CN201100535Y

CN201100535Y - White light LED surface light source module

Info

Publication number: CN201100535Y
Application number: CNU2007201028090U
Authority: CN
Inventors: 崔泽英; 谷青博
Original assignee: PMLED OPTOELECTRONICES Co Ltd
Current assignee: PMLED OPTOELECTRONICES Co Ltd
Priority date: 2007-10-19
Filing date: 2007-10-19
Publication date: 2008-08-13
Anticipated expiration: 2017-10-19

Abstract

The utility model discloses a white-light LED surface light source module which comprises a frame and a wiring board on which low power chips are evenly distributed, wherein the wiring board is fixed on the frame, a glue line is coated on the chips and the wiring board which is positioned in a cavity formed by the frame and the wiring board, and a fluorescent-powder glue line is encapsulated on top of the transparent glue line. The LED chips of the utility model are integrally encapsulated on the wiring board, thus the manufacturing technique link is shortened, and the integrally-encapsulated light source surface is smooth and esthetic, which is convenient for cleaning. The fluorescent substances are positioned on the outermost skin layer of the light source module and far from the chips, thereby receiving little influence from the heat of chips and being convenient for heat rejection, so the higher excitation efficiency can be kept, and light decay is reduced. The per-square-centimeter light-emitting area of the light source of the utility model only needs emitting a luminous flux of less than 51m, so the glare phenomenon is overcome.

Description

White light LED area lighting source module

Technical field

The utility model relates to a kind of light emitting diode, especially a kind of white light LED area lighting source.

Background technology

At present, the encapsulation of small-power white light LEDs is based on Φ 3, Φ 5, Φ 10 or straw hat type, Piranha.The encapsulation of large power white light LED is then to be encapsulated in high-power chip individual particles such as 1W, 3W or many particles on ceramic cartridge or the aluminium base shell.This encapsulating structure is simple, is highly suitable for indicator lamp, the application that flashlight, shot-light, searchlight etc. have emergent light directive property to require.

But, field in the white light high-power applications, as being used for the ambient lighting fields such as operating illumination, field lighting and flood lighting of white light, present large power white light LED product exists also that light efficiency is not high enough, heat dissipation problem, dazzle that optical issue, price problem etc. are many to be difficult to commercial difficulty.

The large power white light LED product has two kinds of packing forms at present, a kind of is to lump together with the many groups of grains of white light LEDs particle (as Φ 3, Φ 5, Φ 10 or straw hat type etc.) that the small-power chip encapsulates, realize adding up of power, tens light sources of forming several watts of little usefulness, many light source products with tens watts of hundreds of compositions.The LED product thermal source that this mode is made disperses to distribute, and heat dissipation problem can be realized originally with lower one-tenth; But because light source is made up of tens even up to a hundred the very high bright spots of light intensity, emission light has high light spot (dazzle point) if be radiated at the not so good body surface of diffuse reflection performance on microcosmic, will feel has many bright spots or even thorn eyespot, and it is unintelligible to cause object to observe; The reflector of aluminum frame is low to the integrated retroreflective efficient of white light in addition, and light loss is bigger, and luminous efficiency is low; The packaged LED lamp of many particles is combined, and the surface configuration complexity is adsorbed dust easily, easy to clean not, and influence attractive in appearance.

Another kind method is to be encapsulated on the low thermal resistance shell with single or many high-power LEDs such as 1W, 3W chip, install large-area fin again additional, so that the high-power chip liberated heat is discharged, reduce the junction temperature of led chip, guarantee the led chip operate as normal.But identical with the shortcoming 1 of last a kind of light source, even have more serious glare, must take the secondary optics measure during as the light source that closely uses; Thermal source concentrates on very little area, and heating power is bigger again, therefore needs extraordinary heat passage of design and bigger cooling surface area.There is the low problem of optical efficiency equally.

At the problem of dazzle, two kinds of methods that adopt are as follows usually:

Method one is to add lid layer mixed light sheet (as transparent panel of frosted glass, anisotropic acrylic board, change light emission angle etc.) on the light source dazzle point intensity to be reduced and emergent ray is dispersed more, and the drawback that this method is brought is the total light flux that has reduced emergent light.And structure becomes complicated, and it is complicated that volume becomes, and cost has increase in various degree.

Method two is to make light source be radiated on the reflector by reflector light emission to be come out again, form diffuse reflection on the reflector surface, emergent ray is dispersed more, this method also has the drawback of the total light flux that has reduced emergent light, and because considered secondary reflection, also can more complicated on the structural design.

In order to address this problem, we utilize the technology of the integrated encapsulation of LED multicore sheet through repeatedly experiment and research, have developed " a kind of white light LED area lighting source module " that be applied to white-light illuminating.

The utility model content

The utility model technical issues that need to address provide the led light source module of the soft free from glare of a kind of light, high-power, high light efficiency.

The technical solution adopted in the utility model is: a kind of white light LED area lighting source module, comprise frame and the wiring board that is evenly equipped with the small-power chip, described wiring board is fixed on the frame, be coated with substratum transparent on wiring board in the cavity of frame and wiring board formation and the chip, on substratum transparent, be packaged with the fluorescent material glue-line.

Wiring board described in the utility model adopts copper-clad plate, and bond pad surface is gold-plated.Adopt aluminium base can reduce the system works temperature, but cost can increase.Bond pad surface nickel plating or naked copper, aluminium also can, preferential select to be difficult for to get rusty, be easy to bonding, material that reflecting rate is high.

The degree of depth of the cavity that frame and wiring board are formed is 6-20mm, substratum transparent thickness is generally greater than 4mm, the thickness of fluorescent material glue-line generally is not more than 2mm, and light that chip sends can be dispersed in before arriving the fluorescent material glue-line on the area than the big hundreds of times of chip list area.

At fluorescent material glue-line outer package matcoveredn, described protective layer is epoxy resin or clear glass or transparent acrylic.

The utility model has compared with prior art been obtained following beneficial effect:

1, the led chip overall package is connected the connection in series-parallel in the circuit board of the single lamp of the bonding of led chip on support and LED and is merged into an operation in the circuit board, has shortened the production technology link, has reduced production cost; And the light source surface smoothing of overall package is attractive in appearance, is convenient to cleaning.

2, small-power chip caloric value is low, can cover the copper layer by wiring board fast calorie spread is arrived whole PCB surface, realizes heat radiation by the PCB surface than the big hundred times of chip area, can effectively reduce the operating temperature of system.General temperature can be controlled at below 50 ℃.Lower junction temperature during chip operation, in the time of can guaranteeing chip operation than higher internal quantum efficiency, thereby obtain than higher luminous efficiency.In addition, because fluorescent material is placed on the outermost top layer of light source block, with the chip chamber distance, it is little influenced by chip heat, is convenient to heat radiation, can keep than higher launching efficiency, reduce light decay.

3, the area of fluorescent material glue-line generally is the hundred times of chip area, and traditional LED encapsulation phosphor gel surface layer only is tens times to tens times of the chip list area.Tradition led light source every square centimeter of light-emitting area need send the above luminous flux of about 1001m, and only need send the luminous flux less than 51m on the light-emitting area of every square centimeter of the utility model light source, so can overcome dazzle.

Description of drawings

Fig. 1 is a structural representation of the present utility model;

The specific embodiment

Below in conjunction with drawings and Examples the utility model is described in further detail.

As shown in Figure 1, the utility model adopts the circuit structure of four groups of series connection, every group of 8 chip parallel connections.Led chip 3 usefulness crystal-bonding adhesives are fixed on the wiring board 2, go between 4 on the bonding, finish circuit and connect.Then wiring board is fixed on the frame 1.Perfusion transparent adhesive tape 5 in the cavity of frame 1 and wiring board 2 formation forms substratum transparent, and the thickness of substratum transparent is 4.5mm, encapsulation fluorescent material glue-line 6 on the substratum transparent 5, and the thickness of fluorescent material glue-line is 1.5mm.Embedding one deck epoxy resin or paste clear glass or transparent acrylic again outside the fluorescent material glue-line.

Wiring board 2 adopts half glass copper-clad plate in the present embodiment, and pad is gold-plated, and pad is gone up white welding resistance outward; Chip adopts blue chip; Frame 1 adopts the fire-retardant engineering material of white PVC; Transparent adhesive tape 5 adopts organic silica gel.

Claims

1, a kind of white light LED area lighting source module, comprise frame and the wiring board that is evenly equipped with the small-power chip, it is characterized in that described wiring board is fixed on the frame, be coated with substratum transparent on wiring board in the cavity of frame and wiring board formation and the chip, on substratum transparent, be packaged with the fluorescent material glue-line.

2, white light LED area lighting source module according to claim 1 is characterized in that: the dark 6-20mm of cavity that described frame and wiring board form, and the thickness of substratum transparent is not less than 4mm, and the thickness of fluorescent material glue-line is not more than 2mm.

3, white light LED area lighting source module according to claim 1 is characterized in that: described wiring board is copper-clad plate.

4, according to claim 1 or 2 or 3 described white light LED area lighting source modules, it is characterized in that: at fluorescent material glue-line outer package matcoveredn.

5, white light LED area lighting source module according to claim 3 is characterized in that: described protective layer is epoxy resin or clear glass or transparent acrylic.