CN210535664U - High-color rendering index and high-light efficiency packaging body - Google Patents

Abstract

The utility model relates to a high-color rendering index and high-light efficiency packaging body, which comprises a supporting piece, wherein a first LED chip and a second LED chip are arranged on the supporting piece; a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A; and a short-wavelength fluorescent powder colloid layer without red fluorescent powder is arranged outside the first LED chip and the packaging body A to form an integral packaging body. The utility model has the advantages that: the utility model discloses high apparent high light efficiency packaging body that indicates adopts the chip excitation of a plurality of different wavelengths to take into account the excitation wavelength of different phosphor powders.

Description

High-color rendering index and high-light efficiency packaging body

Technical Field

The invention belongs to the field of semiconductor photoelectron and optics, and particularly relates to a high-color rendering high-light efficiency packaging body.

Background

The current white light LED generally has several forms, as shown in curve (1) of fig. 1, and uses blue light to excite a single yellow phosphor. In this case, the luminous efficacy is generally high, but the display index is only about 70, and the display index is not suitable for low color temperature application. When the application of medium and low color temperature is needed, red fluorescent powder is generally added. If the color rendering index is further increased to 80 or more, the red and green phosphors are added simultaneously. As shown in the curve (2) of FIG. 1, the color rendering index of the red phosphor and the green phosphor can reach 80. However, as can be seen from the curve (2) in FIG. 1, in the full spectrum application, the blue and cyan portions of the spectrum between 460 and 510nm are still missing, so that in the full spectrum application, it is often necessary to add the cyan phosphor with the peak wavelength between 470 and 505 nm. For the conventional technical scheme for realizing full spectrum, the blue light chip is basically adopted to excite the mixed fluorescent powder, but the color rendering index and the light effect brought by the blue light chip can not meet the requirements of high light effect and high color rendering index. In order to further improve the color rendering index and the luminous efficiency of the light source, several schemes have been proposed in the industry, such as: the purple light chip is adopted to excite the fluorescent powder, so that the spectrum defect caused by the excitation of the blue light chip can be compensated to a certain extent.

The Sunlike full spectrum light source provided by Seoul semiconductor combines Seoul semiconductor LED chip patent technology and Toshiba Materials TRI-R fluorescent powder technology to generate natural light spectrum. Sunlike full spectrum implementation technique: all the LED chips adopt purple light to excite the mixed fluorescent powder with various colors in the whole packaging layer. The specific implementation is shown in fig. 2. The scheme has the defects that all the mixed fluorescent powder is excited by adopting purple light, the excitation efficiency of the purple light is very low, the mixed fluorescent powder cannot be excited efficiently, and the waste of the purple light is caused. In addition, the scheme also has the problem that the blue light emitted by the blue fluorescent powder excited by the purple light excites the secondary excitation of other long-wavelength fluorescent powder again, so that the overall display quality is influenced, and the light efficiency and the color development of the light source cannot be further improved.

The full spectrum implementation mode of the signal photoelectric patent technology comprises the following steps: (patent No. 201810067979.2) adopts violet chip, two blue chips with different dominant wavelength ranges, and light conversion layer coated on the violet chip and the blue chips, and the light conversion layer is prepared by fluorescent powder and packaging glue. In other words, the adopted green powder with the emission wavelength of 490-505 nm, the adopted green powder with the emission wavelength of 520-540 nm, the adopted dark red powder with the emission wavelength of 640-660 nm and the packaging adhesive are mixed together to form the light conversion layer. The specific implementation is shown in fig. 3. Still adopt phosphor powder hybrid excitation in this scheme, the difference is, and part chip is purple light, and the part is the blue light, has improved full gloss register for easy reference's quality to a certain extent, but still has phosphor powder secondary excitation, arouses the problem of inefficiency. Adopt the higher blue light chip of quantum efficiency, promoted whole light efficiency, but can have the purple light by unnecessary extravagant in arousing the problem of 470 with a fee the phosphor powder except that 505 wavelengths, still have the blue light phosphor powder secondary to arouse long wavelength phosphor powder, whole problem of arousing inefficiency. And if different color temperatures are to be realized, the concentration of the red fluorescent powder in the packaging layer needs to be changed, especially under low color temperature, the whole packaging body is very turbid and has darker color due to the existence of the high-concentration red fluorescent powder, so that the overall light efficiency and the color rendering index of the light source are limited to a certain extent.

Combining the above schemes, there are several common problems as follows:

first, as can be seen from the spectra of the six phosphors in fig. 4-9, the optimal excitation wavelengths of the different phosphors are different, and the optimal excitation wavelength of each phosphor cannot be considered by using the light with a single wavelength to excite the mixed phosphor, so that the excitation efficiency of a certain phosphor is low. Therefore, the mixed fluorescent powder can improve the color rendering index, but has larger energy loss and lower luminous efficiency. For example, for cyan phosphor, since the emission wavelength is relatively close to the excitation wavelength, the excitation efficiency is very low, and blue light or violet light with shorter wavelength should be used for excitation. However, the blue light or the purple light with shorter wavelength is adopted to excite the mixed fluorescent powder, although the excitation efficiency of the cyan fluorescent powder can be improved, the photon energy consumption of short-wavelength photons is increased when the yellow fluorescent powder and the red fluorescent powder are excited.

Second, there is also a problem of secondary absorption for the mixed phosphor. It can be seen from the excitation spectra of 655 and 660nm phosphors in fig. 6 and 7 that there is still up to 40% relative absorption for the emission of 495nm phosphor, which not only reduces the cyan light component, but also causes secondary energy loss. Assuming that the quantum efficiencies of the cyan phosphor and the red phosphor are both 90%, the blue light excites the cyan phosphor, and further excites the red phosphor with a quantum efficiency of 81%, which is about 10% lower than that of the blue light directly exciting the red phosphor. Therefore, the secondary absorption has a great influence on both the color rendering property and the luminous efficiency.

Third, for the phosphor excited by blue light, one photon of blue light can only excite one photon of other color at most, and the energy difference between two photons is called Stocks shift. As can be seen from fig. 8 and 9, when the mixed phosphor is excited by a single short-wavelength blue light, the energy difference between the red light and the blue light is large, the photon energy loss is large, and the excess energy is absorbed by the lattice vibration, which not only wastes the photon energy, but also generates heat energy, and puts a high demand on the heat dissipation of the device.

Fourth, as can be seen from fig. 10, the same phosphor is excited by blue light with different wavelengths, and the emission wavelengths are different. The emission wavelength will shift relatively with the shift of the excitation wavelength. People are more and more concerned about health lighting at present, namely that the light-emitting spectrum is wider and the color rendering index is higher. Compared with multi-wavelength excitation, the single-wavelength excitation light has a narrow light emission spectrum and a low color rendering index, and cannot meet the requirement of a wide spectrum and a high color rendering index.

Disclosure of Invention

The invention aims to provide a high-color-rendering-index and high-light-efficiency packaging body which has a higher color rendering index and ensures the luminous efficiency.

In order to solve the technical problems, the technical scheme of the invention is as follows:

a high-color rendering index high-light efficiency package body is characterized in that: the LED chip mounting structure comprises a support member, wherein the support member is provided with a first LED chip and a second LED chip; a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A; the first LED chip and the packaging body A are integrally packaged in a first wavelength fluorescent powder colloid layer without red fluorescent powder; and L is₁＜L_{Red wine}，L₁Is the phosphor wavelength, L, in the phosphor colloidal layer of the first wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-460 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 0 and less than or equal to 160 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip adopts a forward-mounted chip structure.

The fluorescent powder in the first wavelength fluorescent powder colloid layer is one or more of green fluorescent powder, indigo fluorescent powder, cyan fluorescent powder, yellow fluorescent powder and blue fluorescent powder, and L is₁＝470～590nm。

The high-color rendering index and high-light efficiency packaging body comprises a supporting piece, wherein a first LED chip and a second LED chip are arranged on the supporting piece; a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A;

at least the top surface of the first LED chip is provided with a second wavelength fluorescent powder colloid layer without red fluorescent powder to form a packaging body B; the packaging body A and the packaging body B are integrally packaged in a third wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₂＜L₃＜L_{Red wine}，L₂Is the phosphor wavelength, L, in the phosphor colloidal layer of the second wavelength₃Is the phosphor wavelength, L, in the phosphor colloidal layer of the third wavelength_{Red wine}The wavelength of red phosphor;

the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 5 and less than or equal to 160 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip adopts a forward-mounted chip structure.

The fluorescent powder in the second wavelength fluorescent powder colloid layer is one or more of green fluorescent powder, indigo fluorescent powder, cyan fluorescent powder, yellow fluorescent powder and blue fluorescent powder, and L is₂＝470～590nm；

The fluorescent powder in the third wavelength fluorescent powder colloid layer is any one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₃＝510～590nm。

A high-color rendering index and high-light efficiency packaging body comprises a supporting piece, wherein a first LED chip, a third LED chip and a second LED chip are arranged on the supporting piece, and a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A;

a fifth wavelength phosphor colloid layer without containing red phosphor is arranged on at least the top surface of the third LED chip to form a packaging body C; a fourth wavelength fluorescent powder colloid layer without containing red fluorescent powder is arranged on at least the top surface of the first LED chip to form a packaging body D; the packaging body A, the packaging body C and the packaging body D are integrally packaged in a sixth wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₄＜L₅＜L₆＜L_{Red wine}，L₄Is the phosphor wavelength, L, in the fourth wavelength phosphor colloidal layer₅Is the phosphor wavelength, L, in the phosphor colloidal layer of the fifth wavelength₆Is the phosphor wavelength, L, in the phosphor colloidal layer of the sixth wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; λ B- λ C is more than or equal to 0 and less than or equal to 130nm, and λ C- λ A is more than or equal to 15 and less than or equal to 130 nm;

the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip and the third LED chip adopt a positive chip structure.

The fluorescent powder in the fourth wavelength fluorescent powder colloid layer is one or more of indigo fluorescent powder, cyan fluorescent powder and blue fluorescent powder, and L is₄＝470～510nm；

The phosphor in the phosphor colloid layer with the fifth wavelength is green phosphor, and L₅＝510～540nm；

The fluorescent powder in the sixth wavelength fluorescent powder colloid layer is any one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₆＝530～590nm；

The first LED chip is a purple LED chip with the wavelength of 390-430 nm, and the fluorescent powder in the fluorescent powder colloid layer with the fourth wavelength is blue fluorescent powder.

The LED packaging structure comprises a supporting piece, wherein a first LED chip, a third LED chip and a second LED chip are arranged on the supporting piece, and a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A;

a seventh wavelength fluorescent powder colloid layer without containing red fluorescent powder is arranged on at least the top surface of the first LED chip to form a packaging body E; the packaging body A, the third LED chip and the packaging body E are integrally packaged in an eighth wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₇＜L₈＜L_{Red wine}，L₇Is the phosphor wavelength, L, in the phosphor colloidal layer of the seventh wavelength₈Is the wavelength L of the phosphor in the phosphor colloid layer with the eighth wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; λ B- λ C is more than or equal to 0 and less than or equal to 130nm, and λ C- λ A is more than or equal to 15 and less than or equal to 130 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip and the third LED chip adopt a positive chip structure.

The fluorescent powder in the seventh wavelength fluorescent powder colloid layer is one or more of indigo fluorescent powder, cyan fluorescent powder and blue fluorescent powder, and L is₇＝470～510nm；

The fluorescent powder in the eighth wavelength fluorescent powder colloid layer is one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₈＝510～590nm；

The first LED chip is a purple LED chip with the wavelength of 390-430 nm, and the fluorescent powder in the fluorescent powder colloid layer with the seventh wavelength is blue fluorescent powder.

The invention has the advantages that:

(1) the high-color rendering index and high-light efficiency packaging body adopts a plurality of chips with different wavelengths to excite, and can take the excitation wavelengths of different fluorescent powders into consideration, so that the short-wavelength chips can excite the short-wavelength fluorescent powder, the long-wavelength chips excite the long-wavelength fluorescent powder, and the situation that the short-wavelength fluorescent powder generated by the short-wavelength fluorescent powder excites the long-wavelength fluorescent powder again to be absorbed can be avoided; the best excitation wavelength realizes the highest quantum efficiency and simultaneously improves the luminous efficiency of the light source.

(2) The high-color rendering index high-light efficiency packaging body adopts a packaging structure of a plurality of chips with different wavelengths, and is different from the conventional technology in that red fluorescent powder is packaged in the local area range of the top surface and the side surface of the chip, only few short-wavelength and medium-wavelength fluorescent light can irradiate the red fluorescent powder, and the problem of secondary absorption of the red fluorescent powder to cyan, blue and green fluorescent light can be effectively avoided. Especially, the excitation efficiency of the cyan fluorescence is low (see fig. 2), and the secondary loss of the cyan fluorescence can be effectively reduced, so that the light efficiency is improved, and the color rendering index is improved.

(3) According to the high-color rendering index and high-light efficiency packaging body, for the same fluorescent powder, when the wavelength of exciting light moves, the light-emitting wavelength of the same fluorescent powder can also move relatively to the corresponding wavelength direction; therefore, the long-wavelength chip adopted by the invention can excite the red fluorescent powder to obtain the red fluorescent light with longer wavelength, and the short-wavelength chip can excite the cyan, blue and green fluorescent powders to obtain the cyan, blue and green fluorescent lights with shorter wavelength, so that the fluorescence band spectrum is widened, and the color rendering index is further improved.

(4) The light source packaging structure can change the color temperature by changing the proportion of the blue-red chips in the light source. The color temperature of a light source is changed by increasing the amount of red and other fluorescent powder in an integral fluorescent powder layer in the conventional technology, so that the color of a light-emitting surface of COB (chip on Board) packaging is deep and turbid.

(5) The chip adopts the mode of combining the upright mounting structure, the vertical structure and the inverted mounting structure, the technical bias that the same type of chip structure is considered by technical personnel in the field to be favorable for reducing the production difficulty and the cost is changed, the advantages of mature process and low cost can be considered, the advantages of high excitation efficiency and excellent heat dissipation effect are achieved, and the using amount of the first LED chip can be reduced.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a graph of an emission spectrum of a conventional white LED.

Fig. 2 is a schematic diagram of the Sunlike full spectrum implementation principle.

Fig. 3 is a schematic diagram of a full spectrum implementation structure of the belief photo-electric patent technology.

FIG. 4 is a plot of excitation and emission spectra of 495 phosphor.

FIG. 5 is a 518 fluorescence excitation and emission spectrum.

FIG. 6 is a 530 plot of the excitation and emission spectra of the phosphors.

FIG. 7 is a 535 phosphor excitation and emission spectra.

FIG. 8 is a graph of 655 phosphor excitation and emission spectra.

FIG. 9 is a 660 phosphor excitation and emission spectrum.

Fig. 10 is a graph of excitation spectrum and emission spectrum of red phosphor excited by different excitation wavelengths.

FIG. 11 is a schematic view of a structure of the high-finger-rendering and high-light-efficiency package in accordance with embodiment 1.

FIG. 12 is a schematic view of another structure of the high-finger-rendering and high-light-efficiency package in accordance with embodiment 1.

FIG. 13 is a schematic diagram of a specific excitation mode of the light source in example 1.

FIG. 14 is a graph of comparative data from the spectroscopic tests of example 1.

FIG. 15 is a schematic view of a structure of the high-finger-rendering and high-light-efficiency package in accordance with embodiment 2.

FIG. 16 is a schematic view of another structure of the high-finger-rendering and high-light-efficiency package in accordance with embodiment 2.

FIG. 17 is a schematic diagram of a specific excitation mode of the light source in example 2.

FIG. 18 is a top view of the high-aspect and high-light efficiency package of example 2.

FIG. 19 is a graph of comparative data from the spectroscopic tests of example 2.

FIG. 20 is a schematic view of a structure of the high-finger-rendering and high-light-efficiency package in accordance with embodiment 3.

FIG. 21 is a top view of the high-aspect and high-light efficiency package of example 3.

FIG. 22 is a schematic diagram of a specific excitation mode of the light source in example 3.

FIG. 23 is a schematic view of a structure of the high-finger-rendering and high-light-efficiency package according to embodiment 4.

FIG. 24 is a schematic view of another structure of the high-finger-rendering and high-light-efficiency package according to embodiment 4.

FIG. 25 is a schematic diagram of a specific excitation pattern of the light source in example 4.

Detailed Description

The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the scope of the embodiments described herein.

Example 1

As shown in fig. 11, the high-color rendering index and high-light efficiency package of this embodiment includes a support 1 with a circuit, the support 1 is further provided with a first LED chip 2 and a second LED chip 3, and the first LED chip 2 and the second LED chip 3 are connected to the circuit through die bonding or eutectic bonding; a red fluorescent powder colloid layer 4 is arranged on at least the top surface of the second LED chip 3 to form a packaging body A; a first wavelength phosphor glue layer 5 without red phosphor is arranged outside the first LED chip 2 and the package a, so that the first LED chip 2 and the package a are integrally packaged in the first wavelength phosphor glue layer 5 without red phosphor to form an integral package. And L is₁＜L_{Red wine}，L₁Is the phosphor wavelength, L, in the phosphor colloidal layer of the first wavelength_{Red wine}The wavelength of the red phosphor.

The chip selection suggests that the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-460 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 0 and less than or equal to 160 nm.

For the fluorescent powder colloid, the fluorescent powder in the first wavelength fluorescent powder colloid layer is one or more of green fluorescent powder, indigo fluorescent powder, cyan fluorescent powder, yellow fluorescent powder and blue fluorescent powder, and L is₁Is 470-590 nm.

In addition, the number of the first LED chips 2 and the second LED chips 3 on the support 1 is not limited to one, and the number of the first LED chips 2 and the second LED chips 3 may be increased according to the actual light emission spectrum requirement, as shown in fig. 12.

Embodiment 1 of the present invention, a schematic diagram of a specific excitation mode of a light source is shown in fig. 13.

As a preferable scheme of the present embodiment:

taking the sample test series of the SMD packaged Heidike 4000K-90, i.e. the high-color rendering index and high-light efficiency package as an example, the test is carried out, the red fluorescent powder colloid layer 4 is arranged on the top surface and the side surface of the second LED chip 3, and the parameters of three batches of samples are respectively as follows:

the parameters of 4000K-90-1 of the Heidike are as follows:

the first LED chip 2 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 450 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, the phosphor in the first wavelength phosphor colloid layer 5 not containing red phosphor is green phosphor and yellow phosphor mixed phosphor, and the phosphor wavelength is 510 nm.

The parameters of the Heidike 4000K-90-2 are as follows:

the first LED chip 2 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 445 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, the phosphor in the first wavelength phosphor colloid layer 5 not containing red phosphor is green phosphor and yellow phosphor mixed phosphor, and the phosphor wavelength is 510 nm.

The parameters of 4000K-90-3 of the Heidike are as follows:

the first LED chip 2 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 440 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, the phosphor in the first wavelength phosphor colloid layer 5 not containing red phosphor is green phosphor and yellow phosphor mixed phosphor, and the phosphor wavelength is 510 nm.

The comparison data of the parameter test average values of the sample of the embodiment 1 of the invention and a certain type of sample sold in the market are as follows:

comparative data of spectral testing of example 1 of the invention reference is made to figure 14.

And (4) conclusion: the test result of the sample in the embodiment 1 shows that the light source in the embodiment 1 has higher luminous efficiency under the same light source area and the same color temperature; and on the basis that the wavelength of the second LED chip is not lower than that of the first LED chip, the luminous efficiency of the LED lamp can be further improved.

Those skilled in the art will note that: in the embodiment, the package with high color rendering index and high light efficiency takes SMD package as an example, and the first and second LED chips are flip chip structures; in practical application, however, the package is not limited to this package form, and COB package, CSP package, or filament strip package may be adopted according to actual needs. However, when a package form such as COB or filament is used, it is preferable that: the first LED chip is of a flip chip or vertical chip structure, and the second LED chip is of a forward chip structure.

In addition, in the embodiment, the bracket 1 with the circuit is used as a support, which may also be a substrate with a circuit or an adhesive film without a circuit, and will not be described herein again.

Example 2

As shown in fig. 15, the high-color rendering index and high-light efficiency package of this embodiment includes a supporting member 1, the supporting member 1 is a substrate with a circuit, a first LED chip 2 and a second LED chip 3 are disposed on the supporting member 1, and the first LED chip 2 and the second LED chip 3 are disposed on a circuit structure of the substrate; a red fluorescent powder colloid layer 4 is arranged on at least the top surface of the second LED chip 3 to form a packaging body A;

a second wavelength phosphor colloid layer 7 without red phosphor is arranged on at least the top surface of the first LED chip 2 to form a packaging body B; the package body a and the package body B are integrally packaged in the third wavelength phosphor glue layer 8 not containing red phosphor;

and L is₂＜L₃＜L_{Red wine}，L₂Is the phosphor wavelength, L, in the phosphor colloidal layer of the second wavelength₃Is the phosphor wavelength, L, in the phosphor colloidal layer of the third wavelength_{Red wine}The wavelength of the red phosphor.

In addition, the number of the first LED chips 2 and the second LED chips 3 on the support 1 is not limited to one, and the number of the first LED chips 2 and the second LED chips 3 may be increased according to the actual light emission spectrum requirement, as shown in fig. 16.

Embodiment 2 of the present invention, a schematic diagram of a specific excitation mode of a light source is shown in fig. 17.

The wavelength of the first LED chip is recorded as lambda A, the lambda A is 390-445 nm, the wavelength of the second LED chip is recorded as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 5 and less than or equal to 160 nm.

For the selection of the phosphor colloidal layer, the phosphor in the second wavelength phosphor colloidal layer is one or more of green phosphor, indigo phosphor, cyan phosphor, yellow phosphor and blue phosphor, and L₂470-590 nm; the fluorescent powder in the third wavelength fluorescent powder colloid layer is one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₃＝510～590nm。

As a preferable scheme of the present embodiment:

what this embodiment high apparent indicates high light efficiency packaging body adopted is the COB encapsulation, and first LED chip 2 is the flip chip structure, and second LED chip 3 adopts and just adorns the chip structure.

As shown in fig. 18, the specific process is as follows: directly mounting the first LED chip 2 on the corresponding position of the substrate circuit through the conductive adhesive; the second LED chip 3 adopts a forward-mounted chip structure, a red fluorescent powder colloid layer 4 is sprayed on the surface of the second LED chip 3, and a [ process ] is adopted, so that a positive electrode connecting area 41 and a negative electrode connecting area 42 without the red fluorescent powder colloid layer are partially reserved on the top surface of the forward-mounted structure second LED chip 3; and then fixing the second LED chip at the corresponding position of the substrate by using insulating glue, and then electrically connecting the n electrode and the p electrode of the second LED chip with the corresponding positions of the circuit on the substrate by routing. After all the LED chips are fixed to the corresponding positions on the substrate with the circuit, glue is dispensed in the enclosure to form a circular or square shape, and then the fluorescent powder colloid layer is coated integrally to finally form the integral COB packaging structure. In practical application, SMD packaging, CSP packaging or filament strip packaging can be adopted according to actual needs.

In this embodiment, a COB-packaged HDK-3000K sample test series high-color-rendering-index high-light-efficiency package is taken as an example for testing, a red phosphor colloid layer 4 is disposed on both the top surface and the side surface of the second LED chip 3, and a second wavelength phosphor colloid layer 7 without red phosphor is disposed on both the top surface and the side surface of the first LED chip 2; the parameters of the three batches of samples are respectively as follows:

the parameters of the HDK-3000K-RFC90-1 of the Heididae are as follows:

in this embodiment, the first LED chip 2 is an LED chip with a wavelength of 445nm, and the second LED chip 3 is an LED chip with a wavelength of 455 nm; the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the third wavelength fluorescent powder colloid layer 6 is a mixture of yellow fluorescent powder and green fluorescent powder, and the wavelength of the fluorescent powder is 520 nm; the phosphor in the second wavelength phosphor glue layer 5 not containing red phosphor is blue phosphor, and the wavelength of the phosphor is 430 nm.

The parameters of the HDK-3000K-RFC90-2 of the Heididae are as follows:

in the embodiment, the first LED chip 2 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 450 nm; the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the third wavelength fluorescent powder colloid layer 6 is a mixture of yellow fluorescent powder and green fluorescent powder, and the wavelength of the fluorescent powder is 520 nm; the phosphor in the second wavelength phosphor glue layer 5 not containing red phosphor is blue phosphor, and the wavelength of the phosphor is 430 nm.

The parameters of the HDK-3000K-RFC90-3 of the Heididae are as follows:

in the embodiment, the first LED chip 2 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 445 nm; the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the third wavelength fluorescent powder colloid layer 6 is a mixture of yellow fluorescent powder and green fluorescent powder, and the wavelength of the fluorescent powder is 520 nm; the phosphor in the second wavelength phosphor glue layer 5 not containing red phosphor is blue phosphor, and the wavelength of the phosphor is 430 nm.

The average value of the test data of the embodiment 2 of the invention and a certain type of sample sold in the market is shown as the following table:

comparative data of spectral testing of example 2 of the invention reference is made to figure 19.

And (4) conclusion: the test result of the sample in the embodiment 2 shows that the light source of the embodiment 2 has higher luminous efficiency under the same light source area and the same color temperature; on the basis of meeting the wavelength difference between the first chip and the second chip in the embodiment, the light efficiency can be further improved.

Example 3

The high-performance and high-light efficiency package of this embodiment, as shown in FIG. 20,

the LED display panel comprises a substrate 1 with a circuit, wherein a first LED chip 2, a third LED chip 9 and a second LED chip 3 are further arranged on the substrate 1, and the first LED chip 2, the third LED chip 9 and the second LED chip 3 are arranged on a circuit structure of the substrate; a red fluorescent powder colloid layer 4 is arranged on at least the top surface of the second LED chip 3 to form a packaging body A; a fifth wavelength phosphor glue layer 10 without red phosphor is arranged on at least the top surface of the third LED chip 9 to form a package C; a fourth wavelength phosphor glue layer 11 without red phosphor is arranged on at least the top surface of the first LED chip 2 to form a package D; the sixth wavelength phosphor colloid layer 12 without red phosphor is integrally arranged outside the package body a, the package body C and the package body D, so that the package body a, the package body C and the package body D are integrally packaged in the sixth wavelength phosphor colloid layer without red phosphor.

And L is₄＜L₅＜L₆＜L_{Red wine}，L₄Is the phosphor wavelength, L, in the fourth wavelength phosphor colloidal layer₅Is the phosphor wavelength, L, in the phosphor colloidal layer of the fifth wavelength₆Is the phosphor wavelength, L, in the phosphor colloidal layer of the sixth wavelength_{Red wine}The wavelength of the red phosphor.

The chip selection suggests that the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda C is more than or equal to 0 and less than or equal to 130nm, and lambda C-lambda A is more than or equal to 15 and less than or equal to 130 nm. The first LED chip can be preferably a purple light LED chip with the wavelength of 390-430 nm.

For the selection of the phosphor colloidal layer, the phosphor in the fourth wavelength phosphor colloidal layer is one or more of indigo phosphor, cyan phosphor and blue phosphor, and L₄470-510 nm; the phosphor in the phosphor colloid layer of the fifth wavelength is green phosphor, and L₅510-540 nm; the fluorescent powder in the sixth wavelength fluorescent powder colloid layer is one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₆＝530～590nm。

The colloid of the phosphor colloid layer is one or more of epoxy resin, silica gel or polyimide.

As a specific scheme of this embodiment, taking a filament strip-packaged HDK-3000K-RA97 sample test series high-apparent-index high-light-efficiency package as an example, the test is performed, where the test sample is a filament strip package, the first LED chip is in a vertical chip structure, one side of a conductive substrate of the first LED chip is directly attached to a corresponding position of a circuit on a substrate through a conductive adhesive, and an n electrode on the top of the first LED chip is electrically connected with a corresponding position of the circuit on the substrate through a routing; the second and third LED chips adopt a positive chip structure.

As shown in figure 21 of the drawings,

a red phosphor colloid layer 4 is only arranged on the top surface of the second LED chip 3, and a fifth wavelength phosphor colloid layer 10 containing no red phosphor is only arranged on the top surface of the third LED chip 9; a fourth wavelength phosphor glue layer 11 not containing red phosphor is provided only on the top surface of the first LED chip 2; the parameters of the three batches of samples are respectively as follows:

HDK-3000K-RFC97-1 sample parameters:

the first LED chip 2 is a purple light LED chip with the wavelength of 430nm, the third LED chip 7 is an LED chip with the wavelength of 455nm, and the second LED chip 3 is an LED chip with the wavelength of 465 nm;

the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the fourth wavelength fluorescent powder colloid layer 5 which does not contain red fluorescent powder is blue fluorescent powder, and the light-emitting wavelength of the fluorescent powder is 475 nm; the phosphor in the fifth wavelength phosphor colloidal layer 6 may be green phosphor with a light emission wavelength of 515nm, and the phosphor in the sixth wavelength phosphor colloidal layer 8 without red phosphor with a light emission wavelength of 530 nm.

HDK-3000K-RFC97-2 sample parameters:

the first LED chip 2 is a purple light LED chip with the wavelength of 430nm, the third LED chip 7 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 445 nm;

the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the fourth wavelength fluorescent powder colloid layer 5 which does not contain red fluorescent powder is blue fluorescent powder, and the light-emitting wavelength of the fluorescent powder is 475 nm; the phosphor in the fifth wavelength phosphor colloidal layer 6 may be green phosphor with a light emission wavelength of 515nm, and the phosphor in the sixth wavelength phosphor colloidal layer 8 without red phosphor with a light emission wavelength of 530 nm.

HDK-3000K-RFC97-3 sample parameters:

the first LED chip 2 is a purple light LED chip with the wavelength of 420nm, the third LED chip 7 is an LED chip with the wavelength of 420nm, and the second LED chip 3 is an LED chip with the wavelength of 420 nm;

the fluorescent powder in the red fluorescent powder colloid layer 4 is red fluorescent powder, the fluorescent powder in the fourth wavelength fluorescent powder colloid layer 5 which does not contain red fluorescent powder is blue fluorescent powder, and the light-emitting wavelength of the fluorescent powder is 475 nm; the phosphor in the fifth wavelength phosphor colloidal layer 6 may be green phosphor with a light emission wavelength of 515nm, and the phosphor in the sixth wavelength phosphor colloidal layer 8 without red phosphor with a light emission wavelength of 530 nm.

The specific excitation mode of this example 3 is schematically shown in fig. 22.

The results of the light efficiency and other parameters of the three batches of samples of the light source of this example 3 are shown in the following table:

and (4) conclusion: in this embodiment, the first LED chip 2 selects a violet LED chip with a wavelength of 390-430 nm to excite the blue phosphor in the phosphor colloid layer 5 with the fourth wavelength. The blue phosphor in the fourth wavelength phosphor glue layer 5 is completely covered on the top and the periphery of the first LED chip 2, and the excitation efficiency of the violet LED chip for exciting the phosphor can be greatly improved by the encapsulation method of the present embodiment because the blue phosphor can be excited only by the violet light higher than the blue light energy. Meanwhile, if the wavelength difference of the first chip, the second chip and the third chip in the embodiment can be satisfied, the light efficiency can be further improved.

In addition, the first LED chip 2, the third LED chip 7 and the second LED chip 3 on the substrate of this embodiment are not limited to one, and are not limited to the ratio of the first LED chip 2, the third LED chip 7 and the second LED chip 3, and the number of the first LED chip 2, the third LED chip 7 and the second LED chip 3 can be correspondingly adjusted according to the actual light emission spectrum requirement.

Example 4

As shown in fig. 23, the high-color rendering index and high-light efficiency package of this embodiment includes a supporting member 1, a first LED chip 2, a third LED chip 9 and a second LED chip 3 are disposed on the supporting member 1, and a red phosphor glue layer 4 is disposed on at least a top surface of a surface of the second LED chip 3 to form a package a;

a seventh wavelength phosphor glue layer 13 without red phosphor is arranged on at least the top surface of the first LED chip 2 to form a package E; the package body A, the third LED chip and the package body E are integrally packaged in an eighth wavelength phosphor glue layer 14 without red phosphor; and L is₇＜L₈＜L_{Red wine}，L₇Is the phosphor wavelength, L, in the phosphor colloidal layer of the seventh wavelength₈Is the wavelength L of the phosphor in the phosphor colloid layer with the eighth wavelength_{Red wine}The wavelength of the red phosphor.

It should be understood by those skilled in the art that, in general, the number of the first LED chip 2, the third LED chip 7 and the second LED chip 3 on the substrate is not limited to one, and the number of the first LED chip 2, the third LED chip 7 and the second LED chip 3 may be increased according to the actual light emission spectrum requirement, as shown in fig. 24.

Selection of chip and phosphor gel layer:

the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda C is more than or equal to 0 and less than or equal to 130nm, and lambda C-lambda A is more than or equal to 15 and less than or equal to 130 nm. The first LED chip can be a purple light LED chip with the wavelength of 390-430 nm.

The fluorescent powder in the seventh wavelength fluorescent powder colloid layer is one or more of indigo fluorescent powder, cyan fluorescent powder and blue fluorescent powder, and L₇＝470～510nm；

The fluorescent powder in the eighth wavelength fluorescent powder colloid layer is one or the mixture of green fluorescent powder and yellow fluorescent powder, and L is₈＝510～590nm。

For each of the first, second and third LED chips, a flip, flip or vertical chip may be adopted, and preferably, the first LED chip adopts a flip chip or vertical chip structure, and the second and third LED chips adopt a flip chip structure.

As a more specific embodiment: in this embodiment, a high-color-rendering-index and high-light-efficiency package of the CSP-packaged HDK-6500K-RA97 sample test series is taken as an example for testing, a red phosphor colloidal layer 4 is only disposed on the top surface of the second LED chip 3, a seventh wavelength phosphor colloidal layer 13 without red phosphor is only disposed on the top surface of the first LED chip 2, and the three batches of sample parameters are:

HDK-6500K-RA97-1：

the first LED chip 2 is an LED chip with the wavelength of 430nm, the third LED chip 7 is an LED chip with the wavelength of 455nm, and the second LED chip 3 is an LED chip with the wavelength of 465 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is blue phosphor, and the light emitting wavelength thereof is 475 nm. The fluorescent powder in the eighth wavelength fluorescent powder colloid layer is mixed fluorescent powder of green fluorescent powder and yellow fluorescent powder, and the light-emitting wavelength of the mixed fluorescent powder is 530 nm.

HDK-6500K-RA97-2：

The first LED chip 2 is an LED chip with the wavelength of 430nm, the third LED chip 7 is an LED chip with the wavelength of 445nm, and the second LED chip 3 is an LED chip with the wavelength of 445 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is blue phosphor, and the light emitting wavelength thereof is 475 nm. The fluorescent powder in the eighth wavelength fluorescent powder colloid layer is mixed fluorescent powder of green fluorescent powder and yellow fluorescent powder, and the light-emitting wavelength of the mixed fluorescent powder is 530 nm.

HDK-6500K-RA97-3：

The first LED chip 2 is an LED chip with the wavelength of 430nm, the third LED chip 7 is an LED chip with the wavelength of 430nm, and the second LED chip 3 is an LED chip with the wavelength of 430 nm; the phosphor in the red phosphor colloid layer 4 is red phosphor, and the phosphor in the seventh wavelength phosphor colloid layer 5 is blue phosphor, and the light emitting wavelength thereof is 475 nm. The fluorescent powder in the eighth wavelength fluorescent powder colloid layer is mixed fluorescent powder of green fluorescent powder and yellow fluorescent powder, and the light-emitting wavelength of the mixed fluorescent powder is 530 nm.

The specific excitation mode of the light source of this embodiment is schematically shown in fig. 25.

The average value of the three batches of light efficiency and other parameter testing data of the light source of the embodiment 4 is shown in the following table

The high-apparent-finger high-luminous-efficiency packaging body in the embodiment adopts a multi-chip CSP packaging structure, and certainly, in the practical application of the structure in the embodiment, SMD packaging, COB packaging or filament strip packaging can be adopted according to actual needs.

The high-color rendering index and high-light efficiency packages of the embodiments 1 to 4 effectively solve the technical problem faced by the conventional white light LED.

First, the excitation of the chips with a plurality of different wavelengths can be compatible with the excitation wavelengths of different phosphors. Fig. 4-9 show excitation and emission spectra of different phosphors. For 495nm fluorescent powder, when the wavelength of excitation light is 360nm-400nm, the relative excitation efficiency can reach more than 80%. For the fluorescent powder with the wavelength of 518nm, 530nm and 535nm, the relative excitation efficiency is more than 80 percent when the excitation light is between 420nm and 470 nm. And for 655 and 660 phosphors, when short-wavelength blue light is adopted for excitation, although the relative excitation efficiency is higher, the Stokes shift is larger, and much energy is absorbed by lattice vibration and converted into heat energy. For example, 655nm red light with the same excitation photon energy of 1.89eV, 470nm blue light with the photon energy of 2.61eV is used for excitation, the relative excitation efficiency is 60%, the photon energy loss is 0.72eV, and 440nm blue light with the photon energy of 2.81eV is used for excitation, the relative excitation efficiency is 70%, the photon energy loss is 0.92 eV. Namely, the excitation efficiency is improved by 10 percent by adopting short-wavelength excitation, but the photon energy loss is increased by 28 percent. Considering that the red light excitation spectrum changes smoothly between 450 and 500nm, the relative excitation efficiency is reduced from 65% to 55%. It is more suitable to select the light with the relatively longer wavelength of 450-500nm to excite the red phosphor. The excitation light that does not absorb can compensate the blue-green light that lacks in the spectrum, also can be used for arousing outside yellow or blue-green phosphor powder, improves the color rendering index.

Second, the packaging structure of the chip with a plurality of different wavelengths can effectively avoid the problem of secondary absorption of the red fluorescent powder to the blue-green light, and only few blue-green light can irradiate the red fluorescent powder. This is beneficial for increasing the blue-green component of the spectrum and thus the color rendering index.

Thirdly, according to the stokes shift phenomenon, when the wavelength of the excitation light moves, the emission wavelength of the same phosphor also moves relatively to the corresponding wavelength direction. Therefore, the long-wavelength chip adopted by the invention can excite the red fluorescent powder to obtain red light with longer wavelength, and the short-wavelength chip can excite the blue-green fluorescent powder to obtain blue-green light with shorter wavelength, so that the band spectrum is widened, and the color rendering index is greatly improved. Fig. 10 shows an excitation spectrum and an emission spectrum of red phosphor excited by different excitation wavelengths. It can be seen from fig. 10 that the emission spectrum shifts to shorter wavelengths when short wavelength excitation is used. Similarly, when excited with longer wavelengths, the emission spectrum shifts to longer wavelengths. Therefore, the long-wavelength chip adopted by the invention excites the red fluorescent powder, so that the luminous wavelength is red-shifted, and higher color rendering index is obtained. The same advantage is obtained for blue-green light.

Fourthly, the color temperature is changed by changing the proportion of blue and red chips in the light source. The color temperature of a light source is changed by increasing the amount of red and other fluorescent powder in an integral fluorescent powder layer in the conventional technology, so that the color of a light-emitting surface packaged by a COB is deep and turbid, but the invention is realized by adopting full red powder chips, and the color temperature of the light source is changed by changing the number of the full red powder chips, such as: on a light emitting surface with the diameter of 12.3mm, 94 LED chips with the size of 14mil multiplied by 30mil are arranged in total, when the color temperature of a target light source is 4000K, the number of the full red chips is 48, and the number of the blue chips is 46; when the color temperature of the target light source is 3000K, the number of the full red chips is 61, and the number of the blue chips is 34, namely: the change of the color temperature can be realized by changing the proportion of the red light chip and the blue light chip in the light source, unlike the conventional packaging form that the fluorescent powder is accurately weighed by a high-precision balance and then the mixed concentration of the red fluorescent powder is changed in the whole packaging layer. The two methods for adjusting the color temperature can be observed in appearance, the light source with high color rendering index and high luminous efficiency provided by the invention is clearer, the blue light chip and the red powder chip are clear and distinguished, and even the specification and model of the product can be rapidly judged. The change of the color temperature can be directly realized by changing the proportion of the blue-red chips in the light source.

The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (8)

1. A high-color rendering index high-light efficiency package body is characterized in that: comprises a support member having a first LED chip thereonAnd a second LED chip; a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A; the first LED chip and the packaging body A are integrally packaged in a first wavelength fluorescent powder colloid layer without red fluorescent powder; and L is₁＜L_{Red wine}，L₁Is the phosphor wavelength, L, in the phosphor colloidal layer of the first wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-460 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 0 and less than or equal to 160 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip adopts a forward-mounted chip structure.

2. The high-aspect and high-light-efficiency package of claim 1, wherein: the phosphor wavelength L in the first wavelength phosphor colloidal layer₁＝470～590nm。

3. A high-color rendering index high-light efficiency package body is characterized in that: the LED chip mounting structure comprises a supporting piece, wherein a first LED chip and a second LED chip are arranged on the supporting piece; a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A; at least the top surface of the first LED chip is provided with a second wavelength fluorescent powder colloid layer without red fluorescent powder to form a packaging body B; the packaging body A and the packaging body B are integrally packaged in a third wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₂＜L₃＜L_{Red wine}，L₂Is the phosphor wavelength, L, in the phosphor colloidal layer of the second wavelength₃Is the phosphor wavelength, L, in the phosphor colloidal layer of the third wavelength_{Red wine}The wavelength of red phosphor;

the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; and lambda B-lambda A is more than or equal to 5 and less than or equal to

160 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip adopts a forward-mounted chip structure.

4. The high-aspect and high-light-efficiency package according to claim 3, wherein:

the wavelength L of the fluorescent powder in the fluorescent powder colloid layer with the second wavelength₂＝470～590nm；

The phosphor wavelength L in the third wavelength phosphor gel layer₃＝510～590nm。

5. A high-color rendering index high-light efficiency package body is characterized in that: the LED packaging structure comprises a supporting piece, wherein a first LED chip, a third LED chip and a second LED chip are arranged on the supporting piece, and a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A;

a fifth wavelength phosphor colloid layer without containing red phosphor is arranged on at least the top surface of the third LED chip to form a packaging body C; a fourth wavelength fluorescent powder colloid layer without containing red fluorescent powder is arranged on at least the top surface of the first LED chip to form a packaging body D; the packaging body A, the packaging body C and the packaging body D are integrally packaged in a sixth wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₄＜L₅＜L₆＜L_{Red wine}，L₄Is the phosphor wavelength, L, in the fourth wavelength phosphor colloidal layer₅Is the phosphor wavelength, L, in the phosphor colloidal layer of the fifth wavelength₆Is the phosphor wavelength, L, in the phosphor colloidal layer of the sixth wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; λ B- λ C is more than or equal to 0 and less than or equal to 130nm, and λ C- λ A is more than or equal to 15 and less than or equal to 130 nm;

the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip and the third LED chip adopt a positive chip structure.

6. The high-aspect and high-light-efficiency package according to claim 5, wherein:

the wavelength L of the fluorescent powder in the fourth wavelength fluorescent powder colloid layer₄＝470～510nm；

The phosphor wavelength L in the phosphor colloid layer with the fifth wavelength₅＝510～540nm；

The wavelength L of the fluorescent powder in the fluorescent powder colloid layer with the sixth wavelength₆＝530～590nm；

The first LED chip is a purple LED chip with the wavelength of 390-430 nm, and the fluorescent powder in the fluorescent powder colloid layer with the fourth wavelength is blue fluorescent powder.

7. A high-color rendering index high-light efficiency package body is characterized in that: the LED packaging structure comprises a supporting piece, wherein a first LED chip, a third LED chip and a second LED chip are arranged on the supporting piece, and a red fluorescent powder colloid layer is arranged on at least the top surface of the second LED chip to form a packaging body A;

a seventh wavelength fluorescent powder colloid layer without containing red fluorescent powder is arranged on at least the top surface of the first LED chip to form a packaging body E; the packaging body A, the third LED chip and the packaging body E are integrally packaged in an eighth wavelength fluorescent powder colloid layer without red fluorescent powder;

and L is₇＜L₈＜L_{Red wine}，L₇Is the phosphor wavelength, L, in the phosphor colloidal layer of the seventh wavelength₈Is the wavelength L of the phosphor in the phosphor colloid layer with the eighth wavelength_{Red wine}The wavelength of red phosphor; the wavelength of the first LED chip is marked as lambda A, the lambda A is 390-445 nm, the wavelength of the third LED chip is marked as lambda C, the lambda C is 420-465 nm, the wavelength of the second LED chip is marked as lambda B, and the lambda B is 445-550 nm; λ B- λ C is more than or equal to 0 and less than or equal to 130nm, and λ C- λ A is more than or equal to 15 and less than or equal to 130 nm; the first LED chip adopts a flip chip or a vertical chip structure, and the second LED chip and the third LED chip adopt a positive chip structure.

8. The high-aspect and high-light-efficiency package according to claim 7, wherein:

the fluorescent powder glue with the seventh wavelengthPhosphor wavelength L in bulk layer₇＝470～510nm；

The wavelength L of the fluorescent powder in the fluorescent powder colloid layer with the eighth wavelength₈＝510～590nm；

The first LED chip is a purple LED chip with the wavelength of 390-430 nm, and the fluorescent powder in the fluorescent powder colloid layer with the seventh wavelength is blue fluorescent powder.

Images