CN107470730A - A kind of welding method of LED area light source and wiring board - Google Patents
A kind of welding method of LED area light source and wiring board Download PDFInfo
- Publication number
- CN107470730A CN107470730A CN201610393969.9A CN201610393969A CN107470730A CN 107470730 A CN107470730 A CN 107470730A CN 201610393969 A CN201610393969 A CN 201610393969A CN 107470730 A CN107470730 A CN 107470730A
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- China
- Prior art keywords
- light source
- area light
- wiring board
- led area
- ultrasonic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 80
- 238000004021 metal welding Methods 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 63
- 239000010949 copper Substances 0.000 claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 239000011247 coating layer Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of welding method, specifically discloses a kind of LED area light source and the welding method of wiring board, comprises the following steps:Prepare LED area light source, wiring board and 35KHz ultrasonic wave metal welding machines;The output copper cash at wiring board both ends is pressed in the solder side of the LED area light source;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, in welding process, the air pressure of ultrasonic wave metal welding machine is adjusted in 1.8kgf/mm2 ~ 4kgf/mm2 according to the coating material of the solder side of LED area light source and coating layer thickness;Welding maintains a period of time, until the output copper cash at wiring board both ends is fixed in LED area light source.The speed of welding block of the present invention, without any welding material and auxiliary material, has saved cost, has reduced pollution.
Description
Technical field
The present invention relates to a kind of welding method, and in particular to a kind of LED area light source and the welding method of wiring board.
Background technology
Known, the coating material of the solder side of LED area light source has a variety of, common coatings to have three kinds of copper, gold and silver.And in lighting field, LED area light source is usual and two output ends of wiring board weld together, the material of two output ends of wiring board is copper cash, welded at present between LED area light source and copper cash using soldering method, but particularity and preferable heat conductivility due to LED area light source, so be difficult to control with leadless welding wire human weld during soldering, soldering appliance in use(Typically electric iron)Iron head temperature heating it is slower, heat conduction is very fast, easily causes serious problem of faulty soldering.
The method of existing this soldering, not only the strong influence qualification rate of product, and tin material and scaling powder are employed during soldering(Usually rosin), the manufacturing cost of product is added, has aggravated environmental pollution.
The content of the invention
The purpose of the present invention is exactly to solve the problem of prior art, so as to provide the welding method of a kind of LED area light source and wiring board, this method can overcome the defects of background technology, without any other welding material outside LED area light source and wiring board body, reduce cost.
In order to solve the above-mentioned technical problem, the technology used in the present invention means are:The welding method of a kind of LED area light source and wiring board, it is characterised in that this method comprises the following steps:(1)Prepare LED area light source, wiring board and 35KHz ultrasonic wave metal welding machines;(2)The output copper cash at wiring board both ends is pressed on the solder side of the LED area light source;(3)By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, in welding process, the air pressure of ultrasonic wave metal welding machine is adjusted in 1.8kgf/mm2 ~ 4kgf/mm2 according to the coating material of the solder side of LED area light source and coating layer thickness;(4)Welding maintains a period of time, until the output copper cash at wiring board both ends is fixed in LED area light source.
Preferably:The step(3)In 35KHz ultrasonic wave metal welding machine weld interval be no more than 3 seconds.
Preferably:The coating layer thickness of solder side in the LED area light source is 0.035 μm ~ 0.14 μm.
Preferably:A diameter of 0.1mm ~ 0.4mm of the output copper cash at the wiring board both ends.
The beneficial effects of the invention are as follows:Species and thickness of the welding method of the present invention for the coating material of the solder side of existing LED area light source, select ultrasonic energy can be by the output copper wire welding at wiring board both ends in LED area light source for 35KHz ultrasonic wave metal welding machine, and without welding material and scaling powder in welding process, reduce cost, reduce pollution;On the other hand, because the amplification of ultrasonic wave is stable, the qualification rate of product is substantially increased.
Embodiment
The embodiment of the present invention is described in detail with reference to preferable scheme and specific embodiment, and illustrates that the welding method of the present invention can be achieved.
Disclosed by the invention is a kind of LED area light source and the welding method of wiring board, and the welding method comprises the following steps:(1)Prepare LED area light source, wiring board and 35KHz ultrasonic wave metal welding machines;(2)The output copper cash at wiring board both ends is pressed on the solder side of the LED area light source;(3)By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, in welding process, the air pressure of ultrasonic wave metal welding machine is adjusted in 1.8kgf/mm2 ~ 4kgf/mm2 according to the coating material of the solder side of LED area light source and coating layer thickness;(4)Welding maintains a period of time, until the output copper cash at wiring board both ends is fixed in LED area light source.
Preferable scheme:The step(3)In 35KHz ultrasonic wave metal welding machine weld interval be no more than 3 seconds;The coating layer thickness of solder side in the LED area light source is 0.035 μm ~ 0.14 μm;A diameter of 0.1mm ~ 0.4mm of the output copper cash at the wiring board both ends.
Embodiment one:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is copper, and the thickness of copper is 0.035 μm;Prepare a diameter of 0.1mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layers of copper of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 1.8kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 0.8 second.
Embodiment two:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is silver, and silver-colored thickness is 0.035 μm;Prepare a diameter of 0.1mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed on the silver layer of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.0kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1 second.
Embodiment three:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is gold, and golden thickness is 0.035 μm;Prepare a diameter of 0.1mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layer gold of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.2kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1.2 seconds.
Example IV:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is copper, and the thickness of copper is 0.07 μm;Prepare a diameter of 0.2mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layers of copper of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.51kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1.5 seconds.
Embodiment five:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is silver, and silver-colored thickness is 0.07 μm;Prepare a diameter of 0.2mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed on the silver layer of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.4kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1.4 seconds.
Embodiment six:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is gold, and golden thickness is 0.07 μm;Prepare a diameter of 0.2mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layer gold of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.62kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1.6 seconds.
Embodiment seven:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is copper, and the thickness of copper is 0.105 μm;Prepare a diameter of 0.3mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layers of copper of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 2.8kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 1.8 seconds.
Embodiment eight:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is silver, and silver-colored thickness is 0.105 μm;Prepare a diameter of 0.3mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed on the silver layer of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 3kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 2 seconds.
Embodiment nine:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is gold, and golden thickness is 0.105 μm;Prepare a diameter of 0.3mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layers of copper of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 3.08kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 2.1 seconds.
Embodiment ten:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is copper, and the thickness of copper is 0.14 μm;Prepare a diameter of 0.4mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layers of copper of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 3.7kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 2.7 seconds.
Embodiment 11:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is silver, and silver-colored thickness is 0.14 μm;Prepare a diameter of 0.4mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed on the silver layer of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 3.8kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 2.8 seconds.
Embodiment 12:The present embodiment combines preferable scheme to illustrate, first prepares LED area light source, the coating material of the solder side of LED area light source is gold, and golden thickness is 0.14 μm;Prepare a diameter of 0.4mm of the output copper cash at both ends wiring board, and 35KHz ultrasonic wave metal welding machine one again;The output copper cash at wiring board both ends is pressed in the layer gold of LED area light source by jig;By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, the air pressure of ultrasonic wave metal welding machine is arranged on 4kgf/mm2 in welding process;When the output copper cash at wiring board both ends is fixed in LED area light source, closes immediately and withdraw ultrasonic wave metal welding machine, the weld interval of the ultrasonic wave metal welding machine in the present embodiment is 3 seconds.
Welding method disclosed by the invention is simple, but effect is clearly, compared with existing soldering method, the time of welding is greatly accelerated, welding material and scaling powder is also saved, saves cost, reduce pollution, using suitable ultrasonic energy and ultrasonic wave air pressure, realize the temperature requirement of the solder side of LED area light source, substantially increase product qualification rate it is disposable.
Claims (4)
1. the welding method of a kind of LED area light source and wiring board, it is characterised in that this method comprises the following steps:
(1)Prepare LED area light source, wiring board and 35KHz ultrasonic wave metal welding machines;
(2)The output copper cash at wiring board both ends is pressed on the solder side of the LED area light source;
(3)By 35KHz ultrasonic wave metal welding machine by the output copper wire welding at wiring board both ends on the solder side of LED area light source, in welding process, the air pressure of ultrasonic wave metal welding machine is adjusted in 1.8kgf/mm2 ~ 4kgf/mm2 according to the coating material of the solder side of LED area light source and coating layer thickness;(4)Welding maintains a period of time, until the output copper cash at wiring board both ends is fixed in LED area light source.
2. the welding method of LED area light source according to claim 1 and wiring board, it is characterised in that:The step(3)In 35KHz ultrasonic wave metal welding machine weld interval be no more than 3 seconds.
3. the welding method of LED area light source according to claim 1 and wiring board, it is characterised in that:The coating layer thickness of solder side in the LED area light source is 0.035 μm ~ 0.14 μm.
4. the welding method of LED area light source according to claim 1 and wiring board, it is characterised in that:A diameter of 0.1mm ~ 0.4mm of the output copper cash at the wiring board both ends.
Priority Applications (1)
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CN201610393969.9A CN107470730A (en) | 2016-06-07 | 2016-06-07 | A kind of welding method of LED area light source and wiring board |
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CN201610393969.9A CN107470730A (en) | 2016-06-07 | 2016-06-07 | A kind of welding method of LED area light source and wiring board |
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CN201827671U (en) * | 2009-05-08 | 2011-05-11 | 罗本杰(北京)光电研究所有限公司 | Reflective and heat radiation base for high-power LED light source |
CN102095094A (en) * | 2010-11-17 | 2011-06-15 | 象山中翔电子科技有限公司 | Led lamp and manufacturing method thereof |
US20150078014A1 (en) * | 2011-11-01 | 2015-03-19 | Tsmc Solid State Lighting Ltd. | Led module and method of bonding thereof |
CN104716061A (en) * | 2015-01-29 | 2015-06-17 | 信阳师范学院 | Ultrasonic welding method and photovoltaic module for welding through ultrasonic welding method |
-
2016
- 2016-06-07 CN CN201610393969.9A patent/CN107470730A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2612496Y (en) * | 2003-03-24 | 2004-04-21 | 常州振兴中大光源材料有限公司 | Digital control impulse ultrasonic spot welding machine |
CN101455132A (en) * | 2006-05-22 | 2009-06-10 | 皇家飞利浦电子股份有限公司 | Interconnection arrangement and method for interconnecting a high-current carrying cable with a metal thin-film |
CN201827671U (en) * | 2009-05-08 | 2011-05-11 | 罗本杰(北京)光电研究所有限公司 | Reflective and heat radiation base for high-power LED light source |
CN102095094A (en) * | 2010-11-17 | 2011-06-15 | 象山中翔电子科技有限公司 | Led lamp and manufacturing method thereof |
US20150078014A1 (en) * | 2011-11-01 | 2015-03-19 | Tsmc Solid State Lighting Ltd. | Led module and method of bonding thereof |
CN104716061A (en) * | 2015-01-29 | 2015-06-17 | 信阳师范学院 | Ultrasonic welding method and photovoltaic module for welding through ultrasonic welding method |
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Effective date of registration: 20171229 Address after: 214161 lakes in Jiangsu province Wuxi City foreshore Hongxiang Hudai Town Road No. 26 Applicant after: Wuxi Yun yuan Photoelectric Technology Co., Ltd. Address before: 214000 Jiangsu Province, south of the New District of Wuxi Jiangnan garden, room 84, No. 1002 Applicant before: Cheng Guozhong |
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Application publication date: 20171215 |