WO2017181751A1 - Uv filament lamp - Google Patents

Uv filament lamp Download PDF

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Publication number
WO2017181751A1
WO2017181751A1 PCT/CN2017/071035 CN2017071035W WO2017181751A1 WO 2017181751 A1 WO2017181751 A1 WO 2017181751A1 CN 2017071035 W CN2017071035 W CN 2017071035W WO 2017181751 A1 WO2017181751 A1 WO 2017181751A1
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WO
WIPO (PCT)
Prior art keywords
ultraviolet
filament
substrate
lamp
led chip
Prior art date
Application number
PCT/CN2017/071035
Other languages
French (fr)
Chinese (zh)
Inventor
梁旭东
丛巍
Original Assignee
圆融健康科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 圆融健康科技(深圳)有限公司 filed Critical 圆融健康科技(深圳)有限公司
Publication of WO2017181751A1 publication Critical patent/WO2017181751A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means

Definitions

  • the present invention relates to the field of ultraviolet LED technology, and in particular, to an ultraviolet filament and an ultraviolet filament lamp.
  • UV LED Deep ultraviolet LED
  • Traditional mercury lamps do not have such problems, but mercury is poisonous as a heavy metal and has been criticized by people. People are concerned about the use of mercury lamps, which cause mercury to leak, which is life-threatening and so on.
  • UV LED has no mercury pollution, and is a good product with environmental protection and energy saving, and has the advantages of long service life. The replacement of mercury lamps by UV LEDs is an inevitable trend. How to make UV LED lamps omnidirectional is an important issue in the field of UV LEDs.
  • UV LED lamps cannot be illuminated in all directions.
  • An ultraviolet filament comprising a substrate and an ultraviolet LED chip, the ultraviolet LED chip being fixed on the substrate.
  • the substrate is provided with a first conductive strip and a second conductive strip separated from each other; the positive and negative electrodes of the ultraviolet LE D chip are fixed and electrically connected to the first conductive strip and the second conductive strip, respectively connection.
  • a solid crystal region is disposed on the substrate; the positive crystal connecting block and the negative electrode connecting block are disposed in the solid crystal region; and the positive electrode and the negative electrode of the ultraviolet LED chip are respectively connected to the positive electrode connecting block and the negative electrode connecting block Fixed and electrically connected.
  • the substrate has a plurality of the die bonding regions, and the die bonding regions are electrically connected by a third conductive strip.
  • the substrate has a plurality of the die-bonding regions, and the die-bonding regions are electrically connected by an aluminum reflective sheet. [0009] Into - one less
  • An insulating transmissive film of ultraviolet light is disposed on the board.
  • Embodiments of the present invention also provide an ultraviolet filament lamp.
  • the ultraviolet filament lamp includes the above-described ultraviolet filament.
  • the ultraviolet filament lamp is a bulb lamp.
  • the cover body is a bulb-shaped cover body
  • the cover body is provided with a bracket
  • the ultraviolet filament is mounted on the bracket
  • the ultraviolet filament is electrically connected to the lamp cap, and the lamp cap and the cover body form a sealed space.
  • the ultraviolet filament lamp is an ultraviolet filament lamp.
  • the ultraviolet filaments further comprising: a plurality of the ultraviolet filaments, a strip-shaped ultraviolet-transmissive housing, a strip-shaped heat sink and two lamp caps, the lamp cap forming a sealed space with the casing, the ultraviolet filaments being uniformly disposed at On the strip-shaped heat sink, the strip-shaped heat sink is fixed on the lamp cap in the sealed space.
  • the invention is fixed on the substrate by the ultraviolet LED chip to form an ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip. .
  • FIG. 1 is a schematic perspective view of an ultraviolet filament according to a first embodiment of the present invention.
  • FIG. 2 is a top plan view of an ultraviolet filament according to a first embodiment of the present invention.
  • FIG 3 is a schematic cross-sectional structural view of an ultraviolet filament according to a first embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional structural view of an ultraviolet filament according to a second embodiment of the present invention.
  • FIG. 5 is a perspective view of an ultraviolet filament according to an embodiment of the present invention.
  • 6 is a schematic perspective view of an ultraviolet filament according to a third embodiment of the present invention.
  • FIG. 7 is a schematic structural view of an ultraviolet filament bulb according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural view of an ultraviolet filament lamp according to an embodiment of the present invention.
  • an ultraviolet filament according to a first embodiment of the present invention is proposed.
  • the ultraviolet filament of this embodiment includes a substrate 100 and an ultraviolet LED chip 300, and the ultraviolet LED chip 300 is fixed on the substrate 100.
  • the ultraviolet filament of the embodiment of the present invention does not require the ultraviolet LED chip 300 to be packaged on the holder, thereby saving cost.
  • the invention is fixed on the substrate by the ultraviolet LED chip to form the ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip.
  • the ultraviolet filament of the embodiment has a plurality of ultraviolet LED chips 300, which can integrate a plurality of ultraviolet LED chips to meet the needs of different fields.
  • the ultraviolet filament of the embodiment can be applied to form a bulb lamp, and can also be applied to form a fluorescent lamp (ie, a strip lamp or a lamp tube, which emits ultraviolet light), which can be applied to indoor disinfection fields, such as hospital or canteen sterilization, and can also be applied.
  • a fluorescent lamp ie, a strip lamp or a lamp tube, which emits ultraviolet light
  • UV lacquer curing is achieved in the field of light curing.
  • the substrate 100 may be a rigid substrate or a flexible substrate.
  • the material of the rigid substrate may be a glass or a ceramic material or a metal material.
  • the material of the flexible substrate may be a flexible PCB or a flexible plastic.
  • the substrate 100 is preferably made of a rigid ceramic substrate, which has the advantages of good insulation and heat dissipation performance.
  • the present invention preferably has an ultraviolet light reflecting layer such as an aluminum thin film layer provided on the surface of the substrate 100.
  • the aluminum thin film layer is formed on the ceramic substrate.
  • a silicon dioxide film layer is formed on the aluminum thin film layer to facilitate the circuit arrangement of the ultraviolet LED chip.
  • the shape of the substrate 100 is preferably elongated to form a filament shape.
  • the substrate 100 is preferably an aluminum substrate having good deep ultraviolet reflection characteristics, which can improve the emission efficiency of ultraviolet light, is not absorbed by the filament itself, and causes ultraviolet light. Unnecessary loss of light.
  • an ultraviolet transparent insulating film such as an insulating silicon dioxide film
  • the material of the substrate 100 is preferably quartz glass or sapphire, forming Quartz glass substrate or sapphire substrate.
  • the quartz glass substrate or the sapphire substrate can transmit ultraviolet rays well, especially ultraviolet rays having a wavelength of 300 nm or less.
  • the quartz glass substrate or the sapphire substrate gives the ultraviolet light a chance to be emitted through the substrate itself, reducing absorption by the filament itself and increasing ultraviolet light emission.
  • the ultraviolet LED chip 300 can be fixed on the substrate 100 in three ways. The first is to fix and electrically connect the UV LED chip 300 in the form of a conductive strip, so that no gold wire connection is required, which reduces cost and improves light efficiency. The second is to fix and electrically connect the ultraviolet LED chip 300 with a solid crystal region and an aluminum reflective sheet, and it is also possible to eliminate the need for a gold wire. The third is to use a combination of a conductive strip and a solid crystal region, or a gold wire.
  • the number of the ultraviolet LED chips 300 in the ultraviolet filament is preferably plural, for example, 5 or 10, and is set as needed.
  • the substrate 100 is provided with a die bonding region corresponding to the number of the ultraviolet LED chips 300.
  • Fig. 5 is a perspective view showing the ultraviolet filament of the embodiment of the present invention. Referring to FIG. 5, the substrate 100 is provided with two die bonding regions 130, and a positive electrode connection block and a negative electrode connection block (not shown) are disposed in the die bonding region.
  • the ultraviolet LED chip 300 is located in the die bonding region 130.
  • the positive and negative electrodes of the ultraviolet LED chip 300 are fixed and electrically connected to the positive electrode connection block and the negative electrode connection block, respectively.
  • the present embodiment preferably employs an aluminum reflective sheet 230 disposed between the two ultraviolet LED chips 300.
  • the aluminum reflective sheet 230 serves to conduct and reflect ultraviolet light.
  • the width of the aluminum reflective sheet 230 is the same as that of the substrate 100, and the length is greater than the spacing between the two solid crystal regions 130, forming an arch shape, similar to an arch bridge, which is more likely to reflect ultraviolet light.
  • the third conductive strip can be replaced with a third conductive strip, i.e., the third conductive strip is electrically connected between the die attach regions 130.
  • the third conductive strip can be fabricated in the same manner as the die bonding region 130, is cost effective, and can also be grown using metal deposition techniques.
  • the material of the third conductive strip is aluminum, which has better ultraviolet light reflecting ability.
  • the ultraviolet filament of the present embodiment is preferably provided with a first conductive strip 210 and a second conductive strip 220 separated from each other on the ceramic substrate 100.
  • the first conductive strip 210 and the second conductive strip 220 are independent of each other.
  • the first conductive strip 210 covers one side of the substrate 100, and the second conductive strip 220 covers the other side of the substrate 100.
  • the first conductive strip 210 is electrically connected to the outside through an electrode 241, and the second conductive strip 220 is electrically connected to the outside through the electrode 242.
  • the design of the first conductive strip 210 and the second conductive strip 220 can eliminate the fabrication of the solid crystal region, because the positive and negative electrodes of the ultraviolet LED chip 300 can be fixed and electrically connected to the first conductive strip 2, respectively.
  • the first conductive strip 210 is electrically connected to the positive electrode of the ultraviolet LED chip 300, and the second conductive strip 220 is electrically connected to the negative electrode of the ultraviolet LED chip 300.
  • the first conductive strip 210 and the second conductive strip 220 may be formed by silk screen printing.
  • the first conductive strip 210 and the second conductive strip 220 are made of conductive silver paste.
  • the first conductive strip 210 and the second conductive strip 220 may also be formed on the surface of the ceramic substrate 100 by metal deposition (ie, two metal layers are formed). For example, it can be deposited by magnetron sputtering.
  • the connection of the metal layer to the electrodes of the UV LED chip 300 can be accomplished in the form of a eutectic.
  • the ultraviolet LED chip 300 is formed on the first conductive strip 210 and the second conductive strip 220.
  • the underside of the ultraviolet LED chip 300 is empty, which facilitates the circulation of air or other gases, and is favorable for heat dissipation.
  • the ultraviolet LED chip 300 is preferably a deep ultraviolet LED chip having a wavelength of less than 300 nm, and further preferably the ultraviolet LED chip 300 is a deep ultraviolet LED chip of 240 nm to 290 nm.
  • the ultraviolet LED chip 300 refers to a die that is not packaged. Referring to FIG. 3, the die (the UV LED chip 300) includes a light emitting region 330 and a positive electrode 310 and a negative electrode 320 electrically connected to the light emitting region 330.
  • the light-emitting region 330 includes a sapphire substrate and an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer which are sequentially formed on the sapphire substrate.
  • the ultraviolet LED chip 300 is preferably a flip chip, and is electrically connected to the first conductive strip 210 and the second conductive strip 220.
  • the ultraviolet filament of the embodiment facilitates integration of a plurality of ultraviolet LED chips 300, and has high versatility and applicability.
  • FIG. 4 is a schematic cross-sectional structural view of an ultraviolet filament according to a second embodiment of the present invention.
  • the ultraviolet filament of the embodiment differs from the first embodiment in that at least one ultraviolet light reflector 150 is disposed on at least one side of the ultraviolet LED chip 300.
  • the ultraviolet light reflector 150 is shaped into one or more of a cone, a cylinder, and a sphere.
  • the cone can be a cone, a tetrahedron, a faceted cone, and the like.
  • the cylinder may be an elongated cylinder, a cylinder, a multi-faceted cylinder, and an irregular cylinder.
  • the sphere can be a 3/4 sphere, a 1/2 sphere or a complete sphere.
  • the ultraviolet light reflector 150 is preferably in the shape of a cone to facilitate light emission. [0041] The ultraviolet light reflector 150 can effectively raise the ultraviolet light emitted from the side of the ultraviolet LED chip 300, and improve the light extraction efficiency of the front ultraviolet light.
  • the ultraviolet filament of the present embodiment is different from the first embodiment in that the substrate 100 includes a base 110 and sidewalls 120 extending upward from both sides of the base 110.
  • the ultraviolet LED chip 300 is located on the substrate.
  • the upper surface of the ultraviolet LED chip 300 is flush with the upper surface of the side wall 120 so as not to affect the light output.
  • the angle between the inner side surface 121 of the side wall 120 and the base 110 is greater than 125 degrees and less than 165 degrees, preferably 135 degrees, which is advantageous for reflecting the side light of the ultraviolet LED chip 300.
  • the substrate 100 be made of an aluminum material or that the substrate be plated with an aluminum film.
  • Embodiments of the present invention also provide an ultraviolet filament lamp, which comprises the above-mentioned ultraviolet filament.
  • the ultraviolet filament lamp of the embodiment is an ultraviolet filament bulb, and the bulb includes a plurality of the ultraviolet filament 20, a UV-transmissive cover 70 and a base 50, and the cover 70 is in the form of a bulb.
  • the cover body 70 is provided with a bracket 60.
  • the ultraviolet filament 20 is mounted on the bracket 60.
  • the ultraviolet filament 20 is electrically connected to the base 50.
  • the base 50 and the cover 70 form a sealed space.
  • the base 50 has a threaded structure 80 that is electrically connected to the outside and that is fixed.
  • the ultraviolet filament lamp of this embodiment is an ultraviolet filament lamp.
  • the ultraviolet filament lamp comprises a plurality of the above-mentioned ultraviolet filaments 20, a strip-shaped ultraviolet-transmissive housing 30, a strip-shaped heat sink 10 and two bases 40.
  • the base 40 forms a sealed space with the housing 30, and the ultraviolet filament 20 is evenly distributed.
  • the strip heat sink 10 is disposed on the strip heat sink 10, and the strip heat sink 10 is fixed on the lamp cap 40 in the sealed space.
  • the invention is fixed on the substrate by the ultraviolet LED chip to form an ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip.
  • the subject matter of the present application can be manufactured or produced industrially and can produce positive effects.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

Provided are a UV filament and a UV filament lamp, which relate to the technical field of UV LEDs. The UV filament comprises a substrate (100) and a UV LED chip (300), wherein the UV LED chip (300) is fixed on the substrate (100). The UV LED chip is fixed on the substrate to form the UV filament, and the UV filament forms the UV filament lamp, so that the UV filament lamp can emit UV light omnidirectionally, satisfying application requirements of different occasions, and improving applicability of the UV LED chip.

Description

发明名称:紫外灯丝灯  Title of the invention: UV filament lamp
技术领域  Technical field
[0001] 本发明涉及紫外 LED技术领域, 尤其涉及一种紫外灯丝以及紫外灯丝灯。  [0001] The present invention relates to the field of ultraviolet LED technology, and in particular, to an ultraviolet filament and an ultraviolet filament lamp.
背景技术  Background technique
[0002] 深紫外 LED (UV LED) 是最近几年才幵始量产和实用化的。 和普通白光 LED 一样, UV LED也是点光源, 不能形成 360度全角度"照明", 这大大限制了 UV LED使用和应用。 传统的汞灯就不会存在这样的问题, 但是汞作为重金属有毒, 一直被人们所诟病。 人们很担心使用汞灯之后, 造成汞供泄露, 带来生命危险 等等情况。 UV LED没有汞污染, 且是环保、 节能的好产品, 具有使用寿命长等 优点。 UV LED取代汞灯是一个必然的趋势, 如何使 UV LED灯全方位照射是当 下 UV LED领域中的一个重要的课题。  [0002] Deep ultraviolet LED (UV LED) has only been mass-produced and put into practical use in recent years. Like ordinary white LEDs, UV LEDs are point sources that do not form 360-degree full-angle "illumination", which greatly limits the use and application of UV LEDs. Traditional mercury lamps do not have such problems, but mercury is poisonous as a heavy metal and has been criticized by people. People are worried about the use of mercury lamps, which cause mercury to leak, which is life-threatening and so on. UV LED has no mercury pollution, and is a good product with environmental protection and energy saving, and has the advantages of long service life. The replacement of mercury lamps by UV LEDs is an inevitable trend. How to make UV LED lamps omnidirectional is an important issue in the field of UV LEDs.
技术问题  technical problem
[0003] 现有技术中 UV LED灯不能全方位照射。  [0003] In the prior art, UV LED lamps cannot be illuminated in all directions.
问题的解决方案  Problem solution
技术解决方案  Technical solution
[0004] 一种紫外灯丝, 其中, 包括基板和紫外 LED芯片, 所述紫外 LED芯片固定在所 述基板上。  An ultraviolet filament comprising a substrate and an ultraviolet LED chip, the ultraviolet LED chip being fixed on the substrate.
[0005] 进一步, 所述基板上设置有彼此分离的第一导电条和第二导电条; 所述紫外 LE D芯片的正极和负极分别与所述第一导电条和第二导电条固定且电连接。  [0005] Further, the substrate is provided with a first conductive strip and a second conductive strip separated from each other; the positive and negative electrodes of the ultraviolet LE D chip are fixed and electrically connected to the first conductive strip and the second conductive strip, respectively connection.
[0006] 进一步, 所述基板上设置有固晶区; 所述固晶区中具有正极连接块和负极连接 块; 所述紫外 LED芯片的正极和负极分别与所述正极连接块和负极连接块固定且 电连接。  [0006] Further, a solid crystal region is disposed on the substrate; the positive crystal connecting block and the negative electrode connecting block are disposed in the solid crystal region; and the positive electrode and the negative electrode of the ultraviolet LED chip are respectively connected to the positive electrode connecting block and the negative electrode connecting block Fixed and electrically connected.
[0007] 进一步, 所述基板具有若干所述固晶区, 所述固晶区之间通过第三导电条电连 接。  [0007] Further, the substrate has a plurality of the die bonding regions, and the die bonding regions are electrically connected by a third conductive strip.
[0008] 进一步, 所述基板具有若干所述固晶区, 所述固晶区之间通过铝反光薄片电连 接。 [0009] 进-一少 [0008] Further, the substrate has a plurality of the die-bonding regions, and the die-bonding regions are electrically connected by an aluminum reflective sheet. [0009] Into - one less
[0010] 进-一少  [0010] Into one less
[0011] 进-一少  [0011] Into one less
[0012] 进-一少  [0012] Into one less
[0013] 进-一少  [0013] Into one less
[0014] 进-一少  [0014] Into one less
板上设置有一层紫外光的绝缘透射薄膜。  An insulating transmissive film of ultraviolet light is disposed on the board.
[0015] 本发明实施例还提供一种紫外灯丝灯。 该紫外灯丝灯包括上述紫外灯丝。  [0015] Embodiments of the present invention also provide an ultraviolet filament lamp. The ultraviolet filament lamp includes the above-described ultraviolet filament.
[0016] 进一步, 所述紫外灯丝灯为球泡灯。 [0016] Further, the ultraviolet filament lamp is a bulb lamp.
[0017] 进一步, 包括若干所述紫外灯丝、 透紫外光的罩体和灯头, 所述罩体为球泡状 罩体, 所述罩体内设有支架, 所述紫外灯丝安装在所述支架上, 所述紫外灯丝 与所述灯头电连接, 所述灯头和所述罩体形成密封空间。  [0017] Further, comprising a plurality of the ultraviolet filaments, a UV-transmissive cover body and a lamp cap, the cover body is a bulb-shaped cover body, the cover body is provided with a bracket, and the ultraviolet filament is mounted on the bracket The ultraviolet filament is electrically connected to the lamp cap, and the lamp cap and the cover body form a sealed space.
[0018] 进一步, 所述紫外灯丝灯为紫外灯丝灯管。  [0018] Further, the ultraviolet filament lamp is an ultraviolet filament lamp.
[0019] 进一步, 包括若干所述紫外灯丝、 条形透紫外光的壳体、 条形热沉和两个灯头 , 所述灯头与所述壳体形成密封空间, 所述紫外灯丝均匀地设置在所述条形热 沉上, 所述条形热沉位于所述密封空间内固定在所述灯头上。  [0019] further comprising: a plurality of the ultraviolet filaments, a strip-shaped ultraviolet-transmissive housing, a strip-shaped heat sink and two lamp caps, the lamp cap forming a sealed space with the casing, the ultraviolet filaments being uniformly disposed at On the strip-shaped heat sink, the strip-shaped heat sink is fixed on the lamp cap in the sealed space.
发明的有益效果  Advantageous effects of the invention
有益效果  Beneficial effect
[0020] 本发明通过紫外 LED芯片固定在基板上形成紫外灯丝, 并由紫外灯丝形成紫外 灯丝灯, 实现紫外灯丝灯全角度发射紫外光, 满足不同场合的应用, 提高了紫 外 LED芯片的适用性。  [0020] The invention is fixed on the substrate by the ultraviolet LED chip to form an ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip. .
对附图的简要说明  Brief description of the drawing
附图说明  DRAWINGS
[0021] 图 1是本发明实施例一的紫外灯丝立体示意图。  1 is a schematic perspective view of an ultraviolet filament according to a first embodiment of the present invention.
[0022] 图 2是本发明实施例一的紫外灯丝俯视示意图。 2 is a top plan view of an ultraviolet filament according to a first embodiment of the present invention.
[0023] 图 3是本发明实施例一的紫外灯丝横截面结构示意图。 3 is a schematic cross-sectional structural view of an ultraviolet filament according to a first embodiment of the present invention.
[0024] 图 4是本发明实施例二的紫外灯丝横截面结构示意图。 4 is a schematic cross-sectional structural view of an ultraviolet filament according to a second embodiment of the present invention.
[0025] 图 5是本发明实施例的紫外灯丝立体示意图。 [0026] 图 6是本发明实施例三的紫外灯丝立体示意图。 5 is a perspective view of an ultraviolet filament according to an embodiment of the present invention. 6 is a schematic perspective view of an ultraviolet filament according to a third embodiment of the present invention.
[0027] 图 7是本发明实施例的紫外灯丝球泡灯结构示意图。 7 is a schematic structural view of an ultraviolet filament bulb according to an embodiment of the present invention.
[0028] 图 8是本发明实施例的紫外灯丝灯管结构示意图。 8 is a schematic structural view of an ultraviolet filament lamp according to an embodiment of the present invention.
实施该发明的最佳实施例  BEST MODE FOR CARRYING OUT THE INVENTION
本发明的最佳实施方式  BEST MODE FOR CARRYING OUT THE INVENTION
[0029] 请参照图 1至图 3, 提出本发明实施例一的紫外灯丝。 本实施例的紫外灯丝包括 基板 100和紫外 LED芯片 300, 该紫外 LED芯片 300固定在该基板 100上。 本发明实 施例的紫外灯丝, 不需要将紫外 LED芯片 300封装在支架上, 节省成本。 本发明 通过紫外 LED芯片固定在基板上形成紫外灯丝, 并由紫外灯丝形成紫外灯丝灯, 实现紫外灯丝灯全角度发射紫外光, 满足不同场合的应用, 提高了紫外 LED芯片 的适用性。 一般, 本实施例的紫外灯丝上具有多个紫外 LED芯片 300, 可以进行 多个紫外 LED芯片集成, 满足不同领域的需求。 本实施例的紫外灯丝可应用形成 球泡灯, 也可以应用形成日光灯 (即条形灯或者灯管, 此吋发出紫外光线) , 可以应用于室内消毒领域, 例如医院或者食堂消毒, 也可以应用于光固化领域 , 实现 UV漆固化。 [0029] Referring to FIG. 1 to FIG. 3, an ultraviolet filament according to a first embodiment of the present invention is proposed. The ultraviolet filament of this embodiment includes a substrate 100 and an ultraviolet LED chip 300, and the ultraviolet LED chip 300 is fixed on the substrate 100. The ultraviolet filament of the embodiment of the present invention does not require the ultraviolet LED chip 300 to be packaged on the holder, thereby saving cost. The invention is fixed on the substrate by the ultraviolet LED chip to form the ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip. Generally, the ultraviolet filament of the embodiment has a plurality of ultraviolet LED chips 300, which can integrate a plurality of ultraviolet LED chips to meet the needs of different fields. The ultraviolet filament of the embodiment can be applied to form a bulb lamp, and can also be applied to form a fluorescent lamp (ie, a strip lamp or a lamp tube, which emits ultraviolet light), which can be applied to indoor disinfection fields, such as hospital or canteen sterilization, and can also be applied. In the field of light curing, UV lacquer curing is achieved.
[0030] 该基板 100可以为硬质基板, 也可以为柔性基板。 该硬质基板的材料可以为玻 璃或者陶瓷材料, 也可以为金属材料。 该柔性基板的材料可以为柔性 PCB板, 也 可以为柔性塑料。 本实施例优选该基板 100采用硬质的陶瓷基板, 该陶瓷基板具 有绝缘和散热性能好等优点。 为了提高紫外光的射出效率, 本发明优选在该基 板 100的表面设置有紫外光反射层, 例如铝薄膜层。 本实施例中, 该铝薄膜层形 成于该陶瓷基板上。 进一步优选, 在该铝薄膜层上形成有二氧化硅薄膜层, 方 便该紫外 LED芯片的电路布置。  [0030] The substrate 100 may be a rigid substrate or a flexible substrate. The material of the rigid substrate may be a glass or a ceramic material or a metal material. The material of the flexible substrate may be a flexible PCB or a flexible plastic. In the embodiment, the substrate 100 is preferably made of a rigid ceramic substrate, which has the advantages of good insulation and heat dissipation performance. In order to improve the efficiency of ultraviolet light emission, the present invention preferably has an ultraviolet light reflecting layer such as an aluminum thin film layer provided on the surface of the substrate 100. In this embodiment, the aluminum thin film layer is formed on the ceramic substrate. Further preferably, a silicon dioxide film layer is formed on the aluminum thin film layer to facilitate the circuit arrangement of the ultraviolet LED chip.
[0031] 本实施例中, 该基板 100的形状优选为长条形, 形成灯丝形状。  [0031] In this embodiment, the shape of the substrate 100 is preferably elongated to form a filament shape.
[0032] 在另外的一些实施例中, 该基板 100优选为铝质基板, 该铝质基板具有很好的 深紫外反光特性, 可以提高紫外光的射出效率, 不会被灯丝本身吸收, 造成紫 外光不必要的损失。 选择铝质基板吋, 一般需要在铝质基板的固定紫外 LED芯片 的一面形成一层紫外光的绝缘透射薄膜, 例如绝缘二氧化硅薄膜。  [0032] In other embodiments, the substrate 100 is preferably an aluminum substrate having good deep ultraviolet reflection characteristics, which can improve the emission efficiency of ultraviolet light, is not absorbed by the filament itself, and causes ultraviolet light. Unnecessary loss of light. In order to select an aluminum substrate, it is generally required to form an ultraviolet transparent insulating film, such as an insulating silicon dioxide film, on one side of the fixed ultraviolet LED chip of the aluminum substrate.
[0033] 在另外的一些实施例中, 该基板 100的材料优选为石英玻璃或者蓝宝石, 形成 石英玻璃基板或者蓝宝石基板。 该石英玻璃基板或者蓝宝石基板可以很好地透 射紫外线, 尤其是波长在 300nm以下的紫外线。 该石英玻璃基板或者蓝宝石基板 使紫外线有机会透过基板本身射出, 减少被灯丝本身吸收, 增加紫外光射出。 [0033] In some other embodiments, the material of the substrate 100 is preferably quartz glass or sapphire, forming Quartz glass substrate or sapphire substrate. The quartz glass substrate or the sapphire substrate can transmit ultraviolet rays well, especially ultraviolet rays having a wavelength of 300 nm or less. The quartz glass substrate or the sapphire substrate gives the ultraviolet light a chance to be emitted through the substrate itself, reducing absorption by the filament itself and increasing ultraviolet light emission.
[0034] 本实施例中, 该紫外 LED芯片 300可以采用三种方式固定在基板 100上。 第一种 是采用导电条的形式固定和电连接该紫外 LED芯片 300, 这样就不需要金线连接 , 降低成本和提高光效。 第二种是采用固晶区及铝反光薄片固定和电连接该紫 外 LED芯片 300, 也可以不需要金线。 第三种是采用导电条和固晶区相结合, 也 可以不需要金线。 [0034] In this embodiment, the ultraviolet LED chip 300 can be fixed on the substrate 100 in three ways. The first is to fix and electrically connect the UV LED chip 300 in the form of a conductive strip, so that no gold wire connection is required, which reduces cost and improves light efficiency. The second is to fix and electrically connect the ultraviolet LED chip 300 with a solid crystal region and an aluminum reflective sheet, and it is also possible to eliminate the need for a gold wire. The third is to use a combination of a conductive strip and a solid crystal region, or a gold wire.
[0035] 本实施例优选该紫外灯丝中的紫外 LED芯片 300数量是多个, 例如 5颗或者 10颗 , 根据需要自行设定。 上述第二和第三种固定方式中, 该基板 100上设置有与该 紫外 LED芯片 300数量相一致的固晶区。 图 5是本发明实施例的紫外灯丝立体示意 图。 请参照图 5, 该基板 100上设置有两个固晶区 130, 固晶区中设置有正极连接 块和负极连接块 (图中未示出) 。 该紫外 LED芯片 300位于该固晶区 130中, 该紫 外 LED芯片 300的正极和负极分别与该正极连接块和负极连接块固定且电连接。 为了使两两该紫外 LED芯片 300之间形成电通路, 本实施优选采用铝反光薄片 230 设置在两两紫外 LED芯片 300之间。 该铝反光薄片 230起到导电和反射紫外光的目 的。 该铝反光薄片 230的宽度与该基板 100—致, 长度大于两个固晶区 130之间的 间距, 形成拱形, 类似拱桥, 更容易反射紫外光。 在某些实施例中, 可以采用 第三导电条替代该铝反光薄片 230, 即, 该固晶区 130之间该第三导电条电连接 。 该第三导电条可以和该固晶区 130同吋制作完成, 节省成本, 也可以使用金属 沉积技术生长制成。 本实施例优选该第三导电条的材料为铝, 具有较好的紫外 反光能力。  [0035] In this embodiment, the number of the ultraviolet LED chips 300 in the ultraviolet filament is preferably plural, for example, 5 or 10, and is set as needed. In the above second and third fixing modes, the substrate 100 is provided with a die bonding region corresponding to the number of the ultraviolet LED chips 300. Fig. 5 is a perspective view showing the ultraviolet filament of the embodiment of the present invention. Referring to FIG. 5, the substrate 100 is provided with two die bonding regions 130, and a positive electrode connection block and a negative electrode connection block (not shown) are disposed in the die bonding region. The ultraviolet LED chip 300 is located in the die bonding region 130. The positive and negative electrodes of the ultraviolet LED chip 300 are fixed and electrically connected to the positive electrode connection block and the negative electrode connection block, respectively. In order to form an electrical path between the two ultraviolet LED chips 300, the present embodiment preferably employs an aluminum reflective sheet 230 disposed between the two ultraviolet LED chips 300. The aluminum reflective sheet 230 serves to conduct and reflect ultraviolet light. The width of the aluminum reflective sheet 230 is the same as that of the substrate 100, and the length is greater than the spacing between the two solid crystal regions 130, forming an arch shape, similar to an arch bridge, which is more likely to reflect ultraviolet light. In some embodiments, the third conductive strip can be replaced with a third conductive strip, i.e., the third conductive strip is electrically connected between the die attach regions 130. The third conductive strip can be fabricated in the same manner as the die bonding region 130, is cost effective, and can also be grown using metal deposition techniques. In this embodiment, it is preferable that the material of the third conductive strip is aluminum, which has better ultraviolet light reflecting ability.
[0036] 本实施例的紫外灯丝优选在该陶瓷基板 100上设置有彼此分离的第一导电条 210 和第二导电条 220。 该第一导电条 210和第二导电条 220彼此独立不相连接。 该第 一导电条 210布满该基板 100的一侧, 该第二导电条 220布满该基板 100的另一侧 。 该第一导电条 210通过电极 241与外部电连接, 该第二导电条 220通过电极 242 与外部电连接。 采用第一导电条 210和第二导电条 220的设计, 可以省略固晶区 的制作, 因为该紫外 LED芯片 300的正负极分别可以固定并电连接在第一导电条 2 10和第二导电条 220上。 因此, 此设计可以放置多个该紫外 LED芯片 300, 不受固 晶区的限制。 第一导电条 210用于与紫外 LED芯片 300的正极电连接, 该第二导电 条 220与该紫外 LED芯片 300的负极电连接。 该第一导电条 210和第二导电条 220可 以采用丝印的方式形成。 该第一导电条 210和第二导电条 220材质为导电银浆。 该第一导电条 210和第二导电条 220也可以通过金属沉积的方式在该陶瓷基板 100 的表面形成 (即形成两个金属层) 。 例如可以采用磁控溅射的方法沉积。 金属 层与该紫外 LED芯片 300电极的连接可以采用共晶的形式完成。 该紫外 LED芯片 3 00形成在该第一导电条 210和第二导电条 220上, 该紫外 LED芯片 300的下面是空 的, 方便空气或者其他气体流通, 有利于散热。 [0036] The ultraviolet filament of the present embodiment is preferably provided with a first conductive strip 210 and a second conductive strip 220 separated from each other on the ceramic substrate 100. The first conductive strip 210 and the second conductive strip 220 are independent of each other. The first conductive strip 210 covers one side of the substrate 100, and the second conductive strip 220 covers the other side of the substrate 100. The first conductive strip 210 is electrically connected to the outside through an electrode 241, and the second conductive strip 220 is electrically connected to the outside through the electrode 242. The design of the first conductive strip 210 and the second conductive strip 220 can eliminate the fabrication of the solid crystal region, because the positive and negative electrodes of the ultraviolet LED chip 300 can be fixed and electrically connected to the first conductive strip 2, respectively. 10 and the second conductive strip 220. Therefore, this design can place a plurality of the ultraviolet LED chips 300 without being limited by the solid crystal region. The first conductive strip 210 is electrically connected to the positive electrode of the ultraviolet LED chip 300, and the second conductive strip 220 is electrically connected to the negative electrode of the ultraviolet LED chip 300. The first conductive strip 210 and the second conductive strip 220 may be formed by silk screen printing. The first conductive strip 210 and the second conductive strip 220 are made of conductive silver paste. The first conductive strip 210 and the second conductive strip 220 may also be formed on the surface of the ceramic substrate 100 by metal deposition (ie, two metal layers are formed). For example, it can be deposited by magnetron sputtering. The connection of the metal layer to the electrodes of the UV LED chip 300 can be accomplished in the form of a eutectic. The ultraviolet LED chip 300 is formed on the first conductive strip 210 and the second conductive strip 220. The underside of the ultraviolet LED chip 300 is empty, which facilitates the circulation of air or other gases, and is favorable for heat dissipation.
[0037] 该紫外 LED芯片 300优选为波长小于 300nm的深紫外 LED芯片, 进一步优选该紫 外 LED芯片 300是 240nm至 290nm的深紫外 LED芯片。 该紫外 LED芯片 300是指没 有经过封装的裸晶, 请参照图 3, 该裸晶 (该紫外 LED芯片 300) 包括发光区 330 和与发光区 330电连接的正电极 310和负电极 320。 该发光区 330包括蓝宝石衬底 和依次形成于蓝宝石衬底上的 N型半导体层、 发光层和 P型半导体层。 本实施例 优选该紫外 LED芯片 300为倒装芯片, 方便与第一导电条 210和第二导电条 220电 连接。 [0037] The ultraviolet LED chip 300 is preferably a deep ultraviolet LED chip having a wavelength of less than 300 nm, and further preferably the ultraviolet LED chip 300 is a deep ultraviolet LED chip of 240 nm to 290 nm. The ultraviolet LED chip 300 refers to a die that is not packaged. Referring to FIG. 3, the die (the UV LED chip 300) includes a light emitting region 330 and a positive electrode 310 and a negative electrode 320 electrically connected to the light emitting region 330. The light-emitting region 330 includes a sapphire substrate and an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer which are sequentially formed on the sapphire substrate. In this embodiment, the ultraviolet LED chip 300 is preferably a flip chip, and is electrically connected to the first conductive strip 210 and the second conductive strip 220.
[0038] 本实施例的紫外灯丝方便集成多个紫外 LED芯片 300, 具有较高的通用性和适 用性。  [0038] The ultraviolet filament of the embodiment facilitates integration of a plurality of ultraviolet LED chips 300, and has high versatility and applicability.
本发明的实施方式 Embodiments of the invention
[0039] 实施例二 [0039] Embodiment 2
[0040] 图 4是本发明实施例二的紫外灯丝横截面结构示意图。 请参照图 4, 本实施例的 紫外灯丝与实施例一的区别在于: 在紫外 LED芯片 300的至少一侧设置有至少一 个紫外光反射体 150。 该紫外光反射体 150形状为锥体、 柱体以及球体中的一种 或者多种。 锥体可以为圆锥体、 四面体、 多面锥体等等锥体。 该柱体可以为长 条形柱体、 圆柱体、 多面柱体以及不规则的柱体。 该球体可以为 3/4球体、 1/2球 体或者完整球体。 本实施例优选该该紫外光反射体 150形状为锥体, 方便光的射 出。 [0041] 该紫外光反射体 150可以有效提出该紫外 LED芯片 300侧面发出的紫外光, 提升 正面紫外光的出光效率。 4 is a schematic cross-sectional structural view of an ultraviolet filament according to a second embodiment of the present invention. Referring to FIG. 4, the ultraviolet filament of the embodiment differs from the first embodiment in that at least one ultraviolet light reflector 150 is disposed on at least one side of the ultraviolet LED chip 300. The ultraviolet light reflector 150 is shaped into one or more of a cone, a cylinder, and a sphere. The cone can be a cone, a tetrahedron, a faceted cone, and the like. The cylinder may be an elongated cylinder, a cylinder, a multi-faceted cylinder, and an irregular cylinder. The sphere can be a 3/4 sphere, a 1/2 sphere or a complete sphere. In this embodiment, the ultraviolet light reflector 150 is preferably in the shape of a cone to facilitate light emission. [0041] The ultraviolet light reflector 150 can effectively raise the ultraviolet light emitted from the side of the ultraviolet LED chip 300, and improve the light extraction efficiency of the front ultraviolet light.
[0042] 实施例三 Embodiment 3
[0043] 图 6是本发明实施例三的紫外灯丝立体示意图。 请参照图 6, 本实施例的紫外灯 丝与实施例 1的区别在于: 该基板 100包括基体 110以及由该基体 110两侧边向上 延伸出的侧壁 120。 该紫外 LED芯片 300位于该基体上。 优选该紫外 LED芯片 300 的上表面与该侧壁 120的上表面齐平, 这样不会影响出光。 进一步, 优选该侧壁 120的内侧面 121与该基体 110的夹角大于 125度小于 165度, 优选为 135度, 这样 有利于反射该紫外 LED芯片 300的侧面出光。 为了使该基板 100具有反射紫外光的 能力, 优选该基板为铝质材料制成或者在该基板上镀有铝薄膜。  6 is a perspective view of an ultraviolet filament according to a third embodiment of the present invention. Referring to FIG. 6, the ultraviolet filament of the present embodiment is different from the first embodiment in that the substrate 100 includes a base 110 and sidewalls 120 extending upward from both sides of the base 110. The ultraviolet LED chip 300 is located on the substrate. Preferably, the upper surface of the ultraviolet LED chip 300 is flush with the upper surface of the side wall 120 so as not to affect the light output. Further, it is preferable that the angle between the inner side surface 121 of the side wall 120 and the base 110 is greater than 125 degrees and less than 165 degrees, preferably 135 degrees, which is advantageous for reflecting the side light of the ultraviolet LED chip 300. In order for the substrate 100 to have the ability to reflect ultraviolet light, it is preferred that the substrate be made of an aluminum material or that the substrate be plated with an aluminum film.
[0044] 实施例四  [0044] Embodiment 4
[0045] 本发明实施例还提供一种紫外灯丝灯, 该紫外灯丝灯包括上述紫外灯丝。  [0045] Embodiments of the present invention also provide an ultraviolet filament lamp, which comprises the above-mentioned ultraviolet filament.
[0046] 图 7是本发明实施例的紫外灯丝球泡灯结构示意图。 请参照图 7, 本实施例的紫 外灯丝灯为紫外灯丝球泡灯, 该球泡灯包括若干所述紫外灯丝 20、 透紫外光的 罩体 70和灯头 50, 该罩体 70为球泡状罩体, 该罩体 70内设有支架 60, 该紫外灯 丝 20安装在该支架 60上, 该紫外灯丝 20与该灯头 50电连接, 该灯头 50和该罩体 7 0形成密封空间。 该灯头 50具有与外部电连接和用于固定的螺纹结构 80。 7 is a schematic structural view of an ultraviolet filament bulb lamp according to an embodiment of the present invention. Referring to FIG. 7, the ultraviolet filament lamp of the embodiment is an ultraviolet filament bulb, and the bulb includes a plurality of the ultraviolet filament 20, a UV-transmissive cover 70 and a base 50, and the cover 70 is in the form of a bulb. The cover body 70 is provided with a bracket 60. The ultraviolet filament 20 is mounted on the bracket 60. The ultraviolet filament 20 is electrically connected to the base 50. The base 50 and the cover 70 form a sealed space. The base 50 has a threaded structure 80 that is electrically connected to the outside and that is fixed.
[0047] 图 8是本发明实施例的紫外灯丝灯管结构示意图。 请参照图 8, 本实施例的紫外 灯丝灯为紫外灯丝灯管。 该紫外灯丝灯管包括若干上述紫外灯丝 20、 条形透紫 外光的壳体 30、 条形热沉 10和两个灯头 40, 该灯头 40与该壳体 30形成密封空间 , 该紫外灯丝 20均匀地设置在该条形热沉 10上, 该条形热沉 10位于该密封空间 内固定在该灯头 40上。 8 is a schematic structural view of an ultraviolet filament lamp according to an embodiment of the present invention. Referring to Figure 8, the ultraviolet filament lamp of this embodiment is an ultraviolet filament lamp. The ultraviolet filament lamp comprises a plurality of the above-mentioned ultraviolet filaments 20, a strip-shaped ultraviolet-transmissive housing 30, a strip-shaped heat sink 10 and two bases 40. The base 40 forms a sealed space with the housing 30, and the ultraviolet filament 20 is evenly distributed. The strip heat sink 10 is disposed on the strip heat sink 10, and the strip heat sink 10 is fixed on the lamp cap 40 in the sealed space.
工业实用性  Industrial applicability
[0048] 本发明通过紫外 LED芯片固定在基板上形成紫外灯丝, 并由紫外灯丝形成紫外 灯丝灯, 实现紫外灯丝灯全角度发射紫外光, 满足不同场合的应用, 提高了紫 外 LED芯片的适用性。 综上所述, 本发明申请的主题能够在产业上制造或生产, 并且能够产生积极效果。  [0048] The invention is fixed on the substrate by the ultraviolet LED chip to form an ultraviolet filament, and the ultraviolet filament lamp is formed by the ultraviolet filament, so that the ultraviolet filament lamp emits ultraviolet light at a full angle, which satisfies the application of different occasions, and improves the applicability of the ultraviolet LED chip. . In summary, the subject matter of the present application can be manufactured or produced industrially and can produce positive effects.

Claims

权利要求书  Claim
一种紫外灯丝, 其特征在于, 包括基板和紫外 LED芯片, 所述紫外 L ED芯片固定在所述基板上。 An ultraviolet filament characterized by comprising a substrate and an ultraviolet LED chip, the ultraviolet LED chip being fixed on the substrate.
如权利要求 1所述的紫外灯丝, 其特征在于, 所述基板上设置有彼此 分离的第一导电条和第二导电条; 所述紫外 LED芯片的正极和负极分 别与所述第一导电条和第二导电条固定且电连接。 The ultraviolet filament according to claim 1, wherein the substrate is provided with a first conductive strip and a second conductive strip separated from each other; and a positive electrode and a negative electrode of the ultraviolet LED chip are respectively connected to the first conductive strip And the second conductive strip is fixed and electrically connected.
如权利要求 1所述的紫外灯丝, 其特征在于, 所述基板上设置有固晶 区; 所述固晶区中具有正极连接块和负极连接块; 所述紫外 LED芯片 的正极和负极分别与所述正极连接块和负极连接块固定且电连接。 如权利要求 3所述的紫外灯丝, 其特征在于, 所述基板具有若干所述 固晶区, 所述固晶区之间通过第三导电条电连接。 The ultraviolet filament according to claim 1, wherein the substrate is provided with a solid crystal region; the solid crystal region has a positive electrode connecting block and a negative electrode connecting block; and the positive electrode and the negative electrode of the ultraviolet LED chip are respectively The positive electrode connection block and the negative electrode connection block are fixed and electrically connected. The ultraviolet filament according to claim 3, wherein said substrate has a plurality of said die bonding regions, and said die bonding regions are electrically connected by a third conductive strip.
如权利要求 3所述的紫外灯丝, 其特征在于, 所述基板具有若干所述 固晶区, 所述固晶区之间通过铝反光薄片电连接。 The ultraviolet filament according to claim 3, wherein said substrate has a plurality of said crystal-crystalline regions, and said crystal-crystalline regions are electrically connected by an aluminum reflective sheet.
如权利要求 2或者 3或者 4所述的紫外灯丝, 其特征在于, 所述紫外 LEThe ultraviolet filament according to claim 2 or 3 or 4, wherein said ultraviolet LE
D芯片的至少一侧设置有至少一个紫外光反射体。 At least one side of the D chip is provided with at least one ultraviolet light reflector.
如权利要求 6所述的紫外灯丝, 其特征在于, 所述紫外光反射体形状 为锥体、 柱体以及球体中的一种或者多种。 The ultraviolet filament according to claim 6, wherein the ultraviolet light reflector is in the form of one or more of a cone, a cylinder, and a sphere.
如权利要求 1所述的紫外灯丝, 其特征在于, 所述基板包括基体以及 由所述基体两侧边向上延伸出的侧壁。 The ultraviolet filament according to claim 1, wherein said substrate comprises a base body and side walls extending upward from both side edges of said base body.
如权利要求 8所述的紫外灯丝, 其特征在于, 所述侧壁的内侧面与所 述基体的夹角大于 125度小于 165度。 The ultraviolet filament according to claim 8, wherein an angle between an inner side surface of said side wall and said base body is greater than 125 degrees and less than 165 degrees.
如权利要求 1或者 8或者 9所述的紫外灯丝, 其特征在于, 所述基板上 设置有紫外光反射层。 The ultraviolet filament according to claim 1 or 8 or 9, wherein the substrate is provided with an ultraviolet light reflecting layer.
如权利要求 1或者 8或者 9所述的紫外灯丝, 其特征在于, 所述基板为 石英玻璃基板或者蓝宝石基板或者铝质基板; 所述铝质基板上设置有 一层紫外光的绝缘透射薄膜。 The ultraviolet filament according to claim 1 or 8 or 9, wherein the substrate is a quartz glass substrate or a sapphire substrate or an aluminum substrate; and the aluminum substrate is provided with an ultraviolet transparent insulating film.
一种紫外灯丝灯, 其特征在于, 包括权利要求 1至 11任一项所述的紫 外灯丝。 [权利要求 13] 如权利要求 12所述的紫外灯丝灯, 其特征在于, 所述紫外灯丝灯为球 泡灯。 An ultraviolet filament lamp comprising the ultraviolet filament of any one of claims 1 to 11. [Claim 13] The ultraviolet filament lamp according to claim 12, wherein the ultraviolet filament lamp is a bulb lamp.
[权利要求 14] 如权利要求 13所述的紫外灯丝灯, 其特征在于, 包括若干所述紫外灯 丝、 透紫外光的罩体和灯头, 所述罩体为球泡状罩体, 所述罩体内设 有支架, 所述紫外灯丝安装在所述支架上, 所述紫外灯丝与所述灯头 电连接, 所述灯头和所述罩体形成密封空间。  The ultraviolet filament lamp of claim 13 , comprising: a plurality of the ultraviolet filaments, a UV-transmissive cover and a lamp cap, wherein the cover is a bulb-like cover, the cover A bracket is disposed in the body, the ultraviolet filament is mounted on the bracket, and the ultraviolet filament is electrically connected to the lamp cap, and the lamp cap and the cover body form a sealed space.
[权利要求 15] 如权利要求 12所述的紫外灯丝灯, 其特征在于, 所述紫外灯丝灯为紫 外灯丝灯管。  The ultraviolet filament lamp according to claim 12, wherein the ultraviolet filament lamp is a violet filament lamp.
[权利要求 16] 如权利要求 15所述的紫外灯丝灯, 其特征在于, 包括若干所述紫外灯 丝、 条形透紫外光的壳体、 条形热沉和两个灯头, 所述灯头与所述壳 体形成密封空间, 所述紫外灯丝均匀地设置在所述条形热沉上, 所述 条形热沉位于所述密封空间内固定在所述灯头上。  [Claim 16] The ultraviolet filament lamp according to claim 15, comprising a plurality of said ultraviolet filaments, a strip-shaped ultraviolet-transmissive housing, a strip-shaped heat sink and two bases, said lamp holder and said The housing forms a sealed space, and the ultraviolet filament is uniformly disposed on the strip-shaped heat sink, and the strip-shaped heat sink is fixed on the base in the sealed space.
PCT/CN2017/071035 2016-04-21 2017-01-13 Uv filament lamp WO2017181751A1 (en)

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