CN213845314U - Solar-like spectrum packaging structure - Google Patents
Solar-like spectrum packaging structure Download PDFInfo
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- CN213845314U CN213845314U CN202022184797.9U CN202022184797U CN213845314U CN 213845314 U CN213845314 U CN 213845314U CN 202022184797 U CN202022184797 U CN 202022184797U CN 213845314 U CN213845314 U CN 213845314U
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Abstract
The utility model relates to a kind of solar spectrum packaging structure, its characterized in that includes: the substrate is used for bearing or connecting the luminous body; the luminous body comprises at least one blue light chip and at least one CSP chip, wherein the CSP chip comprises a purple light chip and a blue fluorescent powder layer at least coated on the top surface of the purple light chip; and the fluorescent powder packaging layer wholly or partially packages the luminous body on the surface of the substrate. The utility model has the advantages that: photon energy of the short wavelength chip is fully utilized, excitation efficiency of the blue fluorescent powder is improved, and insufficient excitation of the blue fluorescent powder caused by scattered excitation of various colors of fluorescent powder is avoided. The broadening of the fluorescence band spectrum is improved, thereby further improving the color rendering index.
Description
Technical Field
The utility model relates to an encapsulation structure, in particular to kind solar spectrum encapsulation structure.
Background
For LED luminescence, only 30-40% of input electric energy is converted into optical energy, and the rest 60-70% of energy is converted into thermal energy mainly in the form of lattice vibration generated by non-radiative recombination, by integrating current injection efficiency, radiant luminescence quantum efficiency, wafer external light extraction efficiency and the like. The increase in wafer temperature increases non-radiative recombination, further reducing the luminous efficiency.
The main problems existing in the prior art are as follows:
the chip is connected on the substrate through solder paste, die bond, silver adhesive and the like, the mixed fluorescent powder is generally sprayed on the periphery of the upper surface of the chip, the problem of secondary absorption exists for the mixed fluorescent powder, the optimal excitation wavelengths of different fluorescent powders are different, the optimal excitation wavelength of each fluorescent powder cannot be considered when the mixed fluorescent powder is excited by adopting light with single wavelength, and therefore the excitation efficiency of certain fluorescent powder is lower. Therefore, the mixed fluorescent powder is adopted, although the color rendering index is improved, the energy loss is large, and the luminous efficiency is low. The secondary absorption has a great influence on the color rendering property and the luminous efficiency, and the solar-like spectrum or the full spectrum in the true sense cannot be realized.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a class solar spectrum packaging structure that luminous efficiency is high, the spectrum is closer to the sunlight.
In order to solve the technical problem, the utility model adopts the technical scheme that: the solar-like spectrum packaging structure is characterized by comprising the following components:
the substrate is used for bearing or connecting the luminous body;
the luminous body comprises at least one blue light chip and at least one CSP chip, wherein the CSP chip comprises a purple light chip and a blue fluorescent powder layer at least coated on the top surface of the purple light chip;
a fluorescent powder packaging layer, wherein the fluorescent powder packaging layer wholly or partially packages the luminous body on the surface of the substrate,
the distance between the upper surface of the blue chip and the substrate is defined as H1, the distance between the topmost end of the blue fluorescent powder layer of the CSP chip and the substrate is defined as H2, the distance between the upper surface of the fluorescent powder packaging layer and the substrate is defined as H3,
the H1, H2, H3 necessarily satisfy the following relationships:
(1)H2-H1≥0.15mm；
(2)0.3mm≥H3-H2≥-0.07mm。
preferably, a certain horizontal plane in the height direction in the phosphor packaging layer is defined as a concentration boundary, the proportion of the phosphor powder amount not higher than the concentration boundary in the phosphor packaging layer to the total phosphor powder amount in the phosphor packaging layer is 70-80%, and the proportion of the phosphor powder amount higher than the concentration boundary in the phosphor packaging layer to the total phosphor powder amount in the phosphor packaging layer is 30-20%; the concentration boundary is not higher than the topmost end of the blue fluorescent powder layer of the CSP chip and is not lower than the upper surface of the blue chip.
Preferably, the upper surface of the fluorescent powder packaging layer is higher than the topmost end of the blue fluorescent powder layer of the CSP chip, and the thickness of the fluorescent powder packaging layer is more than or equal to 0.3mm H3-H2.
Preferably, the upper surface of the phosphor packaging layer is flush with the topmost end of the blue phosphor layer of the CSP chip.
Preferably, the upper surface of the fluorescent powder packaging layer is lower than the topmost end of the blue fluorescent powder layer of the CSP chip, and the thickness of the fluorescent powder packaging layer is more than or equal to 0mm and more than or equal to H3-H2 and more than or equal to-0.07 mm.
Preferably, the fluorescent powder in the fluorescent powder packaging layer is one or more of green fluorescent powder, yellow fluorescent powder and red fluorescent powder, and the peak wavelength range of the fluorescent powder is 505-900 nm.
Preferably, the top of the blue fluorescent powder layer coated on the top surface of the ultraviolet chip in the CSP chip is cone-shaped, truncated pyramid-shaped or hemispherical.
The utility model has the advantages that:
(1) the utility model discloses class solar spectrum encapsulation adopts the excitation wavelength that different phosphor powders can be taken into account to the chip excitation of a plurality of different wavelengths, can excite short wavelength phosphor powder in order to realize short wavelength chip, and long wavelength chip excites long wavelength phosphor powder, and the photon energy of make full use of short wavelength chip improves blue phosphor powder's excitation efficiency, and simultaneously, because the light efficiency of short wavelength chip is lower, avoids the dispersion to arouse all kinds of phosphor powder, causes the excitation of blue phosphor powder not enough.
(2) The utility model discloses class solar spectrum encapsulation subsides most phosphor powder around below the top surface of CSP packaging body, can fully avoid because the blue light that purple light arouses blue phosphor powder to send is good at the secondary excitation that the phosphor powder of blue light formed to other emission wavelength, has compensatied near the disappearance of 470 ~ 500nm spectrum in the conventional excitation scheme effectively, has increased the rhythm control light relevant with the health for the fluorescence band spectrum more is close to the sunlight, thereby realizes healthy illumination.
Drawings
Fig. 1 is a schematic view of a solar spectrum-like package structure of the present invention.
Fig. 2 is a schematic structural diagram of a solar-like spectrum package according to a first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a second embodiment of the solar-like spectrum package of the present invention.
Fig. 4 is a schematic structural diagram of a third embodiment of the solar-like spectrum package of the present invention.
Fig. 5 is a schematic structural diagram of a solar-like spectrum package according to a fourth embodiment of the present invention.
Fig. 6 is another schematic structural diagram of a solar-like spectrum package according to a fourth embodiment of the present invention.
FIG. 7 is a diagram of a solar-like package according to an embodiment of the present invention and a conventional package structure.
Fig. 8 is a spectrum diagram of a second embodiment of the solar-like spectrum package of the present invention.
Fig. 9 is a spectrum diagram of a third embodiment of the solar-like spectrum package of the present invention.
Fig. 10 is a spectrum diagram of a solar-like spectrum package according to a fourth embodiment of the present invention.
Detailed Description
As shown in fig. 1, the solar spectrum-like package structure of the present invention includes:
the substrate 1 is used for bearing or connecting a luminous body;
the luminous body comprises at least one blue light chip 2 and at least one CSP chip, wherein the CSP chip comprises a purple light chip 3 and a blue fluorescent powder layer 4 at least coated on the top surface of the purple light chip;
a phosphor encapsulating layer 5, wherein the phosphor encapsulating layer encapsulates the light emitting body on the surface of the substrate wholly or partially, the distance between the upper surface of the blue chip and the substrate is defined as H1, the distance between the topmost end of the blue phosphor layer of the CSP chip and the substrate is defined as H2, the distance between the upper surface of the phosphor encapsulating layer and the substrate is defined as H3,
h1, H2, H3 necessarily satisfy the following relationships:
(1)H2-H1≥0.15mm；
(2)0.3mm≥H3-H2≥-0.07mm；
defining a certain horizontal plane in the height direction in the phosphor packaging layer 5 as a concentration boundary line X, wherein the proportion of the phosphor amount not higher than the concentration boundary line X in the phosphor packaging layer 5 to the total phosphor amount in the phosphor packaging layer 5 is 70-80%, and the proportion of the phosphor amount higher than the concentration boundary line X in the phosphor packaging layer 5 to the total phosphor amount in the phosphor packaging layer 5 is 30-20%; the concentration boundary line X is not higher than the topmost end of the blue fluorescent powder layer 4 of the CSP chip and is not lower than the upper surface of the blue chip 2.
Preferably, the fluorescent powder in the fluorescent powder packaging layer is one or more of green fluorescent powder, yellow fluorescent powder and red fluorescent powder, and the peak wavelength range of the fluorescent powder is 505-900 nm.
In addition, the top of the blue fluorescent powder layer 4 coated on the top surface of the purple light chip 3 in the CSP chip is conical, truncated cone-shaped, truncated pyramid-shaped or hemispherical, and the structure is favorable for better sedimentation of part of fluorescent powder in the fluorescent powder packaging layer around the blue fluorescent powder layer 4.
The utility model discloses in make above-mentioned class solar spectrum packaging structure's method mainly includes following step:
s1: firstly, manufacturing a luminous body comprising at least one blue light chip 2 and at least one CSP chip, and then fixing the blue light chip 2 and the CSP chip on a substrate 1;
s2: and then packaging, and packaging the luminous body on the surface of the substrate 1 through the fluorescent powder packaging layer 5 to form a solar spectrum-like packaging structure.
In the manufacturing process of the phosphor encapsulating layer 5, any one or more of spraying, dispensing and molding can be performed in a mixed manner.
Example one
In this embodiment, the encapsulation of the phosphor encapsulation layer in step S2 is performed by combining molding and natural sedimentation.
In this embodiment, referring to fig. 2, the upper surface of the phosphor encapsulation layer is higher than the topmost end of the blue phosphor layer of the CSP chip, and 0.3mm is greater than or equal to H3-H2. In this embodiment, the thickness is selected to be 0.27 to 0.3 mm.
In addition, in this embodiment, the CSP chip has a size of 1021, the emission wavelength of the violet chip 3 is 410nm, the peak wavelength of the blue phosphor layer 4 is 480nm, the emission wavelength of the blue chip 2 is 445nm, and the phosphor encapsulation layer 5 uses red phosphor with a peak wavelength of 890-900 nm.
Firstly, placing a colloid containing fluorescent powder in a lower die of a die pressing die, inversely installing a substrate on an upper die of the die pressing die, and enabling the tops of a blue light chip and a CSP chip to face downwards to the die pressing die; then, carrying out die assembly to enable the blue light chip and the CSP chip to be immersed in the colloid; then the mould pressing mould is reversed to ensure that the upper mould of the mould pressing mould is arranged at the lower part and the lower mould is arranged at the upper part, the fluorescent powder is settled in the colloid in a natural settling mode,
and then curing the colloid to form the fluorescent powder packaging layer. By controlling the settling time and the curing speed, the concentration boundary X is not higher than the topmost end of the blue fluorescent powder layer 4 of the CSP chip and is not lower than the upper surface of the blue chip 2;
the spectrogram of the novel sunlight-like packaging structure obtained by the method in the first embodiment and the traditional packaging structure is shown in fig. 7, and as can be seen from fig. 7, the packaging method in the present embodiment can effectively make up and improve the problem of the absence or low intensity of the spectrum near 475nm in the traditional blue light excitation scheme (dot-dash line), increase the intensity of the spectrum of 500nm or above, and widen the spectrum of the light source, thereby further improving the color saturation.
Example two
In this embodiment, the phosphor encapsulation layer is encapsulated and manufactured in step S2 by combining the first dispensing/spraying with the second molding with different concentrations.
In this embodiment, referring to fig. 3, the upper surface of the phosphor encapsulation layer is higher than the topmost end of the blue phosphor layer of the CSP chip, and 0.3mm is greater than or equal to H3-H2. In this embodiment, the thickness is selected to be 0.27 to 0.3 mm.
In addition, in this embodiment, the CSP chip has a size of 1021, the emission wavelength of the violet chip 3 is 410nm, the peak wavelength of the blue phosphor layer 4 is 480nm, the emission wavelength of the blue chip 2 is 445nm, and the phosphor encapsulation layer 5 uses red phosphor with a peak wavelength of 600 to 630 nm.
Firstly, carrying out first spraying or dispensing packaging, and covering the whole or part of the colloid containing the fluorescent powder on the luminous body to form a lower layer 51 of a fluorescent powder packaging layer; for the convenience of the second packaging, a mold pressing mode is adopted, and the lower layer 51 of the fluorescent powder packaging layer cannot be lower than the uppermost end of the blue fluorescent powder layer of the CSP chip;
then, performing second molding packaging, placing the other colloid containing the fluorescent powder in a lower die of a molding die, inversely installing the substrate on an upper die of the molding die, and enabling the tops of the blue light chip and the CSP chip which are subjected to the first spraying or dispensing to face downwards to the molding die; after die assembly, the blue light chip and the CSP chip are immersed in the colloid, and then the colloid is cured to complete secondary die pressing, so that an upper layer 52 of the fluorescent powder packaging layer is formed; and controlling the concentration of the fluorescent powder in the colloid during the second mould pressing to be smaller than the concentration of the fluorescent powder in the colloid during the first spraying or dispensing.
And the thickness of the first packaging and the second packaging is controlled in a combined manner, so that the concentration boundary line X is not higher than the topmost end of the blue fluorescent powder layer 4 of the CSP chip and is not lower than the upper surface of the blue chip 2.
As shown in fig. 8, the spectrum test data of this embodiment can find that: by adopting the packaging mode of the embodiment, the problem of spectrum loss or low intensity near 475nm in the traditional blue light excitation scheme can be effectively solved, the intensity of the spectrum of 500nm or above is increased, and meanwhile, the spectrum of the light source is widened, so that the color saturation is further improved.
EXAMPLE III
In this embodiment, the phosphor encapsulation layer is encapsulated and manufactured in step S2 by a combination of spraying/dispensing and natural sedimentation.
In this embodiment, as shown in fig. 4, the upper surface of the phosphor encapsulation layer 5 is flush with the topmost end of the blue phosphor layer 4 of the CSP chip.
In addition, in the embodiment, the CSP chip has a size of 1021, the emission wavelength of the violet chip 3 is 410nm, the peak wavelength of the blue phosphor layer 4 is 480nm, the emission wavelength of the blue chip 2 is 445nm, and the phosphor encapsulation layer 5 uses yellow-green phosphor with a peak wavelength of 505 to 530 nm.
Firstly, the colloid containing the fluorescent powder wholly or partially covers the luminous body in a spraying and dispensing way, and then the fluorescent powder is settled in the colloid in a natural settling way;
by controlling the settling time, the concentration boundary X is not higher than the topmost end of the blue fluorescent powder layer 4 of the CSP chip and is not lower than the upper surface of the blue chip 2; and finally, curing the colloid to form the fluorescent powder packaging layer.
When the fluorescent powder packaging layer 5 and the upper surface of the blue fluorescent powder layer 4 of the CSP chip need to be level, the fluorescent powder packaging layer can be controlled by normal dispensing and spraying processes, and can also be slightly higher than the blue fluorescent powder layer of the CSP chip, and then the fluorescent powder packaging layer 5 is solidified and then polished.
As shown in fig. 9, the spectrum test data of this embodiment can find that: by adopting the packaging mode of the embodiment, the problem of spectrum loss or low intensity near 475nm in the traditional blue light excitation scheme can be effectively solved, the intensity of the spectrum of 500nm or above is increased, and meanwhile, the spectrum of the light source is widened, so that the color saturation is further improved.
Practice four
In this embodiment, the encapsulation of the phosphor encapsulation layer in step S2 is performed by using different secondary spraying/dispensing concentrations.
In this embodiment, as shown in fig. 5, the upper surface of the phosphor encapsulation layer is lower than the topmost end of the blue phosphor layer of the CSP chip, and 0mm is greater than or equal to H3-H2 is greater than or equal to-0.07 mm.
In addition, in the embodiment, the CSP chip has a size of 1021, the emission wavelength of the violet chip 3 is 410nm, the peak wavelength of the phosphor of the blue phosphor layer 4 is 480nm, the emission wavelength of the blue chip 2 is 445nm, and the phosphor encapsulation layer 5 uses a yellow-green phosphor having a peak wavelength of 505 to 530nm and a red phosphor having a peak wavelength of 720 to 750nm, wherein the total powder content of the yellow-green phosphor accounts for 50% of the total powder content.
Firstly, carrying out first spraying and dispensing packaging, covering the whole or part of the colloid containing the fluorescent powder on the luminous body, and carrying out semi-curing; then, carrying out secondary spraying and dispensing packaging, covering the colloid containing the fluorescent powder on the luminous body wholly or partially, wherein the concentration of the fluorescent powder in the colloid during the secondary spraying or dispensing is less than that during the primary spraying or dispensing;
by combining the thicknesses of the first spraying and the second spraying, the concentration boundary X is not higher than the topmost end of the blue fluorescent powder layer 4 of the CSP chip and is not lower than the upper surface of the blue chip 2; and finally, curing the colloid to form the fluorescent powder packaging layer.
As shown in fig. 10, the spectrum test data of this embodiment can find that: by adopting the packaging mode of the embodiment, the problem of spectrum loss or low intensity near 475nm in the traditional blue light excitation scheme can be effectively solved, the intensity of the spectrum of 500nm or above is increased, and meanwhile, the spectrum of the light source is widened, so that the color saturation is further improved.
As a more preferable embodiment of this example, as shown in fig. 6, the top of the blue phosphor layer 4 of the CSP chip, which covers the top surface of the violet chip 3, is truncated cone-shaped, so that when the second spraying is performed, part of the phosphor in the phosphor encapsulation layer around the truncated cone-shaped blue phosphor layer 4 is better settled.
The basic principles and main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A solar-like spectrum encapsulation structure, comprising:
the substrate is used for bearing or connecting the luminous body;
the luminous body comprises at least one blue light chip and at least one CSP chip, wherein the CSP chip comprises a purple light chip and a blue fluorescent powder layer at least coated on the top surface of the purple light chip;
a fluorescent powder packaging layer, wherein the fluorescent powder packaging layer wholly or partially packages the luminous body on the surface of the substrate,
the distance between the upper surface of the blue chip and the substrate is defined as H1, the distance between the topmost end of the blue fluorescent powder layer of the CSP chip and the substrate is defined as H2, the distance between the upper surface of the fluorescent powder packaging layer and the substrate is defined as H3,
the H1, H2, H3 necessarily satisfy the following relationships:
(1)H2-H1≥0.15mm；
(2)0.3mm≥H3-H2≥-0.07mm。
2. the solar-like spectrum encapsulation structure of claim 1, wherein: the upper surface of the fluorescent powder packaging layer is higher than the topmost end of the blue fluorescent powder layer of the CSP chip, and the thickness of the fluorescent powder packaging layer is more than or equal to H3-H2 by 0.3 mm.
3. The solar-like spectrum encapsulation structure of claim 1, wherein: the upper surface of the fluorescent powder packaging layer is flush with the topmost end of the blue fluorescent powder layer of the CSP chip.
4. The solar-like spectrum encapsulation structure of claim 1, wherein: the upper surface of the fluorescent powder packaging layer is lower than the topmost end of the blue fluorescent powder layer of the CSP chip, and the thickness of the fluorescent powder packaging layer is more than or equal to 0mm and more than or equal to H3-H2 and more than or equal to-0.07 mm.
5. The solar-like spectrum encapsulation structure according to any one of claims 1 to 4, wherein: the top of the blue fluorescent powder layer coated on the top surface of the ultraviolet chip in the CSP chip is in a cone shape, a truncated pyramid shape or a hemisphere shape.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010064142X | 2020-01-20 | ||
| CN202010064142 | 2020-01-20 | ||
| CN202020391101 | 2020-03-25 | ||
| CN2020203911017 | 2020-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213845314U true CN213845314U (en) | 2021-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022184797.9U Active CN213845314U (en) | 2020-01-20 | 2020-09-29 | Solar-like spectrum packaging structure |
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| CN (1) | CN213845314U (en) |
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- 2020-09-29 CN CN202022184797.9U patent/CN213845314U/en active Active
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