substrate is such as but not limited to copper or aluminium.
In the present embodiment, when the material of heat conduction bearing substrate 22 was non-conducting material, then second patterned electrodes 222 can directly be arranged on the bearing part 221.Yet when the material of heat conduction bearing substrate 22 was electric conducting material, heat conduction bearing substrate 22 also can comprise heat conductive insulating layer 223, and it is arranged between the bearing part 221 and second patterned electrodes 222, isolated patterned electrodes 222 and bearing part 221 with electricity.What deserves to be mentioned is, the material of heat conductive insulating layer 223 can be aluminium nitride (AlN) or carborundum (SiC), wherein the conductive coefficient of aluminium nitride is about 200～230 (W/mk), and the conductive coefficient of carborundum is about 300～490 (W/mk), therefore can conduct heat energy effectively to extraneous.
Light-emitting component 23 is arranged in the perforate 212 of module substrate 21, and is arranged on the heat conduction bearing substrate 22, and therefore, the light that light-emitting component 23 is produced can directly be penetrated by the perforate 212 of module substrate 21.Light-emitting component 23 has first semiconductor layer 231, luminescent layer 232, second semiconductor layer 233, the first electrode E 11 and the second electrode E12.Wherein, first semiconductor layer 231, luminescent layer 232 and second semiconductor layer 233 stack gradually setting, and promptly luminescent layer 232 is arranged on first semiconductor layer 231, and second semiconductor layer 233 is arranged on the luminescent layer 232.The first electrode E11 is electrically connected with first semiconductor layer 231, and the second electrode E12 is electrically connected with second semiconductor layer 233.In the present embodiment, first semiconductor layer 231 is a p type doped layer, and second semiconductor layer 232 is a n type doped layer.In addition, the first electrode E11 directly is arranged on first semiconductor layer 231, and the second electrode E12 directly is arranged on second semiconductor layer 233.Moreover the first electrode E11 and the second electrode E12 also can be electrically connected with the corresponding part of second patterned electrodes 222 respectively by scolder 214.
In the present embodiment, light-emitting component 23 also comprises encapsulation material 234, and its material is such as but not limited to resin, so long as transparent encapsulating material gets final product.Encapsulation material 234 coats first semiconductor layer 231, luminescent layer 232, second semiconductor layer 233, the first electrode E11 and the second electrode E12 at least.Wherein encapsulate material 234 except can protecting light-emitting component 23, after the suitable design of process, its lens (lens) that also can be used as optically focused or astigmatism use.
Moreover in the present embodiment, electroluminescent module 2 also comprises heat dissipation element 24, and it engages with heat conduction bearing substrate 22.In the present embodiment, heat dissipation element 24 engages with the bottom surface 2210 of the bearing part 221 of heat conduction bearing substrate 22.Wherein, heat dissipation element 24 can be sealed or bonding with bottom surface 2210.In addition, in the present embodiment, heat dissipation element 24 can be radiating fin (heat sink) or heat pipe (heat pipe), is not limited at this.
Shown in Fig. 3 A, the module substrate 21 of electroluminescent module 2 also can comprise groove 214 and reflector 215.
Groove 214 be arranged at first surface 211 and be located on perforate 212 around, and the part first patterned electrodes 213 be arranged in the groove 214, relative, the part heat conduction bearing substrate 22 also be arranged in groove 214.In the present embodiment, groove 214 can be effectively fixing heat conduction bearing substrate 22, and then heat dissipation element 24 is closely engaged with heat conduction bearing substrate 22, to avoid generation loosening or displacement.
Reflector 215 is provided with or is formed at the relative and second surface 216 established of first surface 211 with module substrate 21.Wherein, reflector 215 on being formed at second surface 216, also may extend to the sidewall W1 of perforate 212, the light that makes light-emitting component 23 be produced can suitably be reflected, to increase the light service efficiency.In addition, the material in reflector 33 can be selected from the group that platinum (Pt), gold (Au), silver (Ag), palladium (Pd), nickel (Ni), chromium (Cr), titanium (Ti) and combination thereof are constituted.
In addition, shown in Fig. 3 B, the second surface 216 of module substrate 21 can have inclined-plane 216A for another example, its be formed at perforate 212 around, via suitable design, reflector formed thereon 215 is reflection ray more efficiently, to increase the light utilization ratio.In the present embodiment, inclined-plane 216A also can be curved surface, is not limited at this.
The light-emitting component 23 of the electroluminescent module 2 of the foregoing description is example with flip-chip bonding (flip chip) on part second patterned electrodes 222 of heat conduction bearing substrate 22, but is not limited at this.Certainly, according to the design (for example vertical stratification) of light-emitting component 23 different modes, light-emitting component 23 also can go between bonding (wire bonding) on part second patterned electrodes 222 of heat conduction bearing substrate 22.
In addition, in the foregoing description, with a light-emitting component 23 and heat dissipation element 24 of heat conduction bearing substrate 22 collocation, but be not limited to this, it also can be used by a plurality of light-emitting components 23 and heat dissipation element of a plurality of heat conduction bearing substrate 22 collocation 24.
In sum, owing to have perforate on the module substrate of electroluminescent module provided by the present invention, make the light that light-emitting component produced directly to penetrate by opening, the heat energy that light-emitting component produced then can provide heat dissipation path to heat dissipation element by the heat conduction bearing substrate with high thermal conductivity coefficient, so that the heat energy that light-emitting component was produced is effectively conducted to the external world, to improve the luminous efficiency of electroluminescent module.In addition, by the setting in reflector, the light that can reflect light-emitting component effectively and produced is to improve light utilization.Moreover, the groove of module substrate can be firmly fixing heat conduction bearing substrate, avoid its loosening or displacement, can also improve the reliability of electroluminescent module.
The above only is an illustrative, and nonrestrictive.Anyly do not break away from spirit of the present invention and scope, and, all should be contained among the claim its equivalent modifications of carrying out or change.

Claims (18)

1, a kind of electroluminescent module comprises:
Module substrate has perforate, first surface and is arranged at first patterned electrodes of this first surface;
The heat conduction bearing substrate has bearing part and is arranged at second patterned electrodes of this bearing part, and wherein this first surface of this bearing part and this module substrate is relative and establish, and this second patterned electrodes is relative with this first patterned electrodes and establish and be electrically connected mutually; And
Light-emitting component, be arranged in this perforate of this module substrate, and be arranged on this heat conduction bearing substrate, this light-emitting component has first electrode and second electrode, it is electrically connected with the corresponding part of this second patterned electrodes of this heat conduction bearing substrate respectively, and wherein this module substrate also has second surface and reflector, and this second surface is relative with this first surface and establish, and this reflector is formed at this second surface, and reflects the light that this light-emitting component produces.
2, electroluminescent module as claimed in claim 1, wherein rounded, square, the triangle of this perforate of this module substrate, polygon or other shapes.
3, electroluminescent module as claimed in claim 1, wherein this module substrate also has groove, its be located on this perforate around, this first patterned electrodes is arranged at this groove.
4, electroluminescent module as claimed in claim 3, some of these heat conduction bearing substrates are placed in this groove.
5, electroluminescent module as claimed in claim 1, wherein this module substrate is plastic substrate, flexible PCB, ceramic substrate or printed circuit board (PCB).
6, electroluminescent module as claimed in claim 1, wherein this second surface has inclined-plane or curved surface, and it is formed at around this perforate.
7, electroluminescent module as claimed in claim 1, wherein this module substrate also has the reflector, and it is formed at the sidewall in this perforate.
8, electroluminescent module as claimed in claim 1, wherein this heat conduction bearing substrate is composite substrate, metal substrate or ceramic substrate.
9, electroluminescent module as claimed in claim 8, wherein the material of this heat conduction bearing substrate is pottery, copper, aluminium, CuAl 2O 4Or comprise pottery, copper, aluminium, CuAl 2O 4Combination in any.
10, electroluminescent module as claimed in claim 1, wherein this heat conduction bearing substrate also has the heat conductive insulating layer, be formed between this bearing part and this second patterned electrodes, and the material of this heat conductive insulating layer is aluminium nitride or carborundum.
11, electroluminescent module as claimed in claim 1 also comprises:
Heat dissipation element engages with this heat conduction bearing substrate.
12, electroluminescent module as claimed in claim 11, wherein this heat dissipation element engages with the bottom surface of this bearing part of this heat conduction bearing substrate.
13, electroluminescent module as claimed in claim 11, wherein this heat dissipation element is radiating fin or heat pipe.
14, electroluminescent module as claimed in claim 1, wherein this light-emitting component is a light-emitting diode, and comprises at least:
First semiconductor layer;
Luminescent layer is arranged on this first semiconductor layer; And
Second semiconductor layer is arranged on this luminescent layer.
15, electroluminescent module as claimed in claim 14, wherein this first semiconductor layer is a p type doped layer, this second semiconductor layer is a n type doped layer.
16, electroluminescent module as claimed in claim 14, wherein this of this light-emitting component first electrode is electrically connected with this first semiconductor layer, and this second electrode is electrically connected with this second semiconductor layer.
17, electroluminescent module as claimed in claim 14, wherein this light-emitting component also comprises:
The encapsulation material, it coats this first semiconductor layer, this luminescent layer, this second semiconductor layer, this first electrode and this second electrode at least;
Wherein the material of this encapsulation material is a resin, or other transparent encapsulating materials.
18, electroluminescent module as claimed in claim 1, wherein this light-emitting component flip-chip bonding or lead-in wire are bonded to this second patterned electrodes of part of this heat conduction bearing substrate.
CNB2006101717642A 2006-12-29 2006-12-29 Electroluminescent module Expired - Fee Related CN100568558C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006101717642A CN100568558C (en) 2006-12-29 2006-12-29 Electroluminescent module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006101717642A CN100568558C (en) 2006-12-29 2006-12-29 Electroluminescent module

Publications (2)

Publication Number Publication Date
CN101212007A CN101212007A (en) 2008-07-02
CN100568558C true CN100568558C (en) 2009-12-09

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102185090B (en) * 2011-03-29 2013-08-21 晶科电子（广州）有限公司 Luminescent device adopting COB (chip on board) packaging and manufacturing method thereof
CN103515508A (en) * 2012-06-19 2014-01-15 茂邦电子有限公司 Light emitting diode package and its used heat-removal module
CN104362244A (en) * 2014-11-17 2015-02-18 杨文澍 Metal substrate
CN109817793B (en) * 2016-08-31 2022-01-04 开发晶照明（厦门）有限公司 LED module

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