CN216868221U - LED filament with heat radiation structure - Google Patents

LED filament with heat radiation structure Download PDF

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Publication number
CN216868221U
CN216868221U CN202123306897.5U CN202123306897U CN216868221U CN 216868221 U CN216868221 U CN 216868221U CN 202123306897 U CN202123306897 U CN 202123306897U CN 216868221 U CN216868221 U CN 216868221U
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shaped substrate
heat dissipation
filament
strip
electrode
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CN202123306897.5U
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Chinese (zh)
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鲍华生
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Jiangxi Sanhui Electronics Co ltd
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Jiangxi Sanhui Electronics Co ltd
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Abstract

The utility model discloses an LED lamp filament with a heat dissipation structure, which comprises a strip-shaped substrate, wherein light emitting chips are arranged on the front side and the rear side of the strip-shaped substrate, liquid mercury is arranged in the strip-shaped substrate, the upper end and the lower end of the strip-shaped substrate are respectively and fixedly connected with a first electrode and a second electrode, a cooling coating and a copper heat conduction layer are sequentially arranged on the outer sides of the first electrode and the second electrode, heat dissipation fins are arranged on one side of the copper heat conduction layer, aluminum alloy shells are arranged on the outer sides of the heat dissipation fins, and a plurality of heat dissipation holes are uniformly distributed in the aluminum alloy shells. According to the LED filament, the copper heat conduction layer with high heat conduction performance and the cooling coating are used for cooling, the aluminum alloy shell is used for dissipating heat, finally the heat is dissipated through the radiating fins and the radiating holes, meanwhile, the LED filament uses liquid mercury to replace connecting wires in the LED filament, the conductivity of the filament is increased, and the brightness of the filament is increased.

Description

LED filament with heat radiation structure
Technical Field
The utility model relates to the field of LED lamps, in particular to an LED filament with a heat dissipation structure.
Background
The light emitting diode is called LED for short, is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) and the like, is a semiconductor component, is mostly used As an indicator light, a display light emitting diode plate and the like at first time, is also used for illumination along with the appearance of a white light LED, is also called a fourth generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like, and can be divided into five categories of information display, signal lights, vehicle lamps, liquid crystal display backlight sources and general illumination according to different use functions.
Chinese patent publication No. CN203733792U discloses an LED filament, comprising: the LED lamp filament comprises a U-shaped or straight strip-shaped substrate provided with a light-transmitting part and pins, an LED light-emitting chip group fixedly arranged on the strip-shaped substrate and powered by the pins, and a fluorescent colloid wrapped on the periphery of the strip-shaped substrate and the LED light-emitting chip group, wherein the light-transmitting part is a light-transmitting hole arranged on the strip-shaped substrate, and the LED light-emitting chip group is fixedly arranged in a region of the strip-shaped substrate where the light-transmitting hole is not arranged, so that the LED light-emitting chip can emit light through the light-transmitting part due to the light-transmitting part arranged on the substrate and the strip-shaped substrate, the light-emitting angle of the LED lamp filament is enlarged, the light-emitting performance of the LED packaged product is improved, in addition, the fluorescent colloid is wrapped on the periphery of the substrate and the LED light-emitting chip group, the molding process and the accuracy of the fluorescent colloid are simplified, the molding efficiency of the fluorescent colloid and the yield of the LED packaged product are improved, but the LED lamp filament lacks of an enough heat-dissipating structure, the filament lasts high temperature easily appears when the LED filament lasts the use to lead to the fact certain influence to filament quality and luminous, the intensity of illumination of this LED filament is not high simultaneously, can not use in some regional places that the illumination demand nature is strong, has certain limitation.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides an LED filament with a heat dissipation structure.
In order to achieve the purpose, the utility model adopts the following technical scheme: an LED filament with a heat dissipation structure comprises a strip-shaped substrate, wherein blue light chip groups I which are uniformly distributed are arranged on the front side of the strip-shaped substrate, red light chip groups I which are uniformly distributed are arranged on the front side of the strip-shaped substrate, blue light chip groups II which are uniformly distributed are arranged on the rear side of the strip-shaped substrate, red light chip groups II which are uniformly distributed are arranged on the rear side of the strip-shaped substrate, a first electrode is fixedly connected to the upper end of the strip-shaped substrate, a second electrode is fixedly connected to the lower end of the strip-shaped substrate, cooling coatings are arranged on the outer sides of the first electrode and the second electrode, the outer sides of the cooling coatings are arranged on the inner sides of copper heat conduction layers, a yellow fluorescent shell is arranged between the outer ends of the two copper heat conduction layers, heat dissipation fins are arranged on one sides, away from the strip-shaped substrate, of the outer sides of the heat dissipation fins are arranged in the middle of an aluminum alloy shell, and a plurality of heat dissipation holes which are uniformly distributed are arranged in the aluminum alloy shell, and a transparent filament shell is arranged between the outer ends of the two aluminum alloy shells.
As a further description of the above technical solution:
and liquid mercury is arranged in the strip-shaped substrate.
As a further description of the above technical solution:
the inner ends of the heat dissipation holes are arranged at the connection position of the heat dissipation fins in the aluminum alloy shell.
As a further description of the above technical solution:
one side of the aluminum alloy shell, which is far away from the strip-shaped substrate, is arranged on one side of the current pin.
As a further description of the above technical solution:
and sealing layers are arranged on the outer sides of the aluminum alloy shells close to one sides of the strip-shaped substrates.
As a further description of the above technical solution:
and inert gas is arranged in the yellow fluorescent shell.
As a further description of the above technical solution:
and hydrogen gas is arranged in the transparent filament shell.
As a further description of the above technical solution:
the first electrode and the second electrode are respectively and electrically connected with a blue light chip set I, a red light chip set I, a blue light chip set II and a red light chip set II.
The utility model has the following beneficial effects:
1. according to the LED lamp filament, the copper heat conducting layer with high heat conducting performance is used, so that the temperature inside the lamp filament is reduced through the cooling coating, and then the lamp filament is conducted to the aluminum alloy shell with excellent heat dissipation performance to dissipate heat, the radiating fins are fixedly connected to one side of the aluminum alloy shell, and heat inside the lamp filament structure is conducted and discharged to the outside of the lamp filament through the radiating fins and the radiating holes, so that the heat dissipation of the lamp filament is realized, the phenomenon that the lamp filament is continuously high in temperature when the LED lamp filament is continuously used is prevented, certain influence of the heat on the quality and the light emission of the lamp filament is reduced, the structure is simple, and the LED lamp filament is convenient and environment-friendly.
2. According to the LED filament, the light emitting chips are arranged on the front side and the rear side of the strip-shaped substrate, the light emitting structure of the LED filament is increased, so that the light emitting intensity of the LED filament is enhanced, meanwhile, liquid mercury is used in the strip-shaped substrate to replace connecting wires in the strip-shaped substrate, the conductivity of the main body structure of the filament can be increased, so that the brightness of the filament is increased, the light emitting intensity of the filament is improved through the use of inert gas, the LED filament can be used in some places with strong illumination requirements, and the structure is simple.
Drawings
Fig. 1 is a perspective view of an LED filament with a heat dissipation structure according to the present invention;
fig. 2 is a side sectional view of an LED filament with a heat dissipation structure according to the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 1;
fig. 4 is an enlarged view at B in fig. 2.
Illustration of the drawings:
1. a transparent filament envelope; 2. a strip-shaped substrate; 3. a first blue light chip set; 4. a red light chip set I; 5. A blue light chip set II; 6. a red light chip set II; 7. a first electrode; 8. a second electrode; 9. a yellow fluorescent housing; 10. heat dissipation holes; 11. a heat sink; 12. an aluminum alloy housing; 13. a copper heat conducting layer; 14. Liquid mercury; 15. a sealing layer; 16. hydrogen gas; 17. a current pin; 18. an inert gas; 19. And (5) cooling the coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, one embodiment of the present invention is provided: an LED filament with a heat dissipation structure comprises a strip-shaped substrate 2, wherein the strip-shaped substrate 2 is made of a material with small thermal influence, a first blue light chip set 3 which is uniformly distributed is arranged on the front side of the strip-shaped substrate 2, a first red light chip set 4 which is uniformly distributed is arranged on the front side of the strip-shaped substrate 2, a second blue light chip set 5 which is uniformly distributed is arranged on the rear side of the strip-shaped substrate 2, a second red light chip set 6 which is uniformly distributed is arranged on the rear side of the strip-shaped substrate 2, light emitting chips are arranged on the front side and the rear side of the strip-shaped substrate 2, the light emitting structure of the LED filament can be increased, so that the light emitting intensity of the LED filament is enhanced, a first electrode 7 is fixedly connected to the upper end of the strip-shaped substrate 2, a second electrode 8 is fixedly connected to the lower end of the strip-shaped substrate 2, cooling coatings 19 are arranged on the outer sides of the first electrode 7 and the second electrode 8 and used for cooling the first electrode 7, the second electrode 8 and the strip-shaped substrate 2, the outer sides of the cooling coatings 19 are all arranged on the inner sides of the copper heat conducting layers 13, the temperature inside the lamp filament can be reduced by using the copper heat conducting layers 13 with strong heat conducting performance, a yellow fluorescent shell 9 is arranged between the outer ends of the two copper heat conducting layers 13 and used for the LED lamp filament to emit light, the side, away from the strip-shaped substrate 2, of each copper heat conducting layer 13 is provided with a radiating fin 11, the outer sides of the radiating fins 11 are all arranged inside the middle part of an aluminum alloy shell 12, the aluminum alloy material has the highest heat radiating capability, synchronous heat radiation can be carried out through the aluminum alloy shell 12, a plurality of radiating holes 10 are uniformly distributed inside the aluminum alloy shell 12, through the use of the radiating fins 11 and the radiating holes 10, the heat inside of the lamp filament structure is conducted and discharged to the outside of the lamp filament, so that the heat radiation of the lamp filament is realized, the phenomenon that the lamp filament is continuously high temperature when the LED lamp filament is continuously used is prevented, so that certain influence of the heat on the quality and the light emission is reduced, a transparent filament shell 1 is arranged between the outer ends of the two aluminum alloy shells 12 and used for normal illumination perspective of the LED filament.
The liquid mercury 14 is arranged in the strip-shaped substrate 2, the liquid mercury 14 has the characteristics of extremely strong electric conduction and extremely poor heat conduction, the liquid mercury 14 is used in the strip-shaped substrate 2 to replace a connecting wire in the strip-shaped substrate 2, the electric conduction of the main structure of the lamp filament can be increased, so that the brightness of the lamp filament is increased, the inner ends of the heat dissipation holes 10 are arranged at the joints of the heat dissipation fins 11 in the aluminum alloy shell 12, so that the heat dissipation holes 10 can dissipate heat in the aluminum alloy shell 12 conveniently, one side of the aluminum alloy shell 12, far away from the strip-shaped substrate 2, is arranged at one side of the current pin 17 and is used for normally electrifying the LED lamp filament, the sealing layer 15 is arranged on the outer side of one side of the aluminum alloy shell 12, which is close to the strip-shaped substrate 2, and is used for sealing the inside of the LED lamp filament and preventing the gas in the aluminum alloy shell from communicating with each other, so as to protect the light-emitting and heat-dissipating structure in the LED lamp filament, and the inert gas 18 is arranged in the yellow fluorescent shell 9, the LED lamp filament is used for improving the luminous intensity of the lamp filament, hydrogen gas 16 is arranged inside the transparent lamp filament shell 1, heat dissipation and heat conduction are carried out through the characteristic that the heat conduction and heat dissipation performance of the hydrogen gas 16 is strong, and the first electrode 7 and the second electrode 8 are respectively electrically connected with a blue light chip set I3, a red light chip set I4, a blue light chip set II 5 and a red light chip set II 6 and used for normal light emitting of the LED lamp filament.
The working principle is as follows: the LED filament uses the copper heat conduction layer 13 with strong heat conduction performance to reduce the temperature inside the filament through the cooling coating 19, then the heat is conducted to an aluminum alloy shell 12 with excellent heat dissipation performance for heat dissipation, one side of the aluminum alloy shell 12 is fixedly connected with a heat dissipation fin 11, through the use of the heat sink 11 and the heat dissipation holes 10, the heat inside the filament structure is conducted and discharged to the outside of the filament, thereby realizing the heat dissipation of the filament, meanwhile, the LED filament is provided with light emitting chips at the front side and the rear side of the strip-shaped substrate 2, the light emitting structure of the LED filament is increased, thereby enhancing the luminous intensity, and simultaneously, the liquid mercury 14 in the strip-shaped substrate 2 is used for replacing the connecting wires in the strip-shaped substrate 2, so that the conductivity of the main structure of the filament can be increased, thereby increasing the brightness of the filament and, in turn, the luminous intensity of the filament through the use of the inert gas 18.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims (8)

1. The utility model provides a LED filament with heat radiation structure, includes bar base plate (2), its characterized in that: the LED lamp is characterized in that a blue light chipset I (3) which is uniformly distributed is arranged on the front side of the bar-shaped substrate (2), a red light chipset I (4) which is uniformly distributed is arranged on the front side of the bar-shaped substrate (2), a blue light chipset II (5) which is uniformly distributed is arranged on the rear side of the bar-shaped substrate (2), a red light chipset II (6) which is uniformly distributed is arranged on the rear side of the bar-shaped substrate (2), a first electrode (7) is fixedly connected to the upper end of the bar-shaped substrate (2), a second electrode (8) is fixedly connected to the lower end of the bar-shaped substrate (2), cooling coatings (19) are respectively arranged on the outer sides of the first electrode (7) and the second electrode (8), the outer sides of the cooling coatings (19) are respectively arranged on the inner side of the copper heat conduction layer (13), a yellow fluorescent shell (9) is arranged between the outer ends of the copper heat conduction layer (13), and cooling fins (11) are respectively arranged on one side of the copper heat conduction layer (13) far away from the bar-shaped substrate (2), the radiating fins (11) are arranged inside the middle of the aluminum alloy shell (12), a plurality of radiating holes (10) are uniformly distributed inside the aluminum alloy shell (12), and a transparent filament shell (1) is arranged between the outer ends of the aluminum alloy shell (12).
2. The LED filament with the heat dissipation structure as recited in claim 1, wherein: and liquid mercury (14) is arranged in the strip-shaped substrate (2).
3. The LED filament with the heat dissipation structure as recited in claim 1, wherein: the inner ends of the heat dissipation holes (10) are arranged at the joints of the heat dissipation fins (11) in the aluminum alloy shell (12).
4. The LED filament with the heat dissipation structure as recited in claim 1, wherein: and one side of the aluminum alloy shell (12) far away from the strip-shaped substrate (2) is arranged on one side of the current pin (17).
5. The LED filament with the heat dissipation structure as recited in claim 1, wherein: and sealing layers (15) are arranged on the outer sides of the aluminum alloy shells (12) close to one sides of the strip-shaped substrates (2).
6. The LED filament with the heat dissipation structure as recited in claim 1, wherein: and inert gas (18) is arranged in the yellow fluorescent shell (9).
7. The LED filament with the heat dissipation structure as recited in claim 1, wherein: and hydrogen gas (16) is arranged in the transparent filament shell (1).
8. The LED filament with the heat dissipation structure as recited in claim 1, wherein: the first electrode (7) and the second electrode (8) are respectively and electrically connected with a blue light chip set I (3), a red light chip set I (4), a blue light chip set II (5) and a red light chip set II (6).
CN202123306897.5U 2021-12-27 2021-12-27 LED filament with heat radiation structure Active CN216868221U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123306897.5U CN216868221U (en) 2021-12-27 2021-12-27 LED filament with heat radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123306897.5U CN216868221U (en) 2021-12-27 2021-12-27 LED filament with heat radiation structure

Publications (1)

Publication Number Publication Date
CN216868221U true CN216868221U (en) 2022-07-01

Family

ID=82148917

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123306897.5U Active CN216868221U (en) 2021-12-27 2021-12-27 LED filament with heat radiation structure

Country Status (1)

Country Link
CN (1) CN216868221U (en)

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