CN205542894U - Light -emitting device - Google Patents
Light -emitting device Download PDFInfo
- Publication number
- CN205542894U CN205542894U CN201521074849.XU CN201521074849U CN205542894U CN 205542894 U CN205542894 U CN 205542894U CN 201521074849 U CN201521074849 U CN 201521074849U CN 205542894 U CN205542894 U CN 205542894U
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- CN
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- Prior art keywords
- light source
- base plate
- emitting device
- light
- source substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a light -emitting device's manufacturing technology discloses a light -emitting device. The utility model discloses in, light source base plate and radiator base plate interatomic bond or intermolecular combination to forming to whole, thereby forming the route that directly dispels the heat in the interatomic bond of light source base plate and radiator base plate or intermolecular combination department, the feasible heat conduction way of arranging the chip on it in is short, the thermal resistance is little. In addition, use join by fusion or friction stir welding or ultrasonic bonding to make light source base plate and radiator base plate form to whole, do not have solder consumption in process of production.
Description
Technical field
This utility model relates to the manufacturing technology of light-emitting device, particularly to light-emitting device.
Background technology
Existing COB (chip on board, Chip On Board) substrate mainly has two kinds:
1) metal basal board, with the metal that heat conductivity is high, such as fine copper, fine aluminium etc. does the base material of substrate 8 ',
Adhered thereto printed substrate 4 '.By insulant between the electric wiring of printed substrate 4 ' and metal basal board
5 ' isolation.LED (light emitting diode, Light Emitting Diode) chip 1 ' glue 3 ' is bonded in gold
Belonging on substrate, each chip chamber metal wire 2 ' bonding is electrically connected, and after connection, the both positive and negative polarity of chip is respectively
It is connected with the outfan of LED drive power by printed substrate 4 '.LED chip 1 ' and metal basal board
Making heat conduction to connect, LED chip 1 ' is made electrically by the outfan of printed substrate with LED drive power
Connect.Concrete structure is as it is shown in figure 1, also include fluorescent glue 6 ' and box dam 7 ', and substrate 8 ' is by leading
Hot glue 10 ' or screw or heat-conducting glue add screw (rivet or crimp) or soldering is connected with radiator 9 '；
2) ceramic substrate, with the non-conductive ceramic material that heat conductivity is high, such as aluminium nitride, aluminium oxide etc.
Do the base material of substrate 8 ', above sintering metal printed wire 4 '.LED chip 1 ' glue 3 ' is bonded in pottery
On porcelain substrate, each chip chamber plain conductor 2 ' bonding is electrically connected, and after connection, the both positive and negative polarity of chip divides
Tong Guo not be connected with the outfan of LED drive power by operplate printing circuit 4 '.LED chip 1 ' and pottery
Substrate is made heat conduction and is connected, and LED chip 1 ' is driven with LED by plain conductor 2 ' bonding printed wire 4 '
The outfan of power supply is electrically connected.The effect of COB substrate is to provide LED chip with certain arrangement
It is fixed on substrate, forms heat conduction with substrate and be connected and be electrically connected.The substrate of the COB light source made,
Connect with radiator 9 ' by the mode of screw, gluing or welding again.Concrete structure is as in figure 2 it is shown, be similar to
Ground, also includes fluorescent glue 6 ' and box dam 7 ', and substrate 8 ' is by heat-conducting glue 10 ' or screw or heat conduction
Glue adds screw (rivet or crimp) or soldering is connected with radiator 9 '.
But it was found by the inventors of the present invention that said structure there is also following shortcoming:
1) for the LED bulb being finally made, LED chip heat conduction path is long, and thermal resistance is big；
2) production process consumption material, power consumption is big, and production cost is high；
3) production process has chemical attack and cleaning process, not environmentally；
4) LED light source cumbersome when the production and assembly of LED bulb, production efficiency is low；
5) reliable long-term working is poor.
Utility model content
The purpose of this utility model is to provide a kind of light-emitting device so that chip heat conduction path is short, thermal resistance
Little, and consumptive material is few, it is simple to assemble, and reliability is high.
For solving above-mentioned technical problem, embodiment of the present utility model discloses a kind of light-emitting device, sends out
Electro-optical device includes chip, conducting wire, insulating barrier, light source substrate and radiator base plate；
Chip is placed in the surface of light source substrate, light source substrate and radiator base plate interatomic bond or intermolecular
In conjunction with；
Insulating barrier it is provided with between conducting wire and light source substrate；
The both positive and negative polarity of chip is connected with the outfan driving power supply by conducting wire respectively.
Compared with prior art, the main distinction and effect thereof are this utility model embodiment:
In light-emitting device of the present utility model, light source substrate and radiator base plate interatomic bond or molecule
Between combine, to be formed as overall, thus at the interatomic bond of light source substrate and radiator base plate or molecule
Between junction form direct thermal dissipating path so that the heat conduction path of chip placed on it is short, thermal resistance is little.
Further, join by fusion or agitating friction weldering or ultrasonic bonding is used to make light source substrate and radiator
Substrate is formed as overall, does not has solder consumption in process of production.
Further, the both positive and negative polarity of chip uses ultrasonic bonding to be electrically connected with conducting wire, not only
Switching performance is reliable, and open loss.
Further, the material that radiator base plate is identical with the remainder use of radiator, have identical
Thermal coefficient of expansion, thus be not easy to cause the damage caused because of deformation, reliability is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing LED light emission device.
Fig. 2 is the structural representation of existing LED light emission device.
Fig. 3 is the structural representation of a kind of light-emitting device in this utility model the first embodiment；
Fig. 4 is the flow process signal of the manufacture method of a kind of light-emitting device in this utility model the second embodiment
Figure.
Detailed description of the invention
In the following description, many technology are proposed in order to make reader be more fully understood that the application thin
Joint.But, even if it will be understood by those skilled in the art that do not have these ins and outs and based on
The many variations of following embodiment and amendment, it is also possible to realize the required guarantor of each claim of the application
The technical scheme protected.
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing pair
Embodiment of the present utility model is described in further detail.
This utility model the first embodiment relates to a kind of light-emitting device.Fig. 3 is the structure of this light-emitting device
Schematic diagram.This light-emitting device includes chip 1, conducting wire 4, insulating barrier 5, light source substrate 8 and heat radiation
Device substrate 9.
Said chip 1 is placed in the surface of light source substrate 8, between light source substrate 8 and radiator base plate 9 atom
In conjunction with or intermolecular combination.
It is appreciated that light source substrate 8 is by metal solder and radiator base plate interatomic bond or intermolecular
In conjunction with.Metal solder refers to by suitable means, make two metal objects separated (same metal or
Dissimilar metal) produce the method for attachment combined between atom (molecule) and link into an integrated entity.Metal solder bag
Include inversion electric resistance welding, unidirectional current welding resistance, join by fusion, agitating friction weldering etc..
In the present embodiment, it is preferable that light source substrate 8 is welded or ultrasonic by join by fusion or agitating friction
Wave soldering connects and radiator base plate 9 interatomic bond or intermolecular combination.Use join by fusion or agitating friction weldering
Or ultrasonic bonding makes light source substrate 8 and radiator base plate 9 be formed as overall, do not have in process of production
Solder consumes.Be appreciated that join by fusion be with ultra-high frequency vibration soldering tip under modest pressure, make two
The composition surface of nugget genus produces frictional heat and moment melts and engages, and weld strength can match in excellence or beauty with body, uses
Suitably workpiece and rational Interface design, can reach watertight and airtight, and exempts employing supplement and carried
The inconvenience come, it is achieved the welding of high-efficiency cleaning.Agitating friction weldering is the stirring-head by high speed rotating and quilt
The frictional heat generated between welding material surface makes the material of stirring-head adjacent domain be heated to reach molten condition,
Under the forging effect of the stirring-head shaft shoulder, it is achieved the connection between workpiece.
Alternatively, at least two pad, pad are included between light source substrate 8 and radiator base plate 9
It it is circle hole shape.Heat conductivity due to the material of light source substrate 8 own is much larger than the heat conduction of conventional pilot hot glue
Coefficient, the pad between light source substrate 8 and radiator base plate 9 has only to less area, i.e. can reach
Radiating effect.Being appreciated that in other embodiments of the present utility model, pad can also be it
His quantity and/or other shapes, is arranged according to practical structures, is not limited to above-mentioned configuration.
Furthermore, it is to be understood that in other embodiments of the present utility model, it is possible to use high temperature is high
Pressure or other modes make light source substrate 8 and radiator base plate 9 interatomic bond or intermolecular combination.
As optional embodiment, light source substrate 8 is identical with the material of radiator base plate 9, the most all makes
With aluminum or copper.Light source substrate 8 and radiator base plate 9 use identical material, have identical thermal expansion
Coefficient, thus be not easy to cause the damage caused because of deformation, reliability is high.Furthermore, it is to be understood that only
Wanting to form thermal dissipating path, light source substrate 8 can also use different materials from radiator base plate 9.
Insulating barrier 5 it is provided with between conducting wire 4 and light source substrate 8.Preferably, in the present embodiment,
Insulating barrier 5 is by printing or is sprayed on light source substrate 8 formation.It is appreciated that of the present utility model
In other embodiments, insulating barrier 5 can also be formed by photoetching or other traditional approachs.
Need to arrange at light source substrate 8 by the method for printing or spraying and formed on the position of conducting wire 4
Insulating barrier, is made without chemical attack and cleaning, clean environment firendly in process of production.
Alternatively, conducting wire 4 can by the metal forming after molding being engaged on insulating barrier 5 formation,
Or conducting wire 4 and insulating barrier 5 can be bonded on light source substrate 8 with printed substrate form.
Need at light source substrate 8 to arrange on the position of conducting wire 4 by the metal forming after molding being engaged
Form conducting wire 4 in insulating barrier 5, be made without chemical attack and cleaning in process of production,
Clean environment firendly.It will be appreciated, of course, that conducting wire is also in other embodiments of the present utility model
Can be formed by other traditional approachs.
The both positive and negative polarity of chip 1 is connected with the outfan driving power supply by conducting wire 4 respectively.Preferably,
The both positive and negative polarity of chip 1 by ultrasonic bonding electrically connect with conducting wire 4 respectively with drive power supply defeated
Go out end to connect.So, between both positive and negative polarity and the conducting wire 4 of chip 1, not only switching performance is reliable, and
And open loss.It is appreciated that ultrasonic bonding is to utilize dither wave loops to two to need welding
Body surface, pressurization in the case of, make two body surface phase mutual friction be formed between molecular layer
Fusion.
During furthermore, it is to be understood that place one single chip 1 on the surface of light source substrate, draw this single core
A pair both positive and negative polarity of sheet 1；When placing multiple chip 1 on the surface of light source substrate, can be by multiple chips
After 1 serial or parallel connection, draw a pair both positive and negative polarity, it is also possible to after the connection in series-parallel of multiple chip 1, extraction is many
To both positive and negative polarity.Furthermore, it is to be understood that in other embodiments of the present utility model, multiple chips 1
Can also be bonded by metal lead wire 2, flip chip bonding, other modes such as ball bonding are electrically connected, same energy
Realize the technical solution of the utility model.
Preferably, in the present embodiment, chip 1 is bonded on light source substrate 8 by binding agent 3.
Furthermore, it is to be understood that in other embodiments of the present utility model, it is also possible to by chip by welding
Other modes such as material welding, sintering are placed on light source substrate, are not limited to above-mentioned binding agent bonding.
In a preference, above-mentioned light-emitting device also includes box dam 7 and fluorescent glue 6.
As it is shown on figure 3, be formed around box dam 7 at chip 1, in fluorescent glue 6 is filled in box dam 7 and cover
Cover core sheet 1.
At least some of of conducting wire 4 is connected with the outfan with driving power supply outside box dam 7.
It is appreciated that in other embodiments of the present utility model, it is also possible to do not set box dam.
Furthermore, it is to be understood that in other embodiments of the present utility model, it is possible to use silica gel etc.
Other materials covers chip, is not limited to above-mentioned fluorescent glue.
In the present embodiment, light source substrate and radiator base plate interatomic bond or intermolecular combination, with
Be formed as overall, thus in the interatomic bond of light source substrate and radiator base plate or intermolecular junction shape
Become direct thermal dissipating path so that the heat conduction path of chip placed on it is short, thermal resistance is little.
In the various embodiments of the utility model, the remainder of radiator base plate 9 and radiator can
Being integrated, it is also possible to be to assemble to form radiator.
Such as, above-mentioned radiator base plate 9 can be with interference fit with the remainder of radiator.Now, dissipate
The remainder of hot device can be the structure that the shape be suitable to radiator base plate 9 carries out interference fit, example
Such as radiator sleeve, radiator heronsbill or other structures etc..Due to the material of radiator base plate 9 own
Heat conductivity is much larger than the heat conductivity of conventional pilot hot glue, radiator base plate 9 and the remainder of radiator
Between have only to less contact area, i.e. can reach radiating effect.
This utility model the second embodiment relates to the manufacture method of a kind of light-emitting device.Fig. 4 is this luminescence
The schematic flow sheet of the manufacture method of device.As shown in Figure 4, the manufacture method of this light-emitting device include with
Lower step:
In step 401, it is provided that radiator base plate.
Then into step 402, make light source substrate and radiator base plate interatomic bond or intermolecular combination,
To be formed as overall.In the present embodiment, it is preferable that welded or ultrasonic by join by fusion or agitating friction
Wave soldering connects and makes light source substrate and radiator base plate interatomic bond or intermolecular combination.Use join by fusion or stir
Mix friction welding (FW) or ultrasonic bonding makes light source substrate and radiator base plate be formed as overall, in process of production
There is no solder consumption.
Alternatively, including at least two pad between light source substrate and radiator base plate, pad is round
Hole shape.Heat conductivity due to the material of light source substrate own is much larger than the heat conductivity of conventional pilot hot glue,
Pad between light source substrate and radiator base plate has only to less area, i.e. can reach radiating effect.
Be appreciated that in other embodiments of the present utility model, pad can also be other quantity and/
Or other shapes, it is arranged according to practical structures, is not limited to above-mentioned configuration.
Furthermore, it is to be understood that in other embodiments of the present utility model, it is possible to use high temperature is high
Pressure or other modes make light source substrate and radiator base plate interatomic bond or intermolecular combination.
As optional embodiment, light source substrate is identical with the material of radiator base plate, the most all uses aluminum
Or copper.The material that light source substrate is identical with radiator base plate use, has identical thermal coefficient of expansion, from
And it being not easy to cause the damage caused because of deformation, reliability is high.As long as furthermore, it is to be understood that can be formed
Thermal dissipating path, light source substrate can also use different materials from radiator base plate.
Then into step 403, light source substrate forms conducting wire and insulating barrier, wherein insulating barrier
It is located between conducting wire and light source substrate.
Then into step 404, at the surface chip placement of light source substrate, and the both positive and negative polarity of chip is divided
Tong Guo not be connected with the outfan driving power supply conducting wire.Preferably, by ultrasonic bonding by chip
Both positive and negative polarity respectively with conducting wire electrical connection with drive power supply outfan be connected.So, chip
Between both positive and negative polarity and conducting wire, not only switching performance is reliable, and open loss.
It is appreciated that when the surface of light source substrate placement one single chip, draw this one single chip a pair
Both positive and negative polarity；When placing multiple chip on the surface of light source substrate, can by after multiple chip-in series or parallel connection,
Draw a pair both positive and negative polarity, it is also possible to after multiple chip connection in series-parallel, draw multipair both positive and negative polarity.Additionally, can
To understand, in other embodiments of the present utility model, multiple chips can also pass through metal lead wire key
Other modes such as conjunction, flip chip bonding, ball bonding are electrically connected, and can realize technical side of the present utility model equally
Case.
In the present embodiment, light source substrate and radiator base plate interatomic bond or intermolecular combination, with
Be formed as overall, thus in the interatomic bond of light source substrate and radiator base plate or intermolecular junction shape
Become direct thermal dissipating path so that the heat conduction path of chip placed on it is short, thermal resistance is little.
In the various embodiments of the utility model, radiator base plate is permissible with the remainder of radiator
It is integrated, it is also possible to be to assemble to form radiator.
Such as, above-mentioned manufacture method can also comprise the following steps:
Make the remainder interference fit of radiator base plate and radiator.
Now, the remainder of radiator can be that the shape be suitable to radiator base plate carries out interference fit
Structure, such as radiator sleeve, radiator heronsbill or other structures etc..Due to radiator base plate originally
The heat conductivity of stature material is much larger than its of the heat conductivity of conventional pilot hot glue, radiator base plate and radiator
Remaining part has only to less contact area between dividing, i.e. can reach radiating effect.
Present embodiment is the method embodiment corresponding with the first embodiment, and present embodiment can be with
First embodiment is worked in coordination enforcement.The relevant technical details mentioned in first embodiment is in this enforcement
In mode still effectively, in order to reduce repetition, repeat no more here.Correspondingly, present embodiment carries
To relevant technical details be also applicable in the first embodiment.
To sum up, without heat-conducting glue or conducting strip, without screw, the application uses metal solder, the most molten
Connect weldering, the friction new technology such as join by fusion, ultrasonic bonding, light source substrate is directly bonded to thermal component
On, production efficiency is high, good heat conduction effect, manufacturing cost is low and reliable long-term working high,
It should be noted that in the claim and description of this patent, such as the first and second grades it
The relational terms of class is used merely to separate an entity or operation with another entity or operating space,
And not necessarily require or imply and there is the relation of any this reality or suitable between these entities or operation
Sequence.And, term " includes ", " comprising " or its any other variant are intended to nonexcludability
Comprise, so that include that the process of a series of key element, method, article or equipment not only include that
A little key elements, but also include other key elements being not expressly set out, or also include for this process,
The key element that method, article or equipment are intrinsic.In the case of there is no more restriction, by statement " bag
Include one " key element that limits, it is not excluded that including the process of described key element, method, article or setting
Other identical element is there is also in Bei.
Although by referring to some preferred implementation of the present utility model, this utility model being carried out
Diagram and describing, but it will be understood by those skilled in the art that can be in the form and details
To it, various changes can be made, without departing from spirit and scope of the present utility model.
Claims (9)
1. a light-emitting device, it is characterised in that described light-emitting device includes chip, conducting wire, insulating barrier, light source substrate and radiator base plate；
Described chip is placed in the surface of described light source substrate, and described light source substrate and described radiator base plate are welded by join by fusion or agitating friction or ultrasonic bonding is connected with each other；
Described insulating barrier it is provided with between described conducting wire and described light source substrate；
The both positive and negative polarity of described chip is connected with the outfan driving power supply by described conducting wire respectively.
Light-emitting device the most according to claim 1, it is characterised in that the both positive and negative polarity of described chip is connected with the outfan with driving power supply with the electrical connection of described conducting wire respectively by ultrasonic bonding.
Light-emitting device the most according to claim 1, it is characterised in that described radiator base plate and the remainder interference fit of radiator.
Light-emitting device the most according to claim 1, it is characterised in that described light source substrate is identical with the material of described radiator base plate.
Light-emitting device the most according to claim 4, it is characterised in that the material of described light source substrate and described radiator base plate is copper or aluminum.
Light-emitting device the most according to claim 1, it is characterised in that described light source substrate is different from the material of described radiator base plate.
Light-emitting device the most according to claim 1, it is characterised in that described chip is bonded by binding agent or is welded on described light source substrate by welding material.
Light-emitting device the most according to claim 1, it is characterised in that described insulating barrier is by printing or is sprayed on described light source substrate formation.
Light-emitting device the most according to any one of claim 1 to 8, it is characterised in that described light-emitting device also includes box dam and fluorescent glue；
Being formed around described box dam at described chip, described fluorescent glue is filled in described box dam and covers described chip；
At least some of of described conducting wire is connected with the outfan with described driving power supply outside described box dam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074849.XU CN205542894U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074849.XU CN205542894U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205542894U true CN205542894U (en) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521074849.XU Expired - Fee Related CN205542894U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
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| Country | Link |
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| CN (1) | CN205542894U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898688A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
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- 2015-12-21 CN CN201521074849.XU patent/CN205542894U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898688A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 Termination date: 20211221 |