WO2020244490A1 - Carte de circuit de source de lumière et ampoule à del à faible génération de chaleur - Google Patents

Carte de circuit de source de lumière et ampoule à del à faible génération de chaleur Download PDF

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Publication number
WO2020244490A1
WO2020244490A1 PCT/CN2020/093836 CN2020093836W WO2020244490A1 WO 2020244490 A1 WO2020244490 A1 WO 2020244490A1 CN 2020093836 W CN2020093836 W CN 2020093836W WO 2020244490 A1 WO2020244490 A1 WO 2020244490A1
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WO
WIPO (PCT)
Prior art keywords
light source
led
circuit board
circuit substrate
source circuit
Prior art date
Application number
PCT/CN2020/093836
Other languages
English (en)
Chinese (zh)
Inventor
史杰
Original Assignee
史杰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 史杰 filed Critical 史杰
Publication of WO2020244490A1 publication Critical patent/WO2020244490A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the field of energy-saving technology, specifically the field of LED lighting technology, and particularly refers to a light source circuit board and a low-heat LED bulb.
  • LED circuit board bulbs on the market mostly use plate-shaped aluminum substrates attached to the lamp body (as shown in Figure 1).
  • the current on a single light source chip is relatively large, usually greater than> 30mA, so the heat generation and light decay are large, which affects the life of the bulb.
  • the size of the lamp body is usually made larger, resulting in high cost, and the luminous body is basically unshaped and unsightly.
  • the filament lamp (as shown in Figure 2) uses glue to encapsulate the chip and leads, and the light source heats more concentratedly.
  • the encapsulated straight filament has no exposed heat sink, which makes it difficult to dissipate heat, which affects the bulb life.
  • the purpose of the present invention is to provide a light source circuit board and a low-heat LED bulb to solve the problem that the existing bulbs use LED light sources to generate large heat and affect the service life of the bulbs.
  • a light source circuit board includes a circuit substrate and an LED group light source integrated and packaged by a plurality of LED chips;
  • the LED group light source is arranged on the circuit substrate;
  • a plurality of LED chips in the LED group light source are sealed and mounted with phosphor-containing silica gel as the LED group light source.
  • the circuit substrate adopts a copper substrate or an aluminum substrate, and a reflective material layer or a graphene material layer is coated on the surface of the circuit substrate.
  • a graphene material layer is coated on the non-light source covering heat dissipation surface, so that the temperature of the LED chip can be increased by heat transfer and then radiation.
  • the circuit substrate includes a circuit substrate body and a plurality of LED chip mounting boards extending outward along one side of the circuit substrate body.
  • the circuit substrate body can be bent.
  • each group of LED light sources there are two or more LED chips connected in parallel and mounted on the LED group light source with phosphor-filled silica gel; a plurality of LED group light sources are arranged in series on the circuit substrate .
  • the working current of each LED chip is less than 20mA.
  • the LED chip is a flip-chip LED chip or a front-mounted LED chip. After mounting, a drop of phosphorous silica gel is added for color matching and curing, or a CSP chip is directly mounted, and there is no need to add a drop of phosphorous silica gel after mounting.
  • a low-heat LED bulb using any one of the above light source circuit boards, and further comprising a glass bulb, a lamp holder and a driving module;
  • the light source circuit board is installed on the bracket in the glass bulb or on the lamp body;
  • the glass bulb is fixedly connected to the lamp holder, and the lamp holder is provided with a lamp holder; the driving module is disposed in the lamp holder; the lamp holder is electrically connected with the driving module, and the driving module is The light source circuit board is electrically connected.
  • the glass bulb is filled with protective and hot gas.
  • This technical solution uses two or more LED chips to integrate the packaged light source through the LED group light source particles, and the shunt circuit makes the single LED chip in the LED group light source work current ⁇ 20mA, less heat generation, and low working temperature.
  • Figure 1 is a schematic diagram of a traditional LED circuit board bulb
  • Figure 2 is a schematic diagram of an LED straight wire bulb
  • Figure 3a is a schematic diagram of the structure of the light source circuit board of the present invention.
  • Figure 3b is a front view of the circuit substrate in Figure 3a;
  • Figure 3c is a top view of the circuit substrate in Figure 3a;
  • Figure 4a is a schematic diagram of another light source circuit board structure of the present invention.
  • Figure 4b is a cross-sectional view of Figure 4a
  • Figure 4c is a top view of Figure 4a
  • Fig. 5 is an expanded schematic diagram of the light source circuit board of the present invention.
  • Fig. 6 is an enlarged circuit diagram at I of Fig. 5;
  • Fig. 7 is another exploded schematic diagram of the light source circuit board of the present invention.
  • FIG. 8 is an enlarged circuit diagram at II of FIG. 7;
  • Fig. 9 is another expanded schematic diagram of the light source circuit board of the present invention.
  • Figure 10 is a schematic diagram of a low-heat LED bulb of the present invention.
  • Figure 11 is a schematic diagram of another low-heat LED bulb of the present invention.
  • the application provides a light source circuit board, as shown in FIG. 3a, which includes a circuit substrate 1 and a group of light sources 2 of LEDs integrated and packaged by a plurality of LED chips.
  • the LED group light source 2 is arranged on a circuit substrate; in this embodiment, the circuit substrate may be a copper substrate, an aluminum substrate or an FPC soft substrate, and a graphene material layer is coated on the circuit substrate.
  • the circuit substrate 1 includes a circuit substrate body 101 and a plurality of LED chip mounting boards 102 extending outward along one side of the circuit substrate body. A gap is provided between two adjacent LED chip mounting boards, as shown in FIG. 5.
  • the circuit substrate body can be bent, as shown in FIGS. 3a to 4c.
  • the present application provides a light source circuit board, which is a light source circuit board with a power of 5W, as shown in FIG. 7 and FIG. 8, including a circuit substrate and an LED group light source 200 integrated and packaged by a plurality of LED chips.
  • the LED group light source 200 is arranged on a circuit substrate; in this embodiment, the circuit substrate may be a copper substrate, an aluminum substrate or an FPC soft substrate, and a graphene material layer is coated on the circuit substrate.
  • the circuit substrate includes a circuit substrate body 110 and a plurality of LED chip mounting boards 120 extending outward along one side of the circuit substrate body. A gap is provided between two adjacent LED chip mounting boards, as shown in FIG. 7.
  • the present application provides a light source circuit board, as shown in FIG. 9, including a circuit substrate and an LED group light source 020 integrated and packaged by a plurality of LED chips 021.
  • the LED group light source is arranged on the circuit substrate; in this embodiment, the circuit substrate can be a copper substrate or an aluminum substrate or an FPC soft substrate, and a reflective material layer 012 is provided on the circuit substrate.
  • the reflective material can be a metal material or a non-metal material , Wherein the metal material includes at least one or more alloy materials composed of copper, silver, zinc, aluminum, nickel, etc.
  • the circuit substrate includes a circuit substrate body 010 and a plurality of LED chip mounting boards 011 extending outward along one side of the circuit substrate body, and a gap is provided between two adjacent LED chip mounting boards.
  • the LED group light source three LED chips are connected in parallel and mounted with phosphor-containing silica gel as the LED group light source, and then through the circuit 013 design of the circuit substrate, the light source circuit board composed of 30 LED group light sources in series, Through the diversion.
  • the circuit makes the operating current of a single LED chip in each LED group light source ⁇ 20mA, less heat generation, and low operating temperature.
  • the light source circuit board is coated with a graphene material layer on the circuit substrate on the non-light source covering heat dissipation surface to increase the heat dissipation path of the LED chip temperature by first transferring heat and then radiating.
  • each group of LED light sources two or more LED chips are connected in parallel and mounted with phosphor-containing silica gel to form the LED group light source; multiple LED group light sources are arranged in series on the circuit substrate.
  • the introduction of three LED chips in parallel and four LED chips in parallel is used in Examples 1 to 3, it does not mean that the association of two LED chips or more than four LED chips is not introduced, such as five LED chips, six LED chips.
  • the technical solution of parallel connection of LED chips, etc. is just because it is impossible to exhaustively list the number of LED chips, and give examples.
  • the working current of each LED chip is less than 20 mA.
  • the LED chip is a flip-chip LED chip or a front-mounted LED chip. After the mounting, a drop of phosphor-containing silica gel is added for color matching and curing, or a CSP chip is directly mounted, and there is no need to add a drop tape after mounting Phosphor silicone.
  • This application provides a low-heat LED bulb, as shown in FIG. 10, using the light source circuit board 02 in any one of the foregoing embodiments 1 to 3, and further including a glass bulb 01, a lamp holder, and a driving module.
  • the light source circuit board is installed on the bracket 05 in the glass bulb 01; in the embodiments of the present application, the glass bulb is a hollow glass bulb, and there is no specific requirement on the shape of the glass bulb, as long as its function is the same as that of the glass bulb.
  • the technical solution of the present application is realized. Therefore, the shape of the glass bulb of the present application is not limited to a spherical shape, a candle shape, a tube shape, a pear shape, and a mushroom shape.
  • the glass bulb is fixedly connected with the lamp holder, and the lamp holder is provided with a lamp holder 03; the driving module 04 is arranged in the lamp holder; the lamp holder is electrically connected with the driving module, and the driving module is electrically connected with the light source circuit board.
  • the glass bulb is filled with protective and hot gas to better extend the life of the bulb.
  • the present application provides a low-heat LED bulb, as shown in FIG. 11, using the light source circuit board 002 in any one of the foregoing embodiments 1 to 3, and further including a glass bulb 001, a lamp holder 004 and a driving module.
  • the light source circuit board is pasted on the real lamp body 003 with thermally conductive glue, and the driver module is welded to the light source circuit board with a wire passing through the real lamp body.
  • the lamp holder 004 and the lamp holder 005 are equipped to form a low-heat LED bulb.

Abstract

La présente invention concerne une carte de circuit de source de lumière et une ampoule à DEL à faible génération de chaleur. La carte de circuit de source de lumière comprend un substrat de circuit et une source de lumière à groupe de DEL encapsulée d'un seul tenant par une pluralité de puces de DEL. La source de lumière à groupe de DEL est disposée sur le substrat de circuit et la pluralité de puces de DEL dans la source de lumière à groupe de DEL forment la source de lumière à groupe de DEL au moyen d'une étanchéité et d'un montage à l'aide d'un gel de silice avec de la poudre fluorescente. Dans la présente solution technique, une particule de source de lumière à groupe de DEL utilise au moins deux puces de DEL pour intégrer et encapsuler la source de lumière, de sorte que le courant de fonctionnement d'une puce de DEL dans la source de lumière à groupe de DEL soit inférieur à 20 mA au moyen d'un circuit de dérivation, ayant une faible génération de chaleur et une basse température de fonctionnement. Comme la chaleur générée par la source de lumière est fortement réduite, il est possible de fabriquer un petit substrat de dissipation de chaleur, ce qui permet de faciliter la réduction des coûts.
PCT/CN2020/093836 2019-06-03 2020-06-02 Carte de circuit de source de lumière et ampoule à del à faible génération de chaleur WO2020244490A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910477514.9A CN110173631A (zh) 2019-06-03 2019-06-03 一种光源线路板及低发热led灯泡
CN201910477514.9 2019-06-03

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WO2020244490A1 true WO2020244490A1 (fr) 2020-12-10

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CN (1) CN110173631A (fr)
WO (1) WO2020244490A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110173631A (zh) * 2019-06-03 2019-08-27 史杰 一种光源线路板及低发热led灯泡

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CN202834811U (zh) * 2012-04-26 2013-03-27 浙江锐迪生光电有限公司 一种4π出光的LED灯泡
CN103322437A (zh) * 2012-03-22 2013-09-25 赵依军 具有强散热能力的发光二极管球泡灯及其制造方法
CN203521408U (zh) * 2013-11-06 2014-04-02 广州硅能照明有限公司 基于镀银铝基板的led光源
CN203784711U (zh) * 2014-04-21 2014-08-20 史杰 采用折弯cob封装led灯丝的灯泡
CN105135258A (zh) * 2015-08-20 2015-12-09 深圳市栋梁光电科技有限公司 Led灯带
CN204879582U (zh) * 2015-08-20 2015-12-16 浙江阳光照明电器集团股份有限公司 一种led球泡灯
CN204962343U (zh) * 2015-09-28 2016-01-13 苏州紫昱天成光电有限公司 一种led灯泡
CN205746248U (zh) * 2016-06-17 2016-11-30 东莞市飞扬灯饰科技有限公司 一种低压led双色聪明灯
CN206176124U (zh) * 2016-11-22 2017-05-17 宁波阳铭星光电子科技有限公司 Led灯条及采用该led灯条的led灯
US9989219B2 (en) * 2016-10-14 2018-06-05 David R. Hall Light bulb with a motor
US20180280717A1 (en) * 2017-03-30 2018-10-04 Kenneth Ceder Method and Apparatus for Improving Eye Health with Near Infrared and Visible Light
CN110173631A (zh) * 2019-06-03 2019-08-27 史杰 一种光源线路板及低发热led灯泡

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WO2013135153A1 (fr) * 2012-03-12 2013-09-19 浙江锐迪生光电有限公司 Colonne d'éclairage à del et lampe à del l'utilisant
CN203784684U (zh) * 2014-03-05 2014-08-20 单桂桥 Led灯泡
CN204254320U (zh) * 2014-11-10 2015-04-08 杨晓丽 发光二极管封装结构及发光器件
CN205782758U (zh) * 2016-06-01 2016-12-07 山东晶泰星光电科技有限公司 带热辐射材料的led灯丝及led灯丝球泡

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Publication number Priority date Publication date Assignee Title
CN103322437A (zh) * 2012-03-22 2013-09-25 赵依军 具有强散热能力的发光二极管球泡灯及其制造方法
CN202834811U (zh) * 2012-04-26 2013-03-27 浙江锐迪生光电有限公司 一种4π出光的LED灯泡
CN203521408U (zh) * 2013-11-06 2014-04-02 广州硅能照明有限公司 基于镀银铝基板的led光源
CN203784711U (zh) * 2014-04-21 2014-08-20 史杰 采用折弯cob封装led灯丝的灯泡
CN105135258A (zh) * 2015-08-20 2015-12-09 深圳市栋梁光电科技有限公司 Led灯带
CN204879582U (zh) * 2015-08-20 2015-12-16 浙江阳光照明电器集团股份有限公司 一种led球泡灯
CN204962343U (zh) * 2015-09-28 2016-01-13 苏州紫昱天成光电有限公司 一种led灯泡
CN205746248U (zh) * 2016-06-17 2016-11-30 东莞市飞扬灯饰科技有限公司 一种低压led双色聪明灯
US9989219B2 (en) * 2016-10-14 2018-06-05 David R. Hall Light bulb with a motor
CN206176124U (zh) * 2016-11-22 2017-05-17 宁波阳铭星光电子科技有限公司 Led灯条及采用该led灯条的led灯
US20180280717A1 (en) * 2017-03-30 2018-10-04 Kenneth Ceder Method and Apparatus for Improving Eye Health with Near Infrared and Visible Light
CN110173631A (zh) * 2019-06-03 2019-08-27 史杰 一种光源线路板及低发热led灯泡

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