CN209981275U

CN209981275U - Packaging structure of surface mount type light emitting diode

Info

Publication number: CN209981275U
Application number: CN201920993825.6U
Authority: CN
Inventors: 宋文洲
Original assignee: Shenzhen Guang Tai Industrial Co Ltd
Current assignee: Shenzhen Guang Tai Industrial Co Ltd
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-01-21
Anticipated expiration: 2029-06-28

Abstract

The utility model discloses a SMD emitting diode's packaging structure relates to LED encapsulation field. The package structure includes: a PCB circuit board having at least a first electrode and a second electrode; the wafer is fixed at the first electrode and comprises a wafer electrode, and the wafer electrode is connected with the second electrode through a conductive metal wire; a conductive metal line. The utility model discloses a set up the conductive metal line into extrusion portion, connecting portion, extrusion portion and second electrode connection, connecting portion and wafer electrode connection, extrusion portion is for being qualified for the next round of competitions in-process push down the shaping, towards the line segment of wafer direction slope, make the second electrode show on the route is glued to the point, the technical problem of the unable point conductive adhesive far away of point gluing needle apart from the PCB board in prior art has been solved, it is more convenient to make the point glue, and the dropwise add conductive adhesive has strengthened the cohesion of conductive metal line and PCB board, the solder joint of having avoided the product conductive metal to locate with the PCB board under the external force factor is peeled off from the PCB board, the quality of LED product has been improved.

Description

Packaging structure of surface mount type light emitting diode

Technical Field

The utility model belongs to the technical field of the LED encapsulation and specifically relates to a SMD emitting diode's packaging structure is related to.

Background

One wire bonding method of the existing LED product is reverse wire bonding, wherein the reverse wire bonding refers to that a conductive metal wire is LED out from a PCB electrode and then connected to a wafer electrode. As shown in fig. 1, the specific manufacturing method is as follows: (1) firstly, fixing a wafer 2 on one of two different electrodes of a PCB 1; (2) planting a conductive metal ball on the wafer electrode 21, welding a conductive metal wire 3 (called a first welding point 11) on the other electrode of the PCB circuit board 1, then drawing the conductive metal wire 3 to the conductive metal ball (called a second welding point) planted on the wafer electrode 21, and connecting the wafer electrode 21 with the other electrode of the PCB circuit board 1 to form a through circuit; (3) then, the PCB 1 is sealed with the light-transmitting colloid 4.

Referring to fig. 1, in the conventional reverse routing method, after a conductive metal wire 3 is welded at a first welding point 11, the conductive metal wire is vertically pulled up, so that a dispensing needle is too far away from the first welding point 11 when dispensing is performed right above the conductive metal wire 3, and conductive adhesive cannot be dispensed at the first welding point 11 directly, and therefore, the risk that the first welding point 11 is peeled off from a PCB due to weak bonding force between the first welding point 11 and the PCB exists, and the product quality is not high.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, an object of the present invention is to provide a chip type light emitting diode package structure, which is beneficial to dispensing.

The utility model adopts the technical proposal that:

the utility model provides a SMD emitting diode's packaging structure, include:

a PCB circuit board having at least a first electrode and a second electrode;

a wafer fixed at the first electrode, the wafer including a wafer electrode connected with the second electrode by a conductive metal wire;

the conductive metal wire comprises an extrusion part and a connecting part in sequence, the extrusion part is connected with the second electrode, the connecting part is connected with the wafer electrode, and the extrusion part is a conductive metal wire segment which is formed by pressing down in the wire outlet process and inclines towards the wafer direction.

Further, the connecting part is parallel to the PCB circuit board.

Furthermore, the connecting part and the PCB form an included angle.

Furthermore, a conductive metal ball is further arranged on the wafer electrode, and the wafer electrode is connected with the connecting part through the conductive metal ball.

Further, the connection part of the extrusion part and the second electrode is provided with conductive adhesive.

Furthermore, the packaging structure further comprises a packaging colloid used for packaging the PCB, the wafer and the conductive metal wire.

Further, the packaging colloid is a light-transmitting colloid.

The utility model has the advantages that:

the utility model discloses a set up the conductive metal line into extrusion portion, connecting portion, the second electrode of extrusion portion and PCB circuit board is connected, connecting portion and wafer electrode connection, extrusion portion is for being qualified for the next round of competitions the in-process and pushes down fashioned, towards the conductive metal line segment of wafer direction slope, the second electrode that makes the PCB board shows on some glue routes, the technical problem of the needle is glued far away from the PCB board and can't some conductive adhesive in the point in the prior art has been solved, it is more convenient to make some conductive adhesive, and the dropwise add conductive adhesive has strengthened the cohesion of conductive metal bonding wire and PCB board, the solder joint of having avoided the product conductive metal bonding wire and PCB board department under the external force factor peels off from the PCB circuit board, the quality of LED product has been improved.

Drawings

FIG. 1 is a schematic diagram of a reverse wire bonding process of an LED packaging process in the prior art;

fig. 2 is a schematic structural diagram of an embodiment of a mid-chip led package structure according to the present invention;

fig. 3 is a schematic structural diagram of another embodiment of a package structure of a mid-chip light emitting diode according to the present invention;

fig. 4 is a schematic flow chart of an embodiment of a middle patch type light emitting diode packaging process of the present invention.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Example one

The embodiment provides a package structure of a patch type light emitting diode, as shown in fig. 2, the package structure includes:

a PCB circuit board 5, the PCB circuit board 5 having a first electrode 51 and a second electrode 52;

a wafer 6, the wafer 6 being fixed at the first electrode of the PCB 5, the wafer 6 including a wafer electrode 61, the wafer electrode 61 being connected with the second electrode 52 of the PCB 5 through a conductive metal wire 7;

and a conductive metal wire 7, wherein the conductive metal wire 7 sequentially comprises a pressing part 71 and a connecting part 72, the pressing part 71 is connected with the second electrode 52, and the connecting part 72 is connected with the wafer electrode 61. The pressing portion 71 is a conductive metal wire segment that is formed by pressing in the wire outgoing process and is inclined towards the direction of the wafer 6.

In this embodiment, the connecting portion 72 is parallel to the PCB circuit board 5.

Preferably, the wafer electrode 61 is also provided with conductive metal balls (not shown). Specifically, the conductive metal ball is connected to the wafer electrode 61 by means of soldering, and the connection portion 72 is connected to the wafer electrode 61 through the conductive metal ball. The conductive metal balls implanted on the wafer electrode 61 can increase the bonding force between the wafer electrode 61 and the connection portion 72, so that the conductive metal wires 7 are not easily detached from the wafer electrode 61.

It should be noted that the connection in this embodiment is preferably made by welding.

Furthermore, the conductive adhesive 8 is arranged at the joint of the extrusion part 71 and the second electrode 52, so that the bonding force between the conductive metal wire 7 and the PCB 5 is enhanced, the welding point at the joint is prevented from being stripped from the PCB 5, and the quality of the LED product is improved.

In this embodiment, the package structure further includes a molding compound 9 for encapsulating the PCB 5, the die 6 and the conductive wires 7.

Preferably, since the package structure is used for packaging a light emitting diode, the die 6 is a light emitting die or a light receiving die, and the encapsulant 9 should be made of a light-transmissive encapsulant, such as resin or silicon gel, to ensure light transmission.

Example two

The embodiment provides a package structure of a patch type light emitting diode, as shown in fig. 3, the package structure includes:

and a conductive metal wire 7, wherein the conductive metal wire 7 sequentially comprises a pressing part 71 and a connecting part 72, the pressing part 71 is connected with the second electrode 52, and the connecting part 72 is connected with the wafer electrode 61. Wherein, the extrusion part 71 is a conductive metal wire segment which is formed by pressing down in the wire outgoing process and inclines towards the direction of the wafer 6;

the conductive adhesive 8 is arranged at the joint of the extrusion part 71 and the second electrode 52, so that the binding force between the conductive metal wire 7 and the PCB 5 is enhanced, the welding spots at the joint are prevented from being stripped from the PCB 5, and the quality of the LED product is improved;

and the packaging colloid 9 is used for packaging the PCB 5, the wafer 6 and the conductive metal wires 7.

Unlike the first embodiment, in the present embodiment, the connecting portion 72 forms an angle with the PCB 5, rather than being parallel.

Referring to fig. 2 and 3, the pressing portion 71 is connected to the second electrode 52, and the pressing portion 71 is a conductive metal line segment that is pressed downward and inclined toward the wafer 6 during the wire outgoing process, so that the conductive metal line 7 does not shield the second electrode 52, and the second electrode 52 is exposed on the dispensing path (i.e., a path through which the conductive adhesive is vertically dropped from the needle of the dispensing needle to the second electrode of the PCB 5), and the dispensing needle can be lowered to a position close to the second electrode 52 during dispensing, thereby facilitating dispensing.

As shown in fig. 4, the packaging process of the patch type light emitting diode includes the following steps:

s1, die bonding: fixing the wafer 6 at the first electrode 51 of the PCB circuit board 5, the wafer 6 including a wafer electrode 61;

s2, wire welding: and welding the wafer electrode 61 with the second electrode 52 of the PCB 5 through a conductive metal wire 7, wherein the conductive metal wire 7 sequentially comprises a pressing part 71 and a connecting part 72, the pressing part 71 is connected with the second electrode 52, and the connecting part 72 is connected with the wafer electrode 61. Wherein, the extrusion part 71 is a conductive metal wire segment which is formed by pressing down in the wire outgoing process and inclines towards the direction of the wafer 6;

s3, dispensing: dripping conductive adhesive at the joint of the extrusion part 71 and the second electrode 52;

s4, packaging: the PCB circuit board 5, the die 6 and the conductive metal lines 7 are encapsulated by an encapsulant 9.

In conjunction with fig. 2 through 4, specifically,

s1, determining a die bonding position, namely a first electrode 51 of a PCB 5; dropping solid crystal glue at the first electrode 51; the wafer 6 is gripped with tweezers or sucked with a suction nozzle and placed at the first electrode 51; heating and baking to solidify the die bonding glue, so that the wafer 6 and the PCB 5 are adhered together. It should be noted here that the wafer 6 is divided into a single-electrode wafer and a double-electrode wafer, the single-electrode wafer needs to be die-bonded by using a conductive adhesive, and the double-electrode wafer needs to be die-bonded by using an insulating adhesive;

s2, wire welding: a first welding point position is arranged at a second electrode 52 of a PCB 5, a second welding point position is arranged on a wafer electrode 61, the trend of a welding wire between the first welding point and the second welding point is arranged, an LED wire bonding machine is used for welding the second electrode 52 of the PCB 5 and the wafer electrode 61 through a conductive metal wire 7 to form an electrifying loop, the conductive metal wire 7 sequentially forms an extrusion part 71 and a connecting part 72, the extrusion part 71 is connected with the second electrode 52, the connecting part 72 is connected with the wafer electrode 61, and the extrusion part 71 is a conductive metal wire segment which is formed by pressing downwards in the wire outgoing process and inclines towards the direction of a wafer 6. The arrangement of the extrusion portion 71 enables the conductive metal wire 7 not to shield the second electrode 52 of the PCB 5, so that the second electrode 52 of the PCB 5 is exposed on the dispensing path, and the dispensing needle can be lowered to a position close to the second electrode 52 during dispensing, thereby facilitating dispensing.

Preferably, the wire bonding step S2 may further include: a conductive metal ball (not shown) is bonded to the wafer electrode 61, and the second electrode 52 is bonded to the conductive metal ball through a conductive metal wire. The conductive metal balls may increase the bonding force of the wafer electrode 61 and the connection part 72, so that the conductive metal wires 7 are not easily detached from the wafer electrode 61.

S3, glue dispensing: the conductive adhesive 8 is dripped at the joint (first welding point) of the extrusion part 71 and the second electrode 52 of the PCB 5 by using the dispensing needle 10, so that the bonding force between the conductive metal wire 7 and the PCB 5 is enhanced, the first welding point is prevented from being stripped from the PCB 5 under the external force factor, and the quality of the LED product is improved;

s4, packaging: after the dispensing step is completed, the PCB 5, the die 6 and the conductive wires 7 are encapsulated by the encapsulant 9.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. The utility model provides a SMD emitting diode's packaging structure which characterized in that includes:

a PCB circuit board having at least a first electrode and a second electrode;

2. The package structure of the patch type led of claim 1, wherein the connecting portion is parallel to the PCB.

3. The package structure of the patch type led of claim 1, wherein the connection portion forms an included angle with the PCB.

4. The package structure of the patch type led according to claim 2 or 3, wherein a conductive metal ball is further disposed on the die electrode, and the die electrode is connected to the connection portion through the conductive metal ball.

5. The package structure of the patch type led of claim 4, wherein a connection between the pressing portion and the second electrode has a conductive paste.

6. The package structure of the patch type led of claim 5, further comprising an encapsulant for encapsulating the PCB, the die and the conductive metal lines.

7. The package structure of the patch type led of claim 6, wherein the encapsulant is a transparent encapsulant.