CN213278109U

CN213278109U - LED light source and bulb

Info

Publication number: CN213278109U
Application number: CN202022177517.1U
Authority: CN
Inventors: 李汉耀; 魏彬; 朱奕光; 黄付果; 黄林国
Original assignee: Foshan Electrical and Lighting Co Ltd
Current assignee: Foshan Electrical and Lighting Co Ltd
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2021-05-25
Anticipated expiration: 2030-09-28

Abstract

The utility model discloses a LED light source and bulb, LED light source includes: the LED light-emitting device comprises an aluminum substrate, a first welding position and a second welding position, wherein the aluminum substrate is provided with at least two LED chip mounting areas and at least one hollowed-out groove, LED light-emitting chips are mounted in the LED chip mounting areas, the aluminum substrate is bent along the hollowed-out groove, the first welding position and the second welding position are arranged on the aluminum substrate, the first welding position is connected with the anode of each LED light-emitting chip through a connecting circuit, and the second welding position is connected with the cathode of each LED light-emitting chip through a connecting circuit. The bulb comprises the LED light source. The LED light source has good heat dissipation performance by utilizing good heat dissipation performance of the aluminum substrate, meanwhile, the rigidity of the aluminum substrate at a bending position is reduced by arranging the hollow groove on the aluminum substrate, the aluminum substrate can be conveniently bent at a large angle, and the LED light source has a bending function. The utility model discloses mainly used lighting technology field.

Description

LED light source and bulb

Technical Field

The utility model relates to an illumination lamps and lanterns technical field, in particular to LED light source and bulb.

Background

The LED light source used in the large-angle light-emitting LED bulb in the market at present is a bent light source, and for the bent light source, the light emitting angle of the light source can be adjusted through a large bending angle to form a specific shape. The existing bending light source is generally manufactured by wiring a Circuit on a Flexible Printed Circuit (hereinafter referred to as FPC) and then using a flip chip, however, the FPC has poor heat dissipation capability and is prone to heat accumulation, which results in poor light emitting performance of the light source.

Therefore, there is a need in the industry for a reliable solution that can perform the bending function.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a LED light source and bulb to solve one or more technical problem that exist among the prior art, provide a profitable selection or create the condition at least.

The utility model provides a solution of its technical problem is: provided is an LED light source including: the LED light-emitting device comprises an aluminum substrate, a first welding position and a second welding position, wherein the aluminum substrate is provided with at least two LED chip mounting areas and at least one hollowed-out groove, LED light-emitting chips are mounted in the LED chip mounting areas, the aluminum substrate is bent along the hollowed-out groove, the first welding position and the second welding position are arranged on the aluminum substrate, the first welding position is connected with the anode of each LED light-emitting chip through a connecting circuit, and the second welding position is connected with the cathode of each LED light-emitting chip through a connecting circuit.

Further, the bending angle of the hollow groove is between 90 degrees and 150 degrees.

Further, the hollow-out groove is arranged between two adjacent LED chip mounting areas.

Further, the connection circuit is printed on the aluminum substrate. The connection circuit is printed on the aluminum substrate, so that the attractiveness of the LED light source can be improved.

Further, the aluminum substrate comprises an aluminum plate layer, a first insulating layer, a copper-coated layer, a second insulating layer, an LED chip pad, a power supply positive pad and a power supply negative pad, the aluminum plate layer, the first insulating layer, the copper-coated layer and the second insulating layer are sequentially arranged, the connecting circuit is printed on the copper-coated layer, the LED chip pad is located in an LED chip mounting area, and the LED light-emitting chip is fixedly crystallized on the chip pad.

Further, reflective ink is coated on the second insulating layer. The radiation efficiency is increased, and the brightness of the LED light source is improved.

Further, the form of the die bonding includes any one of spot welding, pressure welding or eutectic.

In another aspect, a bulb is provided, which includes the LED light source according to any one of the above technical solutions, and further includes: the bulb shell is connected with the lamp holder, the core column is located inside the bulb shell, the core column is provided with a positive connecting line position and a negative connecting line position, the positive connecting line position is connected with the first welding position, and the negative connecting line position is connected with the second welding position.

Further, the inside of the bulb is filled with a heat conductive gas. The heat emitted by the LED light source is conveniently conducted away through the heat conducting gas.

Further, the heat conductive gas includes: helium, argon, krypton, heliox, argon-oxygen, or krypton-oxygen.

The utility model has the advantages that: the utility model discloses utilize aluminium base board good heat dispersion for the LED light source has good heat dispersion, simultaneously, through setting up the fretwork groove on aluminium base board, has reduced aluminium base board at the rigidity of the position of bending, makes things convenient for aluminium base board to realize that the wide-angle is bent, makes the LED light source have the function of bending. Meanwhile, a bulb with the LED light source is provided. Since the bulb has the above-mentioned LED light source, it has the advantageous effects of the LED light source, and the description thereof will not be repeated here.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.

FIG. 1 is a schematic view of an LED light source when it is not bent;

fig. 2 is a schematic view of the structure of the bulb.

Detailed Description

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the coupling/connection relationships mentioned herein do not mean that the components are directly connected, but mean that a better coupling structure can be formed by adding or reducing coupling accessories according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.

Embodiment 1, referring to fig. 1, an LED light source includes: the LED light-emitting device comprises an aluminum substrate 100, a first welding position 131 and a second welding position 132, wherein the aluminum substrate 100 is provided with at least two LED chip mounting areas 120 and at least one hollow groove 110, LED light-emitting chips are mounted in the LED chip mounting areas 120, the aluminum substrate 100 is bent along the hollow groove 110, the first welding position 131 and the second welding position 132 are arranged on the aluminum substrate 100, the first welding position 131 is connected with the positive electrodes of the LED light-emitting chips through a connecting circuit, and the second welding position 132 is connected with the negative electrodes of the LED light-emitting chips through a connecting circuit. The connection circuit refers to a circuit for electrical connection, and may be composed of a conductor alone or a conductor and an electronic component, and is not limited in particular. When the LED light source needs to be turned on, only the first welding position 131 needs to be connected with the positive power (or live wire) and the second welding position 132 needs to be connected with the negative power (or zero wire), and of course, for those skilled in the art, when the first welding position 131 is directly connected with the live wire, the second welding position 132 is directly connected with the zero wire, so that an ac-to-dc conversion module needs to be added to drive the LED light emitting chip. The power supply supplies power to the LED light-emitting chip to realize the light emission of the LED light-emitting chip. The LED light-emitting chip can be a front-mounted chip or a flip chip.

When the LED light source is formed into a shape, different shapes can be formed only by bending along the hollow groove 110, and the function of bending the LED light source is realized. Moreover, the aluminum substrate 100 has good heat dissipation performance because it is made of aluminum. Therefore, by providing the LED chip mounting region 120 on the aluminum substrate 100 and mounting the LED light emitting chip in the LED chip mounting region 120, the LED light emitting chip can be reliably cooled by utilizing the good heat dissipation performance of the aluminum substrate 100. Considering that the aluminum substrate 100 has a certain rigidity and is not easy to bend, in order to realize the function of bending the LED light source, the rigidity of the aluminum substrate 100 at the bending position is reduced by the hollow groove 110, so that the aluminum substrate 100 can be bent at a large angle.

In some preferred embodiments, the hollow-out groove 110 is disposed between two adjacent LED chip mounting regions 120, and the angle at which the hollow-out groove 110 is bent is between 90 degrees and 150 degrees.

For the form of the connection circuit, it may be in the form of a separate wire. However, this is not aesthetically pleasing for LED light sources. To this end, in some preferred embodiments, the connection circuit is printed on the aluminum substrate 100.

In some preferred embodiments, a structural form of the aluminum substrate 100 is provided. The method specifically comprises the following steps: the aluminum substrate 100 comprises an aluminum plate layer, a first insulating layer, a copper-coated layer, a second insulating layer, an LED chip pad, a power positive pad and a power negative pad, the aluminum plate layer, the first insulating layer, the copper-coated layer and the second insulating layer are sequentially arranged, the connecting circuit is printed on the copper-coated layer, the LED chip pad is located in the LED chip mounting area 120, and the LED light-emitting chip is fixedly crystallized on the LED chip pad. The method for fixing the LED light-emitting chip on the LED chip bonding pad can be realized by adopting the prior technical scheme, and specifically comprises the following steps: spot welding, pressure welding or eutectic.

In some preferred embodiments, the second insulating layer is coated with a reflective ink. The light of the LED light-emitting chip can be reflected through the reflective ink, so that the brightness of the LED light source is improved.

Referring to fig. 2, this embodiment further provides a bulb including the LED light source described in any one of the above embodiments, the LED light source being bent into a desired shape as needed, the bulb further including: the bulb lamp comprises a lamp holder 300, a bulb shell 400 and a core column 200, wherein the bulb shell 400 is connected with the lamp holder 300, the core column 200 is located inside the bulb shell 400, the core column 200 is provided with a positive electrode wiring position 210 and a negative electrode wiring position 220, the positive electrode wiring position 210 is connected with a first welding position 131, and the negative electrode wiring position 220 is connected with a second welding position 132. The lamp cap 300 is mainly connected to an external power source to take electricity. The stem 200 functions to fix the LED light source and electrically connect the LED light source. The stem 200 is provided with a positive electrode terminal 210 and a negative electrode terminal 220, and the shapes and forms of the positive electrode terminal 210 and the negative electrode terminal 220 are not limited. In the present embodiment, referring to fig. 2, the positive and negative electrode

terminal portions

210 and 220 are rod-shaped. The positive electrode connecting position 210 is connected with the first welding position 131 of the LED light source, and the negative electrode connecting position 220 is connected with the second welding position 132 of the LED light source.

For efficient heat dissipation, in some embodiments, the interior of the bulb 400 is filled with a thermally conductive gas. The main function of the heat-conducting gas is to efficiently transfer heat emitted by the LED light source to the bulb 400, so that the influence on the luminous efficiency of the LED light source due to overhigh temperature is avoided. The heat-conducting gas is generally mainly inert gas or mixed gas. In some preferred embodiments, the thermally conductive gas comprises: helium, argon, krypton, heliox, argon-oxygen, or krypton-oxygen.

While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited to the details of the embodiments shown, but is capable of various modifications and changes without departing from the spirit of the invention.

Claims

1. An LED light source, comprising: the LED light-emitting device comprises an aluminum substrate, a first welding position and a second welding position, wherein the aluminum substrate is provided with at least two LED chip mounting areas and at least one hollowed-out groove, LED light-emitting chips are mounted in the LED chip mounting areas, the aluminum substrate is bent along the hollowed-out groove, the first welding position and the second welding position are arranged on the aluminum substrate, the first welding position is connected with the anode of each LED light-emitting chip through a connecting circuit, and the second welding position is connected with the cathode of each LED light-emitting chip through a connecting circuit.

2. The LED light source of claim 1 wherein the hollow-out groove bend angle is between 90 and 150 degrees.

3. The LED light source as claimed in claim 1, wherein the hollow-out groove is disposed between two adjacent LED chip mounting regions.

4. An LED light source as claimed in claim 1, wherein the connection circuit is printed on an aluminum substrate.

5. The LED light source according to claim 4, wherein the aluminum substrate comprises an aluminum plate layer, a first insulating layer, a copper-clad layer, a second insulating layer, an LED chip pad, a power supply positive electrode pad and a power supply negative electrode pad, the aluminum plate layer, the first insulating layer, the copper-clad layer and the second insulating layer are sequentially arranged, the connecting circuit is printed on the copper-clad layer, the LED chip pad is located in the LED chip mounting area, and the LED light emitting chip is die-bonded on the chip pad.

6. An LED light source as claimed in claim 5 wherein the second insulating layer is coated with a reflective ink.

7. An LED light source as claimed in claim 5 wherein the die attach comprises any one of spot welding, pressure welding or eutectic.

8. A light bulb comprising the LED light source of any one of claims 1 to 7, further comprising a lamp cap, a bulb shell, and a stem, the bulb shell being connected to the lamp cap, the stem being located inside the bulb shell, the stem being provided with a positive terminal position and a negative terminal position, the positive terminal position being connected to the first welding position, and the negative terminal position being connected to the second welding position.

9. A lamp as claimed in claim 8, characterized in that the interior of the envelope is filled with a thermally conductive gas.

10. The bulb as set forth in claim 9, wherein the thermally conductive gas comprises: helium, argon, krypton, heliox, argon-oxygen, or krypton-oxygen.