CN103240481B - Welder's piece installing - Google Patents
Welder's piece installing Download PDFInfo
- Publication number
- CN103240481B CN103240481B CN201210027741.XA CN201210027741A CN103240481B CN 103240481 B CN103240481 B CN 103240481B CN 201210027741 A CN201210027741 A CN 201210027741A CN 103240481 B CN103240481 B CN 103240481B
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- CN
- China
- Prior art keywords
- hole
- welder
- piece installing
- dbc substrate
- shoulder hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Inverter Devices (AREA)
Abstract
The present invention provides a kind of Welder's piece installing, and it includes flat board, and is arranged on the shoulder hole on described flat board, in described shoulder hole, the aperture in each step hole sequentially becomes big, in described shoulder hole, at least one step hole is accommodating hole, is used for housing DBC substrate, and both sizes match.Welder's piece installing provided by the invention, to provide enough extending space for solder by arranging the mode of shoulder hole, to occur piling up in gap around DBC substrate and between the shoulder hole inwall of Welder's piece installing after avoiding solder to melt, and reduce because of the contact area after the drift of DBC substrate and between shoulder hole inwall, reduce the damage probability of DBC substrate when removing frock, it is ensured that welded the insulating capacity of rear IGBT module.
Description
Technical field
The present invention relates to igbt encapsulation technology, particularly relate to a kind of Welder's piece installing.
Background technology
Igbt (InsulatedGateBipolarTransistor, hereinafter referred to as IGBT), there is the feature of altofrequency, high voltage and big electric current, and easily turn on and off, be the most representational product of the Power Electronic Technique third time revolution generally acknowledged in the world.At present, IGBT is widely used in the inverters such as railway, urban track traffic, wind-powered electricity generation, solar energy, clean energy resource field in the inverters such as railway, urban track traffic, wind-powered electricity generation, solar energy, clean energy resource and industrial control field.The average annual growth rate 20% of Tenth Five-Year Plan Period power electronic component, and wherein IGBT power electronic devices share reaches 10%, annual average rate of increase is more above 30%.The average annual growth rate 20% of Tenth Five-Year Plan Period power electronic component, will more than 150,000,000,000 yuan to the market sales revenue in 2011.And wherein IGBT power electronic devices share reaches 10%, annual average rate of increase is more above 30%.
IGBT module encapsulation manufacture refers to, IGBT subelement and base plate is welded and fixed by solder.Before welding, the mutual alignment relation between each several part is referring to Fig. 1 a, and hot plate 1 is placed with base plate 2, base plate 2 is placed and places igbt chip 4 on DBC substrate 3, DBC substrate 3；Wherein, the first solder 5 and the second solder 6 it is folded with between base plate 2 and DBC substrate 3 and between igbt chip 4 and DBC substrate 3 respectively.Before starting encapsulation, being first welded and fixed already by the second solder 6 between DBC substrate 3 and igbt chip 4, DBC substrate 3 and igbt chip 4 after welding are called IGBT subelement, and wherein, the fusing point of the second solder 6 is higher than the first solder 5.Welding process between IGBT subelement and base plate 2 is as follows, and hot plate 1 is heated, and hot plate 1 transfers heat to and sequentially passes to base plate the 2, first solder 5 and IGBT subelement.First solder 5 melts, and namely makes IGBT subelement and base plate 2 be welded and fixed, has implied that encapsulation.
Determine by arranging Welder's piece installing 7 referring to Fig. 1 a, DBC substrate 3 position on a base plate 2.For clarity sake, in Fig. 1 a, Welder's piece installing dotted line is illustrated.The schematic diagram of existing Welder's piece installing is referring to Fig. 1 b, and Welder's piece installing is a flat board 7, and this flat board 7 offers several through hole 71.When need to encapsulate, being placed on base plate 2 by Welder's piece installing, then in each through hole 71 of Welder's piece installing, order places the first solder 5, IGBT subelement.During placement, it is ensured that leave suitable assembling allowance between the inwall of the lateral distance through hole 71 of IGBT subelement, make IGBT subelement realize location, and after packaging is accomplished, Welder's piece installing can be taken off.
In the process using existing Welder's piece installing, it is found by the applicant that after there is problems in that solder fusing, can there is position non-directional drift under solder surface tension effect in DBC substrate, after having welded, owing to drift usually makes together with DBC substrate tight contacts between with the inwall of through hole, and contact area is big so that dismounting Welder's piece installing is greatly difficult to be detached；If slightly firmly dismounting, it is easy to cause DBC substrate edges damaged, reduce the insulating capacity of DBC substrate, affect the insulating properties of module, reduce conforming product rate.
Summary of the invention
The present invention provides a kind of Welder's piece installing, is used for optimizing existing Welder's package structure so that Welder's piece installing is easily disassembled.
The invention provides a kind of Welder's piece installing, it is preferred that include flat board, and it being arranged on the shoulder hole on described flat board, in described shoulder hole, the aperture in each step hole sequentially becomes big, and in described shoulder hole, at least one step hole is accommodating hole, for housing DBC substrate, and both highly match.
Welder's piece installing as above, it is preferred that the aperture of described accommodating hole is minimum.
Welder's piece installing as above, it is preferred that the step hole of described shoulder hole is two, for the first unthreaded hole and second unthreaded hole of connection, the size being smaller in size than described second unthreaded hole of described first unthreaded hole, described first unthreaded hole is described accommodating hole.
Welder's piece installing as above, it is preferred that the height of described second unthreaded hole is 0.2mm-1mm.
Welder's piece installing as above, it is preferred that be symmetrically arranged with several described shoulder hole on described flat board.
Welder's piece installing provided by the invention, accommodating hole is for positioning and limit the displacement of DBC substrate, and the shoulder hole bigger than accommodating hole internal diameter, as extending bore, thinks that solder provides enough extending spaces.The height of extending bore sets according to actual needs, is typically between 0.2mm-1mm.When using Welder's piece installing provided by the invention to weld, pile up without being formed in the gap around DBC substrate and between the shoulder hole inwall of Welder's piece installing after solder fusing, even if DBC substrate drifts about, contact area between DBC substrate and accommodating hole inwall is also greatly reduced, damage to DBC substrate when reducing disassembling fixture, it is ensured that welded the insulating capacity of rear IGBT module and the qualification rate of product.
Accompanying drawing explanation
Fig. 1 a is IGBT module encapsulation schematic diagram in prior art；
Fig. 1 b is the structural representation of Welder's piece installing in prior art；
The structural representation of Welder's piece installing that Fig. 2 a provides for the embodiment of the present invention；
Fig. 2 b uses Welder's piece installing of Fig. 2 a to carry out IGBT module encapsulation schematic diagram.
Accompanying drawing labelling
1-hot plate；2-base plate；3-DBC substrate；
4-IGBT chip；5-the first solder；6-the second solder；
7-flat board；71-through hole；8-flat board；
9-shoulder hole；91-the first unthreaded hole；92-the second unthreaded hole.
Detailed description of the invention
The structural representation of Welder's piece installing that Fig. 2 a provides for the embodiment of the present invention, Fig. 2 b uses Welder's piece installing of Fig. 2 a to carry out IGBT module encapsulation schematic diagram.The embodiment of the present invention provides a kind of Welder's piece installing, and it includes flat board 8, and is arranged on the shoulder hole 9 on flat board 8, in shoulder hole 9, the aperture in each step hole sequentially becomes big, in shoulder hole 9, at least one step hole is accommodating hole, is used for housing DBC substrate 3, and both sizes match.Accompanying drawing labelling identical with Fig. 1 a and Fig. 1 b in Fig. 2 a and Fig. 2 b is illustrated as identical parts.
Shoulder hole bigger than accommodating hole internal diameter in shoulder hole is as extending bore, and extending bore is for the solder after accommodating thawing.Size matches and refers to, the size of DBC substrate to be welded is depended in the aperture of accommodating hole, in order to make DBC substrate in welding process not floating, both sizes should be as far as possible close.
When mounted, the bigger diameter end of shoulder hole is arranged below, DBC substrate it is equipped with in accommodating hole, during welding, solder can spread along extending bore after melting, and be unlikely to creep up along with the gap between accommodating hole inwall and DBC substrate, owing to the aperture of extending bore is bigger, solder has enough extending spaces, pile up with the inwall place of cooperation of accommodating hole thus avoiding solder at DBC substrate, thus avoiding solder, DBC substrate and Welder's piece installing are linked together, Welder's piece installing is made easily to be disassembled, do not damage again the insulating properties of DBC substrate, this not only improves production efficiency, also can ensure the qualification rate of product simultaneously.
Optionally, the aperture of accommodating hole is minimum, so can the aperture of extending bore relatively big, enough space can be provided for solder.
Specifically, the step hole of shoulder hole 9 is two, and for the first unthreaded hole 91 and the second unthreaded hole 92 of connection, the size being smaller in size than the second unthreaded hole 92 of the first unthreaded hole 91, the first unthreaded hole 91 is accommodating hole.The shoulder hole of above-mentioned implementation has been able to provide enough space into the extension of solder.
Further, the height of the second unthreaded hole 92 is 0.2mm-1mm.The effect of the second unthreaded hole 92 is to provide enough extending space for solder, and above-mentioned size can practical requirement.
Herein, for all for circular hole, the size that second smooth boring ratio the first unthreaded hole internal diameter is big is about 1mm-5mm, the simply signal of this scope and non-limiting.In practical application, the size that second smooth boring ratio the first unthreaded hole internal diameter is big can be determined in conjunction with the actual range that number and the solder of actually used solder extends to surrounding.
Further, flat board 8 is symmetrically arranged with several shoulder hole 9.This sentences four signals, and an accommodating DBC substrate 3 in each shoulder hole 9, Welder's piece installing once can encapsulate four DBC substrates 3, and work efficiency is high.
Welder's piece installing that the embodiment of the present invention provides, to provide enough extending space for solder by arranging the mode of shoulder hole, to occur piling up in gap around DBC substrate and between the shoulder hole inwall of Welder's piece installing after avoiding solder to melt, and reduce because of the contact area after the drift of DBC substrate and between shoulder hole inwall, reduce the damage probability of DBC substrate when removing frock, it is ensured that welded the insulating capacity of rear IGBT module.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to foregoing embodiments, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein some or all of technical characteristic is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (4)
1. Welder's piece installing, it is characterised in that include flat board, and it being arranged on the shoulder hole on described flat board, in described shoulder hole, the aperture in each step hole sequentially becomes big, and in described shoulder hole, at least one step hole is accommodating hole, for housing DBC substrate, and both sizes match；
The aperture of described accommodating hole is minimum.
2. Welder's piece installing according to claim 1, it is characterized in that, the step hole of described shoulder hole is two, for the first unthreaded hole and second unthreaded hole of connection, the size being smaller in size than described second unthreaded hole of described first unthreaded hole, described first unthreaded hole is described accommodating hole.
3. Welder's piece installing according to claim 2, it is characterised in that the height of described second unthreaded hole is 0.2mm-1mm.
4. Welder's piece installing according to claim 1, it is characterised in that be symmetrically arranged with several described shoulder hole on described flat board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210027741.XA CN103240481B (en) | 2012-02-08 | 2012-02-08 | Welder's piece installing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210027741.XA CN103240481B (en) | 2012-02-08 | 2012-02-08 | Welder's piece installing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103240481A CN103240481A (en) | 2013-08-14 |
| CN103240481B true CN103240481B (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210027741.XA Active CN103240481B (en) | 2012-02-08 | 2012-02-08 | Welder's piece installing |
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| CN (1) | CN103240481B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900541A (en) * | 2014-03-03 | 2015-09-09 | 西安永电电气有限责任公司 | Plastic-packaging type IPM adjustable welding tool and use method thereof |
| CN108391371A (en) * | 2018-04-26 | 2018-08-10 | 生益电子股份有限公司 | A kind of PCB and PCBA |
| JP6830081B2 (en) * | 2018-05-14 | 2021-02-17 | 株式会社鷺宮製作所 | solenoid valve |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040881A (en) * | 2008-08-07 | 2010-02-18 | Fuji Electric Systems Co Ltd | Positioning tool and method for manufacturing semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2991010B2 (en) * | 1993-09-29 | 1999-12-20 | 富士電機株式会社 | Semiconductor device and manufacturing method thereof |
| JP4937842B2 (en) * | 2007-06-06 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
| CN201483124U (en) * | 2009-06-01 | 2010-05-26 | 安徽华东光电技术研究所 | Braze welding clamp for high-energy ignition discharge tube |
| JP5581043B2 (en) * | 2009-11-24 | 2014-08-27 | イビデン株式会社 | Semiconductor device and manufacturing method thereof |
| CN102179654A (en) * | 2011-05-25 | 2011-09-14 | 施世伟 | Overbridge welding clamp of storage battery |
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- 2012-02-08 CN CN201210027741.XA patent/CN103240481B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040881A (en) * | 2008-08-07 | 2010-02-18 | Fuji Electric Systems Co Ltd | Positioning tool and method for manufacturing semiconductor device |
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| CN103240481A (en) | 2013-08-14 |
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Address after: 710016 No. 15 Wenjingbei Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |