CN201193811Y - Illuminating device - Google Patents
Illuminating device Download PDFInfo
- Publication number
- CN201193811Y CN201193811Y CNU2008200052237U CN200820005223U CN201193811Y CN 201193811 Y CN201193811 Y CN 201193811Y CN U2008200052237 U CNU2008200052237 U CN U2008200052237U CN 200820005223 U CN200820005223 U CN 200820005223U CN 201193811 Y CN201193811 Y CN 201193811Y
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- China
- Prior art keywords
- light
- diode chip
- backlight unit
- emitting diode
- emitting device
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Abstract
The utility model relates to a luminescent device, which comprises a luminous diode chip, a sealant substance, a printing circuit board and an electrode, wherein, the luminous diode chip is provided with a conducting terminal, and the sealant substance is used for wrapping the luminous diode chip and the conducting terminal of the luminous diode chip. The printing circuit board is connected with the sealant substance, and is used for fixing the luminous diode chip. The printing circuit board comprises a first surface, a second surface, a third surface and a through hole; the first and the second surfaces faces towards and is opposite to the luminous diode chip respectively; the third surface surrounds the first and the second surfaces; the through hole passes through the first and the second surfaces; the conducting terminal of the luminous diode chip is electrically connected with the electrode through the through hole. During the assembling process, the luminous device can prevent the welding material from penetrating between the printing circuit board and the sealant substance, and protect the original structure not to be damaged, so as to receive the functions normally.
Description
Technical field
The utility model relates to a kind of light-emitting device of field, particularly relates to a kind of light-emitting diode assembly that uses surface mount technology.
Background technology
In recent years, the use of light-emitting diode chip for backlight unit on lighting field presents multiple and grows up.For example light-emitting diode chip for backlight unit is applied in tail-light, mobile phone, PDA and other electronic product widely.
See also shown in Figure 1, it is to illustrate a traditional light-emitting device, the conducting end (pad) 111, sealing material 113 and the light-emitting diode chip for backlight unit 117 that comprise electrode 107, printed circuit board (PCB) 109, light-emitting diode chip for backlight unit, wherein, electrode 107 is the two sides that are centered around printed circuit board (PCB) 109, and electrically connects conducting end 111.113 of sealing materials are positioned on electrode 107 and the conducting end 111, in order to coat light-emitting diode chip for backlight unit 117 and metal wire 119.
On a substrate 101 time, generally be to use scolder 105 at this traditional light-emitting device of welding, as scolding tin, with light-emitting device, comprise printed circuit board (PCB) 109 with and on sealing material 113 stick together on the conducting end 103 of substrate 101.Yet stick together in the process at this, scolder 105 may prolong electrode 107 and infiltrate between printed circuit board (PCB) 109 and the sealing material 113, cause printed circuit board (PCB) 109 and sealing material 113 to be peeled off, even make metal wire 119 fractures, light-emitting diode chip for backlight unit 117 thereby loss of function.
Therefore need a new light-emitting device, can in the process of assembling, the original structure of protection not be destroyed, normally to carry out its due function.
This shows that above-mentioned existing traditional light-emitting device obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that traditional light-emitting device exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing traditional light-emitting device exists, the design people is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of light-emitting device of new structure, can improve general existing traditional light-emitting device, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the utility model that has practical value finally.
Summary of the invention
Main purpose of the present utility model is, overcome the defective that existing traditional light-emitting device exists, and provide a kind of new light-emitting device, technical problem to be solved is to make it can avoid scolder to infiltrate between printed circuit board (PCB) and the sealing material along electrode in the process of assembling, destroy the function of light-emitting diode chip for backlight unit, thereby be suitable for practicality more, and have the value on the industry.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.According to a kind of light-emitting device that the utility model proposes, it comprises:
One light-emitting diode chip for backlight unit has a plurality of conducting end;
One sealing material is in order to coat this light-emitting diode chip for backlight unit and those conducting end;
One printed circuit board (PCB) is bonded on this sealing material, and in order to fix this light-emitting diode chip for backlight unit, this printed circuit board (PCB) comprises:
One first surface, this first surface are towards this light-emitting diode chip for backlight unit;
One second surface, this second surface are this light-emitting diode chip for backlight unit dorsad;
One the 3rd surface, the 3rd surface are around this first surface and this second surface; And
A plurality of through holes are applied between this first surface and this second surface, and the inwall of those through holes has electroplated metal layer; And
A plurality of electrodes have one the 4th surface, one the 5th surface and one the 6th surface, the 4th surface and the 5th surface be respectively towards with this second surface dorsad, the 6th surface is then around the 4th surface and the 5th surface,
Wherein, those conducting end of this light-emitting diode chip for backlight unit are that those electroplated metal layers by those through holes are electrically connected to those electrodes.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid light-emitting device, the material of wherein said this sealing material are epoxy resin, acrylic resin (acryl) or silica gel.
Aforesaid light-emitting device, the wherein said substrate that more comprises, this substrate are at those electrodes by a scolder gluing.
Aforesaid light-emitting device, wherein said this scolder are to be filled between the 5th surface and this substrate of those electrodes.
Aforesaid light-emitting device, the 6th surface of wherein said those electrodes are these substrates of contact, and this scolder then is filled between this five surface and this substrate of those electrodes.
Aforesaid light-emitting device, wherein said this scolder is to be scolding tin.
Aforesaid light-emitting device, the material of wherein said those electrodes are copper or aluminium.
The utility model compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present utility model thes contents are as follows:
The utility model proposes a kind of light-emitting device, comprise light-emitting diode chip for backlight unit, sealing material, printed circuit board (PCB) and electrode, wherein light-emitting diode chip for backlight unit has conducting end, and the sealing material is then in order to coat the conducting end of light-emitting diode chip for backlight unit and light-emitting diode chip for backlight unit.Printed circuit board (PCB) is engaged in the sealing material, and this printed circuit board (PCB) is in order to fixing light-emitting diode chip for backlight unit.Printed circuit board (PCB) comprises first surface, second surface, the 3rd surface and through hole, first surface and second surface be respectively towards and backward luminous diode chip for backlight unit, then around first surface and second surface, through hole then is applied between first surface and the second surface on the 3rd surface.The conducting end of light-emitting diode chip for backlight unit then is electrically connected to electrode by through hole.
By technique scheme, the utility model light-emitting device has following advantage at least:
The conducting end of light-emitting diode chip for backlight unit of the present utility model is to electrically connect by through hole in the printed circuit board (PCB) and electrode; therefore can avoid scolder to infiltrate between light-emitting diode chip for backlight unit and the printed circuit board (PCB), the function of protection electronic installation, light-emitting diode chip for backlight unit along electrode.
In sum, the light-emitting device of the utility model special construction, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it structurally or bigger improvement all arranged on the function, have large improvement technically, and produced handy and practical effect, and more existing traditional light-emitting device has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and conjunction with figs. describe in detail as after.
The specific embodiment of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Description of drawings
Fig. 1 is the structural representation of traditional light-emitting device.
Fig. 2 is the structural representation according to a kind of upper-ejection type light-emitting device of the utility model one embodiment.
Fig. 3 is the structural representation according to a kind of lateral type light-emitting device of another embodiment of the utility model.
101: substrate 103: conducting end
105: scolder 107: electrode
109: printed circuit board (PCB) 111: conducting end
113: sealing material 117: light-emitting diode chip for backlight unit
119: metal wire 201: substrate
203: conducting end 205: scolder
207: electrode 207a: the 4th surface
207b: the 5th surperficial 207c: the 6th surface
209: printed circuit board (PCB) 209a: first surface
209b: second surface 209c: the 3rd surface
211: through hole 213: conducting end
215: sealing material 217: metal wire
219: light-emitting diode chip for backlight unit
The specific embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to according to its specific embodiment of light-emitting device, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
According to this novel embodiment, light-emitting device comprises a light-emitting diode chip for backlight unit, a sealing material, a printed circuit board (PCB) and a plurality of electrode, wherein light-emitting diode chip for backlight unit has a plurality of conducting end, the sealing material then in order to coat light-emitting diode chip for backlight unit with and conducting end.Printed circuit board (PCB) is bonded on the sealing material, and in order to fixing light-emitting diode chip for backlight unit.
Printed circuit board (PCB) comprises a first surface, a second surface, one the 3rd surface and a plurality of through holes, wherein, first surface and second surface respectively towards and backward luminous diode chip for backlight unit, the 3rd surface is then around first surface and second surface, through hole is to be applied between first surface and the second surface, and the inwall of through hole then has electroplated metal layer.
In this embodiment, electrode has one the 4th surface, one the 5th surface and one the 6th surface, wherein the 4th surface and the 5th surface be respectively towards with second surface dorsad, then around the 4th surface and the 5th surface, the conducting end of light-emitting diode chip for backlight unit then is electrically connected to the 4th surface of electrode by through hole on the 6th surface.
By above-mentioned embodiment of the present utility model as can be known; the conducting end of light-emitting diode chip for backlight unit is to electrically connect by through hole in the printed circuit board (PCB) and electrode; therefore can avoid scolder to infiltrate between light-emitting diode chip for backlight unit and the printed circuit board (PCB), the function of protection electronic installation, light-emitting diode chip for backlight unit along electrode.
See also shown in Figure 2, be the structural representation of a kind of upper-ejection type light-emitting device of the utility model light-emitting device one embodiment, it mainly comprises: conducting end (pad) 213, sealing material 215, metal wire 217 and the light-emitting diode chip for backlight unit 219 of electrode 207, printed circuit board (PCB) 209, through hole 211, light-emitting diode chip for backlight unit.
Printed circuit board (PCB) 209 has first surface 209a, second surface 209b, the 3rd surperficial 209c and a plurality of through hole 211, wherein first surface 209a and second surface 209b are respectively towards then centering on first surface 209a and second surface 209b with backward luminous diode chip for backlight unit 219, the three surperficial 209c.The conducting end 213 of light-emitting diode chip for backlight unit 219 is to be electrically connected to electrode 207 by through hole 211.207 at electrode has the 4th surperficial 207a, the 5th surperficial 207b and the 6th surperficial 207c, and through hole 211 is the 4th surperficial 207a of contact electrode 207, and the 6th surperficial 207c is then around the 4th surperficial 207a and the 5th surperficial 207b.
In Fig. 2, sealing material 215 is in order to coat light-emitting diode chip for backlight unit 219, metal wire 217 and light-emitting diode chip for backlight unit conducting end 213.The material of sealing material 215 can be epoxy resin, acrylic resin and silica gel etc.In the middle of this light emitting diode construction, sealing material 215 is to engage with printed circuit board (PCB) 209, with coated with conductive end 213.
On a substrate 201 time, be to use scolder 205 at this light-emitting device of welding, scolding tin for example, with electrode 207 with and on light-emitting device stick together on the conducting end 203 of substrate 201.Because electrode 207 does not connect direct contact conducting end 213 and sealing material 215; and be arranged on the second surface 209b of printed circuit board (PCB) 209; therefore in the middle of assembling process; scolder 205 can not prolong electrode 207 and infiltrate between printed circuit board (PCB) 209 and the sealing material 215; can protect light-emitting diode chip for backlight unit 219, avoid it destroyed.
Seeing also shown in Figure 3ly, is the structural representation of a kind of lateral type light-emitting device of another embodiment of the utility model light-emitting device.
Be the disposing way of printed circuit board (PCB) 209 and light-emitting diode chip for backlight unit 219 with the difference of Fig. 2.In the lateral type light-emitting device of Fig. 3, electrode 207 and printed circuit board (PCB) 209 are to be coupled by its 6th surperficial 207c and the 3rd surperficial 209c and substrate 201,205 in scolder is filled in the 5th surperficial 207b of electrode 207 and square crossing place of substrate conducting end 203, be used for electrode 207 with and on printed circuit board (PCB) 209 be welded on the substrate 201.
Same; because electrode 207 does not connect direct contact conducting end 213 and sealing material 215; and be arranged on the second surface 209b of printed circuit board (PCB) 209; scolder 205 thereby can not prolong electrode 207 and infiltrate between printed circuit board (PCB)s 209 and the sealing material 215; therefore can protect light-emitting diode chip for backlight unit 219, make it can exercise original function.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in the scope that does not break away from technical solutions of the utility model, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solutions of the utility model content, foundation technical spirit of the present utility model is to above any simple modification that embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (7)
1. light-emitting device is characterized in that it comprises:
One light-emitting diode chip for backlight unit has a plurality of conducting end;
One sealing material is in order to coat this light-emitting diode chip for backlight unit and those conducting end;
One printed circuit board (PCB) is bonded on this sealing material, and in order to fix this light-emitting diode chip for backlight unit, this printed circuit board (PCB) comprises:
One first surface, this first surface are towards this light-emitting diode chip for backlight unit;
One second surface, this second surface are this light-emitting diode chip for backlight unit dorsad;
One the 3rd surface, the 3rd surface are around this first surface and this second surface; And
A plurality of through holes are applied between this first surface and this second surface, and the inwall of those through holes has electroplated metal layer; And
A plurality of electrodes, have one the 4th surface, one the 5th surface and one the 6th surface, the 4th surface and the 5th surface be respectively towards with this second surface dorsad, the 6th surface is then around the 4th surface and the 5th surface, wherein, those conducting end of this light-emitting diode chip for backlight unit are that those electroplated metal layers by those through holes are electrically connected to those electrodes.
2. light-emitting device according to claim 1, the material that it is characterized in that wherein said this sealing material are epoxy resin, acrylic resin or silica gel.
3. light-emitting device according to claim 1 is characterized in that it more comprises a substrate, and this substrate is at those electrodes by a scolder gluing.
4. light-emitting device according to claim 3 is characterized in that wherein said this scolder is to be filled between the 5th surface and this substrate of those electrodes.
5. light-emitting device according to claim 3, the 6th surface that it is characterized in that wherein said those electrodes are this substrates of contact, and this scolder then is filled between this five surface and this substrate of those electrodes.
6. light-emitting device according to claim 3 is characterized in that wherein said this scolder is to be scolding tin.
7. light-emitting device according to claim 1, the material that it is characterized in that wherein said those electrodes are copper or aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200052237U CN201193811Y (en) | 2008-03-21 | 2008-03-21 | Illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200052237U CN201193811Y (en) | 2008-03-21 | 2008-03-21 | Illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201193811Y true CN201193811Y (en) | 2009-02-11 |
Family
ID=40393346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200052237U Expired - Lifetime CN201193811Y (en) | 2008-03-21 | 2008-03-21 | Illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201193811Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012151762A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市华星光电技术有限公司 | Led light source module, backlight module, and liquid crystal display |
| CN104279527A (en) * | 2013-07-11 | 2015-01-14 | 华通电脑股份有限公司 | Circuit board for integrated back light module and manufacturing method of circuit board |
-
2008
- 2008-03-21 CN CNU2008200052237U patent/CN201193811Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012151762A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市华星光电技术有限公司 | Led light source module, backlight module, and liquid crystal display |
| CN104279527A (en) * | 2013-07-11 | 2015-01-14 | 华通电脑股份有限公司 | Circuit board for integrated back light module and manufacturing method of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090211 |
|
| CX01 | Expiry of patent term |