CN104279527A - Circuit board for integrated back light module and manufacturing method of circuit board - Google Patents
Circuit board for integrated back light module and manufacturing method of circuit board Download PDFInfo
- Publication number
- CN104279527A CN104279527A CN201310290501.3A CN201310290501A CN104279527A CN 104279527 A CN104279527 A CN 104279527A CN 201310290501 A CN201310290501 A CN 201310290501A CN 104279527 A CN104279527 A CN 104279527A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- backlight module
- light guide
- weld pad
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention relates to a circuit board for an integrated back light module and a manufacturing method of the circuit board. The circuit board is characterized in that the circuit board is enabled to be provided with a first surface and a second surface opposite to the first surface; an electronic device circuit is arranged on the first surface of the circuit board; a surface light source module is arranged on the second surface and comprises a reflecting metal layer, a plurality of light emitting diodes (LED) and light guide material layers, wherein the reflecting metal layer is positioned on the second surface of the circuit board; the LEDs are arranged on the second surface of the circuit board in a surface adhering mode; each light guide material layer covers the corresponding LED. The circuit board for the integrated back light module can be applied to all electronic devices having the demand of back light; the casing thicknesses of the electronic devices can be reduced and the manufacturing cost of the electronic devices can be reduced.
Description
Technical field
The present invention is a kind of circuit board and manufacture method thereof of integrating backlight module, espespecially a kind of correlation technique directly integrating backlight module on circuit boards.
Background technology
Liquid crystal display is still the highest flat-panel screens of current popularity rate, and one of feature of liquid crystal display be itself can't be luminous, light source on its picture is from the backlight module of inside, existing backlight module is broadly divided into side entering type and direct type backlight module, so-called side-entering type backlight module as shown in Figure 6, mainly be provided with a CCFL (CCFL) 71 in one end of light guide plate 70 length direction, and a reflector plate 72 is provided with in the inner side of light guide plate 70, then diffusion barrier 73 is sequentially provided with from inside to outside outside light guide plate 70, diffusion barrier 75 on two brightening pieces 74 and.The medial surface of light guide plate 70 is an inclined-plane again, and this reflector plate 72 also does oblique setting and parallel relative with the medial surface of light guide plate 70.
The operation principle of above-mentioned side-entering type backlight module is that the light making CCFL 71 produce is sent into by the side of light guide plate 70, the light sent into is sent towards its lateral direction via the conduction commutation of light guide plate 70, light is also sent by the medial surface of light guide plate 70 on the other hand, be reflected back light guide plate 70 through reflector plate 72, then sent by the lateral surface of light guide plate 70.
From the above, side-entering type backlight module meaning and light source are sent into by the side of light guide plate 70, are sent after conduction reflection by light guide plate 70 surface.And the difference of direct type backlight module and side-entering type backlight module is: its light source is directly arranged in the below (inner side) of light guide plate 70.
Backlight module row have year, it uses also very general, but when it uses specific electronic installation, i.e. derivative many problems.Such as, when being used in smart mobile phone or panel computer, the most significant problem causes the thickness of these devices effectively to reduce, namely reason has light guide plate and the multi-ply construction of a suitable thickness in backlight module, with regard to the backlight module suitable thickness of tool itself, when being used in aforementioned intelligent mobile phone or panel computer, its thickness is being had by oneself to restriction first in the sky.
Moreover backlight module utilizes finite light source to provide an area source via after leaded light, diffusion, therefore also restricted in brightness.On the other hand, conventional backlight module uses the blooming of reflector plate and a greater number, therefore there is the higher problem of manufacturing cost simultaneously.
From the above, existing backlight module is used in smart mobile phone, panel computer etc. when requiring frivolous electronic installation as far as possible, causes the thickness of these electronic installations to limit on the contrary, is thus necessary further self-criticism, and seeks feasible solution.
Summary of the invention
Therefore main purpose of the present invention is providing a kind of circuit board integrating backlight module, mainly utilize the circuit board of electronic installation, backlight module is integrated on it, to provide a direct light source, owing to being directly incorporated on the circuit board of electronic installation, thickness effectively can reduce, can relatively reduce costs simultaneously; On the other hand, because the backlight module on circuit board can produce direct light source, therefore can effectively promote its brightness.
The technical way taked for reaching aforementioned object makes the circuit board of aforementioned integration backlight module comprise: a circuit board, has a first surface, relative to the second surface of first surface; Its first surface is provided with an electronic installation circuit; Its second surface is formed with multiple weld pad and doing matrix arrangement and is positioned at reflective metal layer between each weld pad; One modular surface light source, comprise multiple light emitting diode and a light guide bed of material, each light emitting diode is arranged on each weld pad of circuit board second surface in adhesive surface mode, this light guide bed of material be covered in circuit board second surface and on light emitting diode;
The circuit board of above-mentioned integration backlight module arranges electronic installation circuit with first surface, using the motherboard as electronic installation, when electronic installation has liquid crystal display, the modular surface light source being then positioned at circuit board second surface can be used as the backlight module of liquid crystal display, modular surface light source is that multiple light emitting diode is arranged on circuit board second surface equably, the light source that these light emitting diodes produce fully can be reflected by the reflective metal layer on circuit board second surface and the leaded light of the light guide bed of material, and the planar light source providing to have the uniformity and brightness concurrently.
Another object of the present invention is providing a kind of method of manufacturing circuit board integrating backlight module.
The technological means taked for reaching aforementioned object makes preceding method comprise: provide a circuit board, this circuit board has relative first surface and second surface, its first surface has an electronic installation circuit, and second surface has multiple weld pad and a reflective metal layer; Multiple light emitting diode is arranged on respectively on each weld pad of circuit board second surface; The second surface of circuit board is formed a light guide bed of material, by light guide bed of material covering board second surface and on light emitting diode.
Utilize said structure and method to be incorporated on the circuit board of electronic installation by backlight module, its useful effect comprises:
1, effectively reduce the outer casing thickness of electronic installation, make the shell of electronic installation not have certain thickness restriction because of the use of backlight module.
2, have the uniformity and brightness concurrently: the present invention arranges multiple light emitting diode equably on the second surface of circuit board, utilize the reflection of reflective metal layer and the leaded light of the light guide bed of material, the uniformity of area source and brightness are all effectively promoted.
3, backlight module is incorporated on the circuit board of electronic installation, will the manufacturing cost reducing backlight module be contributed to.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those skilled in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a stereogram of a preferred embodiment of the present invention.
Fig. 2 is the another stereogram of a preferred embodiment of the present invention.
Fig. 3 is that one of a preferred embodiment of the present invention is analysed and observe and process schematic representation.
To be that a preferred embodiment of the present invention is another analyse and observe and process schematic representation Fig. 4.
Fig. 5 is that a preferred embodiment of the present invention one to be analysed and observe and process schematic representation again.
Fig. 6 is the schematic diagram of known backlight module.
Drawing reference numeral illustrates:
10 circuit board 100 vias
11 first surface 12 second surfaces
13 reflective metal layer 14 weld pads
20 electronic installation circuits
30 modular surface light source 31 light emitting diodes
The 32 light guide bed of materials
70 light guide plate 71 CCFLs
72 reflector plate 73 times diffusion barriers
Diffusion barrier on 74 brightening pieces 75
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
About a preferred embodiment of the present invention, first refer to shown in Fig. 1, Fig. 2, it comprises a circuit board 10, espespecially a kind of circuit board of electronic installation, and this electronic installation includes but not limited to mobile phone, panel computer, individual digital player, personal digital assistant etc.
Aforementioned circuit plate 10 has surface and a bottom surface, below will be called first surface 11 and second surface 12, the first surface 11 of this circuit board 10 has an electronic installation circuit 20, this electronic installation circuit 20 is in order to perform the major function of electronic installation, and can perform the drived control function of liquid crystal panel, contact panel and backlight module further, that is circuit board 10 uses as the motherboard of electronic installation.
The second surface 12 of circuit board 10 again is then provided with a modular surface light source 30, and this modular surface light source 30 is using the backlight of liquid crystal display set on electronic installation.Meaning i.e. this circuit board 10 not only as the motherboard of electronic installation, also simultaneously as the backlight module of liquid crystal display set on electronic installation.
About aforementioned circuit plate 10 further concrete structure, refer to shown in Fig. 3, this circuit board 10 is made up of a multilager base plate, and it has internal layer circuit and multiple via 100 of more than one deck; Refer to shown in Fig. 3, in the present embodiment, circuit board 10 is one through the change silver plate of immersion silver process, it forms aforementioned electronic circuit 20 at first surface 11, and form a reflective metal layer 13 and multiple weld pad 14 at second surface 12, in the present embodiment, this reflective metal layer 13 can be used as ground connection (GND), and these weld pads 14 are an adhesive surface (SMT) contacts.
Refer to shown in Fig. 2 and Fig. 4, this modular surface light source 30 comprises multiple light emitting diode 31 and a light guide bed of material 32, these light emitting diodes 31 are surface adhering element, and are arranged on respectively on each weld pad 14 of circuit board 10 second surface 12 in adhesive surface mode.
After the installation that each light emitting diode 31 completes on circuit board 10 second surface 12, form this light guide bed of material 32 (as shown in Figure 5) with mode of printing at circuit board 10 second surface subsequently.In the present embodiment, the light guide bed of material 32 is mainly made up of the transparent material such as acrylic group or silica gel.When aforementioned light emitting diode 31 is shinny, its light source produced, except being reflected by the reflective metal layer 13 on second surface 12 except, and by the leaded light of the light guide bed of material 32, and must produce the area source that a uniformity and brightness all fully promotes, be provided as backlight use.Solia particle (diameter 1 ~ 25um) can be added further, to increase the scattering of light source in aforementioned transparent material.
In the present embodiment, modular surface light source 30 work can further by the electronic installation circuit 20 on circuit board 10 first surface 11 control drive.For reaching above-mentioned purpose, electronic installation circuit 20 on aforementioned circuit plate 10 first surface 11 is connected with the weld pad 14 of second surface 12 by via 100, meaning and electronic installation circuit 20 incorporate the drive circuit of modular surface light source 30 further, and are responsible for the running of each light emitting diode 31 on modular surface light source 30 by electronic installation circuit 20.
From the above, the present invention is the circuit board being used in the electronic installation with backlight display, this circuit board arranges electronic installation circuit at first surface, and using the motherboard as this electronic installation, the modular surface light source of its second surface is then as the backlight module of display; Because these backlight modules are directly incorporated on circuit board, the reduction of electronic installation thickness will be contributed to; And modular surface light source of the present invention is arranged on circuit board second surface equably by multiple light emitting diode, the light source that these light emitting diodes produce fully can be reflected by the reflective metal layer on second surface and the leaded light of the light guide bed of material, and the planar light source providing to have the uniformity and brightness concurrently.It need not use expensive blooming, reflector plate, therefore contributes to reducing manufacturing cost.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; the protection domain be not intended to limit the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. integrate a circuit board for backlight module, it is characterized in that, comprising:
One circuit board, has a first surface, relative to the second surface of described first surface; Described first surface is provided with an electronic installation circuit; The weld pad and one described second surface being formed with multiple arrangement is positioned at the reflective metal layer between each weld pad;
One modular surface light source, comprise multiple light emitting diode and a light guide bed of material, described light emitting diode is arranged on each weld pad of described circuit board second surface respectively, the described light guide bed of material be covered in described circuit board second surface and on described light emitting diode.
2. the circuit board of integration backlight module according to claim 1, is characterized in that, described circuit board is one through the change silver plate of immersion silver process.
3. the circuit board of integration backlight module according to claim 2, is characterized in that, described circuit board is made up of a multilager base plate, and it has the internal layer circuit of more than one deck;
Weld pad on described circuit board second surface is an adhesive surface contact, and each light emitting diode of described modular surface light source is arranged on the weld pad of circuit board second surface in adhesive surface mode.
4. the circuit board of integration backlight module according to claim 3, is characterized in that, the described light guide bed of material is made up of the transparent material of acrylic group or silica gel.
5. the circuit board of integration backlight module according to claim 4, is characterized in that, adds solia particle further in described transparent material, to increase the scattering of light source.
6. the circuit board of integration backlight module according to claim 5, is characterized in that, described circuit board has multiple via, and the weld pad on described circuit board second surface is connected with the electronic installation line electricity of first surface by via.
7. integrate a method of manufacturing circuit board for backlight module, it is characterized in that, comprising:
There is provided a circuit board, described circuit board has relative first surface and second surface, and described first surface has an electronic installation circuit, and described second surface has multiple weld pad and a reflective metal layer;
Multiple light emitting diode is arranged on respectively on each weld pad of described circuit board second surface;
The second surface of described circuit board is formed a light guide bed of material, by the described light guide bed of material cover described circuit board second surface and on described light emitting diode.
8. the method for manufacturing circuit board of integration backlight module according to claim 7, is characterized in that, the described light guide bed of material be with mode of printing on the second surface of described circuit board.
9. the method for manufacturing circuit board of integration backlight module according to claim 8, it is characterized in that, the described light guide bed of material is made up of the transparent material of acrylic group or silica gel, adds solia particle further in described transparent material, to increase the scattering of light source.
10. the method for manufacturing circuit board of the integration backlight module according to any one of claim 7 to 9, is characterized in that, described light emitting diode is arranged on the weld pad of described circuit board second surface in adhesive surface mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310290501.3A CN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board for integrated back light module and manufacturing method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310290501.3A CN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board for integrated back light module and manufacturing method of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104279527A true CN104279527A (en) | 2015-01-14 |
Family
ID=52254683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310290501.3A Pending CN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board for integrated back light module and manufacturing method of circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN104279527A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561782A (en) * | 2017-09-27 | 2018-01-09 | 惠科股份有限公司 | Backlight module and display device |
| CN109872905A (en) * | 2017-12-01 | 2019-06-11 | 致伸科技股份有限公司 | Illuminated keyboard |
| CN109872907A (en) * | 2017-12-05 | 2019-06-11 | 致伸科技股份有限公司 | Illuminated keyboard |
| CN110908178A (en) * | 2018-09-17 | 2020-03-24 | 夏普株式会社 | Illumination device and display device |
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| CN201193811Y (en) * | 2008-03-21 | 2009-02-11 | 亿光电子工业股份有限公司 | Illuminating device |
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| CN102781165A (en) * | 2012-08-14 | 2012-11-14 | 友达光电(厦门)有限公司 | Welding structure for LED (light-emitting diode) array and circuit board thereof |
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| CN101109500A (en) * | 2006-07-19 | 2008-01-23 | 新灯源科技有限公司 | High-power cluster light emitting diode lighting equipment of coupling high efficiency soaking/radiating module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561782A (en) * | 2017-09-27 | 2018-01-09 | 惠科股份有限公司 | Backlight module and display device |
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| CN109872905A (en) * | 2017-12-01 | 2019-06-11 | 致伸科技股份有限公司 | Illuminated keyboard |
| CN109872907A (en) * | 2017-12-05 | 2019-06-11 | 致伸科技股份有限公司 | Illuminated keyboard |
| CN110908178A (en) * | 2018-09-17 | 2020-03-24 | 夏普株式会社 | Illumination device and display device |
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