CN204497262U - A kind of good large power white light LED that dispels the heat - Google Patents
A kind of good large power white light LED that dispels the heat Download PDFInfo
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- CN204497262U CN204497262U CN201420793110.3U CN201420793110U CN204497262U CN 204497262 U CN204497262 U CN 204497262U CN 201420793110 U CN201420793110 U CN 201420793110U CN 204497262 U CN204497262 U CN 204497262U
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- heat
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- filled cavities
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Abstract
The utility model provides a kind of good large power white light LED that dispels the heat, and comprises COB chip module, transparent ceramic fluorescence cover plate, reflector, upper liquid filled cavities, lower liquid filled cavities and radiator; Described COB chip module is the heat-radiating substrate being packaged with many blue-light LED chips, and is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate is positioned at above COB chip module and is also fixed on reflector by sealing viscose glue; Described upper liquid filled cavities to be between described transparent ceramic fluorescence cover plate and COB chip module and falling heat-transfer fluid; Described lower liquid filled cavities is in the below of described COB chip module and communicates with described upper liquid filled cavities, and falling heat-transfer fluid and heat accumulating type phase change grains; Described radiator is located on the outer ring of described lower liquid filled cavities and is connected to the below of described reflector and COB chip module.The utility model is not only luminous good, and heat radiation is also good.
Description
Technical field
The utility model relates to a kind of large power white light LED, is specifically related to a kind of good large power white light LED that dispels the heat.
Background technology
Since Edison invented incandescent lamp in 1882, mankind's lighting source experienced by three phases: incandescent lamp, neon light, gaseous discharge lamp.As the real revolution of lighting technology, white light LEDs is described as forth generation lighting source.Compared to traditional lighting, its significant difference is, white light LEDs utilizes semi-conducting material that electric energy is converted into light, and light does not produce heat simultaneously, and has the feature such as long-life, energy-saving and environmental protection.
Body fluorescence conversion technology is still the mainstream technology manufacturing white light LEDs at present both at home and abroad.Traditional body fluorescence conversion technology is by applying yellow fluorescent powder on blue-light LED chip, and when fluorescent material sends sodium yellow after blue-light excited, blue light and yellow light mix form white light; This technology has that coated technique is simple, blue-light LED chip and yellow fluorescent powder preparation is comparatively ripe, YAG:Ce
3+the excitation spectrum of fluorescent material and the advantage such as InGaN or GaN blue chip luminescent spectrum comparatively mates manufacture white light LEDs method the most ripe at present.But also there are the following problems: 1, the fluorescent powder grain uniformity of disperseing in organic material is poor, so that affects the optical homogeneity of white light LED part; 2, there is comparatively serious light scattering in phosphor surface, has considerable influence to luminous efficiency; 3, mixing organic gel material thermal stability is not high, exists aging and degenerates; 4, the heat conduction of fluorescent coating, heat dispersion are poor, easily cause fluorescent material occurrence temperature cancellation, aging, cause luminous efficiency to reduce; 5, because being coated on chip surface time, coating layer thickness is difficult to control, and causes white light correlated colour temperature angular distribution uneven, causes producing the phenomenons such as yellow circle around ejecting white light light source.
White light LEDs is popularized in illumination still exists the lower key issue of luminous flux with application aspect, namely as lighting source, must send more light as far as possible, must have higher energy utilization efficiency.And single-chip power cannot meet lighting field to high brightness, high-power requirement, if realize great power LED with multiple blue-light LED chip applies yellow fluorescent powder, its above-mentioned 5 defects are just obvious all the more, differ greatly with the large power white light LED in ideal.
On the other hand, for realizing the luminous flux needed for general lighting, must seek high-power, high integrated white light LED technology, this sharply increases making the density of heat flow rate of LED.LED is temperature-sensitive element, if the heat that chip place produces can not shed in time, junction temperature will be caused to raise, affect its service behaviour, and then cause following series of problems: 1, luminous intensity reduces, and chip light emitting efficiency reduces rapidly along with the rising of junction temperature; 2, chip emission spectrum generation red shift, causes light conversion efficiency to decline; 3, life of product significantly shortens.Great power LED module is towards high integration, volume miniaturization, and its radiator structure and performance quality directly affect the optics of great power LED, thermal characteristic and reliability.
Summary of the invention
The technical problems to be solved in the utility model, is to provide a kind of good large power white light LED that dispels the heat, and can not only realize luminous good large power white light LED, also have good heat dispersion.
The technical problems to be solved in the utility model is achieved in that a kind of good large power white light LED that dispels the heat, and it is characterized in that: comprise COB chip module, transparent ceramic fluorescence cover plate, reflector, upper liquid filled cavities, lower liquid filled cavities and radiator;
Described COB chip module is the heat-radiating substrate being packaged with many blue-light LED chips; Described COB chip module is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate is positioned at above COB chip module and is also fixed on reflector by sealing viscose glue; And this transparent ceramic fluorescence cover plate cover plate that to be the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtained; Described upper liquid filled cavities to be between described transparent ceramic fluorescence cover plate and COB chip module and falling heat-transfer fluid; Described lower liquid filled cavities is in the below of described COB chip module and communicates with described upper liquid filled cavities, and falling heat-transfer fluid and heat accumulating type phase change grains, the bottom of described lower liquid filled cavities is provided with a liquid injection port, and liquid injection port is provided with sealing plug; Described radiator is located on the outer ring of described lower liquid filled cavities and is connected to the below of described reflector and COB chip module.
Further, described heat accumulating type phase change grains phase transition temperature is 30 ~ 35 DEG C, and interspersing among in bag-type container with holes, described COB chip module 1 centre position offers the liquid pass hole being communicated with described upper liquid filled cavities and lower liquid filled cavities, and described bag-type container size is greater than the aperture of this liquid pass hole.
Further, described heat-conducting fluid is water white transparency fluid, and its refractive index is between 1.4 ~ 1.7.
Further, described heat-radiating substrate is aluminium sheet, copper coin or ceramic wafer; And bonding by heat conduction viscose glue between described radiator with described reflector, and for welding between the heat-radiating substrate of COB chip module.
Further, the end face radius of described transparent ceramic fluorescence cover plate is less than bottom surface radius, and side is arcwall face, and thickness range is 0.5 ~ 2.5mm.
Further, the medial surface of described reflector comprises the face of cylinder being in hypomere and the bell mouth surface being positioned at epimere; Described COB chip module whole height outline is lower than the face of cylinder of reflector.
Further, the blue-light LED chip in described COB chip module is according to circular ring type array arrangement, and the spacing between adjacent two blue-light LED chips is 3.0-5.0mm; And blue-light LED chip is fixed on heat-radiating substrate by crystal-bonding adhesive or eutectic welding manner bonding, and be electrically connected with external electrode.
The utility model tool has the following advantages:
(1) high power, the small size of integrated optical source module can be realized, be applicable to manufacture low-cost high-efficiency large power white light LED;
(2) by the adjustment of exterior angle in two gradient reflector, transparent ceramic fluorescence coverslip thickness or Effective Doping concentration, not only can increase effective output of light, the edge chromatic effects such as the Huang Bian even eliminating packaged light source appearance can also be slowed down, to realize good illumination effect;
(3) by the introducing of heat accumulating type phase change grains in heat-conducting fluid, bottom liquid filled cavities in liquid filled cavities, heat transfer and the heat storage capacity of fluid has been taken into account; By the dredging fast of heat between high thermal conductive substrate, heat-conducting fluid and radiator, heat exchange and heat radiation, the chip that has been coupled well, each level heat management between encapsulation and radiator, can realize the good heat radiating of High Density Integration light source.
Accompanying drawing explanation
The utility model is further described with reference to the accompanying drawings in conjunction with the embodiments.
Fig. 1 is the structural representation of the utility model large power white light LED embodiment;
Fig. 2 is the structural representation of the COB chip module of the utility model embodiment;
Fig. 3 is the structural representation of the transparent ceramic fluorescence cover plate of the utility model embodiment;
Fig. 4 is the section structure schematic diagram of the utility model reflector;
Fig. 5 is the section structure schematic diagram of the utility model bag-type container with holes;
Fig. 6 is the finished product spectrogram of the utility model embodiment.
Embodiment
As shown in Figures 1 to 5, the large power white light LED that heat radiation of the present utility model is good, comprises COB chip module 1, transparent ceramic fluorescence cover plate 2, reflector 4, upper liquid filled cavities 31, lower liquid filled cavities 32 and radiator 6.
As depicted in figs. 1 and 2, described COB chip module 1 is the heat-radiating substrate 12 being packaged with many blue-light LED chips 11; Wherein, blue-light LED chip 11 of the present utility model can reach more than 100, can realize real high-power; Described COB chip module 1 is positioned at the bottom of reflector 4, and centre offers a liquid pass hole 14; The both positive and negative polarity 13 of described COB chip module 1 is electrically connected with external positive and negative electrode respectively.In a preferred embodiment, on described COB chip module 1, the blue-light LED chip 11 of encapsulation presses array structure arrangement, as circular array arrangement, and is connected by series, parallel or series-parallel connection; And the spacing of adjacent blue-light LED chip 11 is 3.0 ~ 5.0mm.Heat-radiating substrate 12 in described COB chip module 1 is square, oval or circular.
As shown in figures 1 and 3, described transparent ceramic fluorescence cover plate 2 is positioned at above COB chip module 1 and is also fixed on reflector 4 by sealing viscose glue 5; Described transparent ceramic fluorescence cover plate 2 is the obtained cover plate of the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material, and thickness range is 0.5 ~ 2.5mm.End face 21 radius of described transparent ceramic fluorescence cover plate 2 is less than bottom surface 22 radius, and side 23 is arcwall face, and the congregational rate of light can be made so better.
As shown in Figure 1 and Figure 4, the medial surface of described reflector 4 comprises the face of cylinder 41 being in hypomere and the bell mouth surface 42 being positioned at epimere, make the longitudinal section of formation reflector 4 form two gradient shape, and its interior angle A1 is 90 °, and exterior angle A2 is no more than the oblique angle of 90 °; Described COB chip module 1 whole height outline is lower than the face of cylinder 41.Reflector 4 is two gradient shapes, not only can increase effective output of light, can also slow down the edge chromatic effects such as the Huang Bian even eliminating packaged light source appearance, to eliminate bright dipping time space aberration.
Again as shown in Figure 1, described upper liquid filled cavities 31 to be between described transparent ceramic fluorescence cover plate 2 and COB chip module 1 and falling heat-transfer fluid B; Described heat-conducting fluid B is water white transparency fluid, and its refractive index is between 1.4 ~ 1.7.
As shown in Figure 1 and Figure 5, described lower liquid filled cavities 32 is in the below of described COB chip module 1 and communicates with described upper liquid filled cavities 31, and falling heat-transfer fluid B and heat accumulating type phase change grains C, the bottom of described lower liquid filled cavities 32 is provided with a liquid injection port 322, and liquid injection port 322 is provided with sealing plug 324; Described heat accumulating type phase change grains C phase transition temperature is 30 ~ 35 DEG C, and intersperses among in the bag-type container 8 of with holes 82, and described bag-type container 8 size is greater than the aperture of this liquid pass hole 14.
Described radiator 6 is located on the outer ring of described lower liquid filled cavities 32 and is connected to the below of described reflector 4 and COB chip module 1.The heat-radiating substrate 12 of described COB chip module 1 is aluminium sheet, copper coin or ceramic wafer; And bonding by heat conduction viscose glue 7 between described radiator 6 with described reflector 4, and for welding between the heat-radiating substrate 12 of COB chip module 1, as welded or laser welding by eutectic.
Blue-light LED chip 11 in described COB chip module 1 is according to circular ring type array or other array arrangement, and the spacing between adjacent two blue-light LED chips 11 is 3.0-5.0mm; And blue-light LED chip 11 is fixed on heat-radiating substrate 12 by crystal-bonding adhesive or eutectic welding manner bonding, its electrode 13 is electrically connected with external electrode.
As shown in Figure 6, the Exemplary parameter values table of a kind of good large power white light LED that dispels the heat of the present utility model is as shown in the table:
| Parameter name | Exemplary parameter values | Parameter name | Exemplary parameter values |
| Dominant wavelength (nm) | 556.4 | Luminous flux (Φ v/lm) | 7836.047 |
| Peak wavelength (nm) | 449.0 | Optical efficiency (lm/W) | 121.621 |
| Color rendering index (Ra) | 64.4 | Forward voltage (Vf/V) | 30.69 |
| Bandwidth (nm) | 21.3 | Forward current (If/mA) | 2099.400 |
| Colour temperature Tc(K) | 5384 | Leakage current (uA) | 0.0 |
| Colorimetric purity | 0.212 | Spectral energy (%) | 63 |
| Chromaticity coordinate (x, y) | 0.3363,0.4004 | The time of integration (mS) | 5 |
| Chromaticity coordinate (u, v) | 0.1886,0.3368 | Luminous power | 24459.35 |
Dispel the heat in the spectral distribution curve figure of good large power white light LED as can be seen from of the present utility model a kind of in Fig. 6: made large power white light LED achieves high light flux and specular removal, and its light efficiency value is greater than 120lm/W, and luminous flux is greater than 7800lm.
Although the foregoing describe embodiment of the present utility model; but be familiar with those skilled in the art to be to be understood that; specific embodiment described by us is illustrative; instead of for the restriction to scope of the present utility model; those of ordinary skill in the art, in the modification of the equivalence done according to spirit of the present utility model and change, should be encompassed in scope that claim of the present utility model protects.
Claims (7)
1. the large power white light LED that heat radiation is good, is characterized in that: comprise COB chip module, transparent ceramic fluorescence cover plate, reflector, upper liquid filled cavities, lower liquid filled cavities and radiator; Described COB chip module is the heat-radiating substrate being packaged with many blue-light LED chips, and is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate is positioned at above COB chip module and is also fixed on reflector by sealing viscose glue; And this transparent ceramic fluorescence cover plate cover plate that to be the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtained; Described upper liquid filled cavities to be between described transparent ceramic fluorescence cover plate and COB chip module and falling heat-transfer fluid; Described lower liquid filled cavities is in the below of described COB chip module and communicates with described upper liquid filled cavities, and falling heat-transfer fluid and heat accumulating type phase change grains, the bottom of described lower liquid filled cavities is provided with a liquid injection port, and liquid injection port is provided with sealing plug; Described radiator is located on the outer ring of described lower liquid filled cavities and is connected to the below of described reflector and COB chip module.
2. a kind of good large power white light LED that dispels the heat according to claim 1, it is characterized in that: described heat accumulating type phase change grains phase transition temperature is 30 ~ 35 DEG C, and intersperse among in bag-type container with holes, described COB chip module centre position offers the liquid pass hole being communicated with described upper liquid filled cavities and lower liquid filled cavities, and described bag-type container size is greater than the aperture of this liquid pass hole.
3. a kind of good large power white light LED that dispels the heat according to claim 1, is characterized in that: described heat-conducting fluid is water white transparency fluid, and its refractive index is between 1.4 ~ 1.7.
4. a kind of good large power white light LED that dispels the heat according to claim 1, is characterized in that: described heat-radiating substrate is aluminium sheet, copper coin or ceramic wafer; And bonding by heat conduction viscose glue between described radiator with described reflector, and for welding between the heat-radiating substrate of COB chip module.
5. a kind of good large power white light LED that dispels the heat according to claim 1, is characterized in that: the end face radius of described transparent ceramic fluorescence cover plate is less than bottom surface radius, and side is arcwall face, and thickness range is 0.5 ~ 2.5mm.
6. a kind of good large power white light LED that dispels the heat according to claim 1, is characterized in that: the medial surface of described reflector comprises the face of cylinder being in hypomere and the bell mouth surface being positioned at epimere; Described COB chip module whole height outline is lower than the face of cylinder of reflector.
7. a kind of good large power white light LED that dispels the heat according to claim 1, is characterized in that: the blue-light LED chip in described COB chip module is according to circular ring type array arrangement, and the spacing between adjacent two blue-light LED chips is 3.0-5.0mm; And blue-light LED chip is fixed on heat-radiating substrate by crystal-bonding adhesive or eutectic welding manner bonding, and be electrically connected with external electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420793110.3U CN204497262U (en) | 2014-12-16 | 2014-12-16 | A kind of good large power white light LED that dispels the heat |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420793110.3U CN204497262U (en) | 2014-12-16 | 2014-12-16 | A kind of good large power white light LED that dispels the heat |
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| CN204497262U true CN204497262U (en) | 2015-07-22 |
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| CN201420793110.3U Withdrawn - After Issue CN204497262U (en) | 2014-12-16 | 2014-12-16 | A kind of good large power white light LED that dispels the heat |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505456A (en) * | 2014-12-16 | 2015-04-08 | 福建中科芯源光电科技有限公司 | High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof |
| WO2017197794A1 (en) * | 2016-05-18 | 2017-11-23 | 中国人民大学 | Laser white light emitting apparatus for lighting or display |
-
2014
- 2014-12-16 CN CN201420793110.3U patent/CN204497262U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505456A (en) * | 2014-12-16 | 2015-04-08 | 福建中科芯源光电科技有限公司 | High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof |
| CN104505456B (en) * | 2014-12-16 | 2017-06-16 | 福建中科芯源光电科技有限公司 | A kind of large power white light LED for radiating good and its manufacture method |
| WO2017197794A1 (en) * | 2016-05-18 | 2017-11-23 | 中国人民大学 | Laser white light emitting apparatus for lighting or display |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150722 Effective date of abandoning: 20170616 |