CN205726644U - A kind of cooling circuit board - Google Patents

A kind of cooling circuit board Download PDF

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Publication number
CN205726644U
CN205726644U CN201620282371.8U CN201620282371U CN205726644U CN 205726644 U CN205726644 U CN 205726644U CN 201620282371 U CN201620282371 U CN 201620282371U CN 205726644 U CN205726644 U CN 205726644U
Authority
CN
China
Prior art keywords
support column
heat sink
substrate
circuit board
cooling circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620282371.8U
Other languages
Chinese (zh)
Inventor
李志勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Super Circuit Board Co Ltd
Original Assignee
Shenzhen Super Circuit Board Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Super Circuit Board Co Ltd filed Critical Shenzhen Super Circuit Board Co Ltd
Priority to CN201620282371.8U priority Critical patent/CN205726644U/en
Application granted granted Critical
Publication of CN205726644U publication Critical patent/CN205726644U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This utility model provides a kind of cooling circuit board, connects post, cover plate including substrate, support column, heat sink, heat radiation;Being provided with Copper Foil in described substrate back side groove, described heat radiation connection post welds with Copper Foil in substrate recess and is fastened;Described support column is connected with each other with substrate four avris circular hole upper end copper by welding;Described support column leading inside is provided with semicircle groove, and described support column rear inside is provided with semicircle fluting;Described heat sink front end is provided with bevelling;Described heat sink is through support column rear end semicircle fluting, and matches with support column leading inside semicircle groove;Heat sink upper end is located at by described cover plate, and cover plate upper end is provided with some louvres.This utility model provides a kind of cooling circuit board, and simple in construction is reasonable in design, heat dissipating layer can quick heat radiating, thus ensure that circuit effectively works.

Description

A kind of cooling circuit board
Technical field
This utility model relates to field of circuit boards, a kind of cooling circuit board particularly related to.
Background technology
The electronic equipment that printed circuit board (PCB) almost can be seen at us all be unable to do without it, little to accutron, computer, general-purpose computer, and big to electronic devices and components such as computer communication electronic equipments, between them, electrical interconnection will use printed circuit board (PCB).Along with the highdensity development trend of printed circuit board (PCB), the production requirement of circuit board is more and more higher.Printed circuit board radiating processes bad, so that circuit board is corroded, have impact on the service life of circuit board.In sum, there is following defect in prior art: circuit board working environment complexity is various, and the wet impact of moisture-sensitive, so that circuit board is corroded, have impact on the service life of circuit board.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of cooling circuit board.
The technical solution of the utility model is as follows: a kind of cooling circuit board, connects post, cover plate including substrate, support column, heat sink, heat radiation;Described substrate is epoxy resin;Described substrate upper end is provided with some circular holes, and substrate back side is provided with some circular grooves;Being provided with Copper Foil in described substrate back side groove, described heat radiation connection post welds with Copper Foil in substrate recess and is fastened;It is copper rod that described heat radiation connects post;Described substrate four side is provided with circular hole, and in described circular hole, avris is provided with painting copper;Described support column is connected with each other with substrate four avris circular hole upper end copper by welding;Described support column leading inside is provided with semicircle groove, and described support column rear inside is provided with semicircle fluting;Described heat sink front end is provided with bevelling;Described heat sink is through support column rear end semicircle fluting, and matches with support column leading inside semicircle groove;Heat sink upper end is located at by described cover plate, and cover plate upper end is provided with some louvres.
Preferably, described heat sink is copper coin.
Preferably, semicircle fluting it is provided with inside described support column upper end.
Preferably, it is provided with circular hole in the middle of fluting inside described support column upper end.
Preferably, described heat sink is connected post for closely cooperating with heat radiation.
Using such scheme, this utility model provides a kind of cooling circuit board, and simple in construction is reasonable in design, heat dissipating layer can quick heat radiating, thus ensure that circuit effectively works.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model example.
Detailed description of the invention
For the ease of understanding this utility model, below in conjunction with the accompanying drawings and specific embodiment, this utility model is described in detail.Accompanying drawing gives preferred embodiment of the present utility model.But, this utility model can realize in many different forms, however it is not limited to the embodiment described by this specification.On the contrary, providing the purpose of these embodiments is to make the understanding to disclosure of the present utility model more thorough comprehensively.
It should be noted that be referred to as " being fixed on " another element when element, it can be directly on another element or can also there is element placed in the middle.When an element is considered as " connection " another element, and it can be directly to another element or may be simultaneously present centering elements.Term " vertical ", " level ", "left", "right" and similar statement that this specification is used are for illustrative purposes only.
Unless otherwise defined, all of technology that this specification is used and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model are generally understood that.This specification is intended merely to describe the purpose of specific embodiment at term used in the description of the present utility model, is not intended to limit this utility model.The term "and/or" that this specification is used includes the arbitrary and all of combination of one or more relevant Listed Items.
With example, this utility model is further illustrated below in conjunction with the accompanying drawings.
As it is shown in figure 1, a kind of cooling circuit board, connect post 2904, cover plate 2905 including substrate 2901, support column 2902, heat sink 2903, heat radiation;
Described substrate 2901 is epoxy resin;
Described substrate 2901 upper end is provided with some circular holes, and substrate 2901 reverse side is provided with some circular grooves;
The convenient heat radiation of described substrate circular hole;
Being provided with Copper Foil in described substrate 2901 negative grooves, described heat radiation connection post 2904 welds with Copper Foil in substrate 2901 groove and is fastened;
The convenient heat radiation of described Copper Foil, and be connected with heat sink by connecting heat radiation connection post, convenient heat radiation;
It is copper rod that described heat radiation connects post 2904;
Described substrate 2,901 4 side is provided with circular hole, and in described circular hole, avris is provided with painting copper;
Described painting copper thickness is more than five millimeters, convenient fastening;
Described support column 2902 is connected with each other with substrate 2,901 4 avris circular hole upper end copper by welding;
Described support column leading inside is provided with semicircle groove, and described support column rear inside is provided with semicircle fluting;
Heat sink is facilitated to block;
Described heat sink 2903 front end is provided with bevelling;
Facilitate heat sink front end good by heat radiation support column;
Described heat sink 2903 is through support column rear end semicircle fluting, and matches with support column leading inside semicircle groove;
Heat sink 2903 upper end is located at by described cover plate 2905, and cover plate 2905 upper end is provided with some louvres;
Described cover plate is plastic cement material.
Preferably, described heat sink is copper coin.
Preferably, it is provided with semicircle fluting inside described support column upper end, is used for preventing cover plate.
Preferably, inside described support column upper end, in the middle of fluting, it is provided with circular hole, for fastening with cover plate.
Preferably, described heat sink is connected post for closely cooperating with heat radiation, facilitates joint, two ends, easily dispels the heat.
This utility model provides a kind of cooling circuit board, and simple in construction is reasonable in design, heat dissipating layer can quick heat radiating, thus ensure that circuit effectively works.
It should be noted that above-mentioned each technical characteristic continues to be mutually combined, form various embodiments the most enumerated above, be accordingly to be regarded as the scope that this utility model description is recorded;Further, for those of ordinary skills, can be improved according to the above description or be converted, and all these modifications and variations all should be belonged to the protection domain of this utility model claims.

Claims (5)

1. a cooling circuit board, it is characterised in that include that substrate, support column, heat sink, heat radiation connect post, cover plate;
Described substrate is epoxy resin;
Described substrate upper end is provided with some circular holes, and substrate back side is provided with some circular grooves;
Being provided with Copper Foil in described substrate back side groove, described heat radiation connection post welds with Copper Foil in substrate recess and is fastened;
It is copper rod that described heat radiation connects post;
Described substrate four side is provided with circular hole, and in described circular hole, avris is provided with painting copper;
Described support column is connected with each other with substrate four avris circular hole upper end copper by welding;
Described support column leading inside is provided with semicircle groove, and described support column rear inside is provided with semicircle fluting;
Described heat sink front end is provided with bevelling;
Described heat sink is through support column rear end semicircle fluting, and matches with support column leading inside semicircle groove;
Heat sink upper end is located at by described cover plate, and cover plate upper end is provided with some louvres.
A kind of cooling circuit board the most according to claim 1, it is characterised in that described heat sink is copper coin.
A kind of cooling circuit board the most according to claim 1, it is characterised in that be provided with semicircle fluting inside described support column upper end.
A kind of cooling circuit board the most according to claim 3, it is characterised in that be provided with circular hole in the middle of fluting inside described support column upper end.
A kind of cooling circuit board the most according to claim 1, it is characterised in that described heat sink is connected post for closely cooperating with heat radiation.
CN201620282371.8U 2016-04-07 2016-04-07 A kind of cooling circuit board Expired - Fee Related CN205726644U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620282371.8U CN205726644U (en) 2016-04-07 2016-04-07 A kind of cooling circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620282371.8U CN205726644U (en) 2016-04-07 2016-04-07 A kind of cooling circuit board

Publications (1)

Publication Number Publication Date
CN205726644U true CN205726644U (en) 2016-11-23

Family

ID=57308976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620282371.8U Expired - Fee Related CN205726644U (en) 2016-04-07 2016-04-07 A kind of cooling circuit board

Country Status (1)

Country Link
CN (1) CN205726644U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161123

Termination date: 20180407

CF01 Termination of patent right due to non-payment of annual fee