KR101059071B1 - Printed circuit board for LED mounting - Google Patents

Abstract

The present invention relates to a printed circuit board, comprising: a first regular hexagon having a mounting interval of a light emitting diode having a length of one side; When a plurality of equilateral triangles having a length of one side having a mounting interval between the two regular hexagons are disposed at the maximum, a bonding pad on which light emitting diodes are mounted at vertices of the plurality of equilateral triangles is formed on one surface of the substrate.

Since the bonding pads of the printed circuit board of the present invention are arranged at uniform intervals, the light emitting diodes may be mounted at equal intervals.

Description

Printed Circuit Board for Light Emitting Diode Mounting {PRINTED CIRCUIT BOARD FOR MOUNTING LIGHT EMITTING DIODE PACKAGE}

The present invention relates to a printed circuit board, and more particularly, to a printed circuit board on which a light emitting diode is mounted.

In general, a light emitting diode (LED) is an electronic component that emits light by recombination of carriers (electrons or holes) injected into a p-n junction structure of a semiconductor.

When a forward voltage is applied to a semiconductor having a p-n junction structure, electrons and holes move and recombine with each other across the junction surface. As a result, energy is lowered and light corresponding to the energy difference is emitted than when electrons and holes exist independently. Since light emitting diodes can irradiate light with high efficiency at low voltage, they are recently used in home appliances, remote controls, electronic signs, lighting lamps, traffic lights, and the like.

On the other hand, when a conventional light emitting diode is used for a lighting lamp or a signal lamp, the light emitting diodes are arranged and used on a circular printed circuit board. To achieve an even distribution, the light emitting diodes arranged on the printed circuit board may have an even interval. it's difficult.

In addition, the conventional printed circuit board forms a conductive pattern on the front, rear, and the like for electrical connection of the light emitting diodes, so there is a certain limit in arranging the heat radiation pads for heat radiation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object thereof is to provide a printed circuit board in which a plurality of light emitting diodes are arranged at equal intervals and connected in series and in parallel in a plurality of spiral shapes.

Another object of the present invention is to provide a printed circuit board on which a connection pattern and a parallel pattern electrically connecting a plurality of light emitting diodes are formed on the front surface of the substrate, and the heat dissipation pads can be coupled to the entire rear surface of the substrate.

A printed circuit board for mounting a light emitting diode according to the present invention includes: a first regular hexagon having a length of one side of a mounting gap of a light emitting diode; A second regular hexagon enlarged by an integral multiple of the mounting interval with respect to the center of the first regular hexagon; When a plurality of equilateral triangles having a length of one side of the mounting interval is disposed between the first regular hexagon and the second regular hexagon at a maximum, a bonding pad on which a light emitting diode is mounted at a vertex of the plurality of equilateral triangles is provided on one surface of a substrate. Is formed.

A printed circuit board for mounting a light emitting diode according to the present invention includes: a first regular hexagon having a length of one side of a mounting gap of a light emitting diode; A second regular hexagon enlarged by an integral multiple of a mounting interval based on the center of the first regular hexagon; When a plurality of equilateral triangles having a length of one side of the mounting interval is disposed between the first regular hexagon and the second regular hexagon at a maximum, the light emitting diode is mounted at vertices of the plurality of equilateral triangles except for the vertices of the second regular hexagon. Bonding pads are formed on one surface of the substrate.

Here, the substrate is formed with a plurality of serial patterns connecting the bonding pads to each other such that the first to sixth series paths reaching one side of the second regular hexagon at each vertex of the first regular hexagon are formed on one surface of the substrate. In addition, the number of the bonding pads is equally divided into six parts in the first to sixth serial paths.

The first to second series paths may be formed in a spiral or zigzag shape including specific sides of the plurality of equilateral triangles.

In addition, the substrate, a first electrode and a second electrode is formed on the one surface, the first electrode is connected to a bonding pad formed at the vertex of the first regular hexagon, the second electrode is connected to a parallel pattern, The parallel pattern is preferably connected to the last bonding pad reaching one side of the second regular hexagon among the bonding pads included in the first to sixth serial paths.

In addition, the substrate, a heat radiation pad for radiating heat generated from the light emitting diode is attached to one surface, the heat discharge pad is the first electrode, the second electrode, the bonding pad, the serial pattern, and the parallel pattern and the heat radiation pad Insulation pads may be formed to insulate each other.

In addition, the substrate may include a via hole including a conductive material, and a heat dissipation pad connected to the via hole may be attached to the other surface of the substrate.

In addition, the light emitting diode may include a heat sink insulated from an electrode mounted on the bonding pad and mounted on one surface of the substrate, and the via hole may be connected to a position where the heat sink is mounted.

Since the light emitting diode mounting printed circuit board of the present invention has a configuration in which a plurality of light emitting diodes are arranged at equal intervals and connected in series and in parallel in a plurality of spiral shapes, the basis of an electrically and optically uniform lighting device Can be used as a technology

In addition, the present invention has a configuration in which a connection pattern and a parallel pattern for electrically connecting a plurality of light emitting diodes are formed on the front surface of the substrate, and the heat dissipation pads can be coupled to the entire rear surface of the substrate, thereby preventing heat generated from the light emitting diodes. There is an effect that can effectively radiate heat.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. In describing the present invention, the same reference numerals are used for the same means in order to facilitate understanding. Numerals used in the description of the present specification, for example, first and second, are merely identification symbols for distinguishing the same or similar entities.

1 is a view showing a front surface of a light emitting diode mounting printed circuit board according to an embodiment of the present invention, and FIG. 2 is a rear view of a light emitting diode mounting printed circuit board according to an embodiment of the present invention. It is a figure which shows an outer surface.

Referring to FIG. 1, a light emitting diode mounting printed circuit board 100 according to an embodiment of the present invention may include a substrate 110, a first heat dissipation pad 114, a second heat dissipation pad 116, and an insulating pattern. 118, a bonding pad 130, a series pattern 140, a parallel pattern 150, a first electrode 120, a second electrode 122, and a via hole 112.

The substrate 110 is a substrate on which a conductive pattern for mounting and driving a light emitting diode (not shown) is formed. The substrate 110 may be a circular type rigid circuit board used in a lighting device. The light emitting diode may be a package type that may be mounted on the substrate 110. The conductive pattern is formed of a conductive material and includes a bonding pad 130, a series pattern 140, a parallel pattern 150, a first electrode 120, and a second electrode 122.

The first heat dissipation pad 114 and the second heat dissipation pad 116 have the same circular type as the substrate 110, and are preferably made of a material having good thermal conductivity (eg, copper plate). The first heat dissipation pad 114 and the second heat dissipation pad 116 are attached to the front and rear surfaces of the substrate 110, respectively, to radiate heat generated from the light emitting diodes (not shown) to the front and rear sides of the substrate 110. do.

The insulating pattern 118 is formed on the first heat dissipation pad 114, and electrically insulates the conductive pattern from the first heat dissipation pad 114.

The bonding pads 130 are portions in which the electrodes of the light emitting diode are soldered and mounted, and are formed in pairs with respect to the mounting point 134. The mounting point 134 is a reference point of the position where the light emitting diode is mounted. The mounting points 134 are positioned to have equal intervals with respect to the first electrode connection hole 121, which is the center of the substrate 110. A notch 132 indicating a mounting direction of the light emitting diode may be formed in the bonding pad 130.

The first electrode 120 is applied with (+) power and the first electrode connection hole 121 penetrating the substrate 110 is formed, and the second electrode 122 is applied with (-) power and the substrate 110. A second electrode connection hole 123 penetrating the through is formed. Wires for applying positive power and negative power may be connected to the first electrode connection hole 121 and the second electrode connection hole 123, respectively. The first electrode 120 may be located at the center of the substrate 110, and the second electrode 122 may be located at the outer portion of the substrate 110, but is not limited thereto. For example, the first electrode 120 may be located. ) And the second electrode 122 may be located at the center of the substrate 110.

When the light emitting diode is mounted on the bonding pad 130, the series pattern 140 electrically connects the plurality of bonding pads 130 in series to form a plurality of series paths (not shown) connected to the first electrode 120.

The parallel pattern 150 is connected to the second electrode 122, and when the LED is mounted, a plurality of series paths are connected to each other in parallel with the second electrode 122.

The via hole 160 is a hole for transferring heat generated from the light emitting diode to the heat radiation pad 116 attached to the rear surface of the substrate 110.

Hereinafter, referring to FIG. 3, the arrangement of the bonding pads 130 for equally spaced mounting of the plurality of light emitting diodes will be described in detail.

3 is a view for explaining an arrangement position of the bonding pad illustrated in FIG. 1.

Referring to FIG. 3, the first regular hexagon 170 and the second regular hexagon 180 having the common center of the first electrode connection hole 121, which is the center of the substrate 110, and the outer side and the first regular hexagon 170 are formed. An equilateral triangle 178 is shown between the two regular hexagons 180.

The first regular hexagon 170 is a virtual first reference figure for arranging the plurality of bonding pads 130 at equal intervals. One side of the first regular hexagon 170 is a mounting interval P of the light emitting diodes.

The second regular hexagon 180 is a virtual second reference diagram in which the first regular hexagon 170 is enlarged by an integral multiple of the mounting interval with respect to the first electrode connection hole 121. In this embodiment, the integer multiple is 2 times but is not limited thereto.

The equilateral triangle 178 is an imaginary triangle having the length of one side of the first regular hexagon 170 as the length of each side. Therefore, in this embodiment, the length of each side of the equilateral triangle 178 has a length of the mounting interval 1P of the light emitting diode. Each side of the equilateral triangle 178 may be a position where the serial pattern (140 in FIG. 1) is patterned.

In the space between the outer side of the first regular hexagon 170 and the inner side of the second regular hexagon 180, when the plurality of equilateral triangles 178 are arranged to contact each other without overlapping each other, a maximum number of equilateral triangles 178 may be disposed. Can be. In the present embodiment, up to 48 equilateral triangles 178 may be disposed between the first regular hexagon 170 and the second regular hexagon 180. In this case, the vertices of the plurality of equilateral triangles 178 may be the mounting points 134 described with reference to FIG. 1. In this embodiment, all of the mounting points 134 are 36 pieces.

When the bonding pads 130 are formed to mount the light emitting diodes to the plurality of mounting points 134 obtained as described above, the plurality of bonding pads 130 may be disposed at equal intervals from each other. Therefore, when a light emitting diode is mounted on each of the plurality of bonding pads 130, the plurality of light emitting diodes may also be disposed on the substrate 110 at equal intervals. Therefore, when the light emitting diodes are mounted and driven at equal intervals on the light emitting diode mounting printed circuit board 100 according to an embodiment of the present invention, the light emitting diodes may have a uniform light distribution.

Meanwhile, when the maximum number of equilateral triangles 178 is disposed between the first regular hexagon 170 and the second regular hexagon 180, vertices 181, 182, and 181 of vertices of the plurality of equilateral triangles 178 are included. 183, 184, 185, and 186 are preferably excluded from the mounting point 134. This is to make the outer shape of the light emitting diode mounted on the substrate 110 close to the circular shape when the substrate 110 is circular.

4 is a view for explaining the connection relationship between the serial pattern and the parallel pattern shown in FIG.

Referring to Figure 4, first, the connection relationship of the serial pattern 140 will be described. In FIG. 4, the serial pattern 140 is represented by a solid line connecting the plurality of mounting points 134. Each vertex of the first regular hexagon 170 is electrically connected to the first electrode 120, respectively. The serial pattern 140 is patterned such that the plurality of mounting points 134 on the substrate 110 are divided into six equal parts and included in the first to sixth serial paths 201, 202, 203, 204, 205, and 206, respectively. do. Specifically, the serial pattern 140 may include first to sixth serial paths 201, 202, 203, 204, and 205 starting at each vertex of the first regular hexagon 170 and reaching one side of the second regular hexagon 180. , 206 is preferably patterned to form. In this embodiment, five mounting points 134 are included in each of the first to sixth serial paths 201, 202, 203, 204, 205, and 206.

The first to sixth serial paths 201, 202, 203, 204, 205, and 206 may be spiral. Since the serial pattern 140 is patterned along sides of an equilateral triangle, the spiral serial paths 201, 202, 203, and 204 are helical. , 205 and 206 are at an angle of 60 °.

Since the plurality of mounting points 134 are divided into six equal parts and included in each of the first to sixth spiral series paths 201, 202, 203, 204, 205, and 206, the first to sixth spiral series paths 201. , 202, 203, 204, 205, and 206 each include the same number of mounting points 134. Accordingly, an equal number of light emitting diodes may be mounted in each of the first to sixth spiral series paths 201, 202, 203, 204, 205, and 206.

Next, the connection relationship between the parallel patterns 150 will be described. In FIG. 4, the parallel pattern 150 is indicated by a dotted line surrounding the outer shell of the substrate 110. The parallel pattern 150 is electrically connected to the second electrode 122, and is indicated by a solid line surrounding the periphery of the substrate 110. The parallel pattern 150 has an end reaching one side of the second regular hexagon 180 among the first to sixth serial paths 201, 202, 203, 204, 205, and 206, that is, the first to sixth serial paths ( Each of the bonding pads included in 201, 202, 203, 204, 205, and 206 is connected to the last bonding pad that reaches one side of the second regular hexagon 180, respectively.

When the light emitting diode is mounted at the mounting point 134 of the printed circuit board 100 according to the exemplary embodiment of the present invention, each of the first to sixth series paths 201, 202, 203, 204, 205, and 206 may be disposed on each of the first to sixth series paths. The same number of light emitting diodes may be mounted.

The unexplained symbols 181, 182, 183, 184, 185, and 186 correspond to vertices of the second regular hexagon, and the light emitting diodes are not mounted as described above.

FIG. 5 is a circuit diagram illustrating an electrical connection relationship between a light emitting diode using a series pattern and a parallel pattern of FIG. 4.

Referring to FIG. 5, the same number of LEDs 300 are mounted on each of the first to sixth series paths 201, 202, 203, 204, 205, and 206. Light emitting diodes mounted on the first to sixth series paths 201, 202, 203, 204, 205, and 206, respectively, are connected in series with each other on each path. The first to sixth series paths 201, 202, 203, 204, 205, and 206 are connected in parallel to each other with respect to the first electrode 120 and the second electrode 122. Therefore, an equal voltage is applied to the first to sixth series paths 201, 202, 203, 204, 205, and 206 so that each of the light emitting diodes can be stably driven in an electrically uniform state.

6 is a view for explaining another connection relationship between the serial pattern and the parallel pattern shown in FIG.

Referring to FIG. 6, the first to sixth serial paths 211, 212, 213, 214, 215, and 216 have a zigzag shape, unlike the spiral shape shown in FIG. 4. Since the serial pattern 140 is patterned along the sides of the equilateral triangle, the angle at which the zigzag serial paths 211, 212, 213, 214, 215, and 216 are bent is 60 °.

The serial pattern 140 is not limited to a spiral or zigzag form as long as the plurality of mounting points 134 on the substrate 110 are divided into six equal parts and patterned to be included in the first to sixth serial paths, respectively. Other connection relationships, such as the connection relationship of the parallel pattern 150 is easily understood by those skilled in the art from the description of FIG.

7 is a view for explaining another connection relationship between the serial pattern and the parallel pattern shown in FIG.

Referring to FIG. 7, first, the connection relationship of the serial pattern 140 will be described. In FIG. 7, the serial pattern 140 is represented by a solid line connecting the plurality of mounting points 134. The first electrode 120 and the second electrode 122 are formed in the first regular hexagon 170. Three vertices of the first regular hexagon 170 are electrically connected to the first electrode 120, and three other vertices of the first regular hexagon 170 are electrically connected to the second electrode 122.

The serial pattern 140 is patterned such that a plurality of mounting points 134 on the substrate 110 are divided into six equal parts and included in the first to sixth serial paths 221, 222, 223, 224, 225, and 226, respectively. do. In detail, the serial pattern 140 may include first to sixth serial paths 221, 222, 223, 224, and 225 starting at each vertex of the first regular hexagon 170 and reaching one side of the second regular hexagon 180. 226 is preferably patterned to form. The first through sixth serial paths 201, 202, 203, 204, 205, and 206 may be spiral.

Next, the connection relationship between the parallel patterns 150 will be described. The parallel pattern 150 includes a first parallel pattern 152 and a second parallel pattern 154. The first parallel pattern 152 is electrically connected to the first electrode 120 and extends from the center of the substrate 110 toward the outer surface of the substrate 110 to surround a portion of the outer surface of the substrate 110 to form a second regular hexagon 180. Is electrically connected to the ends of the fourth to sixth series paths 224, 225, and 226 that reach one side of That is, the bonding pads included in the fourth to sixth serial paths 204, 205, and 206 are respectively connected to the last bonding pads reaching one side of the second regular hexagon 180.

The second parallel pattern 154 is electrically connected to the second electrode 122 and extends from the center of the substrate 110 toward the outer surface of the substrate 110 to surround a portion of the outer surface of the substrate 110 to form a second regular hexagon 180. Is electrically connected to the ends of the first to third series paths 221, 222, and 223 that reach one side of the cross-section. That is, the bonding pads included in the first to third serial paths 201, 202, and 203 are respectively connected to the last bonding pads reaching one side of the second regular hexagon 180.

The first parallel pattern 152 electrically connects the fourth to sixth series paths 224, 225, and 226 connected to the second electrode 122 to the first electrode 120 in parallel, and the second parallel pattern 154. ) Electrically connects the first to third series paths 221, 222, and 223 connected to the first electrode 120 to the second electrode 122 in parallel.

When the light emitting diode is mounted at the mounting point 134 of the printed circuit board 100 according to the exemplary embodiment of the present invention, the first to sixth serial paths 221, 222, 223, 224, 225, and 226 are respectively provided on the mounting points 134. The same number of light emitting diodes may be mounted. The serial pattern 140 is not limited to the spiral shape as long as the plurality of mounting points 134 on the substrate 110 are divided into six equal parts and patterned to be included in the first to sixth serial paths, respectively.

FIG. 8 is a circuit diagram illustrating an electrical connection relationship between a light emitting diode using a series pattern and a parallel pattern of FIG. 7.

Referring to FIG. 8, the same number of LEDs 300 are mounted on each of the first to sixth series paths 221, 222, 223, 224, 225, and 226. The light emitting diodes mounted on the first to sixth series paths 221, 222, 223, 224, 225, and 226 are respectively connected in series on each path. The first to third serial paths 221, 222, and 223 and the fourth to sixth serial paths 224, 225, and 226 may be formed of a first parallel pattern 154 and a first parallel pattern 152. The electrode 120 and the second electrode 122 are connected in parallel with each other. Accordingly, an equal voltage is applied to the first to sixth series paths 201, 202, 203, 204, 205, and 206 so that each LED can be stably driven in an electrically uniform state.

9 is a plan view of a light emitting diode mounted on the printed circuit board of FIG. 1, and FIG. 10 is a cross-sectional view taken along line II ′ of the light emitting diode of FIG. 9.

9 and 10, the LED mounting board 100 includes a substrate 110 having via holes 112 formed therein and heat dissipation pads 114 and 116 coupled to front and rear surfaces of the substrate 110. .

The light emitting diode 300 includes a housing 310 constituting a body, an electrode terminal 320 soldered to a bonding pad (not shown) of the printed circuit board 100, and a heat sink in which the light emitting diode chip 340 is insulated and mounted. 330 and a light emitting diode chip 340 that is wire-bonded to the electrode 320 and emits light when a driving voltage is applied. The heat sink 330 may be insulated from the electrode terminal 320 and protrude outwardly from the housing 310 to be soldered to the solder 116 when the light emitting diode 300 is mounted on the printed circuit board 110.

The via hole 112 is a hole penetrating the heat dissipation pad 114 coupled to the substrate 110 and the front surface of the substrate 110. The via hole 112 is filled with a conductive material or plated to generate heat generated by the light emitting diode 300. Transfer to the heat dissipation pad 116 coupled to the back. Therefore, the via hole 112 is preferably formed where the heat sink 330 can be connected to the soldered position.

The printed circuit board 100 according to the exemplary embodiment of the present invention has a structure in which bonding pads, serial patterns, and parallel patterns for electrically connecting the light emitting diodes 300 may be disposed on the front surface of the substrate 110. The heat dissipation pad 116 that performs a heat dissipation function may be coupled to the entire rear surface of the substrate 110, thereby improving heat dissipation efficiency.

In addition, since the conductive pattern, such as a bonding pad, is electrically insulated from the heat dissipation pad 114 coupled to the front surface, the heat dissipation function may be performed not only on the rear surface but also on the front surface of the substrate 110.

In addition, unlike the conventional metal printed circuit board or the conductive thin film printed circuit board, the printed circuit board 100 according to an embodiment of the present invention can use a rigid circuit board, which can reduce manufacturing costs in comparison with the conventional method. It works.

Although the detailed description of the present invention described above has been described with reference to a preferred embodiment of the present invention, a person skilled in the art without departing from the spirit and scope of the present invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a view illustrating a front surface of a printed circuit board for mounting a light emitting diode according to an embodiment of the present invention.

2 is a diagram illustrating a rear surface of a printed circuit board for mounting a light emitting diode according to an embodiment of the present invention.

3 is a view for explaining an arrangement position of the bonding pad illustrated in FIG. 1.

4 is a view for explaining the connection relationship between the serial pattern and the parallel pattern shown in FIG.

FIG. 5 is a circuit diagram illustrating an electrical connection relationship between a light emitting diode using a series pattern and a parallel pattern of FIG. 4.

6 is a view for explaining another connection relationship between the serial pattern and the parallel pattern shown in FIG.

7 is a view for explaining another connection relationship between the serial pattern and the parallel pattern shown in FIG.

FIG. 8 is a circuit diagram illustrating an electrical connection relationship between a light emitting diode using a series pattern and a parallel pattern of FIG. 7.

9 is a plan view of a light emitting diode mounted on the printed circuit board of FIG. 1.

FIG. 10 is a cross-sectional view taken along line II ′ of the light emitting diode of FIG. 9.

Claims (8)

A first regular hexagon having a mounting interval of the light emitting diode having a length of one side; A second regular hexagon enlarged by an integral multiple of the mounting interval with respect to the center of the first regular hexagon; When a plurality of equilateral triangles having a length of one side of the mounting interval is arranged between the first regular hexagon and the second regular hexagon at least partially without overlapping each other, A printed circuit board for mounting a light emitting diode, wherein a bonding pad having the light emitting diode mounted thereon is formed on one surface of a substrate at vertices of the equilateral triangles. A first regular hexagon having a mounting interval of the light emitting diode having a length of one side; A second regular hexagon enlarged by an integral multiple of a mounting interval based on the center of the first regular hexagon; When a plurality of equilateral triangles having a length of one side of the mounting interval is arranged between the first regular hexagon and the second regular hexagon at least partially without overlapping each other, A printed circuit board for mounting a light emitting diode, wherein a bonding pad on which a light emitting diode is mounted is formed on one surface of a substrate except for the vertices of the second regular hexagon. The method of claim 1 or 2, wherein the substrate, A plurality of serial patterns are formed on the surface to connect the bonding pads to each other so that first to sixth serial paths each reaching one side of the second regular hexagon at each vertex of the first regular hexagon are formed. The printed circuit board of claim 1, wherein the number of the bonding pads is equally divided into six parts in the first to sixth serial paths. The method of claim 3, wherein the first to second series path, A printed circuit board for mounting a light emitting diode mounted in a spiral or zigzag shape including specific sides of the plurality of equilateral triangles. The method of claim 4, wherein the substrate A first electrode and a second electrode are formed on one surface, the first electrode is connected to a bonding pad formed at a vertex of the first regular hexagon, and the second electrode is connected to a parallel pattern, The parallel pattern is a light emitting diode mounting printed circuit board is connected to the last bonding pad reaching one side of the second regular hexagon of the bonding pads included in the first to sixth serial path. The method of claim 5, wherein the substrate, A heat dissipation pad is attached to one surface to radiate heat generated from the light emitting diode, The heat dissipation pad includes a first electrode, a second electrode, a bonding pad, a series pattern, and an insulating pad to insulate the parallel pattern from the heat dissipation pad. The method of claim 1, wherein the substrate, Via holes containing a conductive material are formed, The printed circuit board of claim 1, wherein a heat dissipation pad connected to the via hole is attached to the other surface of the substrate. The method of claim 7, wherein The light emitting diode includes a heat sink insulated from an electrode mounted on the bonding pad and mounted on one surface of the substrate. The via hole may be connected to a position where the heat sink is mounted.

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