CN204968223U - Heat conduction circuit board, subassembly in a poor light and display module assembly - Google Patents
Heat conduction circuit board, subassembly in a poor light and display module assembly Download PDFInfo
- Publication number
- CN204968223U CN204968223U CN201520723871.6U CN201520723871U CN204968223U CN 204968223 U CN204968223 U CN 204968223U CN 201520723871 U CN201520723871 U CN 201520723871U CN 204968223 U CN204968223 U CN 204968223U
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- heat
- pin
- dissipating layer
- heat dissipating
- circuit board
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Abstract
The utility model relates to a heat conduction circuit board, subassembly in a poor light and display module assembly, heat conduction circuit board wherein, include: a FPC board and with the 2nd FPC board that a FPC board is connected, a FPC board has circuit layer, base plate and the first heat dissipation layer of range upon range of setting, be equipped with on the circuit layer at least one welding position and all with heat conduction pin, connection pin that the welding phase is connected, the welding position is used for welding components and parts, the heat conduction pin still with first heat dissipation layer is connected, the 2nd FPC board has ground wire pin and function pin, the ground wire pin passes through the heat conduction pin with a FPC is connected, the function pin with it is connected to connect the pin. Compare the traditional circuit board, above -mentioned heat conduction circuit board for the radiating rate of the higher circuit board of temperature.
Description
Technical field
The utility model relates to display field, particularly relates to a kind of heat-conduction circuit board, backlight assembly and display module.
Background technology
Along with the progress of science and technology, improving constantly of people's living standard, the requirement of people to each electronic product also constantly promotes.Circuit board is part indispensable in electronic product, but heat conduction at present between multiple circuit board be connected to each other is poor, and the heat that the circuit board causing heating higher produces is difficult to shed, and then makes the electronic product less stable of application circuit board.
Such as, in display module, the LED of backlight assembly is arranged at the side of FPC plate usually, opposite side is white space, white space does not do any radiating treatment, usually comes from the LED in backlight assembly, like this due to the pyrotoxin showing module, the heat making LED send is difficult to leave, and then causes the heating of display module excessive.
Utility model content
Based on this, be necessary to provide that a kind of heat conduction is better, the good heat-conduction circuit board of stability, and apply backlight assembly and the display module of this heat-conduction circuit board.
A kind of heat-conduction circuit board, comprising: a FPC plate and the 2nd FPC plate be connected with a described FPC plate,
A described FPC plate has the circuit layer of stacked setting, substrate and the first heat dissipating layer,
The connection pin that described circuit layer is provided with at least one welding position, is connected with described welding position, and heat conduction pin, described welding position is used for welding component, and described heat conduction pin is connected with described first heat dissipating layer;
Described 2nd FPC plate has ground wire pin and functional pin, and described ground wire pin is connected with a described FPC by described heat conduction pin, and described functional pin is connected with the described pin that is connected.
In one of them embodiment, a described FPC plate offers via hole, be connected with described first heat dissipating layer to make described heat conduction pin.
In one of them embodiment, described via hole is positioned on described first heat dissipating layer, and one end of described heat conduction pin is connected with described via hole.
In one of them embodiment, described circuit layer has white space and land, and a described FPC plate also comprises the second heat dissipating layer, and described second heat dissipating layer is arranged on described white space, and described second heat dissipating layer is connected with described heat conduction pin.
In one of them embodiment, described first heat dissipating layer covers described substrate completely.
In one of them embodiment, described connection pin and described heat conduction pin are positioned at the homonymy of described substrate, and described connection pin and described heat conduction pin spacing parallel arranging arrange, described connection pin and described heat conduction pin are two, and two described connection pins are between two described heat conduction pins.
In one of them embodiment, described first heat dissipating layer is silver heat dissipating layer, copper heat dissipating layer, plumbous matter heat dissipating layer, aluminium matter heat dissipating layer, irony heat dissipating layer or graphite heat dissipating layer.
A kind of backlight assembly, comprise above-mentioned arbitrary described heat-conduction circuit board, the described welding position of a described FPC plate is provided with light source.
A kind of display module, comprises above-mentioned backlight assembly, also comprises the LCD assembly with the stacked setting of described backlight assembly.
Compare traditional circuit-board, above-mentioned heat-conduction circuit board has set up the first heat dissipating layer and heat conduction pin, make the heat on the first heat dissipating layer can be delivered on the 2nd FPC plate by heat conduction pin, thus make can carry out heat exchange between two circuit boards, heat on a FPC plate higher for temperature is delivered on the 2nd lower PFC plate of temperature, accelerates the radiating rate of the higher FPC plate of temperature.The heat that first heat dissipating layer makes a FPC plate send is loose to be uniformly distributed, and avoids a FPC plate to occur the phenomenon of local overheating, adds the stability of heat-conduction circuit board.In addition, the first heat dissipating layer can also assist a FPC plate heat radiation, improves the radiating effect of a FPC plate.
Accompanying drawing explanation
Fig. 1 is the structural representation of the display module of the utility model one preferred embodiment;
Fig. 2 is the partial schematic diagram of the module of display shown in Fig. 1;
Fig. 3 is the partial enlarged drawing at the module A place of display shown in Fig. 2;
Fig. 4 is the cutaway view of a FPC plate shown in Fig. 2;
Fig. 5 is the structural representation at another visual angle of FPC plate shown in Fig. 2;
Fig. 6 is the partial enlarged drawing at a FPC plate B place shown in Fig. 5.
Embodiment
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Better embodiment of the present utility model is given in accompanying drawing.But the utility model can realize in many different forms, is not limited to execution mode described herein.On the contrary, provide the object of these execution modes be make to disclosure of the present utility model understand more thorough comprehensively.
It should be noted that, when element is called as " being arranged at " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in specification of the present utility model herein just in order to describe concrete execution mode, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
See also Fig. 1, it is the structural representation of the display module 10 of the utility model one preferred embodiment.
Display module 10, comprises the backlight assembly 20 of stacked setting, LCD assembly 30.Wherein, backlight assembly 20 has heat-conduction circuit board 100, and is arranged at the light source in heat conduction circuit version, such as LED.
As shown in Figures 2 to 4, it is partial schematic diagram, the partial enlarged drawing at its A place and the cutaway view of a FPC plate of the module 10 of display shown in Fig. 2.
Heat-conduction circuit board 100, comprising: a FPC plate 110 and the 2nd FPC plate 120 be connected with a FPC plate 110.
One FPC plate 110 has circuit layer 111, substrate 112, first heat dissipating layer 113 of stacked setting, and also can be understood as, circuit layer 111 and the first heat dissipating layer 113 lay respectively at the both sides of substrate 112.Wherein, the connection pin 111B that circuit layer 111 is provided with at least one welding position, is connected with welding position, and heat conduction pin 111A.Welding position is used for welding component, and in the present embodiment, welding position is provided with light source 200.Heat conduction pin 111A is connected with the first heat dissipating layer 113, for by the transfer of heat on heat dissipating layer.Concrete, a FPC plate 110 offers via hole 114, and to make heat conduction pin 111A be connected with the first heat dissipating layer 113, in the present embodiment, via hole 114 is positioned on the first heat dissipating layer 113, and one end of heat conduction pin 111A is connected with via hole 114.Wherein, via hole 114 refers to the through hole be opened on a FPC plate 110, and is arranged at the circuit layer 111 on through-hole wall.
2nd FPC plate 120 has ground wire pin and functional pin, and wherein, ground wire pin is connected with a FPC by heat conduction pin 111A, mutually transmits to enable the heat between a FPC plate 110 and the 2nd FPC plate 120; Functional pin be connected pin 111B and be connected.
Compare traditional circuit-board, above-mentioned heat-conduction circuit board 100 has set up the first heat dissipating layer 113 and heat conduction pin 111A, make the heat on the first heat dissipating layer 113 can be delivered on the 2nd FPC plate 120 by heat conduction pin 111A, thus make can carry out heat exchange between two circuit boards, heat on a FPC plate 110 higher for temperature is delivered on the 2nd lower PFC plate 120 of temperature, accelerates the radiating rate of the higher FPC plate 110 of temperature.The heat that first heat dissipating layer 113 makes a FPC plate 110 send is loose to be uniformly distributed, and avoids a FPC plate 110 to occur the phenomenon of local overheating, adds the stability of heat-conduction circuit board 100.In addition, the first heat dissipating layer 113 can also assist a FPC plate 110 to dispel the heat, and improves the radiating effect of a FPC plate 110.
There is the display module 10 of conductive circuit board, only heat can be delivered to the 2nd FPC plate 120 from the larger FPC plate 110 of heating, and the antistatic effect of LED can be promoted, the interference from LCD-IC signal can also be shielded.
Connect the homonymy that pin 111B and heat conduction pin 111A is all positioned at substrate 112.In the present embodiment, be all positioned at the side that a FPC plate 110 arranges components and parts.And, connection pin 111B and heat conduction pin 111A spacing parallel arranging arrange, concrete connection pin 111B and heat conduction pin 111A is two, and two connect pin 111B between two heat conduction pin 111A, and two connect the both positive and negative polarity that pin 111B is respectively used to connection the 2nd FPC plate 120.
See also Fig. 5 and Fig. 6, it is respectively the structural representation at another visual angle of FPC plate 110 shown in Fig. 2 and the partial enlarged drawing at B place thereof.
In the present embodiment, the first heat dissipating layer 113 is covered substrate 112 completely.In other embodiments, the first heat dissipating layer 113 also can cover part circuit layer 111.Or the first heat dissipating layer 113 also can be multiple.Such as, multiple heat dissipating layer is arranged at intervals on the surface of substrate 112 side.
According to actual conditions, circuit layer 111 has white space and land, one FPC plate 110 also comprises the second heat dissipating layer, second heat dissipating layer is stacked to be arranged on white space, concrete, second heat dissipating layer is positioned on the surface of circuit layer 111 away from substrate 112, and the second heat dissipating layer is connected with heat conduction pin 111A, with auxiliary FPC plate 110 heat conduction and a heat radiation.
It is pointed out that according to actual conditions, also can omit the first heat dissipating layer 113, replaced by the second heat dissipating layer.
In the present embodiment, the first heat dissipating layer 113 and the second heat dissipating layer are copper, and in other embodiments, heat dissipating layer also can be made for Heat Conduction Materials such as silver, copper, lead, aluminium, iron, graphite flakes.It should be noted that, the 2nd FPC plate 120 also can be arranged the first heat dissipating layer 113 and/or the second heat dissipating layer.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (9)
1. a heat-conduction circuit board, comprising: a FPC plate and the 2nd FPC plate be connected with a described FPC plate, is characterized in that,
A described FPC plate has the circuit layer of stacked setting, substrate and the first heat dissipating layer,
The connection pin that described circuit layer is provided with at least one welding position, is connected with described welding position, and heat conduction pin, described welding position is used for welding component, and described heat conduction pin is connected with described first heat dissipating layer;
Described 2nd FPC plate has ground wire pin and functional pin, and described ground wire pin is connected with a described FPC by described heat conduction pin, and described functional pin is connected with the described pin that is connected.
2. heat-conduction circuit board according to claim 1, is characterized in that, a described FPC plate offers via hole, is connected with described first heat dissipating layer to make described heat conduction pin.
3. heat-conduction circuit board according to claim 2, is characterized in that, described via hole is positioned on described first heat dissipating layer, and one end of described heat conduction pin is connected with described via hole.
4. heat-conduction circuit board according to claim 1, it is characterized in that, described circuit layer has white space and land, a described FPC plate also comprises the second heat dissipating layer, described second heat dissipating layer is arranged on described white space, and described second heat dissipating layer is connected with described heat conduction pin.
5. heat-conduction circuit board according to claim 1, is characterized in that, described first heat dissipating layer covers described substrate completely.
6. heat-conduction circuit board according to claim 1, it is characterized in that, described connection pin and described heat conduction pin are positioned at the homonymy of described substrate, and described connection pin and described heat conduction pin spacing parallel arranging arrange, described connection pin and described heat conduction pin are two, and two described connection pins are between two described heat conduction pins.
7. heat-conduction circuit board according to claim 1, is characterized in that, described first heat dissipating layer is silver heat dissipating layer, copper heat dissipating layer, plumbous matter heat dissipating layer, aluminium matter heat dissipating layer, irony heat dissipating layer or graphite heat dissipating layer.
8. a backlight assembly, is characterized in that, comprise the arbitrary described heat-conduction circuit board of claim 1 to 7, the described welding position of a described FPC plate is provided with light source.
9. show a module, it is characterized in that, comprise backlight assembly according to claim 8, also comprise the LCD assembly with the stacked setting of described backlight assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520723871.6U CN204968223U (en) | 2015-09-17 | 2015-09-17 | Heat conduction circuit board, subassembly in a poor light and display module assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520723871.6U CN204968223U (en) | 2015-09-17 | 2015-09-17 | Heat conduction circuit board, subassembly in a poor light and display module assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204968223U true CN204968223U (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520723871.6U Expired - Fee Related CN204968223U (en) | 2015-09-17 | 2015-09-17 | Heat conduction circuit board, subassembly in a poor light and display module assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204968223U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
-
2015
- 2015-09-17 CN CN201520723871.6U patent/CN204968223U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN111837171B (en) * | 2019-02-20 | 2022-07-01 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 516000 Guangdong province Huizhou Zhongkai hi tech Development Zone No. 23 District Patentee after: CHINA DISPLAY OPTOELECTRONICS TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 516000 Guangdong province Huizhou Zhongkai hi tech Development Zone No. 23 District Patentee before: TCL DISPLAY TECHNOLOGY (HUIZHOU) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |