CN103236491A - LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and preparation method thereof - Google Patents
LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and preparation method thereof Download PDFInfo
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Abstract
The invention discloses an LED (light emitting diode) ceramic COB (chip on board) light source fluorescent lamp and a preparation method thereof. A high-heat-conduction ceramic substrate is used for replacing the traditional metal packaging substrate, a multi-chip integration COB chip module applied to a fluorescent lamp bar is additionally used, and therefore the LED ceramic COM light source fluorescent lamp has the advantages of high lighting effect, high reliability and high quality; and a non-isolated power supply and all PC (personal computer) shells can be selected to lower the production cost so as to achieve the best cost performance. According to the LED ceramic COM light source fluorescent lamp disclosed by the invention, when the color temperature is 5700-6300K, a color rendering index exceeds 70, and the whole lamp lighting effect exceeds 1001m/w. The obtained fluorescent lamp has the advantages of low energy consumption, long service life and high lighting effect, and the production and application requirement scan be satisfied.
Description
Technical field
The present invention relates to a kind of LED fluorescent lamp and manufacture method thereof, especially a kind of LED pottery COB light source fluorescent lamp and preparation method thereof.
Background technology
LED is a kind of assembly of being made by semi-conducting material, is the high-performance solid light source that a kind of novel faint electric energy of usefulness just can be luminous.The LED main feature is: the life-span is long, energy consumption is low, colour developing degree height, easy care, volume are little, dc powered, driving voltage are low, light that speed is fast, no stroboscopic, dazzle is few, vibration strength is strong, generate heat less, explosion-proof characteristics such as (no hyperbar assemblies), is one of high-technology field of global tool development prospect in recent years.LED encapsulates owing to structure and complex process, and directly has influence on serviceability and the life-span of LED, is hot research in recent years always, and particularly the focus in the focus is studied in the large power white light LED encapsulation especially.The function of LED encapsulation mainly comprises: 1. mechanical protection, to improve reliability; 2. strengthen heat radiation, to reduce junction temperature of chip, improve the LED performance; 3. optics control improves light extraction efficiency, optimizes beam distribution; 4. power supply management comprises that ac/dc changes, and power supply control etc.The encapsulation step of tradition led chip is mainly: 1, expand crystalline substance, the thickly dotted chip of arranging is removed any be convenient to solid crystalline substance.2, consolidate crystalline substance, then chip is put into the support the inside at frame bottom point conduction/nonconducting glue (whether conducting electricity on chip is that last mo(u)ld bottom half PN junction or left right model PN junction are decided).3, short roasting, chip is not mobile when allowing the glue curing bonding wire.4, bonding wire uses gold thread chip and support conducting.5, before measurement, preliminary test can be bright.6, encapsulating wraps up chip and support with glue.7, long roasting, allow glue curing.8, the back is surveyed, and whether bright the test energy is and whether electrical parameter is up to standard.9, light splitting color separation, color and voltage haply consistent product branch away.10, packing.
The selection of LED method for packing, material, structure and technology is mainly by chip structure, photoelectricity/mechanical property, specifically factor such as application and cost decision.Through 40 years of development, stent-type (Lamp LED), SMD (SMD LED), power-type LED developing stage such as (Power LED) have successively been experienced in the LED encapsulation.Along with the increase of chip power, the demand of solid-state illumination technical development has particularly proposed new, higher requirement to optics, calorifics, electricity and the mechanical structure etc. of LED encapsulation.In order to reduce packaging thermal resistance effectively, improve light extraction efficiency, must adopt the brand-new technology thinking to carry out package design and Design of Luminaires.
COB (Chip On Board) encapsulation is a kind ofly by adhesive or scolder led chip directly to be pasted on the printed circuit board (pcb) plate, realizes the novel encapsulated technology of electrical interconnection between chip and pcb board again by the lead-in wire bonding.The pcb board material has several: 1. hang down unit price FR4,2. high-thermal conductive metal copper base or aluminium base 3. apply the copper ceramic substrate, 4. sintering silver circuit ceramic substrate.The COB technology is mainly used in the LED encapsulation of high-power multiple chips array, compares with SMT, has not only improved package power density greatly, and has reduced packaging thermal resistance (being generally 6-12W/m.K).
Ceramic substrate refers to use silver or silver alloy slurry silk-screen on ceramic substrate, at high temperature is bonded directly to the special process plate on aluminium oxide (AL2Q3) or aluminium nitride (ALN) the ceramic substrate surface (single or double) then.Made substrate has the good electric insulation property, high thermal conduction characteristic, and can make various complex figures as pcb board, have very big current capacity.
Semiconductor lamp will enter the general illumination field, and production cost is first restraining factors.Reduce the cost of semiconductor lamp, must at first consider how to reduce the packaging cost of LED.Traditional LED light fixture way is: led light source discrete device → MCPCB light source module → LED light fixture, and mainly being based on does not have the core light source component that is suitable for and the way of taking, and when not only consuming expenses of labour, and cost is higher.And adopt support as the encapsulation of chip, increase manufacturing step and the cost in lamp source, add the use metal substrate, not proof voltage impact safety hidden danger big (＜600V), support and metal substrate use the polymer insulating film insulation, not only increase thermal resistance and poor chemical stability, add not Nai Gaorere of macromolecule material, can't guarantee the long term life in lamp source.In addition, metal substrate and chip coefficient of thermal expansion differences are too many, the stress fatigue under causing easily that chip is long-term and using and cause dead lamp.So traditional SMD LED light fixture is commonly called as " babysbreath ", the lamp light source solder joint is many, fault is many, dazzle that light is many, light efficiency is low (60-100ml/w), big (〉 3% of light decay).
Summary of the invention
The purpose of this invention is to provide a kind of LED pottery COB light source fluorescent lamp and preparation method thereof, use high heat conducting ceramic substrate to replace traditional metallic packaging substrate, add the integrated COB chip of the multi-chip that is applied on fluorescent lamp bar module, have high light efficiency, highly reliable, high-quality advantage, and can select non-insulating power supply and whole PC shell to reduce production costs, reach best cost performance.
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of the alumina ceramic plate that makes, al nitride ceramic board, aluminium oxide+50% glass dust for use, above with silver paste or silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 0.9-1.1g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, namely.
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1550-1650 ℃ of sintering again; Al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1600-1700 ℃ of sintering; The composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 800-900 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be the bismuth borosilicate glass of 3-15% as adhesive, made in 1 hour through 750-850 ℃ of sintering; Silver paste is that fine silver made through 750-850 ℃ of sintering in 1 hour.
Second step: carry out the integrated COB encapsulation of multi-chip, select a kind of in the composite ceramic substrate of aluminium oxide ceramic substrate that first step makes, aluminium nitride ceramics substrate, aluminium oxide+50% glass dust for use, the chip specification of selecting for use is 1023 chips, and packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of different size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
The model of glass dust is TF-888, and manufacturer is the limited company of being full of of heap of stone.
The manufacturer of 1023 chips is three peace Photoelectric Co., Ltd..
A kind of preparation method of LED pottery COB light source fluorescent lamp, made ceramic substrate has the good electric insulation property in the first step, high thermal conduction characteristic, and can make various complex figures as pcb board, have very big current capacity; The medium and small chip technology of second step is seasoned relatively, and the ceramic substrate that high heat passes coefficient also is convenient to the integrated and heat radiation of chip; Avoided heat conductive silica gel in the third step or bubble appears in the bond plies band in installation process, the light fixture cooling system is conductive coefficient 0.9W/mK simultaneously, can effectively heat be exported to lamp housing.
The present invention initiates and uses ceramic substrate to carry out multi-chip COB package application in fluorescent tube, multiple chips directly can be encapsulated on the ceramic substrate of aluminium oxide and aluminium nitride, directly dispel the heat by ceramic substrate, can not only reduce manufacturing process and the cost thereof of support, also have the heat radiation advantage that reduces thermal resistance.On using, it is simpler and convenient that LED ceramic substrate COB light source module can make the installation of lighting factory produce, can elasticity use and isolate and non-insulating power supply, also can use metal lamp housing such as aluminium or aluminium alloy or all use the PC lamp housing to reduce cost.On producing, the existing processes technology and equipment can be supported the extensive manufacturing of the COB light source module of rate of good quality rate fully.Expansion along with the LED illumination market, the light fixture demand is in quick growth, and we can progressively form the integrated COB light source module of the serial multi-chip of various potteries main product according to the different lamps demands of applications fully, so that large-scale production, the cost performance of raising light fixture.
The present invention adopts ceramic COB encapsulation technology, the design of high efficiency driving power and high heat conduction light fixture cooling system, have multinomial characteristics: 1. high-power integrated COB chip module is compared aspect the effect with monocrystalline LED, do not have many shadows phenomenon, free from glare is realized the making of high-quality bulb or light fixture.2. ruddiness, green glow, blue light, white light can be encapsulated in one, realize that warm light is adjustable to the cold light colour temperature, ruddiness and white light can be encapsulated in one, easily realize more than color rendering index＞85 and 90.3. the easier realization modularization of high-power integrated COB light source module and replaceable function, light fitting shape better designs, the easier design of lamp distribution.4. aspect the making of light source cost, integrated optical source is more or less the same at efficient and monocrystalline aspect the solid brilliant bonding wire, in sealing, and cutting, light splitting etc. are saved great amount of cost at artificial and equipment.5. aspect the light fixture cost, the COB light fixture all is lower than monocrystalline LED light fixture on production cost, and the design of no aluminium base in the design, layout, the process that re-packs have been saved design cost and time, and have saved weldering plate cost and time.6. cross the high temperature Reflow Soldering when aspect reliability, having avoided the weldering plate to the stealth injury that LED causes, avoid bad phenomenon generations such as dead lamp.7. power is big, the well-illuminated height of light, and thermal resistance is little, good heat dissipation.Can accomplish thinness, the configuration design variation can be fit to different specific (special) requirements light fixtures and use.8. light efficiency height, LED pottery COB light source fluorescent lamp product of the present invention be through effect test during at colour temperature 5700-6300K, shows to refer to surpass 70, and whole light is imitated and surpassed 100lm/w, meets the needs of production.
Embodiment:
Embodiment 1:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the alumina ceramic plate that makes for use, above with silver paste silk-screen circuit, the consumption of silver or silver alloy slurry is 0.9g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 12.5mm, namely.
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1550 ℃ of sintering again.
Silver paste is that fine silver made through 750 ℃ of sintering in 1 hour.
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium oxide ceramic substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T8 (Φ 26X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 2:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the alumina ceramic plate that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind and got required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1600 ℃ of sintering again.
Wherein the silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering.
All the other are with embodiment 1.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 3:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the alumina ceramic plate that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 1.1g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, 1650 ℃ of sintering made in 3 hours.
Wherein the silver alloy slurry be fine silver add mass fraction be 15% bismuth borosilicate glass as adhesive, made in 1 hour through 850 ℃ of sintering.
All the other are with embodiment 1.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 4:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the al nitride ceramic board that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 0.9g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1600 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 3% bismuth borosilicate glass as adhesive, made in 1 hour through 750 ℃ of sintering.
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium nitride ceramics substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T5 (Φ 16X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 5:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the al nitride ceramic board that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 12.5mm, namely.
Wherein al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1650 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering.
All the other are with embodiment 4.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 6:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the al nitride ceramic board that makes for use, above with silver paste silk-screen circuit, the consumption of silver or silver alloy slurry is 1.1g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1700 ℃ of sintering.
Silver paste is that fine silver made through 850 ℃ of sintering in 1 hour.
All the other are with embodiment 4.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 7:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of aluminium oxide+50% glass dust that makes for use, above with silver paste silk-screen circuit, the consumption of silver paste is 0.9g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein the composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 800 ℃ of sintering.
Silver paste is that fine silver made through 800 ℃ of sintering in 1 hour.
Second step: carry out the integrated COB of multi-chip encapsulation, select the composite ceramic substrate of aluminium oxide+50% glass dust that first step makes for use, the chip specification of selecting for use is 1023 chips, and packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T8 (Φ 26X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 8:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of aluminium oxide+50% glass dust that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein the composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 850 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering.
All the other are with embodiment 7.
The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
Embodiment 9:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of aluminium oxide+50% glass dust that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.1g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 12.5mm, namely.
Wherein the composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 900 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 15% bismuth borosilicate glass as adhesive, made in 1 hour through 850 ℃ of sintering.
All the other are with embodiment 4.
Embodiment 10:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the alumina ceramic plate that makes for use, above with silver or silver alloy slurry silk-screen circuit, the consumption of silver paste is 0.8g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 12.5mm, namely.
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 6% silica, adding mass fraction again and be 35% alcohol is that 3% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1500 ℃ of sintering again.
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium oxide ceramic substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T5 (Φ 16X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
Embodiment 11:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select the al nitride ceramic board that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 1.2g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1750 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 16% bismuth borosilicate glass as adhesive, made in 1 hour through 700 ℃ of sintering.
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium nitride ceramics substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T5 (Φ 16X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
Embodiment 12:
A kind of preparation method of LED pottery COB light source fluorescent lamp is divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of aluminium oxide+50% glass dust that makes for use, above with silver or silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.3g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely.
Wherein the composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 52% glass dust, adding mass fraction again and be 35% alcohol is that 1% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 950 ℃ of sintering.
Wherein the silver alloy slurry be fine silver add mass fraction be 2% bismuth borosilicate glass as adhesive, made in 1 hour through 900 ℃ of sintering.
Second step: carry out the integrated COB of multi-chip encapsulation, select a kind of in the composite ceramic substrate of aluminium oxide+50% glass dust that first step makes for use, the chip specification of selecting for use is 1023 chips, and packaging technology adopts the COB encapsulation integrated.
Third step carries out the assembling of the fluorescent lamp of T5 (Φ 16X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
Comparative Examples 1:
A kind of LED fluorescent lamp of conventional package, first step, the lamp pearl of making single-chip or multi-chip, the substrate of employing polyphthalamide material.Second step is contained in formation conventional metals lamp bar above the aluminum strip with the lamp bead seal.Third step carries out the assembling of the fluorescent lamp of T8 (Φ 26X1200mm) size, adopts isolated wide pressure (100-265V) driving power, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%.Use aluminum metal to add the fluorescent lamp lamp housing of PC.The fluorescent tube of finishing is through the standard effect test, 25 ℃ of probe temperatures, humidity 65%.
The efficiency ratio of the LED fluorescent tube that each embodiment 1-12 and Comparative Examples 1 make is more as shown in the table:
By last table result as can be seen, the LED that makes in processing range of the present invention pottery COB light source fluorescent lamp product embodiments 1-9 is through effect test during at colour temperature 5700-6300K, show and refer to surpass 70, whole light is imitated and is surpassed 100lm/w, light efficiency is higher than embodiment 10-12 outside processing range and the LED light fixture of conventional package, use power to be lower than the LED light fixture of the conventional package of the outer embodiment 10-12 of processing range, energy saving is better, satisfies the needs of producing and using.
Claims (6)
1. the preparation method of LED pottery COB light source fluorescent lamp is characterized in that: be divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of the alumina ceramic plate that makes, al nitride ceramic board, aluminium oxide+50% glass dust for use, above with silver paste or silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 0.9-1.1g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, namely;
Second step: carry out the integrated COB encapsulation of multi-chip, select a kind of in the composite ceramic substrate of aluminium oxide ceramic substrate that first step makes, aluminium nitride ceramics substrate, aluminium oxide+50% glass dust for use, the chip specification of selecting for use is 1023 chips, and packaging technology adopts the COB encapsulation integrated;
Third step carries out the assembling of the fluorescent lamp of different size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
2. the preparation method of a kind of LED pottery COB light source fluorescent lamp as claimed in claim 1 is characterized in that:
Wherein alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1550-1650 ℃ of sintering again; Al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1600-1700 ℃ of sintering; The composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 800-900 ℃ of sintering.
3. the preparation method of a kind of LED pottery COB light source fluorescent lamp as claimed in claim 1 is characterized in that:
Wherein the silver alloy slurry be fine silver add mass fraction be the bismuth borosilicate glass of 3-15% as adhesive, made in 1 hour through 750-850 ℃ of sintering; Silver paste is that fine silver made through 750-850 ℃ of sintering in 1 hour.
4. as the preparation method of claim 1 or 2 or 3 described a kind of LED pottery COB light source fluorescent lamps, it is characterized in that: be divided into the following step:
First step: the preparation of ceramic substrate, select the alumina ceramic plate that makes for use, above with silver or silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely;
Alumina ceramic plate is that aluminium oxide is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind getting required aluminium oxide idiosome through flow casting molding in 24 hours, made in 3 hours through 1600 ℃ of sintering again;
The silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering;
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium oxide ceramic substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated;
Third step carries out the assembling of the fluorescent lamp of T8 (Φ 26X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
5. as the preparation method of claim 1 or 2 or 3 described a kind of LED pottery COB light source fluorescent lamps, it is characterized in that: be divided into the following step:
First step: the preparation of ceramic substrate, select the al nitride ceramic board that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver or silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 12.5mm, namely;
Al nitride ceramic board is that aluminium nitride is added mass fraction is 5% silica, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 as a child through the required aluminium nitride idiosome of flow casting molding, made in 3 hours through 1650 ℃ of sintering;
The silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering;
Second step: carry out the integrated COB encapsulation of multi-chip, the aluminium nitride ceramics substrate of selecting for use first step to make, the chip specification of selecting for use is 1023 chips, packaging technology adopts the COB encapsulation integrated;
Third step carries out the assembling of the fluorescent lamp of T5 (Φ 16X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
6. as the preparation method of claim 1 or 2 or 3 described a kind of LED pottery COB light source fluorescent lamps, it is characterized in that: be divided into the following step:
First step: the preparation of ceramic substrate, select a kind of in the composite ceramic slab of aluminium oxide+50% glass dust that makes for use, above with silver alloy slurry silk-screen circuit, the consumption of silver alloy slurry is 1.0g in the fluorescent tube of whole 1.2M, the laser cutting obtains required ceramic substrate size, substrate width 16mm, namely;
The composite ceramic slab of aluminium oxide+50% glass dust is that aluminium oxide is added mass fraction is 50% glass dust, adding mass fraction again and be 35% alcohol is that 2% polyphthalamide is as adhesive as flux and mass fraction, mix and grind 24 hours again through the required aluminium oxide idiosome of flow casting molding, made in 1 hour through 850 ℃ of sintering;
The silver alloy slurry be fine silver add mass fraction be 9% bismuth borosilicate glass as adhesive, made in 1 hour through 800 ℃ of sintering;
Second step: carry out the integrated COB of multi-chip encapsulation, select the composite ceramic substrate of aluminium oxide+50% glass dust that first step makes for use, the chip specification of selecting for use is 1023 chips, and packaging technology adopts the COB encapsulation integrated;
Third step carries out the assembling of the fluorescent lamp of T8 (Φ 26X1200mm) size, adopts non-isolated wide pressure 100-265V driving power in the packaging technology, and power-efficient is 91-93%, and the PF value is 0.94, constant current accuracy 95%; Having adopted conductive coefficient is the light fixture cooling system of 0.9W/mK; 3M8805 hot curing heat-conducting glue is adopted in the light source substrate bottom.
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| CN112004325A (en) * | 2020-09-07 | 2020-11-27 | 中国振华集团云科电子有限公司 | Multilayer heterogeneous mature porcelain structure thin film component and circuit board preparation method |
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