CN102049580A - Welding method of lead frame - Google Patents
Welding method of lead frame Download PDFInfo
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- CN102049580A CN102049580A CN 201010293732 CN201010293732A CN102049580A CN 102049580 A CN102049580 A CN 102049580A CN 201010293732 CN201010293732 CN 201010293732 CN 201010293732 A CN201010293732 A CN 201010293732A CN 102049580 A CN102049580 A CN 102049580A
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Abstract
The invention discloses a welding method of a lead frame, comprising the following steps of: (1) grinding stage: grinding away coated nickel at the position of a welding disk on the lead frame, and exposing material copper at the welding disk on the lead frame; (2) tin soldering paste printing stage: printing tin soldering paste at the position of the welding disk on the lead frame; (3) patch stage: laminating components on the tin soldering paste of the welding disk on the lead frame; (4) welding stage: feeding the lead frame into a reflow welding machine for welding; and (5) after the welding is finished, taking out the lead frame, standing to room temperature and then sending the lead frame for inspection. In the welding method, as the coated nickel at the position of the welding disk on the lead frame is removed, the tin soldering paste is directly printed on the copper; and in welding, weld nuggets are easily formed between the tin soldering paste and the copper, drag welding can be avoided for welding spots, therefore, the combination of the components and the surface of the welding disk is firmer, the welding reliability is enhanced, and further the requirement for improving the quality is met.
Description
Technical field
The present invention relates to a kind of welding method of lead frame.
Background technology
Welding is a kind of very important process in the present machinery manufacturing industry, and is along with miniaturization, microminiaturization and the high performance of electronic product, also just more and more higher to the requirement of welding procedure.In the manufacturing process of electronics, microelectronic component, the welding reliability problem becomes the focal issue that many people pay close attention to, and can reduce the damage of welding components and parts when improving soldering reliability is assurances of modern electronic product quality.
At present, take all factors into consideration from hardness, extensibility and cost performance aspect, the material of the lead frame in the welding procedure is generally selected copper or phosphorus hydrogen copper for use.But because copper is a kind of metal material of very easily oxidation, can influence welding effect greatly after the oxidation, also just influence the quality and the reliability of welding.For preventing the lead frame oxidation, reducing storage cost, can on lead frame, plate the material that one deck is difficult for oxidation usually, select for use nickel as coating in the industry usually.The lead frame soldering reliability of nickel coating, operability, easily degree of oxidation is the most moderate a kind of, so generally use in industry.
But still there is following shortcoming in the lead frame of nickel coating:
(1) solder joint on the lead frame drags weldering easily, does not promptly form metallic compound between components and parts pin and pad, and it is unreliable to weld;
The leadframe pad surface is not easy tin when (2) welding, and weld interval is long.
Reflow Soldering is to follow the appearance of microminiaturized electronic product and the solder technology that grows up, is mainly used in the welding of all kinds of surface-assembled components and parts.Its core link is to utilize the external heat source heating, makes solder fusing and the infiltration of flowing once more, finishes the welding of circuit board.And the equipment that the Reflow Soldering technology is used is reflow machine, also is Re-current welder.Reflow machine is set five zones of running parameter from distributing successively between inlet and the outlet, and these zones comprise heating zone, preheating zone, molten Xi Qu, soak into district and cooling zone.And the method that adopts reflow machine to weld may further comprise the steps:
(1) the printed solder paste stage: on the bond pad surface of circuit board, coat solder(ing) paste;
(2) the paster stage: the subsides of SMT components and parts are put on the corresponding position of pad of circuit board,, components and parts are fixed because solder(ing) paste has certain viscosity;
(3) the welding stage: allow the circuit board that has mounted components and parts enter reflow machine; The circuit board that has mounted components and parts makes solder(ing) paste through after super-dry, preheating, fusing, infiltration and the cooling components and parts being welded on the pad of circuit board successively through heating zone, preheating zone, molten Xi Qu, infiltration district and the cooling zone of reflow machine;
(4) take out circuit board after welding is finished and put, then censorship to room temperature.
Summary of the invention
Purpose of the present invention aims to provide a kind of welding method of lead frame.This welding method is simple to operate, is on the basis of existing lead frame welding method, strengthens welding reliability between components and parts and lead frame effectively by changing process.
The object of the invention can realize by following technical measures: a kind of welding method of lead frame may further comprise the steps:
(1) the polishing stage: the coating nickel of the pad locations on the lead frame is polished off, expose the material copper of the pad locations of lead frame,
(2) the printed solder paste stage: printed solder paste on the pad locations on the lead frame;
(3) the paster stage: components and parts are fitted on the solder(ing) paste of the pad on the lead frame;
(4) the welding stage: lead frame sent in the reflow machine weld;
(5) take out lead frame after welding is finished and put, then censorship to room temperature.
The present invention has changed the method for components and parts pin and the welding of bond pad surface nickel in the prior art, the coating nickel of the pad locations on the lead frame is polished off, expose the material copper of lead frame, this moment, the surface of pad locations was a copper, go up solder(ing) paste easily, components and parts pin and copper are directly welded.Solder(ing) paste and brazing be easier formation nugget when connecing, thereby makes components and parts more firm with combining of bond pad surface, has strengthened soldering reliability, reaches the lifting quality requirements.
Adopt the laser polishing that the coating nickel of the pad locations on the lead frame is polished off in the step described in the present invention (1).
Must carry out the operation of step (2) in 4 hours among the present invention after the coating nickel on the pad locations of step (1) lead frame polishes off, promptly printed solder paste on pad locations is proceeded the operation of step (3)～(5) then.
Compared with prior art, the present invention has following beneficial effect:
(1) among the present invention the coating nickel of the pad locations on the lead frame is polished off, expose lead frame material copper, the surface that makes pad locations is a copper, the components and parts pin directly connects with brazing, owing to solder(ing) paste directly is printed on the copper easier formation nugget between solder(ing) paste and copper during welding, weldering can not appear dragging in solder joint, thereby make components and parts more firm, strengthened soldering reliability, reach the lifting quality requirements with combining of bond pad surface.
(2) lead frame of the present invention flies after bond pad surface dispels coating nickel through polishing, solder(ing) paste on easier on the surperficial copper that pad exposes, thus effectively shorten weld interval.
(3) the present invention just polishes and dispels the coating nickel of leadframe pad position, do not change the material of lead frame, do not change the coating material yet, do not need special storage condition, thereby not only do not increase any Master Cost, do not increase storage expenses yet.
(4) the laser polishing of the present invention's employing, processing ease does not increase the production difficulty.
(5) the present invention is just on the basis of the method that existing components and parts pin and bond pad surface nickel weld, increase polishing and dispeled the operation of the coating nickel of leadframe pad position, can realize strengthening welding reliability between components and parts and lead frame, and entire method is simple, operation is suitable for applying easily.
Description of drawings
Fig. 1 is the flow diagram of the welding method of components and parts of the present invention and lead frame;
Fig. 2 is the front view through the lead frame after the laser polishing of the present invention.
The specific embodiment
As shown in Figure 1, be the welding method of a kind of lead frame of the present invention, may further comprise the steps:
(1) the polishing stage: lead frame is placed laser marking machine, focal length when operating current is 8.5-9A and laser polishing is under the condition of 28CM then, pad locations on the lead frame 12 is carried out the laser polishing, the coating nickel of pad locations 2 is polished off, the copper surface of exposing lead frame is referring to Fig. 2.Because the surface of pad locations 2 is a copper after polishing, make the components and parts pin directly and brazing connect, and solder(ing) paste and brazing easier formation nugget when connecing, thus make components and parts more firm with combining of bond pad surface, strengthen soldering reliability, reached the lifting quality requirements.
(2) the printed solder paste stage: in 4 hours after the coating nickel of the pad locations on step (1) lead frame polishes off, printing one deck solder(ing) paste on the copper surface of the pad locations on the lead frame.
(3) the paster stage: components and parts are pasted on the solder(ing) paste, and components and parts then rely on the viscosity of solder(ing) paste to be fitted on the pad of lead frame.
(4) the welding stage: lead frame put into send into reflow machine on the conveyer belt and weld; Lead frame behind the applying components and parts by the transfer rate of 600 mm/min enter successively reflow machine heating zone, preheating zone, molten Xi Qu, soak into district and cooling zone, and lead frame through time in above-mentioned five zones be respectively heating zone 1 minute, preheating zone 4 minutes, molten tin district 1 minute, soak into the district 1 minute, cooling zone 2 minutes.Solder(ing) paste is through after super-dry, preheating, fusing, infiltration and the cooling being welded to components and parts on the pad on the lead frame.The temperature in five districts of reflow machine is respectively 40～120 ℃ of heating zones, 120～180 ℃ of preheating zones, 180～260 ℃ in molten tin district, soaks into 260～310 ℃ in district, 260～120 ℃ of cooling zones.
(5) take out lead frame after welding is finished and put, then censorship to room temperature.
The present invention can summarize with other the concrete form without prejudice to spirit of the present invention or principal character.Above-mentioned embodiment of the present invention all can only be thought explanation of the present invention rather than restriction, therefore every foundation essence technology of the present invention all belongs in the scope of technical solution of the present invention any trickle modification, equivalent variations and modification that above embodiment did.
Claims (3)
1. the welding method of a lead frame is characterized in that, may further comprise the steps:
(1) the polishing stage: the coating nickel of the pad locations on the lead frame is polished off, expose the material copper of the pad locations of lead frame;
(2) the printed solder paste stage: printed solder paste on the pad locations on the lead frame;
(3) the paster stage: components and parts are fitted on the solder(ing) paste of the pad on the lead frame;
(4) the welding stage: lead frame sent in the reflow machine weld;
(5) take out lead frame after welding is finished and put, then censorship to room temperature.
2. the welding method of lead frame according to claim 1 is characterized in that, adopts the laser polishing that the coating nickel of the pad locations on the lead frame is polished off in the described step (1).
3. the welding method of lead frame according to claim 1 and 2, it is characterized in that, after polishing off, the coating nickel on the pad locations of described step (1) lead frame must in 4 hours, carry out the operation of step (2), promptly printed solder paste on pad locations is proceeded the operation of step (3)～(5) then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293732 CN102049580B (en) | 2010-09-26 | 2010-09-26 | Welding method of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293732 CN102049580B (en) | 2010-09-26 | 2010-09-26 | Welding method of lead frame |
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| Publication Number | Publication Date |
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| CN102049580A true CN102049580A (en) | 2011-05-11 |
| CN102049580B CN102049580B (en) | 2013-04-24 |
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| CN 201010293732 Active CN102049580B (en) | 2010-09-26 | 2010-09-26 | Welding method of lead frame |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752970A (en) * | 2013-12-24 | 2014-04-30 | 广州金升阳科技有限公司 | Lead frame soldering method |
| CN115206958A (en) * | 2022-09-16 | 2022-10-18 | 四川奥库科技有限公司 | IPM packaging system and method based on DBC/DPC substrate and lead frame |
| CN115446410A (en) * | 2022-09-21 | 2022-12-09 | 北京经纬恒润科技股份有限公司 | Welding method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001217369A (en) * | 2000-01-31 | 2001-08-10 | Sumitomo Metal Mining Co Ltd | Method for pretreating special copper alloy material in solder plating process of semiconductor |
| WO2003017366A1 (en) * | 2001-08-21 | 2003-02-27 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
| CN1447638A (en) * | 2002-01-11 | 2003-10-08 | 日本电气英富醍株式会社 | Welding method and welded parts |
| CN1850415A (en) * | 2006-05-19 | 2006-10-25 | 广州金升阳科技有限公司 | Welding wire and lead frame spot welding method |
| CN101009235A (en) * | 2006-01-24 | 2007-08-01 | 恩益禧电子股份有限公司 | Semiconductor apparatus manufacturing method |
| CN101642004A (en) * | 2007-03-26 | 2010-02-03 | 罗伯特.博世有限公司 | Method for fitting an electrical component to a contacting element and contacting element with an electrical component |
-
2010
- 2010-09-26 CN CN 201010293732 patent/CN102049580B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001217369A (en) * | 2000-01-31 | 2001-08-10 | Sumitomo Metal Mining Co Ltd | Method for pretreating special copper alloy material in solder plating process of semiconductor |
| WO2003017366A1 (en) * | 2001-08-21 | 2003-02-27 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
| CN1447638A (en) * | 2002-01-11 | 2003-10-08 | 日本电气英富醍株式会社 | Welding method and welded parts |
| CN101009235A (en) * | 2006-01-24 | 2007-08-01 | 恩益禧电子股份有限公司 | Semiconductor apparatus manufacturing method |
| CN1850415A (en) * | 2006-05-19 | 2006-10-25 | 广州金升阳科技有限公司 | Welding wire and lead frame spot welding method |
| CN101642004A (en) * | 2007-03-26 | 2010-02-03 | 罗伯特.博世有限公司 | Method for fitting an electrical component to a contacting element and contacting element with an electrical component |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752970A (en) * | 2013-12-24 | 2014-04-30 | 广州金升阳科技有限公司 | Lead frame soldering method |
| CN115206958A (en) * | 2022-09-16 | 2022-10-18 | 四川奥库科技有限公司 | IPM packaging system and method based on DBC/DPC substrate and lead frame |
| CN115446410A (en) * | 2022-09-21 | 2022-12-09 | 北京经纬恒润科技股份有限公司 | Welding method |
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| CN102049580B (en) | 2013-04-24 |
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Address after: 510663 Guangzhou Science City, Luogang District science Avenue, science and technology development center, Department of the Department of the 1st Street, No. 5 Patentee after: Guangzhou Jinshengyang Science & Technology Co., Ltd. Address before: 510760, 8, Cang Lian Industrial Park, Po Road South, Whampoa District, Guangdong, Guangzhou Patentee before: Guangzhou Jinshengyang Science & Technology Co., Ltd. |