WO2013097314A1 - Led array light source without circuit substrate - Google Patents

Led array light source without circuit substrate Download PDF

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Publication number
WO2013097314A1
WO2013097314A1 PCT/CN2012/070589 CN2012070589W WO2013097314A1 WO 2013097314 A1 WO2013097314 A1 WO 2013097314A1 CN 2012070589 W CN2012070589 W CN 2012070589W WO 2013097314 A1 WO2013097314 A1 WO 2013097314A1
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WO
WIPO (PCT)
Prior art keywords
light source
led
conductive material
array light
led array
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Application number
PCT/CN2012/070589
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French (fr)
Chinese (zh)
Inventor
高鞠
Original Assignee
苏州晶品光电科技有限公司
上海芯洲电子科技有限公司
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Publication of WO2013097314A1 publication Critical patent/WO2013097314A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the invention belongs to the technical field of LED light sources, and in particular relates to a LED array light source without a circuit board. Background technique
  • LED lamps have been widely used in various lighting fields due to their high luminous efficiency, low power consumption, high voltage resistance and high safety.
  • the life of the LED light source is directly related to the operating temperature of the node. At present, only about 50% of the electric energy of the LED lamp is converted into light energy during the working process, and the remaining electric energy is almost converted into thermal energy, so that the temperature of the LED lamp rises. For every 10 degrees Celsius increase in temperature, the reliability is reduced by half. Heat dissipation is a big problem. If the heat dissipation is not good, it will directly lead to the degradation of LED performance and stability. At the same time, poor heat dissipation will cause serious light decay to affect the life of the lamp.
  • Taiwan 1229948 discloses a flip-chip LED package array and a package unit thereof. It is mainly disclosed that an LED chip is disposed on a ceramic substrate and connected to a metal wiring layer on the ceramic substrate.
  • the porcelain substrate is disposed in a recess of a metal body that acts as a heat sink by means of a thermal paste.
  • the heat sink is ultimately connected to the heat sink, which dissipates the heat through the convection to the ambient air.
  • the LED chip and the metal wiring layer are separated from the metal body by the thick ceramic substrate and the thermal conductive adhesive, the LED chip and the metal are The heat on the wiring layer cannot be quickly transferred to the heat sink and then transferred to the heat sink for heat dissipation. From the LED chip through a relatively thick substrate, thermal paste, heat sink to the heat sink, the thermal resistance is very large, so the heat dissipation effect is not good.
  • the present invention provides a circuit-less substrate LED array light source, which greatly improves the heat dissipation capability and light-emitting efficiency of the illuminating light source, and is more suitable for automated production to provide consumer use.
  • a circuit-less substrate LED array light source comprising a plurality of LED chips or LED lamp beads, characterized in that: further comprising a sheet-type conductive material, a conductive pattern is arranged on the sheet-type conductive material, and a plurality of conductive patterns are reserved on the conductive pattern
  • the LED chip or the LED lamp bead is directly mounted on the bonding area, and is electrically connected to each other through a conductive pattern.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: the conductive material is a flexible sheet type conductive material.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: a connection structure for placing an LED chip or an LED lamp bead is disposed in the bonding region.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material has a thickness of 0.1 mm - 2 mm and a tensile strength of 5 MPa or more.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material is one or a combination of copper, aluminum, silver, gold powder metallurgical materials.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material is one of a film material such as copper foil, aluminum foil or silver foil.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: the conductive line has a groove structure at the connection portion with the LED, which facilitates the placement and soldering of the LED chip or the LED lamp bead.
  • the above-mentioned circuit-less substrate LED array light source is characterized in that: when the light source is an LED chip, the sheet-type conductive material is integrally covered with the phosphor film.
  • the invention adopts a planar sheet-type imposition structure to provide an LED two-dimensional light source.
  • the flexible film-type conductive material directly supplies power and provides mechanical support, removes the substrate components, and increases the heat dissipation and plasticity of the LED light source.
  • the design of the conductive pattern and the connection structure of the LED chip or the LED lamp bead realizes the circuit conduction of the LED light source.
  • the operation is convenient and the degree of automation is high.
  • the design of the conductive pattern can be realized by computer simulation, and the optical, electrical and thermal properties of the device as a whole are optimized.
  • the conductive material itself is a flexible sheet type material, and the conductive pattern has good permeability, completely eliminating the heavy aluminum substrate and the prior art.
  • the plastic substrate does not need to use a large heat sink, so it is more advantageous to efficiently and quickly transfer the heat generated by the LED chip or the LED lamp bead to the conductive material for heat dissipation, and the heat dissipation effect is good, the LED chip or the LED The lamp bead is not easily damaged and has a long service life.
  • Conductive material adopts flexible sheet material, which makes the LED array light source fold and bend arbitrarily during use, greatly increasing the practicality of light source design and use.
  • Figure 1 is a schematic view showing the structure of a non-circuit substrate LED array light source of the present invention.
  • a circuit-less substrate LED array light source includes a plurality of LED chips or LED lamp beads 1 and a flexible sheet-type conductive material 2, and a conductive pattern is disposed on the flexible sheet-type conductive material 2 in a conductive pattern.
  • a plurality of bonding regions 4 are reserved thereon, and a connection structure 3 for placing LED chips or LED lamp beads is disposed in the bonding region 4, and the LED chips or LED lamp beads are directly mounted on the bonding region 4 through the connection structure 3, and are electrically conductive.
  • the patterns are connected to each other.
  • the flexible sheet type conductive material 2 should have certain characteristics such as solder resistance, lightness, and mechanical strength.
  • the flexible sheet type electrically conductive material 2 is one or a combination of copper, aluminum, silver, gold powder materials and the like.
  • the conductive pattern can be prepared by printing, printing, electrostatic spraying or the like on a re-substrate, followed by peeling off the substrate to obtain a flexible sheet-like conductive material 2 having a conductive pattern.
  • the solder resist layer is then printed on the surface of the conductive material to form a precisely sized LED chip or LED bead bond area 4 .
  • the flexible sheet-type conductive material 2 is one of film materials such as copper foil, aluminum foil, and silver foil.
  • the conductive pattern can be directly formed into a flexible sheet-type conductive material 2 having a conductive pattern by laser engraving, etching, stamping, etc., and then the solder resist layer is printed on the surface of the conductive material to form an accurate LED chip or LED lamp bead bond area. 4.
  • the LED chip or LED lamp bead 1 can be fixed on the bonding area 4 by soldering, patching, laser, plasma welding, etc.
  • the design of the conductive pattern can be optimized by computer simulation to optimize the optical, electrical and thermal properties of the device as a whole. performance.
  • the present invention directly coats copper on a substrate using a calendering method, and then performs patterning dry film, exposure, development, etching, film removal, and tin plating to obtain a conductive material 2 having a predetermined circuit pattern.
  • the conductive pattern includes pads for connecting the positive and negative electrodes of the LED element. The substrate is then peeled off, leaving only the copper foil with the conductive pattern.
  • the LED chip or the LED lamp bead 1 can be directly attached to the bonding area 4 through the connection structure 3.
  • the circuit-less substrate of the invention has the following features:
  • Planar full-package semiconductors The advantage is that it is convenient for rapid and efficient production, high degree of automation, and can be packaged quickly and in full.
  • the packaged product has high reliability and good consistency;
  • Copper foil, silver foil, gold foil, etc. with conductive pattern are used as the conductive circuit material, directly connected with the LED, and the aluminum substrate or the insulating substrate is removed, thereby increasing the heat dissipation and light-emitting efficiency of the LED light source.
  • this flat film type full-package LED product is easier to dissipate heat, and the selection of flexible substrate increases the application of LED light source.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

An LED array light source without a circuit substrate comprises a plurality of LED chips or LED lamp beads (1), and a slice conductive material (2). The slice conductive material (2) is provided with a conductive pattern. A plurality of combination areas (4) are reserved on the conductive pattern. Connection structures (3) are provided in the combination areas (4) for containing the LED chips or LED lamp beads (1). The LED chips or LED lamp beads (1) are directly attached on the combination areas (4) and are mutually connected and communicated through the conductive pattern. The LED array light source without a circuit substrate can be formed as a curved-surface light emitting light source due to the flexible characteristic thereof, so that the heat radiation capability and the light emitting efficiency are increased. Simultaneously, the LED array light source without a circuit substrate has advantages that it is applicable for automated production and difficult to be damaged, and has a long service life.

Description

说 明 书  Description
无电路基板 LED阵列光源 技术领域  Circuitless substrate LED array light source
本发明属于 LED光源技术领域， 特别是涉及一种无电路基板 LED阵列光源。 背景技术  The invention belongs to the technical field of LED light sources, and in particular relates to a LED array light source without a circuit board. Background technique
随着科技的发展， LED灯凭借发光效率高、 低电耗、 不需高压、 安全性高等 优点，已被广泛的应用在各种照明领域。 LED光源的寿命与节点的工作温度有直 接的联系， 目前 LED灯在工作过程中只有大约 50%的电能转换成光能，其余的电 能几乎都转成热能， 使 LED灯的温度升高， 而温度每增加 10摄氏度其信赖性就 会减少一半。 散热是个大问题。 如果散热不好会直接导致 LED性能和稳定性降 低， 同时散热不好会产生严重光衰影响灯的寿命。  With the development of technology, LED lamps have been widely used in various lighting fields due to their high luminous efficiency, low power consumption, high voltage resistance and high safety. The life of the LED light source is directly related to the operating temperature of the node. At present, only about 50% of the electric energy of the LED lamp is converted into light energy during the working process, and the remaining electric energy is almost converted into thermal energy, so that the temperature of the LED lamp rises. For every 10 degrees Celsius increase in temperature, the reliability is reduced by half. Heat dissipation is a big problem. If the heat dissipation is not good, it will directly lead to the degradation of LED performance and stability. At the same time, poor heat dissipation will cause serious light decay to affect the life of the lamp.
例如台湾 1229948新型专利案揭露一种覆晶式发光二极管封装阵列及其封 装单元， 主要揭露一发光二极管芯片设置于一陶瓷基板上， 并连接该陶瓷基板 上的金属连线层。 该瓷基板是利用导热胶设置于一起热沉作用的金属本体的凹 穴内的。 热沉最终与散热片连接， 将热通过对流散发到环境空气中去。 在这种 做法下， 由于该发光二极管芯片与金属连线层两者， 与该金属本体之间还隔着 该比较厚的陶瓷基板与该导热胶等两层， 因此， 该发光二极管芯片与金属连线 层上的热， 是无法很快地传导到该热沉上， 进而传递到散热器上进行散热的。 从 LED芯片经过比较厚的基板， 导热胶， 热沉至散热器， 热阻很大， 因此散热 效果不好。  For example, Taiwan 1229948 discloses a flip-chip LED package array and a package unit thereof. It is mainly disclosed that an LED chip is disposed on a ceramic substrate and connected to a metal wiring layer on the ceramic substrate. The porcelain substrate is disposed in a recess of a metal body that acts as a heat sink by means of a thermal paste. The heat sink is ultimately connected to the heat sink, which dissipates the heat through the convection to the ambient air. In this way, since the LED chip and the metal wiring layer are separated from the metal body by the thick ceramic substrate and the thermal conductive adhesive, the LED chip and the metal are The heat on the wiring layer cannot be quickly transferred to the heat sink and then transferred to the heat sink for heat dissipation. From the LED chip through a relatively thick substrate, thermal paste, heat sink to the heat sink, the thermal resistance is very large, so the heat dissipation effect is not good.
发明内容 Summary of the invention
为了解决现有技术中 LED光源散热效果不好， 容易损坏， 使用寿命较短的 说 明 书 In order to solve the problem of poor heat dissipation of the LED light source in the prior art, it is easy to damage and has a short service life. Description
问题， 本发明提供了一种无电路基板 LED 阵列光源， 令发光光源的散热能力及 出光效率大幅提高， 同时更加适合自动化生产， 以提供消费大众使用。 The present invention provides a circuit-less substrate LED array light source, which greatly improves the heat dissipation capability and light-emitting efficiency of the illuminating light source, and is more suitable for automated production to provide consumer use.
为了解决上述问题， 本发明所采取的技术方案是：  In order to solve the above problems, the technical solution adopted by the present invention is:
一种无电路基板 LED阵列光源， 包括若干个 LED芯片或者 LED灯珠， 其特 征在于： 还包括一薄片式导电材料， 在薄片式导电材料上设置有导电图案， 在 导电图案上预留有若干结合区， 所述 LED芯片或者 LED灯珠直接贴装与结合区， 并通过导电图案相互连结导通。  A circuit-less substrate LED array light source, comprising a plurality of LED chips or LED lamp beads, characterized in that: further comprising a sheet-type conductive material, a conductive pattern is arranged on the sheet-type conductive material, and a plurality of conductive patterns are reserved on the conductive pattern The LED chip or the LED lamp bead is directly mounted on the bonding area, and is electrically connected to each other through a conductive pattern.
前述的一种无电路基板 LED 阵列光源， 其特征在于： 所述导电材料采用柔 性薄片式导电材料。  The above-mentioned circuit-less substrate LED array light source is characterized in that: the conductive material is a flexible sheet type conductive material.
前述的一种无电路基板 LED 阵列光源， 其特征在于： 在结合区内设置有用 于放置 LED芯片或者 LED灯珠的连接结构。  The above-mentioned circuit-less substrate LED array light source is characterized in that: a connection structure for placing an LED chip or an LED lamp bead is disposed in the bonding region.
前述的一种无电路基板 LED 阵列光源， 其特征在于： 所述柔性薄片式导电 材料厚度 0. 1毫米 -2毫米， 抗拉强度 5MPa以上。  The above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material has a thickness of 0.1 mm - 2 mm and a tensile strength of 5 MPa or more.
前述的一种无电路基板 LED 阵列光源， 其特征在于： 所述柔性薄片式导电 材料采用铜、 铝、 银、 金粉末冶金材料中的一种或几种组合。  The above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material is one or a combination of copper, aluminum, silver, gold powder metallurgical materials.
前述的一种无电路基板 LED 阵列光源， 其特征在于： 所述柔性薄片式导电 材料采用铜箔、 铝箔、 银箔等薄膜材料中的一种。  The above-mentioned circuit-less substrate LED array light source is characterized in that: the flexible sheet-type conductive material is one of a film material such as copper foil, aluminum foil or silver foil.
前述的一种无电路基板 LED阵列光源， 其特征在于： 所述导电线路上与 LED 连接部位有凹槽结构， 便于 LED芯片或者 LED灯珠的安置和焊接。  The above-mentioned circuit-less substrate LED array light source is characterized in that: the conductive line has a groove structure at the connection portion with the LED, which facilitates the placement and soldering of the LED chip or the LED lamp bead.
前述的一种无电路基板 LED阵列光源， 其特征在于： 所述光源是 LED芯片 时， 薄片式导电材料整版覆盖荧光粉薄膜。  The above-mentioned circuit-less substrate LED array light source is characterized in that: when the light source is an LED chip, the sheet-type conductive material is integrally covered with the phosphor film.
本发明的有益效果是： 说 明 书 The beneficial effects of the invention are: Instruction manual
1、 本发明采用平面薄片式整版结构， 提供了 LED二维光源。  1. The invention adopts a planar sheet-type imposition structure to provide an LED two-dimensional light source.
2、 柔性薄膜型导电材质直接供电和提供机械支撑， 去除了基板部件， 增 加了 LED光源的散热及可塑性。  2. The flexible film-type conductive material directly supplies power and provides mechanical support, removes the substrate components, and increases the heat dissipation and plasticity of the LED light source.
3、 导电图案和放置 LED芯片或者 LED灯珠的连接结构的设计， 实现了 LED 光源的电路导通。 操作方便， 自动化程度高； 另外导电图案的设计可通过计算 机模拟实现， 优化了器件整体的光学、 电学及热学性能。  3. The design of the conductive pattern and the connection structure of the LED chip or the LED lamp bead realizes the circuit conduction of the LED light source. The operation is convenient and the degree of automation is high. In addition, the design of the conductive pattern can be realized by computer simulation, and the optical, electrical and thermal properties of the device as a whole are optimized.
4、 由于多个 LED芯片或者 LED灯珠直接贴附在导电材料上， 导电材料自身 为柔性薄片型材质， 同时导电图案具有较好的通透性， 完全摆脱了先前技术中 的厚重铝基板和塑料基板， 也无需使用大块的散热器， 因此更加有利于将 LED 芯片或者 LED灯珠在工作中产生的热可以高效迅速的传导到该导电材料上进行 散热， 散热效果好， LED芯片或者 LED灯珠不易损坏， 使用寿命长。  4. Since a plurality of LED chips or LED lamp beads are directly attached to the conductive material, the conductive material itself is a flexible sheet type material, and the conductive pattern has good permeability, completely eliminating the heavy aluminum substrate and the prior art. The plastic substrate does not need to use a large heat sink, so it is more advantageous to efficiently and quickly transfer the heat generated by the LED chip or the LED lamp bead to the conductive material for heat dissipation, and the heat dissipation effect is good, the LED chip or the LED The lamp bead is not easily damaged and has a long service life.
5导电材料采用柔性薄片型材质，使 LED阵列光源在使用中可以任意折叠弯 曲， 大大地增加了光源设计和使用的实用性。  5 Conductive material adopts flexible sheet material, which makes the LED array light source fold and bend arbitrarily during use, greatly increasing the practicality of light source design and use.
附图说明 DRAWINGS
图 1是本发明无电路基板 LED阵列光源的结构示意图。  BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view showing the structure of a non-circuit substrate LED array light source of the present invention.
具体实施方式 detailed description
下面结合附图对本发明作进一步的描述。  The invention will now be further described with reference to the accompanying drawings.
如图 1所示，一种无电路基板 LED阵列光源， 包括若干个 LED芯片或者 LED 灯珠 1和一柔性薄片式导电材料 2，在柔性薄片式导电材料 2上设置有导电图案， 在导电图案上预留有若干结合区 4，在结合区 4内设置有用于放置 LED芯片或者 LED灯珠的连接结构 3， LED芯片或者 LED灯珠通过连接结构 3直接贴装与结合 区 4， 并通过导电图案相互连结导通。 说 明 书 As shown in FIG. 1 , a circuit-less substrate LED array light source includes a plurality of LED chips or LED lamp beads 1 and a flexible sheet-type conductive material 2, and a conductive pattern is disposed on the flexible sheet-type conductive material 2 in a conductive pattern. A plurality of bonding regions 4 are reserved thereon, and a connection structure 3 for placing LED chips or LED lamp beads is disposed in the bonding region 4, and the LED chips or LED lamp beads are directly mounted on the bonding region 4 through the connection structure 3, and are electrically conductive. The patterns are connected to each other. Instruction manual
柔性薄片式导电材料 2应具有一定的耐焊接性、 轻薄、 机械强度等特征。 柔性薄片式导电材料 2采用铜、 铝、 银、 金粉末材料等中的一种或几种组 合。 导电图案的制备可以通过打印、 印刷、 静电喷涂等方法制备再衬底上， 后 通过衬底剥离的方法得到具有导电图案的柔性薄片式导电材料 2。后在导电材料 的表面印刷阻焊层形成尺寸精确的 LED芯片或者 LED灯珠结合区 4。  The flexible sheet type conductive material 2 should have certain characteristics such as solder resistance, lightness, and mechanical strength. The flexible sheet type electrically conductive material 2 is one or a combination of copper, aluminum, silver, gold powder materials and the like. The conductive pattern can be prepared by printing, printing, electrostatic spraying or the like on a re-substrate, followed by peeling off the substrate to obtain a flexible sheet-like conductive material 2 having a conductive pattern. The solder resist layer is then printed on the surface of the conductive material to form a precisely sized LED chip or LED bead bond area 4 .
柔性薄片式导电材料 2采用铜箔、 铝箔、 银箔等薄膜材料中的一种。 导电 图案的制备可以通过激光雕刻、 刻蚀、 冲压等技术直接形成具有导电图案的柔 性薄片式导电材料 2，后在导电材料的表面印刷阻焊层形成尺寸精确的 LED芯片 或者 LED灯珠结合区 4。  The flexible sheet-type conductive material 2 is one of film materials such as copper foil, aluminum foil, and silver foil. The conductive pattern can be directly formed into a flexible sheet-type conductive material 2 having a conductive pattern by laser engraving, etching, stamping, etc., and then the solder resist layer is printed on the surface of the conductive material to form an accurate LED chip or LED lamp bead bond area. 4.
LED芯片或者 LED灯珠 1可通过钎焊、 贴片、 激光、 等离子体焊接等方式固 定在的结合区 4上， 导电图案的设计可采用计算机模拟的方法来优化器件整体 的光学、 电学及热学性能。  The LED chip or LED lamp bead 1 can be fixed on the bonding area 4 by soldering, patching, laser, plasma welding, etc. The design of the conductive pattern can be optimized by computer simulation to optimize the optical, electrical and thermal properties of the device as a whole. performance.
本发明直接使用压延方法在衬底上覆铜， 然后再进行图案化干膜、 曝光、 显影、 蚀刻、 去膜、 镀锡铅步骤， 以得到具有预定电路图案的导电材料 2。 该导 电图案中包括用于连接该 LED元件的正负极的焊盘 (pad)。 然后将衬底剥离， 只 保留带有导电图案的铜箔。  The present invention directly coats copper on a substrate using a calendering method, and then performs patterning dry film, exposure, development, etching, film removal, and tin plating to obtain a conductive material 2 having a predetermined circuit pattern. The conductive pattern includes pads for connecting the positive and negative electrodes of the LED element. The substrate is then peeled off, leaving only the copper foil with the conductive pattern.
该 LED芯片或者 LED灯珠 1可通过连接结构 3直接贴装与结合区 4。  The LED chip or the LED lamp bead 1 can be directly attached to the bonding area 4 through the connection structure 3.
本发明无电路基板 LED阵列光源具有以下特点：  The circuit-less substrate of the invention has the following features:
1、 平面式整版封装半导体。 其优点在于有利于快速、 高效生产， 自动化程 度高， 可以整版快速封装。 封装产品的可靠性高， 一致性好；  1. Planar full-package semiconductors. The advantage is that it is convenient for rapid and efficient production, high degree of automation, and can be packaged quickly and in full. The packaged product has high reliability and good consistency;
2、 采用具有导电图案的铜箔， 银箔， 金箔等作为导电电路材料， 直接与 LED连接， 去除了铝基板或者绝缘基板， 增加了 LED光源的散热、 出光效率及可 说 明 书 2. Copper foil, silver foil, gold foil, etc. with conductive pattern are used as the conductive circuit material, directly connected with the LED, and the aluminum substrate or the insulating substrate is removed, thereby increasing the heat dissipation and light-emitting efficiency of the LED light source. Description
塑性； Plasticity
4、 直接形成导电图案， 省去了单颗产品需要单独布线的问题；  4. Directly forming a conductive pattern, eliminating the need for a single product to be individually routed;
5、 与传统的 LED封装类型相比， 此平面薄膜型整版封装 LED产品更易于散 热， 同时柔性衬底的选用， 增加了 LED光源应用的广泛性。  5. Compared with the traditional LED package type, this flat film type full-package LED product is easier to dissipate heat, and the selection of flexible substrate increases the application of LED light source.
以上显示和描述了本发明的基本原理、 主要特征及优点。 本行业的技术人 员应该了解， 本发明不受上述实施例的限制， 上述实施例和说明书中描述的只 是说明本发明的原理， 在不脱离本发明精神和范围的前提下， 本发明还会有各 种变化和改进， 这些变化和改进都落入要求保护的本发明范围内。 本发明要求 保护范围由所附的权利要求书及其等效物界定。  The basic principles, main features and advantages of the present invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, and that the present invention is only described in the foregoing embodiments and the description of the present invention, without departing from the spirit and scope of the invention. Various changes and modifications are intended to fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and their equivalents.

Claims

权利要求书 Claim
1、 一种无电路基板 LED阵列光源， 包括若干个 LED芯片或者 LED灯珠， 其 特征在于： 还包括一薄片式导电材料， 在薄片式导电材料上设置有导电图案， 在导电图案上预留有若干结合区， 所述 LED芯片或者 LED灯珠直接贴装与结合 区， 并通过导电图案相互连结导通。  A non-circuit substrate LED array light source, comprising a plurality of LED chips or LED lamp beads, characterized in that: further comprising a sheet-type conductive material, wherein a conductive pattern is arranged on the sheet-type conductive material, reserved on the conductive pattern There are a plurality of bonding regions, and the LED chip or the LED lamp bead is directly mounted on the bonding region, and is electrically connected to each other through a conductive pattern.
2、 根据权利要求 2所述的一种无电路基板 LED阵列光源， 其特征在于： 所 述导电材料采用柔性薄片式导电材料。  2. A circuit-less substrate LED array light source according to claim 2, wherein: said conductive material is a flexible sheet-type conductive material.
3、 根据权利要求 2所述的一种无电路基板 LED阵列光源， 其特征在于： 在 结合区内设置有用于放置 LED芯片或者 LED灯珠的连接结构。  3. A circuit-less substrate LED array light source according to claim 2, wherein: a connection structure for placing an LED chip or an LED lamp bead is disposed in the bonding region.
4、 根据权利要求 3所述的一种无电路基板 LED阵列光源， 其特征在于： 所 述柔性薄片式导电材料厚度 0. 1毫米 -2毫米， 抗拉强度 5MPa以上。  4. The circuit-less substrate LED array light source according to claim 3, wherein the flexible sheet-type conductive material has a thickness of 0.1 mm - 2 mm and a tensile strength of 5 MPa or more.
5、 根据权利要求 4所述的一种无电路基板 LED阵列光源， 其特征在于： 所 述柔性薄片式导电材料采用铜、 铝、 银、 金粉末冶金材料中的一种或几种组合。  5. The circuit-less substrate LED array light source according to claim 4, wherein: the flexible sheet-type conductive material is one or a combination of copper, aluminum, silver, gold powder metallurgical materials.
6、 根据权利要求 4所述的一种无电路基板 LED阵列光源， 其特征在于： 所 述柔性薄片式导电材料采用铜箔、 铝箔、 银箔等薄膜材料中的一种。  6. The circuit-less substrate LED array light source according to claim 4, wherein the flexible sheet-type conductive material is one of a film material such as copper foil, aluminum foil or silver foil.
7、根据权利要求 5或 6所述的一种无电路基板 LED阵列光源，其特征在于： 所述导电线路上与 LED连接部位有凹槽结构， 便于 LED芯片或者 LED灯珠的安 置和焊接。  7. The circuit-less substrate LED array light source according to claim 5 or 6, wherein: the conductive line has a groove structure at the connection portion with the LED, which facilitates the installation and soldering of the LED chip or the LED lamp bead.
8、 根据权利要求 7所述的一种无电路基板 LED阵列光源， 其特征在于： 所 述光源是 LED芯片时， 薄片式导电材料整版覆盖荧光粉薄膜。  8. The circuit-less substrate LED array light source according to claim 7, wherein when the light source is an LED chip, the sheet-type conductive material is integrally covered with the phosphor film.
PCT/CN2012/070589 2011-12-31 2012-01-19 Led array light source without circuit substrate WO2013097314A1 (en)

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