CN213930462U

CN213930462U - Multi-color temperature COB light source

Info

Publication number: CN213930462U
Application number: CN202022987959.2U
Authority: CN
Inventors: 李刚
Original assignee: Shenzhen Dadao Semiconductor Co ltd
Current assignee: Shenzhen Dadao Semiconductor Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2021-08-10
Anticipated expiration: 2030-12-11

Abstract

The utility model discloses a multi-color temperature COB light source, which comprises a substrate, wherein a light-emitting area is defined on the first surface of the substrate; the light source array is composed of a plurality of light source groups with different colors or different color temperature ranges and is arranged in the light emitting area; a substrate dam disposed on the first surface of the substrate and surrounding the light emitting region therein; the at least one euphotic layer or semi-euphotic layer is arranged in the substrate dam and covers the light source group; each light-emitting light source group comprises at least one light-emitting light source; each light-emitting light source comprises at least one light-emitting chip and a fluorescent layer, and the fluorescent layer is wrapped on the side face and the light-emitting surface of the light-emitting chip. The utility model discloses a photic zone or semi-transparent layer effectively protect luminescent light source's fluorescent layer promotes the reliability of product by a wide margin, and photic zone or semi-transparent layer still have the effect of mixing light for the light-emitting colour mixture is more even, and the facula does not have the colour difference, has reduced the degree of difficulty to optical design.

Description

Multi-color temperature COB light source

Technical Field

The utility model relates to a light source technical field especially relates to a polychrome temperature COB light source.

Background

The urban intelligent lighting system is used as a core subsystem of a smart city, and various Internet of things and IT technologies such as wireless Zigbee, WiFi and GPRS are used, so that the control functions such as remote single-lamp switching, dimming and detection are realized, and a new chapter of management and energy conservation for urban lighting is developed. The light quality of the intelligent commercial lighting lamp is related to the structure and the optical device of the lamp, but the core of the intelligent commercial lighting lamp is the LED light source of the lamp. In order to meet the requirement of lamp intellectualization, the intelligent lamp generally adopts an LED light source capable of adjusting light and color, and most of the intelligent lamp adopts a COB (chip on board) light source capable of adjusting color in practical application. The color-adjustable COB light source mainly combines the light-emitting light sources with various color temperatures, controls the light-emitting light sources through respective power supplies, and achieves the purpose of dimming and color adjustment through light mixing. The main packaging form of present polychrome COB light source has following several:

1. partition multi-color temperature structure: and dividing the COB light emitting area into two or more areas by using dam glue or injection molding, wherein each area is made into different color temperatures, and each color temperature is controlled by a respective independent power supply.

2. SMD paster polychrome temperature structure: the SMD lamp beads packaged well are pasted on the substrate, the SMD lamp beads with different color temperatures can be arranged in a mixed mode through circuit design, and the SMD lamp beads with each color temperature are controlled by respective independent power supplies.

3. CSP multicolor temperature structure: the packaged CSP lamp beads are mounted on the substrate, the CSP lamp beads with different color temperatures can be arranged in a mixed mode through circuit design, and the CSP lamp beads with each color temperature are controlled by respective independent power supplies.

4. CSP + white light COB polychrome temperature structure: the medium color temperature CSP lamp beads and the light-emitting chips are mounted on the substrate, a layer of fluorescent glue covers the medium color temperature CSP lamp beads and the light-emitting chips, when the LED lamp works, blue light generated by the light-emitting chips excites the fluorescent glue to generate high color temperature, light generated by the medium color temperature CSP lamp beads generates secondary excitation in the fluorescent glue and finally generates low color temperature, the medium color temperature CSP lamp beads and the light-emitting chips can be arranged in a mixed mode through circuit design, and the medium color temperature CSP lamp beads and the light-emitting chips are controlled by independent power supplies.

The following disadvantages exist in the above modes:

for the partitioned multi-color temperature structure, due to the limitation of partitioning and light emitting chip array arrangement, the mixed light and color mixing performance is poor, and from the light spots, yellow and white of the product are more serious, and obvious different-color light spots are generated; the design requirement on the optical lens is high, and the optical lens is not suitable for products with high light spot uniformity requirements such as spot lamps and down lamps.

To SMD paster polychrome temperature structure, the volume of present SMD lamp pearl is big, can't closely arrange to realize high optical density. The distance between the light emitting chips among the SMD lamp beads is large, dark stripes are easy to generate, and the light spot quality is influenced. The heat resistance of present SMD lamp pearl support is poor, and the high temperature that high density was arranged and is produced can make the support yellow stain, and the light decay is serious, can't satisfy high optical density requirement of adjusting luminance.

To CSP polychrome temperature structure, CSP lamp pearl is because there is not the support, and the volume is very little, can realize the closely arranged of CSP lamp pearl, but CSP lamp pearl's fluorescent glue is poor with chip adhesion, peels off easily in the use, leads to the product to become invalid.

CSP + white light COB polychrome temperature structure because well colour temperature CSP lamp pearl and the luminous chip luminous light each other all can arouse the fluorescent glue that covers above them simultaneously for monochromatic control and mixed light process are more complicated, and the control of adjusting luminance and mixing colors is very difficult, can only accomplish double-color temperature at most usually.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in providing a reliability height, and the colour mixture is even, and the facula does not have the colour difference, satisfies the polychrome temperature COB light source that high power density adjusted luminance required.

The utility model provides a technical scheme that its technical problem adopted is: a multi-color temperature COB light source is provided, comprising:

a substrate, wherein a light emitting region is defined on a first surface of the substrate;

the light source array is composed of a plurality of light emitting source groups with different colors or different color temperature ranges and is arranged in the light emitting area;

a substrate dam disposed on a first surface of the substrate and surrounding the light emitting region therein;

at least one euphotic layer or semi-euphotic layer, set up in the said base plate dam and cover on the said luminescent light source group;

each light-emitting light source group comprises at least one light-emitting light source; each light-emitting light source comprises at least one light-emitting chip and a fluorescent layer, and the fluorescent layer is wrapped on the side surface and the light-emitting surface of the light-emitting chip;

the luminous light sources belonging to the same luminous light source group have the same color or the same color temperature range, and the luminous light sources belonging to different luminous light source groups have different colors or different color temperature ranges.

Preferably, the luminescent light source further comprises a fence; the enclosing wall wraps the side face of the light-emitting chip, and the fluorescent layer wraps the light-emitting surface of the light-emitting chip and part or all of the upper surface corresponding to the enclosing wall.

Preferably, the light emitting chip comprises two opposite surfaces, wherein the surface facing away from the substrate forms the light emitting surface, and the surface facing towards the substrate forms a welding surface;

the welding surface is provided with an anode pad and a cathode pad which are spaced, and the first surface of the substrate is provided with an anode pad and a cathode pad which are respectively in conductive connection with the anode pad and the cathode pad;

a plurality of conductive circuits are arranged on the first surface of the substrate, and each light-emitting light source group corresponds to at least one conductive circuit;

each conductive circuit is electrically connected with the corresponding anode welding pad and the corresponding cathode welding pad, so that the series connection and/or the parallel connection of the light-emitting light sources are realized.

Preferably, each conductive circuit has at least one external positive electrode welding spot and at least one external negative electrode welding spot;

the external positive electrode welding spots and the external negative electrode welding spots are arranged on the first surface of the substrate and positioned on the outer side of the substrate box dam; and/or the external positive electrode welding spot and the external negative electrode welding spot are arranged on the second surface of the substrate through a conductive through hole penetrating through the substrate.

Preferably, the welding surface of the light-emitting chip is further provided with a heat conduction bonding pad insulated from the positive bonding pad and the negative bonding pad, and the first surface of the substrate is provided with a heat conduction bonding pad in heat conduction connection with the heat conduction bonding pad.

Preferably, the top surface of the light-transmitting layer is a plane.

Preferably, the top surface of the light-transmitting layer is convex.

Preferably, the top surface of the light-transmitting layer is a concave surface.

The utility model has the advantages that: the light transmitting layer or the semi-light transmitting layer which covers the light emitting source group effectively protects the fluorescent layer of the light emitting source, so that the fluorescent layer is not easy to peel off, the reliability of the product is greatly improved, and the light transmitting layer or the semi-light transmitting layer can also generate good light mixing effect on light from different light emitting source groups, so that the light emitting and color mixing are more uniform, light spots are free from color difference, and the difficulty of optical design is reduced; the light-emitting light sources are compactly arranged, so that the optical density is improved, and the requirement of high-optical-density dimming is met.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic cross-sectional view of a multi-color-temperature COB light source according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a multi-color-temperature COB light source according to another embodiment of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 and 2, the multi-color-temperature COB light source of the present invention includes a substrate 10, a light source array, a substrate box dam 30 and a light-transmitting layer or a semi-light-transmitting layer 40.

The substrate 10 has a first surface and a second surface opposite to each other, and a light emitting area is defined on the first surface of the substrate 10 for mounting the light source array. The substrate 10 may be, but is not limited to, a ceramic substrate such as an alumina ceramic plate or an aluminum nitride ceramic plate, a metal substrate, or a substrate made of other materials.

The light source array is composed of a plurality of light emitting source groups with different colors or different color temperature ranges and is arranged in the light emitting area.

The substrate dam 30 is disposed on the first surface of the substrate 10 and surrounds the light emitting region therein, which may be formed by dam paste bake-curing. The outer peripheral shape of the substrate dam 30 depends on the range of the light emitting region, and may be other shapes such as a circle, a square, a rectangle, a polygon, and the like.

The transparent layer or semi-transparent layer 40 is disposed in the substrate dam 30, fills the light-emitting region and covers the light source assembly 20, and plays roles of protecting, mixing light and transmitting or semi-transmitting light. The top surface of the light-transmissive or semi-light-transmissive layer 40 away from the substrate 10 may be planar, convex, concave, or the like. The translucent layer or semi-translucent layer 40 is made of silica gel, epoxy resin or glass glazing, and the semi-translucent layer is doped with one or more of diffusion powder, matte powder, fluorescent powder and coloring powder.

Each of the light source groups 20 includes at least one light source, and each of the light sources includes at least one light emitting chip 21 and a fluorescent layer 22. The light sources belonging to the same light source group 20 have the same color or the same color temperature range, and the light sources belonging to different light source groups 20 have different colors or different color temperature ranges.

Specifically, each light emitting chip 21 includes two opposite surfaces, wherein a surface facing away from the substrate 10 forms a light exit surface, and a surface facing toward the substrate 10 forms a bonding surface.

As shown in fig. 1, in an embodiment of the present invention, the fluorescent layer 22 is wrapped on the side surface and the light emitting surface of the light emitting chip 21.

In another embodiment of the invention, as shown in fig. 2, the light source further comprises a fence 23. The side wall 23 wraps the side surface of the light emitting chip 21, and the fluorescent layer 22 wraps the light emitting surface of the light emitting chip 21 and part or all of the corresponding upper surface of the wall 23.

In a light source assembly 20, the light emitting chips 21 and the corresponding phosphor layer 22 generate a color or color temperature range, so that several light source assemblies 20 generate different colors or different color temperature ranges, respectively, to finally form combinations of different colors and/or different color temperature ranges. That is, in any two light source groups 20, the light emitting chips 21 and the fluorescent layer 22 of one light source group 20 generate one color or color temperature range, and the light emitting chips 21 and the fluorescent layer 22 of the other light source group 20 generate another color or color temperature range.

The fluorescent layer 22 is made of silica gel or epoxy resin and contains at least one phosphor. The composition of the fluorescent layer 22 can be set according to actual requirements, so that when the light emitting chips 21 are powered on, the corresponding light emitting source sets 20 can generate white light with different colors and/or different color temperature ranges.

As shown in fig. 1 and 2, the bonding surface of the light emitting chip 21 is provided with a positive electrode pad 51 and a negative electrode pad 52 which are spaced and insulated from each other. Correspondingly, the first surface of the substrate 10 is provided with a positive electrode pad 12 and a negative electrode pad 13 which are spaced and insulated. The positive electrode pad 12 and the negative electrode pad 13 are electrically conductively connected to the positive electrode pad 51 and the negative electrode pad 52, respectively.

The first surface of the substrate 10 is further provided with a plurality of conductive circuits (not shown), and each of the light source groups 20 corresponds to at least one of the conductive circuits. Each conductive circuit is electrically connected with the corresponding anode welding pad 12 and the corresponding cathode welding pad 13, so that the series connection and/or the parallel connection of the light-emitting light sources are realized.

Each conductive circuit has at least one external positive electrode solder joint 61 and at least one external negative electrode solder joint 62, so that each corresponding light source group 20 corresponds to at least one external positive electrode solder joint 61 and at least one external negative electrode solder joint 62.

The external positive electrode pads 61 and the external negative electrode pads 62 may be disposed on the first surface of the substrate 10 and outside the substrate dam 50, or may be partially or entirely disposed on the second surface of the substrate 10 through conductive vias (not shown) penetrating the substrate 10.

Further, a heat conducting pad (not shown) insulated from the positive pad 51 and the negative pad 52 may be further disposed on the welding surface of the light emitting chip 21, and a heat conducting pad (not shown) is disposed on the first surface of the substrate 10 and is in heat conducting connection with the heat conducting pad to conduct out heat generated by light emission of the light emitting chip 21, so as to dissipate heat.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A multi-color temperature COB light source, comprising:

2. The multi-color-temperature COB light source of claim 1, wherein the luminescent light source further comprises an enclosure; the enclosing wall wraps the side face of the light-emitting chip, and the fluorescent layer wraps the light-emitting surface of the light-emitting chip and part or all of the upper surface corresponding to the enclosing wall.

3. The multi-color-temperature COB light source of any one of claims 1-2, wherein the light-emitting chip comprises two opposing surfaces, wherein the surface facing away from the substrate forms the light exit surface and the surface facing toward the substrate forms a bonding surface;

4. The multi-color temperature COB light source of claim 3, wherein each of the conductive circuits has at least one external positive electrode pad and at least one external negative electrode pad;

5. The multi-color-temperature COB light source as claimed in claim 3, wherein the bonding surface of the light-emitting chip is further provided with a heat conducting bonding pad insulated from the positive bonding pad and the negative bonding pad, and the first surface of the substrate is provided with a heat conducting bonding pad in heat conducting connection with the heat conducting bonding pad.

6. The multi-color-temperature COB light source of any one of claims 1-2, wherein the top surface of the light transmissive layer is planar.

7. The multi-color-temperature COB light source of any one of claims 1-2, wherein the top surface of the light-transmissive layer is convex.

8. The multi-color-temperature COB light source of any one of claims 1-2, wherein the top surface of the light-transmissive layer is concave.