CN213583852U - Integrated packaging structure of multilayer LED - Google Patents

Abstract

The utility model discloses an integrated packaging structure of multilayer LED, be equipped with the bar recess including hot base plate and the hot base plate surface bilateral symmetry of apron, apron bottom surface symmetry is equipped with the bar lug, the equal adaptation of position and size of bar recess and bar lug. The surface of the top end of the heat conduction layer is connected with the surface of the bottom of the insulation layer, fluorescent glue is arranged on the surface of the light emitting chip, the light emitting chip comprises a red light chip, a green light chip, a blue light chip, a cyan light chip, an amber light chip, a deep blue light chip and a white light chip, and the light emitting chips are electrically connected with one another. The heat conduction layer, the insulating layer, the transparent layer and the reflector surface are on the same plane, and the heat conduction layer, the insulating layer, the transparent layer and the reflector surface are mutually parallel up and down. This integrated packaging structure of multilayer LED, the direct bottom plate thermal diffusivity of laminating of hot base plate is strong, and separates by the insulating layer between fluorescent glue and the heat-conducting layer, thereby can not lead to the high temperature of fluorescent glue to influence saturation and the homogeneity that the colour was thrown out to the light.

Description

Integrated packaging structure of multilayer LED

Technical Field

The utility model relates to a LED integrated packaging technology field specifically is an integrated packaging structure of multilayer LED.

Background

The LED integrated packaging technology is to directly package a plurality of LED chips on a high heat conduction substrate to be used as a lighting module and directly radiate heat through the high heat conduction substrate. Besides the integrated packaging technology, the packaging mode of the LED in the prior art also comprises the SMD (surface mounted device) surface mounted packaging technology and the high-power packaging technology, and compared with the SMD surface mounted packaging technology or the high-power packaging technology, the integrated packaging technology has the beneficial effects of simplifying the manufacturing process of the support, saving the cost, reducing the heat dissipation of the thermal resistance and realizing personalized design. Therefore, the LED integrated package technology is a package method mainly pushed by lighting enterprises at present. As the application market of the integrated packaged LED is more and more mature, the requirements of users on the integrated packaged product are not limited to the stability and reliability of the product. Some lighting fixtures applied to professional photography places are required to improve the color saturation and the color uniformity of an LED packaging device while the requirement on the brightness of white light is higher and higher. At present, the brightness of the light source packaged independently is higher, and the luminous efficiency of the LED light source packaged by the same chip is generally reduced by 20-30%. The main reasons of the analysis are two aspects: firstly, the temperature is too high due to poor heat dissipation, and the luminous efficiency of the chip is reduced; secondly, the problem of light guiding of the bracket is solved, the light output amount of a common chip comprises the sum of front light output and side light output, in some horizontal chips, the side light output amount accounts for 20-25% of the total light output amount, and if the part of light cannot be effectively extracted, the brightness of the packaged LED light source is obviously reduced. In the integrated package, the current supports are all planar, the chips are very close to each other, and after the integrated package is adopted, the side light of the chips is almost totally reflected back and forth among the chips for multiple times and is slowly consumed, so that the effective light emitting cannot be formed. In addition, the fluorescent powder in the LED light source has the function of light color recombination to form white light. The characteristics thereof mainly include particle size, shape, luminous efficiency, conversion efficiency, stability, and the like, wherein the luminous efficiency and the conversion efficiency are critical. Researches show that along with temperature rise, the quantum efficiency of the fluorescent powder is reduced, light emission is reduced, the radiation wavelength is changed, the color temperature and the chromaticity of the white light LED are changed, and the aging of the fluorescent powder is accelerated at higher temperature. The traditional LED device has two problems, namely, the fluorescent powder and silica gel are mixed and then directly coated on an LED wafer, the LED fluorescent powder is close to a heat source, the integral temperature of the fluorescent powder is easily higher, the excitation efficiency of the fluorescent powder is reduced, the lighting effect is lower, and the fluorescent powder is easy to cause light decay in an environment with overhigh temperature for a long time; the other way is that the fluorescent powder is coated by mixing the fluorescent powder with the pouring sealant and then spot-coating the mixture on the wafer. Because the coating thickness and the shape of the fluorescent powder cannot be accurately controlled, the emergent light is inconsistent in color, and blue light or yellow light is generated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated packaging structure of multilayer LED has good heat dissipation, and the problem among the prior art can be solved to the high and even advantage of colour saturation.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an integrated packaging structure of multilayer LED, includes hot base plate and apron, hot base plate bottom surface connection bottom plate, hot base plate top are equipped with the heat-conducting layer, and insulating layer bottom surface is connected to heat-conducting layer top surface, and insulating layer top surface array is equipped with a plurality of luminous chips, and luminous chip surface is equipped with fluorescent glue, fluorescent glue top surface connection stratum lucidum bottom surface, and stratum lucidum top surface connects reflector surface bottom surface, and reflector surface top surface is equipped with the wall all around and glues.

Preferably, the two sides of the surface of the hot substrate are symmetrically provided with strip-shaped grooves, the surface of the bottom of the cover plate is symmetrically provided with strip-shaped convex blocks, and the strip-shaped grooves and the strip-shaped convex blocks are matched with each other in position and size.

Preferably, through holes are symmetrically formed in four corners of the cover plate, and a hollow groove is formed in the center of the cover plate.

Preferably, the cover plate is smaller than the thermal substrate, and the base plate is the same size as the thermal substrate.

Preferably, the size of the hollow groove is matched with the size of the reflecting mirror surface and the transparent layer.

Preferably, the light emitting chips include a red light chip, a green light chip, a blue light chip, a cyan light chip, an amber light chip, a deep blue light chip and a white light chip, and the light emitting chips are electrically connected with one another.

Preferably, the heat conduction layer, the insulation layer, the transparent layer and the mirror surface are on a non-same plane, and the heat conduction layer, the insulation layer, the transparent layer and the mirror surface are mutually parallel up and down.

Preferably, the insulating layer is provided with die bonding grooves in an array manner, the size of the die bonding grooves is matched with that of the light emitting chip, and the light emitting chip is arranged in the die bonding grooves.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the multilayer LED integrated packaging structure comprises a hot substrate and a cover plate, wherein the size of a hollow groove is matched with the size of a reflecting mirror surface and the size of a transparent layer. The bottom plate is connected to hot base plate bottom surface, and hot base plate top is equipped with the heat-conducting layer, and insulating layer bottom surface is connected to heat-conducting layer top surface, and insulating layer top surface array is equipped with a plurality of luminous chips, and luminous chip includes ruddiness chip, green glow chip, blue light chip, amber chip, dark blue light chip and white light chip, electric connection between the luminous chip. The heat conduction layer, the insulating layer, the transparent layer and the reflector surface are on the same plane, and the heat conduction layer, the insulating layer, the transparent layer and the reflector surface are mutually parallel up and down. The thermal substrate with the structure is strong in heat dissipation performance due to the fact that the thermal substrate is directly attached to the bottom plate, the fluorescent glue is separated from the heat conducting layer through the insulating layer, and the saturation and uniformity of colors projected by light cannot be influenced due to the fact that the temperature of the fluorescent glue is too high.

Drawings

FIG. 1 is a side view cross-sectional structure of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a front view of the thermal base plate of the present invention;

fig. 4 is a cover plate structure view of the present invention.

In the figure: 1. a hot substrate; 2. wall glue; 3. a cover plate; 4. a reflective mirror surface; 5. a strip-shaped groove; 6. a bar-shaped projection; 7. a hollow groove; 8. a through hole; 9. a base plate; 10. a heat conductive layer; 11. an insulating layer; 12. fluorescent glue; 13. a light emitting chip; 14. a transparent layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, a multilayer LED integrated package structure includes a thermal substrate 1 and a cover plate 3, wherein strip-shaped grooves 5 are symmetrically disposed on two sides of the surface of the thermal substrate 1, strip-shaped bumps 6 are symmetrically disposed on the bottom surface of the cover plate 3, and the positions and sizes of the strip-shaped grooves 5 and the strip-shaped bumps 6 are matched. Through holes 8 are symmetrically arranged at four corners of the cover plate 3, and a hollow groove 7 is arranged at the center of the cover plate 3. The size of the hollow groove 7 is matched with the size of the reflecting mirror surface 4 and the transparent layer 14.

The cover plate 3 is smaller in size than the thermal substrate 1, and the bottom plate 9 is the same in size as the thermal substrate 1. The bottom surface of the thermal substrate 1 is connected with the bottom plate 9, the top end of the thermal substrate 1 is provided with a heat conduction layer 10, the top surface of the heat conduction layer 10 is connected with the bottom surface of the insulation layer 11, the top surface of the insulation layer 11 is provided with a plurality of light-emitting chips 13 in an array mode, the insulation layer 11 is provided with a crystal fixing groove in an array mode, the size of the crystal fixing groove is matched with the size of the light-emitting chips 13, and the light-emitting. The light emitting chips 13 include a red light chip, a green light chip, a blue light chip, a cyan light chip, an amber light chip, a deep blue light chip and a white light chip, and the light emitting chips 13 are electrically connected with one another. The seven colors are common LED chips and are convenient to obtain, and the wavelengths of the chips in all colors are uniformly distributed in the visible light range of 380-780 nm. Wherein, red, green and blue are three primary colors, while cyan, amber, deep blue and white light are a supplement to the three primary colors, which can increase the color gamut range and improve the color saturation and uniformity. Luminous chip 13 surface is equipped with fluorescent glue 12, and fluorescent glue 12 is epoxy AB glue, and 14 bottom surfaces of stratum lucidum are connected to fluorescent glue 12 top surfaces, and 4 bottom surfaces of reflector surface are connected to 14 top surfaces of stratum lucidum, and 4 top surfaces of reflector surface are equipped with wall glue 2 all around. The heat conducting layer 10, the insulating layer 11, the transparent layer 14 and the mirror surface 4 are on a non-same plane, and the heat conducting layer 10, the insulating layer 11, the transparent layer 14 and the mirror surface 4 are parallel to each other. This structure thermal substrate 1 direct laminating bottom plate 9 thermal diffusivity is strong, and separates by insulating layer 11 between fluorescent glue 12 and the heat-conducting layer 10, thereby can not lead to the too high saturation and the homogeneity that influence the light and throw out the colour of fluorescent glue 12 temperature.

In summary, the multilayer LED integrated package structure includes a thermal substrate 1 and a cover plate 3, and the size of the hollow groove 7 is matched with the size of the reflector surface 4 and the transparent layer 14. Bottom plate 9 is connected to 1 bottom surface of hot base plate, and 1 top of hot base plate is equipped with heat-conducting layer 10, and 11 bottom surfaces of insulating layer are connected to the 10 top surface of heat-conducting layer, and 11 top surface arrays of insulating layer are equipped with a plurality of luminous chips 13, and luminous chip 13 includes ruddiness chip, green glow chip, blue light chip, amber chip, dark blue light chip and white light chip, electric connection between the luminous chip 13. The heat conducting layer 10, the insulating layer 11, the transparent layer 14 and the mirror surface 4 are on a non-same plane, and the heat conducting layer 10, the insulating layer 11, the transparent layer 14 and the mirror surface 4 are parallel to each other. This structure thermal substrate 1 direct laminating bottom plate 9 thermal diffusivity is strong, and separates by insulating layer 11 between fluorescent glue 12 and the heat-conducting layer 10, thereby can not lead to the too high saturation and the homogeneity that influence the light and throw out the colour of fluorescent glue 12 temperature.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. A multilayer LED integrated package structure comprises a thermal substrate (1) and a cover plate (3), and is characterized in that: bottom plate (9) is connected to hot base plate (1) bottom surface, hot base plate (1) top is equipped with heat-conducting layer (10), insulating layer (11) bottom surface is connected to heat-conducting layer (10) top surface, insulating layer (11) top surface array is equipped with a plurality of luminous chips (13), luminous chip (13) surface is equipped with fluorescent glue (12), fluorescent glue (12) top surface connection stratum lucidum (14) bottom surface, stratum lucidum (14) top surface connection reflector surface (4) bottom surface, reflector surface (4) top surface is equipped with all around and encloses wall glue (2).

2. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: the hot base plate (1) surface bilateral symmetry is equipped with bar recess (5), and apron (3) bottom surface symmetry is equipped with bar lug (6), the equal adaptation of position and size of bar recess (5) and bar lug (6).

3. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: through holes (8) are symmetrically formed in four corners of the cover plate (3), and a hollow groove (7) is formed in the center of the cover plate (3).

4. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: the size of the cover plate (3) is smaller than that of the thermal substrate (1), and the size of the bottom plate (9) is the same as that of the thermal substrate (1).

5. The integrated package structure of multi-layer LED according to claim 3, wherein: the size of the hollow groove (7) is matched with the sizes of the reflecting mirror surface (4) and the transparent layer (14).

6. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: the light-emitting chips (13) comprise red light chips, green light chips, blue light chips, cyan light chips, amber light chips, deep blue light chips and white light chips, and the light-emitting chips (13) are electrically connected with one another.

7. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: the heat conduction layer (10), the insulation layer (11), the transparent layer (14) and the reflector (4) are on the same plane, and the heat conduction layer (10), the insulation layer (11), the transparent layer (14) and the reflector (4) are parallel to each other.

8. The integrated package structure of multi-layer LED as claimed in claim 1, wherein: the die bonding groove is formed in the insulating layer (11) in an array mode, the size of the die bonding groove is matched with that of the light emitting chip (13), and the light emitting chip (13) is installed in the die bonding groove.

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