CN107910430A - Manufacturing method of LED circuit board - Google Patents

Abstract

The invention provides a L ED circuit board manufacturing method, which belongs to the technical field of L ED and comprises the steps of obtaining a long strip-shaped substrate on a metal support in a cutting or stamping mode, sequentially etching a first conductive circuit and a second conductive circuit on the long strip-shaped substrate along the vertical direction of the long strip-shaped substrate, wherein the first conductive circuit and the second conductive circuit are arranged in a Z-shaped interval mode, coating a plurality of sequentially arranged first conductive areas on the first conductive circuit, and coating a plurality of sequentially arranged second conductive areas on the second conductive circuit, wherein each first conductive area and each second conductive area form a mounting area for placing L ED chips, and the first conductive circuit and the second conductive circuit are connected in series and parallel through L ED chips arranged in the mounting area.

Description

Manufacturing method of LED circuit board

technical field

The invention relates to the technical field of LEDs, in particular to a method for manufacturing an LED circuit board.

Background technique

LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

The LED circuit board is used for mounting LED chips, and the manufacturing process of the LED circuit board in the prior art is particularly complicated, resulting in relatively high production costs in the manufacturing process.

Contents of the invention

The object of the present invention is to provide a method for manufacturing an LED circuit board, which can improve the above problems.

Embodiments of the present invention are achieved like this:

A method for manufacturing an LED circuit board, the method comprising: cutting or stamping a substrate on a metal support to obtain a strip-shaped substrate; The first conductive circuit and the second conductive circuit are sequentially etched in the direction, wherein the first conductive circuit and the second conductive circuit are arranged in a Z-shaped interval; coating the first conductive circuit with multiple layers arranged in sequence A plurality of second conductive regions arranged in sequence are coated on the second conductive circuit, wherein each first conductive region and each second conductive region form an installation area for placing LED chips , the first conductive circuit and the second conductive circuit are connected in parallel through the LED chips arranged in the installation area.

In a preferred embodiment of the present invention, the elongated substrate is a rigid substrate or a flexible substrate.

In a preferred embodiment of the present invention, the hard substrate is glass or transparent ceramics.

In a preferred embodiment of the present invention, the material of the flexible substrate is a metal or non-metal substrate.

In a preferred embodiment of the present invention, before the step of obtaining the strip-shaped substrate by cutting or punching the substrate on the metal support, the method further includes: using a press and a mold to stamp and form the metal support; Putting the metal bracket into an injection mold for injection molding to form an insulator, so that the metal bracket and the insulator are embedded and fixed together; electroplating the semi-finished product after injection molding, so that the outer surface of the metal bracket is formed with a coating ; Bending and cutting the electroplated semi-finished products by using the guiding mold; packaging the finished bending and cutting products.

In a preferred embodiment of the present invention, after stamping and forming the metal bracket using a press and a mold, it also includes: inspecting the metal bracket to sort out qualified products and defective products; putting the metal bracket into the injection mold The insulator is formed by injection molding in the process, including: putting the qualified metal bracket into the injection mold for injection molding to form the insulator.

In a preferred embodiment of the present invention, after the step of putting the qualified metal bracket into the injection mold for injection molding to form the insulator, it also includes: inspecting the semi-finished products after injection molding to sort out qualified products and unqualified products. Good products; electroplating semi-finished products after injection molding, including: electroplating semi-finished products that pass the inspection after injection molding.

In a preferred embodiment of the present invention, after the step of electroplating the qualified semi-finished products after injection molding, it also includes: inspecting the semi-finished products after electroplating to sort out qualified products and defective products; The semi-finished products are bent and cut, including: using the leading module to bend and cut the semi-finished products that have passed the inspection and completed electroplating.

In a preferred embodiment of the present invention, after the step of causing the module to bend and cut semi-finished products that have passed the inspection and completed electroplating, it also includes: inspecting the products that have been bent and cut to sort out qualified products. Goods and defective products; packaging of products that have been bent and cut, including: packaging of products that have passed the inspection and completed bending and cutting.

In a preferred embodiment of the present invention, after the step of packaging the products that pass the inspection and have been bent and cut, it also includes: inspecting the packaging quality to sort out qualified products and defective products.

The beneficial effects of the embodiments of the present invention are:

An embodiment of the present invention provides a method for manufacturing an LED circuit board. Firstly, a strip-shaped substrate is obtained by cutting or punching a substrate on a metal support, and then a strip-shaped substrate is obtained along the strip-shaped substrate on the strip-shaped substrate. The vertical direction of the first conductive line and the second conductive line are sequentially etched, wherein the first conductive line and the second conductive line are arranged in a Z-shaped interval, and then coated on the first conductive line A plurality of first conductive regions arranged in order, and a plurality of second conductive regions arranged in sequence are coated on the second conductive circuit, wherein each first conductive region and each second conductive region form an LED chip The installation area of the installation area, the first conductive line and the second conductive line are connected in series and parallel through the LED chips arranged in the installation area. Therefore, compared with the prior art, this method has a simpler manufacturing process and effectively saves cost of production.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of an LED circuit board provided by an embodiment of the present invention;

Fig. 2 is a flow chart of a method for manufacturing an LED circuit board provided by the first embodiment of the present invention;

3 is a schematic structural diagram of another LED circuit board provided by an embodiment of the present invention;

Fig. 4 is a flow chart of a method for manufacturing an LED circuit board provided by the second embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product of the invention is used, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation", "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or can be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an LED circuit board provided by an embodiment of the present invention. The LED circuit board is mainly manufactured by the LED circuit board manufacturing method as shown in FIG. 2 .

The LED circuit board includes a metal bracket, a strip substrate, a first conductive circuit and a second conductive circuit.

first embodiment

Please refer to FIG. 2. FIG. 2 is a flow chart of a method for manufacturing an LED circuit board according to the first embodiment of the present invention. The method includes:

Step S110: Obtain a strip-shaped substrate by cutting or punching the substrate on the metal support.

Referring to Figure 1, first place the substrate on the prepared metal bracket, the substrate is used to set the circuit on the substrate, the substrate is cut or stamped to obtain a strip-shaped substrate, as a way, the The elongated substrate can be a rigid substrate or a flexible substrate, the rigid substrate can be glass or light-transmitting ceramics, and the flexible substrate can be a metal or non-metal substrate with good heat dissipation performance.

In addition, the flexible substrate can also be a transparent flexible substrate, or a colored and highly transparent flexible substrate, and its material can be polyimide. The advantage of polyimide is that it has good mechanical properties and high radiation resistance. performance and dielectric properties.

Step S120: sequentially etching a first conductive circuit and a second conductive circuit on the long substrate along a vertical direction of the long substrate.

Etch the conductive lines on the long substrate according to the set track, that is, the first conductive line and the second conductive line. Both the front and back of the long substrate can etch the conductive lines for crystal bonding, which can achieve 360-degree three-dimensional Luminous effect, and specifically good heat dissipation performance.

The first conductive line and the second conductive line are sequentially etched on the strip-shaped substrate along the vertical direction of the strip-shaped substrate, the first conductive line and the second conductive line are arranged in a Z shape, and the first conductive line is reserved There are a plurality of first conductive regions arranged in sequence, and a plurality of second conductive regions arranged in sequence are reserved on the second conductive circuit, and each first conductive region and each second conductive region are used for setting LED chips. In the installation area, the first conductive circuit and the second conductive circuit are connected in series and parallel through the LED chips arranged in the installation area.

Wherein, the first conductive circuit and the second conductive circuit are arranged in a Z shape, which can form a series-parallel connection between the LED chips, effectively save the space of the LED circuit board, and make the structure more stable.

Both the first conductive area and the second conductive area are coated with a conductive layer, and the LED chip is installed in the installation area, so that the first conductive line and the second conductive line can be connected in series and parallel, thereby reducing the supply current of the external power supply and effectively reducing the LED chip. power consumption of the circuit board.

Wherein, in order to save the space of the LED circuit board more conveniently, each first conductive area and each second conductive area can be closely interlaced, which can make the distance between the two wires smaller without affecting the installation of the LED chip. , It also greatly saves the space of the LED circuit board.

Step S130: coating a plurality of first conductive regions arranged in sequence on the first conductive circuit, and coating a plurality of second conductive regions arranged in sequence on the second conductive circuit.

A plurality of conductive regions are coated on the first conductive circuit and the second conductive circuit, and the conductive region is realized by coating a conductive layer, and each first conductive region and each second conductive region form a mounting for placing LED chips area, the first conductive line and the second conductive line are connected in parallel through the LED chips arranged in the installation area.

An LED chip is installed between the first conductive line and the second conductive line, and the LED chip is usually relatively small, so in order to better solder or bond the LED chip, the first conductive area is a first conductive The conductive area where the line protrudes toward the direction of the second conductive line, and the second conductive area is the conductive area where the second conductive line protrudes toward the direction of the first conductive line, so that the LED chip can be installed on the first conductive line. In the gap between the conductive circuit and the second conductive circuit, the stability of the structure of the LED circuit board is increased. Wherein, the shape of the first conductive region and the second conductive region can be a convex triangle, as shown in Figure 3, thereby saving the coating of the conductive layer of the conductive region, and compared with conductive regions of other shapes, it is more convenient for the LED chip fit.

In order not to affect the luminescence of the LED chip, if the distance between the LEDs is too dense, it may cause the entire light to be too strong, or there are certain obstacles to the installation of the LED chip, and too dense may also cause a short circuit. Therefore, The installation areas on the elongated substrate may be set sequentially according to preset distances, for example, the installation areas may be set at intervals of 2 cm.

In addition, the LED chip is welded on the installation area through solder paste, and then the LED circuit board is wrapped with silicone.

second embodiment

Please refer to FIG. 4. FIG. 4 is a flow chart of a method for manufacturing an LED circuit board according to the second embodiment of the present invention. The method includes:

Step S210: stamping and forming the metal bracket by using a press and a mold.

The metal bracket after stamping is inspected to sort out qualified products and defective products. If the metal bracket is defective, it will return to stamping. If the metal bracket is qualified, it will enter the next process, and the qualified metal bracket will be inspected. Put it into an injection mold for injection molding to form an insulator, and the inspection is carried out by combining the first article inspection and inspection.

Step S220: putting the metal bracket into an injection mold for injection molding to form an insulator, so that the metal bracket and the insulator are fixed together by insert molding.

Inspect the semi-finished products after injection molding to sort out qualified products and defective products. If the semi-finished products after injection molding are defective products, return to continue injection molding. If the finished products after injection molding are qualified products, enter the next process, that is, to The semi-finished products that pass the inspection after injection molding are electroplated, and the inspection is carried out by the first article inspection and patrol inspection.

Step S230: Electroplating the semi-finished product after injection, so that a plating layer is formed on the outer surface of the metal bracket.

Check the semi-finished products after electroplating to sort out qualified products and defective products. If the semi-finished products after electroplating are defective products, return to continue electroplating. If the semi-finished products after electroplating are qualified products, enter the next process, that is, use the lead module The semi-finished products that have passed the inspection and have been electroplated are bent and cut, and the inspection is carried out by IQC (Incoming Quality Control).

Step S240: Bending and cutting the electroplated semi-finished product by using the guide mold.

Inspect the products that have been bent and cut to sort out qualified products and defective products. If the products after bending and cutting are defective, return to continue bending and cutting. If the products after bending and cutting are Qualified products enter the next process, which is to pack the products that have passed the inspection and completed bending and cutting. The inspection is carried out by combining the first article inspection and patrol inspection.

Step S250: Packing the bent and cut products.

The quality of packaging is inspected to sort out qualified products and defective products, and the inspection is carried out by means of OQC (Outgoing Quality Control, Outgoing Quality Inspection).

The metal bracket produced by the above manufacturing method is used as the LED bracket. After the metal bracket is stamped and formed, its surface is rough and can form a firm bond with the insulator to ensure the airtightness of the product. At the same time, electroplating treatment is performed after injection molding. The substance can further seal the joint edge of the insulating metal bracket, thereby further improving the airtightness of the product, and preventing the coating from being polluted by the injection molding material, thereby effectively improving the performance of the product.

Wherein, the metal support needs to be bonded or welded together with the substrate and the metal support, and the metal support is used to carry the substrate.

Step S260: Obtain a strip-shaped substrate by cutting or punching the substrate on the metal support.

Step S270: sequentially etching the first conductive circuit and the second conductive circuit on the long substrate along the vertical direction of the long substrate.

Wherein, the first conductive circuit and the second conductive circuit are arranged in a Z-shaped interval.

Step S280: coating a plurality of first conductive regions arranged in sequence on the first conductive circuit, and coating a plurality of second conductive regions arranged in sequence on the second conductive circuit.

Wherein, each first conductive region and each second conductive region form an installation area for placing LED chips, and the first conductive circuit and the second conductive circuit are connected in parallel through the LED chips arranged in the installation area. .

For the specific description of step S260-step S280, please refer to the relevant description in the first embodiment, and no more details are given here.

To sum up, the embodiment of the present invention provides a method for manufacturing an LED circuit board. Firstly, the substrate on the metal support is cut or stamped to obtain a strip-shaped substrate, and then the strip-shaped substrate is cut along the strip-shaped substrate. In the vertical direction of the elongated substrate, the first conductive circuit and the second conductive circuit are sequentially etched, wherein the first conductive circuit and the second conductive circuit are arranged in a Z-shaped interval, and then the first conductive circuit is A plurality of first conductive regions arranged in sequence are coated on the circuit, and a plurality of second conductive regions arranged in sequence are coated on the second conductive circuit, wherein each first conductive region is formed with each second conductive region An installation area for placing LED chips, the first conductive circuit and the second conductive circuit are connected in series and parallel through the LED chips arranged in the installation area, thus, compared with the prior art, the manufacturing process of this method is It is concise and effectively saves the production cost.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A method for manufacturing an LED circuit board, characterized in that the method comprises: The substrate on the metal support will be cut or stamped to obtain a long substrate; On the elongated substrate, etch a first conductive line and a second conductive line in sequence along the vertical direction of the long substrate, wherein the first conductive line and the second conductive line form a Z-shaped interval arrangement settings; A plurality of first conductive regions arranged in sequence are coated on the first conductive circuit, and a plurality of second conductive regions arranged in sequence are coated on the second conductive circuit, wherein each first conductive region is connected to each A second conductive area forms an installation area for placing LED chips, and the first conductive line and the second conductive line are connected in parallel through the LED chips arranged in the installation area. 2. The method for manufacturing an LED circuit board according to claim 1, wherein the elongated substrate is a rigid substrate or a flexible substrate. 3. The method for manufacturing an LED circuit board according to claim 2, wherein the hard substrate is glass or light-transmitting ceramics. 4. The method for manufacturing an LED circuit board according to claim 2, wherein the material of the flexible substrate is a metal or non-metal substrate. 5. The LED circuit board manufacturing method according to claim 3, characterized in that, before the step of obtaining the strip-shaped substrate by cutting or punching the substrate on the metal support, the method further comprises: Use a press and a mold to stamp and form a metal bracket; Putting the metal bracket into an injection mold for injection molding to form an insulator, so that the metal bracket and the insulator are embedded and fixed together; Electroplating the semi-finished product after injection molding, so that the outer surface of the metal bracket is formed with a plating layer; Bending and cutting the electroplated semi-finished product by using the guiding mold; Package the bent and cut products. 6. The method for manufacturing an LED circuit board according to claim 5, characterized in that, after forming the metal bracket by using a press and a mold, further comprising: The metal bracket is inspected to sort out qualified products and defective products; The insulator is formed by placing the metal bracket into the injection mold for injection molding, including: Putting the qualified metal bracket into the injection mold for injection molding to form the insulator. 7. The LED circuit board manufacturing method according to claim 6, characterized in that, after the step of putting the qualified metal bracket into the injection mold for injection molding to form the insulator, it also includes: Inspect the semi-finished products after injection molding to sort out qualified products and defective products; Electroplating of semi-finished products after injection molding, including: Electroplating is performed on semi-finished products that pass the inspection after injection molding. 8. The LED circuit board manufacturing method according to claim 7, characterized in that, after the step of electroplating the semi-finished products that pass the inspection after injection molding, it also includes: Inspect the semi-finished products after electroplating to sort out qualified products and defective products; Bending and cutting of electroplated semi-finished products using guide molds, including: The leading module is used to bend and cut the semi-finished products that have passed the inspection and completed electroplating. 9. The LED circuit board manufacturing method according to claim 8, characterized in that, after the step of causing the module to bend and cut the semi-finished product that has passed the inspection and completed electroplating, it further includes: Inspect the products that have been bent and cut to sort out qualified products and defective products; Packaging of bent and cut products, including: Package the products that have passed the inspection and completed bending and cutting. 10. The LED circuit board manufacturing method according to claim 9, characterized in that, after the step of packaging the products that have passed the inspection and completed bending and cutting, it further includes: Check the packaging quality to sort out qualified and defective products.