CN215527755U

CN215527755U - High-strength heat dissipation type LED packaging structure

Info

Publication number: CN215527755U
Application number: CN202120869816.3U
Authority: CN
Inventors: 谢径舟
Original assignee: Dongguan Ebird Photoelectric Technology Co ltd
Current assignee: Dongguan Ebird Photoelectric Technology Co ltd
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2022-01-14
Anticipated expiration: 2031-04-25

Abstract

The utility model provides a high-strength heat dissipation type LED packaging structure which comprises an insulating support, wherein a bowl-shaped concave cavity is arranged on the insulating support, a reflecting layer covers the inner wall of the bowl-shaped concave cavity, two wiring boards are arranged in the insulating support and are of an L-shaped structure, a Z-shaped insulating convex strip is formed between the two wiring boards, and a heat dissipation insulating plate covers the bottom of the insulating support; wiring board one side is connected with electrically conductive pin, is equipped with the LED chip on the wiring board, is connected with the viscose layer between the bottom of LED chip and the wiring board, and the top electrode of LED chip passes through electrically conductive pin connection wiring board, is equipped with the buckler of U font on the wiring board, and LED chip and electrically conductive pin all are located the encirclement of buckler, and the bowl form cavity is filled with the insulation package body. The utility model can not only form higher luminous brightness, but also avoid heat accumulation on one side, the insulating raised line can improve the bending resistance, and the waterproof groove can improve the sealing performance.

Description

High-strength heat dissipation type LED packaging structure

Technical Field

The utility model relates to an LED, and particularly discloses a high-strength heat dissipation type LED packaging structure.

Background

The LED is also called a light emitting diode, is a common light emitting device, can convert electrical energy into light energy, adopts a solid semiconductor chip as a light emitting material, has the characteristics of high electro-optic conversion efficiency, long service life, high brightness and less heat generation, and gradually replaces the traditional bulb to become a mainstream lighting source.

An LED package is usually provided with an insulating support structure, and conductive pins such as terminals are disposed in the support, and then LED chips and conductive pins are disposed on the conductive pins. In the prior art, the luminous brightness of the packaging structure with only one LED chip is insufficient, and the packaging structure with a plurality of LED chips can improve the luminous brightness, but the LED chips are arranged on the same conductive pin, so that the heat dissipation effect is poor, and the working performance of the LED packaging structure is influenced.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a heat dissipation type LED package structure with high strength, which can form a high luminance, and has good heat dissipation performance and good sealing performance.

In order to solve the problems of the prior art, the utility model discloses a high-strength heat dissipation type LED packaging structure which comprises an insulating support, wherein a bowl-shaped cavity is arranged on the insulating support, a reflecting layer covers the inner wall of the bowl-shaped cavity, two routing plates positioned at the bottom of the bowl-shaped cavity are arranged in the insulating support, the routing plates are of an L-shaped structure, a Z-shaped insulating convex strip is formed between the two routing plates, and a heat dissipation insulating plate covers the bottom of the insulating support;

one side that the bowl form cavity center was kept away from to the routing board is connected with electrically conductive pin, be equipped with the LED chip on the routing board, be connected with the viscose layer between the bottom of LED chip and the routing board, two routing boards are connected respectively through two electrically conductive lead wires in the top of LED chip, be equipped with the buckler of U font on the routing board, the buckler is connected with insulating sand grip and is formed the closed loop, LED chip and electrically conductive lead wire all are located the encirclement of buckler, the buckler is located the encirclement of bowl form cavity, it has the insulation package body to fill in the bowl form cavity.

Further, the heat dissipation insulating plate is a heat dissipation ceramic plate.

Further, electrically conductive pin includes upper ledge portion, the portion of bending and lower platform portion, upper ledge portion and routing board fixed connection, and the portion of bending is located outside one side of insulating support, and lower platform portion is located the below of heat dissipation insulation board.

Furthermore, an elastic layer is connected between the lower platform part and the heat dissipation insulating plate.

Further, the elastic layer is a heat conduction silica gel layer.

Further, the viscose layer is a heat conduction silica gel layer.

Further, a fluorescent layer covers the top light-emitting surface of the LED chip.

The utility model has the beneficial effects that: the utility model discloses a high-strength heat dissipation type LED packaging structure, which is packaged with two LED chips respectively arranged on different routing plates, so that high luminous brightness can be formed, heat can be prevented from accumulating on a structure on one side, the heat dissipation efficiency of the overall structure is high, the heat dissipation performance of the overall structure can be further improved by matching with an insulating heat dissipation plate at the bottom, the space utilization rate of the overall structure can be improved by the L-shaped routing plate, the bending resistance of the overall structure can be improved by the Z-shaped insulating raised lines, the sealing performance of the packaging structure can be effectively improved by matching waterproof grooves with an insulating packaging body, and the working performance of the LED chips is prevented from being influenced by corrosive substances.

Drawings

Fig. 1 is a schematic top view of the present invention without the insulating package.

FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1.

The reference signs are: the packaging structure comprises an insulating support 10, a bowl-shaped cavity 11, a reflecting layer 12, an insulating convex strip 13, a heat dissipation insulating plate 14, a routing plate 20, a waterproof groove 21, a conductive pin 30, an upper platform part 31, a bending part 32, a lower platform part 33, an elastic layer 34, a chip 40, a conductive lead 41, an adhesive layer 42, a fluorescent layer 43 and an insulating packaging body 50.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 and 2.

The embodiment of the utility model discloses a high-strength heat dissipation type LED packaging structure, which comprises an insulating support 10, wherein a bowl-shaped cavity 11 is arranged on the insulating support 10, the side wall of the bowl-shaped cavity 11 inclines towards the center from top to bottom, a reflecting layer 12 covers the inner wall of the bowl-shaped cavity 11, two routing plates 20 positioned at the bottom of the bowl-shaped cavity 11 are arranged in the insulating support 10, the routing plates 20 are of a conductive plate structure, the areas of the two routing plates 20 are equal, the routing plates 20 are of a complementary L-shaped structure, namely, one routing plate 20 can be superposed with the other routing plate 20 after rotating for 180 degrees, a Z-shaped insulating convex strip 13 is formed between the two routing plates 20, preferably, the insulating convex strip 13 and the insulating support 10 are of an integrally formed structure, and a heat dissipation insulating plate 14 covers the bottom of the insulating support 10, so that the heat dissipation performance of the integral structure can be effectively improved;

one side of each routing plate 20, which is far away from the center of the bowl-shaped cavity 11, is connected with a conductive pin 30, one end of the conductive pin 30, which is far away from the routing plate 20, protrudes out of the insulating support 10, each routing plate 20 is provided with a normally-installed LED chip 40, an adhesive layer 42 is connected between the bottom of the LED chip 40 and the routing plate 20, two electrodes at the top of each LED chip 40 are respectively connected with the two routing plates 20 through two conductive leads 41, namely, the top electrode of each LED chip 40 is respectively connected with the two routing plates 20 through the conductive leads 41, each routing plate 20 is provided with a U-shaped waterproof groove 21, each waterproof groove 21 can be connected with the insulating convex strip 13 to form a closed loop, namely, two ends of each waterproof groove 21 are abutted against the side surface of the insulating convex strip 13, the LED chip 40 and the conductive leads 41 are positioned in the enclosure of the two waterproof grooves 21, the waterproof grooves 21 are positioned in the enclosure of the bowl-shaped cavity 11, the bowl-shaped cavity 11 is filled with a light-transmitting insulating package 50, and the insulating package 50 is further filled in the waterproof groove 21.

During operation, most of the light emitted by the LED chip 40 directly exits through the insulating package 50, and part of the light is reflected by the reflective layer 12 and exits through the insulating package 50. The two LED chips 40 are integrated in the packaging structure, the light emitting performance is good, the two LED chips 40 are respectively arranged on the two wiring boards 20, the heat can be effectively prevented from being concentrated on the conductive pins 30 on one side to influence the heat dissipation efficiency, the two L-shaped wiring boards 20 which are complementarily arranged can effectively ensure that a large enough accommodating space and a large enough wiring space are formed for the LED chips 40, and the space utilization rate of the whole structure is high; the insulating convex strips 13 arranged in the Z shape can effectively improve the bending resistance of the insulating support 10, can effectively improve the mechanical resistance of the whole structure, can effectively protect the welding structure of the LED chip 40 and the conductive lead 41 thereof, and has stable and reliable whole structure; fill in insulating packaging body 50 wherein through the cooperation part of waterproof slot 21 can effectively completely cut off external corrosive substance, avoid corrosive substance to enter into packaging structure's inside from the gap that forms between routing board 20 and insulating packaging body 50, avoid inside circuit structures such as LED chip 40 or electrically conductive lead 41 to be corroded and damaged.

In the present embodiment, the heat dissipating and insulating plate 14 is a heat dissipating ceramic plate having good heat dissipating performance and insulating performance.

In this embodiment, each conductive pin 30 satisfies the following relation that the conductive pin 30 includes an upper platform portion 31, a bending portion 32 and a lower platform portion 33, the upper platform portion 31 is fixedly connected with the routing board 20, the bending portion 32 is located outside one side of the insulating support 10, the lower platform portion 33 is located below the heat dissipation insulating board 14, and the lower platform portion 33 is used for realizing the welding installation with the pad of the PCB board.

Based on the above embodiment, be connected with elastic layer 34 between lower platform portion 33 and the heat dissipation insulation board 14, connect lower platform portion 33 and heat dissipation insulation board 14 through elastic layer 34 and can effectively improve the stability of welding installation structure behind the PCB board, anti-seismic performance is good.

Based on the above embodiment, the elastic layer 34 is a heat-conducting silica gel layer, and the heat-conducting silica gel has good elasticity and heat-conducting property, so that the heat dissipation performance of the LED package structure body can be ensured, and the elastic shock-proof performance of the overall structure can also be ensured.

In this embodiment, the adhesive layer 42 is a heat-conducting silica gel layer, and the heat-conducting silica gel has good heat-conducting property and adhesive property, so that the firmness and heat dissipation performance of the overall structure can be effectively improved.

In this embodiment, the top light emitting surface of each LED chip 40 is covered with one fluorescent layer 43, the fluorescent layer 43 can effectively improve the light emitting efficiency of the LED chip 40, and can adjust the light emitting color thereof, and the fluorescent layer 43 is only disposed on the top light emitting surface of the LED chip 40, so that the effect of the fluorescent layer 43 can be ensured, the material can be effectively saved, and the cost can be reduced, and preferably, the fluorescent layer 43 is a fluorescent glue layer.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The high-strength heat dissipation type LED packaging structure is characterized by comprising an insulating support (10), wherein a bowl-shaped cavity (11) is formed in the insulating support (10), a reflection layer (12) covers the inner wall of the bowl-shaped cavity (11), two wiring boards (20) located at the bottom of the bowl-shaped cavity (11) are arranged in the insulating support (10), each wiring board (20) is of an L-shaped structure, a Z-shaped insulating convex strip (13) is formed between the two wiring boards (20), and a heat dissipation insulating plate (14) covers the bottom of the insulating support (10);

keep away from line beating board (20) one side at bowl form cavity (11) center is connected with conductive pin (30), be equipped with LED chip (40) on line beating board (20), the bottom of LED chip (40) with be connected with adhesive layer (42) between line beating board (20), two electrodes in the top of LED chip (40) are connected two respectively through two electrically conductive lead wire (41) line beating board (20), be equipped with waterproof groove (21) of U font on line beating board (20), waterproof groove (21) with insulating sand grip (13) are connected and are formed the closed loop, LED chip (40) with electrically conductive lead wire (41) all are located in the encirclement of waterproof groove (21), waterproof groove (21) are located in the encirclement of bowl form cavity (11), it has insulating packaging body (50) to fill in bowl form cavity (11).

2. The high-strength heat-dissipation type LED package structure according to claim 1, wherein the heat-dissipation insulating board (14) is a heat-dissipation ceramic board.

3. The high-strength heat dissipation type LED packaging structure according to claim 1, wherein the conductive pins (30) comprise an upper platform portion (31), a bending portion (32) and a lower platform portion (33), the upper platform portion (31) is fixedly connected with the wiring board (20), the bending portion (32) is located outside one side of the insulating support (10), and the lower platform portion (33) is located below the heat dissipation insulating board (14).

4. The high-strength heat dissipation type LED package structure according to claim 3, wherein an elastic layer (34) is connected between the lower platform part (33) and the heat dissipation insulating plate (14).

5. The high-strength heat dissipation type LED package structure according to claim 4, wherein the elastic layer (34) is a thermal conductive silicone adhesive layer.

6. The high-strength heat dissipation type LED package structure according to claim 1, wherein the adhesive layer (42) is a heat conductive silicone layer.

7. The high-strength heat-dissipation LED package structure as recited in claim 1, wherein the top light-emitting surface of the LED chip (40) is covered with a fluorescent layer (43).