CN102095094A - Led lamp and manufacturing method thereof - Google Patents
Led lamp and manufacturing method thereof Download PDFInfo
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- CN102095094A CN102095094A CN2010105550512A CN201010555051A CN102095094A CN 102095094 A CN102095094 A CN 102095094A CN 2010105550512 A CN2010105550512 A CN 2010105550512A CN 201010555051 A CN201010555051 A CN 201010555051A CN 102095094 A CN102095094 A CN 102095094A
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- light
- led light
- emitting area
- emitting diode
- backlight unit
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Abstract
The invention discloses an LED lamp and a manufacturing method thereof. The LED lamp comprises an LED chip (1) and a shell (2), wherein the shell (2) is provided with a light-emitting surface (5) used for installing the LED (1); a circuit layer (3) covers on the light-emitting surface (5); the LED chip (1) is welded on the circuit layer (3); and adhesive layers (4) are arranged above the LED chip (1) and on the periphery of the LED chip (1). The manufacturing method of the LED lamp comprises the steps of cleaning, sensibilisation, chemical plating, plating, and the like. By adopting the invention, the LED chip (1) is welded on the circuit layer (3) by manufacturing the circuit layer (3) on the light-emitting surface (5) of the shell (2) without using a circuit board , thereby the cost is saved, but also the space inside the shell (2) is saved and the installation is convenient.
Description
Technical field:
The present invention relates to light fixture and make the field, specifically is a kind of LED light fixture and preparation method thereof.
Background technology:
The LED light fixture is made up of LED light-emitting diode chip for backlight unit, circuit board and housing, described LED light-emitting diode chip for backlight unit is welded on the circuit board through the weld tabs on the support, described support generally is the white plastic sheet, and the weld tabs on the described support is connected with the LED light-emitting diode chip for backlight unit; Described power panel is installed in enclosure interior.LED light fixture of the prior art must be used circuit board, power supply need be given the power supply of LED light-emitting diode chip for backlight unit through the circuit on the circuit board, circuit board has not only increased the cost of manufacture of LED light fixture, and because the space in the housing is limited, mounting circuit boards is also relatively more difficult in housing; In addition, in the prior art, when being welded on the LED light emitting diode on the circuit board, generally adopt Reflow Soldering or wave-soldering, and this welding manner temperature is higher, cool time is long, damages the LED light-emitting diode chip for backlight unit easily.
Summary of the invention:
The technical problem to be solved in the present invention is, provides a kind of cost of manufacture LED light fixture low, easy for installation, and this LED light fixture need not mounting circuit boards in housing.
Technical solution of the present invention is, the LED light fixture of following structure is provided, comprise LED light-emitting diode chip for backlight unit and housing, described housing is provided with in order to the light-emitting area of LED light-emitting diode chip for backlight unit to be installed, be coated with circuit layer on the described light-emitting area, described LED light-emitting diode chip for backlight unit is welded on the circuit layer, the top of described LED light-emitting diode chip for backlight unit and be provided with glue-line on every side.
Adopt above structure compared with prior art, the present invention has the following advantages: adopt structure of the present invention, do not need to use circuit board, it is just passable only to need to be provided with circuit layer on the light-emitting area of housing, the LED light-emitting diode chip for backlight unit is welded on the circuit layer, not only provide cost savings, and saved the interior space of housing, made things convenient for installation.
As improvement, described welding is meant ultrasonic bonding, like this, and the advantage that temperature is low because ultrasonic bonding has, weld interval is short, avoided effectively damaging the LED light-emitting diode chip for backlight unit, prolonged the service life of LED light emitting diode because of the high temperature of welding.
Another technical problem that the present invention will solve is that the preparation method of a kind of cost of manufacture LED light fixture low, easy for installation is provided.
Another technical solution of the present invention is, the preparation method of following LED light fixture is provided, and may further comprise the steps:
(1), the light-emitting area to housing clean, oil removing;
(2), according to the layout of circuit, thereby sensitization forms easy coating to light-emitting area;
(3), adopt chemical plating process, successively to light-emitting area copper facing, nickel plating, afterwards light-emitting area is cleaned;
(4), on light-emitting area electrosilvering, finally at light-emitting area circuit forming surface layer;
(5), the LED light-emitting diode chip for backlight unit is welded on the light-emitting area;
(6), to the top and the circumfusion glue of LED light-emitting diode chip for backlight unit, and make the glue sclerosis through baking.
Adopt after the above method compared with prior art, the present invention has the following advantages: adopt the inventive method, do not need to use support, saved material and production cost, can be by above-mentioned steps at light-emitting area circuit forming surface layer, thus the LED light-emitting diode chip for backlight unit is conducted electricity by circuit layer
As improvement, in step (5), described welding is meant the mode that adopts ultrasonic bonding, the LED light emitting diode directly is welded on the circuit layer of light-emitting area, the advantage that temperature is low because ultrasonic bonding has, weld interval is short, all have avoided damaging the LED light-emitting diode chip for backlight unit because of the high temperature of welding (prior art generally adopts Reflow Soldering or wave-soldering) effectively, have prolonged the service life of LED light-emitting diode chip for backlight unit.
As improvement, in the step (2), described sensitization is meant light-emitting area is immersed in the palladium solution.
As improvement, between step (3) and step (4), successively to light-emitting area electro-coppering, electronickelling.Like this, when preventing chemical plating, the copper and mickel that plates is fewer, thereby may cause conduction bad, by electro-coppering, electronickelling, can increase the thickness of copper, nickel.
Description of drawings:
Fig. 1 is the upward view of LED light fixture of the present invention.
Fig. 2 is the partial enlarged drawing of LED light fixture of the present invention.
Shown in the figure 1, the LED light-emitting diode chip for backlight unit, 2, housing, 3, circuit layer, 4, glue-line, 5, light-emitting area.
The specific embodiment:
The invention will be further described to adopt the specific embodiment below:
As shown in Figure 1 and Figure 2, LED light fixture of the present invention, comprise LED light-emitting diode chip for backlight unit 1 and housing 2, described housing 2 is provided with in order to the light-emitting area 5 of LED light-emitting diode chip for backlight unit 1 to be installed, be coated with circuit layer 3 on the described light-emitting area 5, described LED light-emitting diode chip for backlight unit 1 is welded on the circuit layer 3; The top of described LED light-emitting diode chip for backlight unit 1 and be provided with glue-line 4 on every side; Described light-emitting area 5 is not irradiative surface itself, but could be luminous owing to LED light-emitting diode chip for backlight unit 1 has been installed.
Described welding is meant ultrasonic bonding.
The preparation method of LED light fixture of the present invention may further comprise the steps:
(1), the light-emitting area to housing clean, oil removing; To light-emitting area cleaning, oil removing mainly is for the ease of follow-up processing, if light-emitting area leaves spot, just can make the part can't sensitization and chemical plating, thus complete circuit layer, poor reliability can't be formed;
(2), according to the layout of circuit, thereby sensitization forms easy coating to light-emitting area; Before sensitization, pre-designed circuit, to the local sensitization that needs on the light-emitting area to conduct electricity, and then form easy coating, described easy coating is meant the surface of being convenient to the subsequent chemistry plating; The sensitization here generally is meant light-emitting area is immersed in palladium solution the inside;
(3), adopt chemical plating process, successively to light-emitting area copper facing, nickel plating, afterwards light-emitting area is cleaned;
(4), on light-emitting area electrosilvering, finally at light-emitting area circuit forming surface layer; Because silver relatively is convenient to welding, so silver-plated the most surperficial;
(5), the LED light-emitting diode chip for backlight unit is welded on the light-emitting area;
(6), to the top of LED light-emitting diode chip for backlight unit and spreading glue on every side, and make the glue sclerosis and then form glue-line through baking; The purpose of the encapsulating process among the present invention is the LED light-emitting diode chip for backlight unit is fixed with light-emitting area effectively, and described glue can adopt this LED encapsulation field epoxide resin material commonly used.
Adopt the ultrasonic bonding mode, directly be welded on the LED light emitting diode on the light-emitting area; Ultrasonic bonding is to utilize the dither ripple to be delivered to the body surface of two need welding, under the situation of pressurization, makes the mutual friction of two body surface phases and forms fusion between the molecular layer; The advantage of ultrasonic bonding: welding temperature is low, speed of welding is fast, weld strength is high, good airproof performance.
Between step (3) and step (4), successively to light-emitting area electro-coppering, electronickelling.
Below only just preferred embodiment of the present invention be described, but can not be interpreted as it is restriction to claim.The present invention not only is confined to above embodiment; its concrete steps allow variation; for example: when glue sclerosis when very fast; the process of baking can be omitted; promptly adopt air-set just passable; in a word, all various variations of being done in the protection domain of independent claims of the present invention are all in protection scope of the present invention.
Claims (6)
1. LED light fixture, comprise LED light-emitting diode chip for backlight unit (1) and housing (2), it is characterized in that: described housing (2) is provided with in order to the light-emitting area (5) of LED light-emitting diode chip for backlight unit (1) to be installed, be coated with circuit layer (3) on the described light-emitting area (5), described LED light-emitting diode chip for backlight unit (1) is welded on the circuit layer (3); The top of described LED light-emitting diode chip for backlight unit (1) and be provided with glue-line (4) on every side.
2. LED light fixture according to claim 1 is characterized in that: described welding is meant ultrasonic bonding.
3. the preparation method of a LED light fixture, it is characterized in that: it may further comprise the steps:
(1), the light-emitting area to housing clean, oil removing;
(2), according to the layout of circuit, thereby sensitization forms easy coating to light-emitting area;
(3), adopt chemical plating process, successively to light-emitting area copper facing, nickel plating, afterwards light-emitting area is cleaned;
(4), on light-emitting area electrosilvering, finally at light-emitting area circuit forming surface layer;
(5), the LED light-emitting diode chip for backlight unit is welded on the light-emitting area;
(6), to the top of LED light-emitting diode chip for backlight unit and spreading glue on every side, and make the glue sclerosis and then form glue-line through baking.
4. the preparation method of LED light fixture according to claim 3 is characterized in that: in the step (5), described welding is meant the mode that adopts ultrasonic bonding, the LED light emitting diode directly is welded on the circuit layer of light-emitting area.
5. the preparation method of LED light fixture according to claim 3 is characterized in that: in the step (2), described sensitization is meant light-emitting area is immersed in the palladium solution.
6. the preparation method of LED light fixture according to claim 3 is characterized in that: between step (3) and step (4), successively to light-emitting area electro-coppering, electronickelling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105550512A CN102095094A (en) | 2010-11-17 | 2010-11-17 | Led lamp and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105550512A CN102095094A (en) | 2010-11-17 | 2010-11-17 | Led lamp and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102095094A true CN102095094A (en) | 2011-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105550512A Pending CN102095094A (en) | 2010-11-17 | 2010-11-17 | Led lamp and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN102095094A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107470730A (en) * | 2016-06-07 | 2017-12-15 | 程国中 | A kind of welding method of LED area light source and wiring board |
| CN107883327A (en) * | 2017-12-20 | 2018-04-06 | 李春田 | A kind of LED lamp and preparation method for automatically adjusting colour temperature |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201141553Y (en) * | 2007-12-25 | 2008-10-29 | 珠海市寰宇之光能源科技有限公司 | LED lamp with reflecting film |
| CN101586795A (en) * | 2008-05-23 | 2009-11-25 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN201964164U (en) * | 2010-11-17 | 2011-09-07 | 象山中翔电子科技有限公司 | LED (light-emitting diode) lamp |
-
2010
- 2010-11-17 CN CN2010105550512A patent/CN102095094A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201141553Y (en) * | 2007-12-25 | 2008-10-29 | 珠海市寰宇之光能源科技有限公司 | LED lamp with reflecting film |
| CN101586795A (en) * | 2008-05-23 | 2009-11-25 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN201964164U (en) * | 2010-11-17 | 2011-09-07 | 象山中翔电子科技有限公司 | LED (light-emitting diode) lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107470730A (en) * | 2016-06-07 | 2017-12-15 | 程国中 | A kind of welding method of LED area light source and wiring board |
| CN107883327A (en) * | 2017-12-20 | 2018-04-06 | 李春田 | A kind of LED lamp and preparation method for automatically adjusting colour temperature |
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Application publication date: 20110615 |