CN107507898B - LED illumination COB packaging structure - Google Patents
LED illumination COB packaging structure Download PDFInfo
- Publication number
- CN107507898B CN107507898B CN201710700873.7A CN201710700873A CN107507898B CN 107507898 B CN107507898 B CN 107507898B CN 201710700873 A CN201710700873 A CN 201710700873A CN 107507898 B CN107507898 B CN 107507898B
- Authority
- CN
- China
- Prior art keywords
- led
- pcb
- adhesive layer
- led wafer
- lower side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 238000005286 illumination Methods 0.000 title claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 239000011324 bead Substances 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000004411 aluminium Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 101150038956 cup-4 gene Proteins 0.000 description 7
- 206010010904 Convulsion Diseases 0.000 description 3
- 230000036461 convulsion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007791 dehumidification Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses an LED illumination COB packaging structure, which comprises an aluminum-based PCB, an LED wafer and a driving assembly, and is characterized in that: the LED chip is adhered to the inside of the groove through die bond glue, a spherical reflecting cup for condensing light is fixed at the position, corresponding to the groove, of the lower side of the PCB, the middle of the groove is communicated with the lower side of the PCB, a through hole corresponding to the through position is formed in the top of the reflecting cup, an LED lamp bead is connected to the lower side of the LED chip, the LED lamp bead is embedded into the through hole and is arranged in the reflecting cup, the LED chip and bonding leads of the LED chip and a driving assembly are packaged on the PCB through a glue layer of silica gel, a radiator is further arranged at the position, corresponding to the LED chip, of the PCB, and the radiator is a small exhaust fan for cooling air exhaust outwards. By adopting an aluminum-based PCB and applying silica gel with high bonding degree, low water absorption and high heat conduction to package the LED wafer, the system thermal resistance is reduced, the service life of the LED is greatly prolonged, the heat conductivity is improved, and the heat dissipation is facilitated.
Description
Technical Field
The invention relates to the technical field of lighting lamps, in particular to a COB (chip on board) packaging structure for an LED lamp.
Background
The conventional COB packaging of the LED lamp generally adopts a PPA bracket, and has high cohesive force with packaging silica gel, however, the water absorption of the silica gel with high cohesive force is directly proportional to the cohesive force, so that the packaged product is easy to get damp again, needs to be dried, has large system thermal resistance and low thermal conductivity, is unfavorable for heat dissipation, ensures longer working procedure of the COB product, has higher cost and influences the yield and the quality reliability. Accordingly, there is a need for further improvements and optimizations to existing LED garden lights.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a COB packaging structure of an LED lighting lamp, so as to improve the yield and the quality reliability.
The technical scheme adopted for solving the technical problems is as follows:
the utility model provides a LED illumination COB packaging structure, includes aluminium base PCB board, LED wafer and drive assembly, its characterized in that: the LED chip is adhered to the inside of the groove through die bond glue, a spherical reflecting cup for condensing light is fixed at the position, corresponding to the groove, of the lower side of the PCB, the middle of the groove is communicated with the lower side of the PCB, a through hole corresponding to the through position is formed in the top of the reflecting cup, an LED lamp bead is connected to the lower side of the LED chip, the LED lamp bead is embedded into the through hole and is arranged in the reflecting cup, the LED chip and bonding leads of the LED chip and a driving assembly are packaged on the PCB through a glue layer of silica gel, a radiator is further arranged at the position, corresponding to the LED chip, of the PCB, and the radiator is a small exhaust fan for cooling air exhaust outwards.
The adhesive layer comprises a fluorescent adhesive layer and a packaging adhesive layer, the fluorescent adhesive layer is covered on the LED wafer, and the packaging adhesive layer is covered outside the fluorescent adhesive layer.
The inner side of the reflecting cup is a curved surface formed by fitting a secondary Bezier curve, and a flexible reflecting film is attached to the curved surface.
The cup mouth of the reflecting cup is provided with a transparent cover, and the transparent cover is arranged as a plane mirror or a convex mirror.
The edge of the light-transmitting cover is bonded or riveted with the cup opening of the light-reflecting cup through AB glue.
The invention has the beneficial effects that: by adopting an aluminum-based PCB and applying silica gel with high bonding degree, low water absorption and high heat conduction to package the LED wafer, the system thermal resistance is reduced, the service life of the LED is greatly prolonged, the heat conductivity is improved, the heat dissipation is convenient, the COB product does not need baking and dehumidification before application, the working procedures are reduced, the cost is reduced, and the yield and the quality reliability are improved; the LED lamp beads are arranged in the reflecting cup, so that the light source is reflected through the light gathering concave part to the greatest extent, and the light loss is reduced; through the heat dissipation of small-size air exhauster convulsions, accelerated heat dissipation rate greatly, furthest takes away the temperature of light source, guarantees radiating efficiency, improves life.
Drawings
The invention is described in further detail below with reference to the attached drawing figures, wherein:
fig. 1 is a structural diagram of the present invention.
Detailed Description
Referring to fig. 1, an LED lighting COB package structure includes an aluminum-based PCB board 1, an LED chip 2, and a driving assembly 3, wherein: the LED chip 2 is fixed with the sphere reflection cup 4 that is used for spotlight through die bond glue in the recess, PCB board 1 downside corresponds recess department, the recess middle part is link up with PCB board 1 downside, the through-hole that corresponds with the department that link up is opened at reflection cup 4 top, LED chip 2 downside is connected with LED lamp pearl 5, LED lamp pearl 5 embedding through-hole is placed in reflection cup 4, LED chip 2 and bonding wire with drive assembly 3 seal on PCB board 1 through adopting the viscose layer 6 of silica gel, PCB board 1 is last still to be equipped with radiator 7 corresponding LED chip 2 department, radiator 7 is the small-size air exhauster of outwards convulsions cooling. By adopting an aluminum-based PCB and applying silica gel with high bonding degree, low water absorption and high heat conduction to package the LED wafer, the system thermal resistance is reduced, the service life of the LED is greatly prolonged, the heat conductivity is improved, the heat dissipation is convenient, the COB product does not need baking and dehumidification before application, the working procedures are reduced, the cost is reduced, and the yield and the quality reliability are improved; the LED lamp beads 5 are arranged in the reflecting cup 4, so that the light source is reflected through the light gathering concave part to the greatest extent, and the light loss is reduced; through the heat dissipation of small-size air exhauster convulsions, accelerated heat dissipation rate greatly, furthest takes away the temperature of light source, guarantees radiating efficiency, improves life.
Preferably, the adhesive layer 6 comprises a fluorescent adhesive layer and a packaging adhesive layer, the fluorescent adhesive layer is covered on the LED wafer 2, the color rendering of the LED is effectively improved, and the packaging adhesive layer is covered outside the fluorescent adhesive layer.
As a further improvement of the technical scheme, the inner side of the reflecting cup 4 is a curved surface formed by fitting a secondary Bezier curve, and the design structure of the multi-curved surface fitting ensures that the light emitted by the LED light source is collected and utilized to the maximum extent, so that the light in different directions is effectively overlapped, and the brightness and the light efficiency of emergent light rays are greatly improved; and a flexible reflective film is stuck on the transparent film.
Further, the mouth of the reflecting cup 4 is provided with a transparent light-transmitting cover 8 to prevent impurities from entering, and the light-transmitting cover 8 is a plane mirror or a convex mirror.
Further, the edge of the light-transmitting cover 8 is adhered or riveted with the cup opening of the light-reflecting cup 4 through AB glue so as to effectively prevent water.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and any modifications or equivalent substitutions without departing from the spirit and scope of the present invention should be covered in the scope of the technical solution of the present invention.
Claims (3)
1. The utility model provides a LED illumination COB packaging structure, includes aluminium base PCB board, LED wafer and drive assembly, its characterized in that: the LED light source is characterized in that grooves with the shape and depth being matched with the LED wafer are formed in the upper side of the PCB, the LED wafer is adhered in the grooves through die bond glue, a spherical reflecting cup for condensing light is fixed at the position, corresponding to the grooves, of the lower side of the PCB, the middle of the grooves is communicated with the lower side of the PCB, through holes corresponding to the through holes are formed in the tops of the reflecting cups, LED lamp beads are connected to the lower side of the LED wafer, the LED lamp beads are embedded into the through holes and are arranged in the reflecting cups, the LED wafer and bonding leads of the LED wafer and a driving assembly are packaged on the PCB through adhesive layers of silica gel, a radiator is further arranged at the position, corresponding to the LED wafer, of the PCB, the radiator is a small exhaust fan for exhausting and cooling outwards, the inner side of the reflecting cup is a curved surface formed by fitting a secondary Bezier curve, a flexible reflecting film is adhered on the curved surface, and the edge of a light transmitting cover is adhered or riveted with the opening of the reflecting cup through AB glue.
2. The LED illuminated COB package of claim 1, wherein: the adhesive layer comprises a fluorescent adhesive layer and a packaging adhesive layer, the fluorescent adhesive layer is covered on the LED wafer, and the packaging adhesive layer is covered outside the fluorescent adhesive layer.
3. The LED lighting COB package of claim 1 or 2, wherein: the cup mouth of the reflecting cup is provided with a transparent cover, and the transparent cover is arranged as a plane mirror or a convex mirror.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710700873.7A CN107507898B (en) | 2017-08-16 | 2017-08-16 | LED illumination COB packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710700873.7A CN107507898B (en) | 2017-08-16 | 2017-08-16 | LED illumination COB packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107507898A CN107507898A (en) | 2017-12-22 |
| CN107507898B true CN107507898B (en) | 2023-11-03 |
Family
ID=60691928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710700873.7A Active CN107507898B (en) | 2017-08-16 | 2017-08-16 | LED illumination COB packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107507898B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109296997A (en) * | 2018-09-17 | 2019-02-01 | 盐城东紫光电科技有限公司 | A kind of knockdown COB encapsulating structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202629638U (en) * | 2012-04-12 | 2012-12-26 | 周海兵 | COB (Chip on Board)-packaged LED (Light-Emitting Diode) plant lamp |
| CN203150616U (en) * | 2013-02-19 | 2013-08-21 | 厦门市朗星节能照明股份有限公司 | LED light source COB packaging structure |
| CN203150541U (en) * | 2013-02-19 | 2013-08-21 | 厦门市朗星节能照明股份有限公司 | LED light source based on COB packaging |
| CN203927665U (en) * | 2014-04-18 | 2014-11-05 | 唐益明 | A kind of LED plant growth lamp |
| CN204033303U (en) * | 2014-09-09 | 2014-12-24 | 王敬华 | A kind of observing mirror for oral cavity |
| CN204285212U (en) * | 2014-12-24 | 2015-04-22 | 河北光迪照明科技开发有限公司 | A kind of LED garden lamp |
| WO2015109574A1 (en) * | 2014-01-26 | 2015-07-30 | 上海瑞丰光电子有限公司 | Led wafer-level encapsulation method |
| CN104990019A (en) * | 2015-07-23 | 2015-10-21 | 安徽卡澜特车灯科技有限公司 | High-efficiency LED double-chip high beam and low beam integrated automobile headlamp cooling system |
| CN105020652A (en) * | 2015-07-23 | 2015-11-04 | 安徽卡澜特车灯科技有限公司 | High-efficiency LED (Light-Emitting Diode) dual chip high-low beam integrated automobile headlamp module |
| CN205026539U (en) * | 2015-07-23 | 2016-02-10 | 安徽卡澜特车灯科技有限公司 | Shine big lamp module group before far and near light integration car of high efficiency LED double chip |
| CN106369490A (en) * | 2016-10-17 | 2017-02-01 | 青岛海尔股份有限公司 | Refrigerator and illuminating part thereof |
| CN206130708U (en) * | 2016-10-17 | 2017-04-26 | 青岛海尔股份有限公司 | Refrigerator and lighting parts thereof |
-
2017
- 2017-08-16 CN CN201710700873.7A patent/CN107507898B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202629638U (en) * | 2012-04-12 | 2012-12-26 | 周海兵 | COB (Chip on Board)-packaged LED (Light-Emitting Diode) plant lamp |
| CN203150616U (en) * | 2013-02-19 | 2013-08-21 | 厦门市朗星节能照明股份有限公司 | LED light source COB packaging structure |
| CN203150541U (en) * | 2013-02-19 | 2013-08-21 | 厦门市朗星节能照明股份有限公司 | LED light source based on COB packaging |
| WO2015109574A1 (en) * | 2014-01-26 | 2015-07-30 | 上海瑞丰光电子有限公司 | Led wafer-level encapsulation method |
| CN203927665U (en) * | 2014-04-18 | 2014-11-05 | 唐益明 | A kind of LED plant growth lamp |
| CN204033303U (en) * | 2014-09-09 | 2014-12-24 | 王敬华 | A kind of observing mirror for oral cavity |
| CN204285212U (en) * | 2014-12-24 | 2015-04-22 | 河北光迪照明科技开发有限公司 | A kind of LED garden lamp |
| CN104990019A (en) * | 2015-07-23 | 2015-10-21 | 安徽卡澜特车灯科技有限公司 | High-efficiency LED double-chip high beam and low beam integrated automobile headlamp cooling system |
| CN105020652A (en) * | 2015-07-23 | 2015-11-04 | 安徽卡澜特车灯科技有限公司 | High-efficiency LED (Light-Emitting Diode) dual chip high-low beam integrated automobile headlamp module |
| CN205026539U (en) * | 2015-07-23 | 2016-02-10 | 安徽卡澜特车灯科技有限公司 | Shine big lamp module group before far and near light integration car of high efficiency LED double chip |
| CN106369490A (en) * | 2016-10-17 | 2017-02-01 | 青岛海尔股份有限公司 | Refrigerator and illuminating part thereof |
| CN206130708U (en) * | 2016-10-17 | 2017-04-26 | 青岛海尔股份有限公司 | Refrigerator and lighting parts thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107507898A (en) | 2017-12-22 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20231008 Address after: 2nd Floor, No. 3 Meixing Street, Guzhen Town, Zhongshan City, Guangdong Province, 528400 Applicant after: Guangdong Tianji Optoelectronics Co.,Ltd. Address before: No. 223, jin'ou Road, Jianghai District, Jiangmen City, Guangdong Province 529000 Applicant before: GUANGDONG LCLED LIGHTING Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |