CN210040248U - LED packaging body and LED lamp capable of improving near ultraviolet full spectrum - Google Patents
LED packaging body and LED lamp capable of improving near ultraviolet full spectrum Download PDFInfo
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- CN210040248U CN210040248U CN201921265807.2U CN201921265807U CN210040248U CN 210040248 U CN210040248 U CN 210040248U CN 201921265807 U CN201921265807 U CN 201921265807U CN 210040248 U CN210040248 U CN 210040248U
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- 238000001228 spectrum Methods 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 75
- 239000010410 layer Substances 0.000 claims description 86
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 24
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 43
- 230000008093 supporting effect Effects 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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Abstract
The utility model provides a improve LED packaging body and LED lamps and lanterns of near ultraviolet full gloss register for easy reference, improve LED packaging body of near ultraviolet full gloss register for easy reference including packaging support, purple light LED chip and fluorescence glue film, purple light LED chip is the purple light LED chip of formal dress type or flip-chip type, purple light LED chip solid crystal is on packaging support, and forms the electricity with it and connects; the fluorescence glue film is equipped with the multilayer to stack gradually in purple light LED chip's emitting surface, and the emergent light wavelength that lowermost layer fluorescence glue film arouses to the superiors' fluorescence glue film shortens gradually. A purple light LED chip is adopted to complement purple light spectrum, so that the emergent spectrum is fuller; meanwhile, light with longer wavelength is excited out firstly and then is emitted out through the fluorescent glue layer with short wave, light with long wave is not easy to be absorbed by the fluorescent glue layer with short wave, and then the light can be completely emitted out, the whole light effect is ensured, and the near ultraviolet full spectrum light effect can be effectively improved.
Description
Technical Field
The utility model relates to a LED encapsulation field, concretely relates to can effectively improve LED packaging body and the LED lamps and lanterns that have this LED packaging body of improvement near ultraviolet full gloss register for easy reference light spectrum of near ultraviolet full gloss register for easy reference light spectrum light efficiency.
Background
The prior LED lamps are mostly in three forms of red-blue combination, full blue and full red, and are used for illuminating or covering plants so as to provide the wavelength range required by the photosynthesis of the plants. In recent years, full-spectrum LED lamps have become popular, which can better simulate sunlight, that is, the visible light spectrum of the sun can be approached by supplementing colors such as cyan and light blue, and the color rendering index of the packaged finished product is also greatly improved. Although called full spectrum, some of the purple-shifted spectrum is missing. In addition, in the prior art, the doping of multiple phosphors enables light excited by one phosphor to be easily absorbed again by another phosphor, and especially short-wave light is easily absorbed by other phosphors to excite light with longer wavelength.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides a can effectively improve the LED packaging body of nearly ultraviolet full gloss register for easy reference and have the LED lamps and lanterns of this LED packaging body.
In order to achieve the above purpose, the utility model provides a technical scheme as follows:
an LED packaging body for improving near ultraviolet full spectrum comprises a packaging support, a purple light LED chip and a fluorescent glue layer, wherein the purple light LED chip is a positively-mounted or reversely-mounted purple light LED chip, and is fixedly crystallized on the packaging support and electrically connected with the packaging support; the fluorescence glue film is equipped with the multilayer to stack gradually in purple light LED chip's emitting surface, and the emergent light wavelength that lowermost layer fluorescence glue film arouses to the superiors' fluorescence glue film shortens gradually.
Further, the main band of the purple light LED chip is 390-400 nm.
Furthermore, the fluorescent glue layer is provided with three layers, namely a red powder fluorescent glue layer, a yellow-green powder fluorescent glue layer and a blue powder fluorescent glue layer which are sequentially stacked from bottom to top.
Further, the ultraviolet LED chip comprises a transparent adhesive layer, wherein the transparent adhesive layer covers the surface of the ultraviolet LED chip; the fluorescent glue layer is arranged on the transparent glue layer.
Further, the transparent adhesive layer is a transparent silica gel layer or an epoxy resin layer.
Furthermore, the packaging support is of a bowl-cup structure, and the purple light LED chip and the fluorescent glue layer are both arranged in the bowl-cup structure of the packaging support.
An LED lamp at least comprises the LED packaging body for improving the near ultraviolet full spectrum.
Through the utility model provides a technical scheme has following beneficial effect:
a purple light LED chip is adopted to complement purple light spectrum, so that the emergent spectrum is fuller; simultaneously, the fluorescence glue film sets up to range upon range of multilayer structure, and the emergent light wavelength that bottom fluorescence glue film arouses to the top fluorescence glue film shortens gradually, and the longer light of wavelength is aroused earlier promptly, then jets out through the fluorescence glue film of shortwave, and the light of long wave is difficult to be absorbed by the fluorescence glue film of shortwave, and then can be complete the outgoing, guarantees holistic light efficiency, can effectively improve near ultraviolet full spectrum light efficiency.
Drawings
Fig. 1 is a schematic structural diagram of an LED package for improving a near-ultraviolet full spectrum in a first embodiment;
fig. 2 is a schematic structural diagram of an LED package for improving the near-ultraviolet full spectrum in the second embodiment.
Detailed Description
To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The present invention will now be further described with reference to the accompanying drawings and detailed description.
Referring to fig. 1, the present embodiment further provides an LED package for improving a near ultraviolet full spectrum, including a package support 10, a fluorescent glue layer, and a violet LED chip 20, where the violet LED chip 20 is a forward-mounted or flip-chip violet LED chip 20, and the violet LED chip 20 is die-bonded on the package support 10 and electrically connected thereto; the fluorescence glue film is equipped with the multilayer to stack gradually in purple light LED chip 20's emitting surface, and the emergent light wavelength that the fluorescence glue film of lower floor arouses to the fluorescence glue film of the superiors shortens gradually.
A purple light LED chip 20 is adopted to complement purple light spectrum, so that the emergent spectrum is fuller; simultaneously, the fluorescence glue film sets up to range upon range of multilayer structure, and the emergent light wavelength that bottom fluorescence glue film arouses to the top fluorescence glue film shortens gradually, and the longer light of wavelength is aroused earlier promptly, then jets out through the fluorescence glue film of shortwave, and the light of long wave is difficult to be absorbed by the fluorescence glue film of shortwave, and then can be complete the outgoing, guarantees holistic light efficiency, can effectively improve near ultraviolet full spectrum light efficiency.
Specifically, the die bonding mode of the violet LED chip 20 and the electrical connection structure with the package support are both the prior art, and the violet LED chip 20 is a forward-mounted or flip-chip type violet LED chip 20, for example, the forward-mounted type LED chip is die-bonded on the package support by conventional solder paste or silver paste, and then is respectively soldered on the positive electrode and the negative electrode of the package support by metal wires, and finally electrical connection is formed; after the inverted LED chip is fixed, the electrode of the purple LED chip 20 is directly and electrically connected to the electrode of the packaging support, and the packaging is convenient.
Specifically, the lamination preparation method of the fluorescent glue layer is as follows: the first fluorescent glue layer, namely the lowest fluorescent glue layer, is coated on the light-emitting surface of the purple light LED chip 20, after the first fluorescent glue layer is coated and hardened to meet the supporting effect, the second fluorescent glue layer is coated on the surface of the lowest fluorescent glue layer, after the second fluorescent glue layer is coated and hardened to meet the supporting effect, the third fluorescent glue layer is coated on the surface of the second fluorescent glue layer, and the rest is done in the same way. The method for hardening the fluorescent glue layer to meet the supporting effect can adopt natural air drying hardening after baking, preferentially adopts baking, and has high efficiency. Or the fluorescent glue layer is directly replaced by a fluorescent powder film which is prepared into a film, and the fluorescent glue layer can be directly prepared by lamination.
Further, in this embodiment, the main wavelength band of the violet LED chip 20 is 390-400 nm; the violet LED chip 20 adopting the main waveband is a main product of the existing violet LED chip 20, and has mature technology and easy acquisition. Of course, in other embodiments, the violet LED chips 20 with other main bands may also be adopted, such as the violet LED chips 20 with a main band of 375- "390 nm.
Further, in this embodiment, the phosphor layer has three layers, which are a red phosphor layer 41, a yellow-green phosphor layer 42, and a blue phosphor layer 43 stacked in sequence from bottom to top. The purple light emitted by the purple light LED chip 20 irradiates the red powder fluorescent glue layer 41, is partially absorbed by the red powder of the red powder fluorescent glue layer 41 and excites the red light, and the red light is emitted through the yellow-green powder fluorescent glue layer 42 and the blue powder fluorescent glue layer 43, the wavelength of the red light is longest, the red light is not easily absorbed by the yellow-green powder fluorescent glue layer 42 and the blue powder fluorescent glue layer 43, and the light emitting quantity of the red light can be well ensured. The violet light which is not absorbed by the red phosphor adhesive layer 41 is irradiated to the yellow-green phosphor adhesive layer 42, and part of the violet light is absorbed by the yellow-green phosphor of the yellow-green phosphor adhesive layer 42, and is excited to emit yellow-green light, and is emitted through the blue phosphor adhesive layer 43, and the yellow-green light has a longer wavelength and is not easily absorbed by the blue phosphor adhesive layer 43, so that the light emitting amount of the yellow-green light is ensured. The violet light not absorbed by the red phosphor adhesive layer 41 and the yellow-green phosphor adhesive layer 42 is irradiated to the blue phosphor adhesive layer 43, and a part of the violet light is absorbed by the blue phosphor to excite blue light, and the blue light is directly emitted. The emitted red light, yellow-green light, blue light and purple light are mixed to form white light, so that the white light spectrum is relatively saturated, and the light effect is good. Meanwhile, in the embodiment, the yellow-green phosphor glue layer 42 formed by mixing the yellow powder and the green powder has a short yellow wavelength close to that of the green powder, and the yellow powder and the green powder are doped in proportion under normal conditions, so that the loss degree is small and can be ignored. Of course, in other embodiments, the yellow powder and the green powder in the yellow-green powder fluorescent glue layer 42 may be respectively made into a yellow powder fluorescent glue layer and a green powder fluorescent glue layer, and stacked separately, where the yellow powder fluorescent glue layer is on the lower layer, and the green powder fluorescent glue layer is on the upper layer, that is, the stacked structure from bottom to top of the fluorescent glue layer in the present scheme is: red phosphor glue layer/yellow phosphor glue layer/green phosphor glue layer/blue phosphor glue layer.
Further, in this embodiment, the LED chip further includes a transparent adhesive layer 30, and the transparent adhesive layer 30 covers the surface of the violet LED chip 20; the fluorescent adhesive layer is disposed on the transparent adhesive layer 30. Firstly coating the transparent adhesive layer 30 on the purple light LED chip 20 to obtain a flat surface of the transparent adhesive layer 30, and then laminating the fluorescent adhesive layer on the flat surface of the transparent adhesive layer 30, so that the preparation is easy, and the light emitting effect is better; meanwhile, a remote fluorescent powder structure is obtained, so that the fluorescent powder of the fluorescent glue layer can be far away from a heat source (namely the purple light LED chip 20), and the quality of the fluorescent glue layer is better ensured. Specifically, the transparent adhesive layer 30 may be a transparent silica gel layer or an epoxy resin layer in the prior art. Of course, in other embodiments, the transparent adhesive layer structure may not be required.
Further, in this embodiment, the package support 10 is a package support 10 having a cup structure 11, and the violet LED chip 20 and the fluorescent glue layer are both disposed in the cup structure 11 of the package support 10. By adopting the bowl cup structure 11, on one hand, the inner wall of the bowl cup can play a good role in light polymerization and reflection; meanwhile, the bowl-cup structure 11 can support the fluorescent glue layer, so that the thickness of the laminated layer is uniform and does not deform; the fluorescent glue layer is effectively prevented from collapsing and deforming at the periphery; the overall light emitting effect is better. Of course, in other embodiments, the package support 10 may also be a conventional planar substrate.
The embodiment also provides an LED lamp, which includes a housing, an LED package and a driving power supply, wherein the LED package is the LED package for improving the near ultraviolet full spectrum; the LED packaging body is assembled on the shell, and the driving power supply is electrically connected with the LED packaging body to provide power for the LED packaging body.
Example two
The LED package for improving the near ultraviolet full spectrum provided in this embodiment is substantially the same as the LED package for improving the near ultraviolet full spectrum provided in the first embodiment, except that: referring to fig. 2, in the present embodiment, the phosphor layers are provided with five layers, which are a red phosphor layer 44, a yellow phosphor layer 45, a green phosphor layer 46, a green phosphor layer 47, and a blue phosphor layer 48, stacked in sequence from bottom to top, respectively, and the violet light emitted by the violet LED chip 20 is emitted through the red phosphor layer 44, the yellow phosphor layer 45, the green phosphor layer 46, the green phosphor layer 47, and the blue phosphor layer 48 in sequence, and a part of the violet light is absorbed and excited by the red phosphor of the red phosphor layer 44, the yellow phosphor of the yellow phosphor layer 45, the green phosphor of the green phosphor layer 46, the green phosphor of the green phosphor layer 47, and the blue phosphor of the blue phosphor layer 48, respectively, to emit corresponding light, and the excited light is emitted through the phosphor layer with a shorter wavelength, and is not easily absorbed, thereby ensuring the amount of light emission, making the spectrum more saturated, and the light efficiency better.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. An LED packaging body for improving near ultraviolet full spectrum is characterized in that: the ultraviolet LED chip is a forward-mounted or inverted ultraviolet LED chip, and is fixedly crystallized on the packaging support and electrically connected with the packaging support; the fluorescence glue film is equipped with the multilayer to stack gradually in purple light LED chip's emitting surface, and the emergent light wavelength that lowermost layer fluorescence glue film arouses to the superiors' fluorescence glue film shortens gradually.
2. The LED package for improving the full spectrum of near ultraviolet of claim 1, wherein: the main wave band of the purple light LED chip is 390-400 nm.
3. The LED package for improving the full spectrum of near ultraviolet of claim 1, wherein: the fluorescent glue layer is provided with three layers, namely a red powder fluorescent glue layer, a yellow-green powder fluorescent glue layer and a blue powder fluorescent glue layer which are sequentially stacked from bottom to top.
4. The LED package for improving the full spectrum of near ultraviolet of claim 1, wherein: the ultraviolet LED chip is characterized by also comprising a transparent adhesive layer, wherein the transparent adhesive layer covers the surface of the ultraviolet LED chip; the fluorescent glue layer is arranged on the transparent glue layer.
5. The LED package for improving the full spectrum of near ultraviolet light according to claim 4, wherein: the transparent adhesive layer is a transparent silica gel layer or an epoxy resin layer.
6. The LED package for improving the full spectrum of near ultraviolet of claim 1, wherein: the packaging support is of a bowl-cup structure, and the purple light LED chip and the fluorescent glue layer are both arranged in the bowl-cup structure of the packaging support.
7. An LED lamp, characterized in that: the LED package for improving the near ultraviolet full spectrum, which comprises at least the LED package as recited in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921265807.2U CN210040248U (en) | 2019-08-06 | 2019-08-06 | LED packaging body and LED lamp capable of improving near ultraviolet full spectrum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921265807.2U CN210040248U (en) | 2019-08-06 | 2019-08-06 | LED packaging body and LED lamp capable of improving near ultraviolet full spectrum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210040248U true CN210040248U (en) | 2020-02-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921265807.2U Expired - Fee Related CN210040248U (en) | 2019-08-06 | 2019-08-06 | LED packaging body and LED lamp capable of improving near ultraviolet full spectrum |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210040248U (en) |
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2019
- 2019-08-06 CN CN201921265807.2U patent/CN210040248U/en not_active Expired - Fee Related
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Granted publication date: 20200207 |
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