CN217693866U - Concatenation formula printed circuit board - Google Patents
Concatenation formula printed circuit board Download PDFInfo
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- CN217693866U CN217693866U CN202123390553.7U CN202123390553U CN217693866U CN 217693866 U CN217693866 U CN 217693866U CN 202123390553 U CN202123390553 U CN 202123390553U CN 217693866 U CN217693866 U CN 217693866U
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- circuit board
- cover plate
- butterfly
- unit circuit
- heat conduction
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Abstract
The utility model discloses a concatenation formula printed circuit board relates to circuit board technical field, and its technical scheme main points are: the butterfly-shaped structure comprises a plurality of unit circuit boards, wherein each side wall of each unit circuit board is provided with a half butterfly-shaped mortise, the half butterfly-shaped mortises on the left side and the right side of each unit circuit board are symmetrical to each other, and the half butterfly-shaped mortises on the front side and the back side of each unit circuit board are symmetrical to each other; butterfly tenons are embedded in two corresponding half butterfly mortises on the connecting edges of two adjacent unit circuit boards; the unit circuit board comprises an upper cover plate, a circuit board main body and a lower cover plate which are sequentially arranged from top to bottom, wherein an upper heat conduction layer is arranged at the top of the circuit board main body, and a lower heat conduction layer is arranged at the bottom of the circuit board main body; the top of the upper heat conduction layer is provided with a first radiating fin; the bottom of the lower heat conduction layer is provided with a second radiating fin; the upper cover plate and the lower cover plate are provided with a plurality of heat dissipation holes. Can realize the concatenation of circuit board and use, and have good radiating effect, heat is piled up in a large number when can avoiding using, increases the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, it relates to a concatenation formula printed circuit board.
Background
With the development of society, the electronic information manufacturing industry is more mature. The circuit board is one of the main products in the electronic information manufacturing industry, and the appearance of the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric equipment.
At present, circuit boards mostly adopt an integrated structure.
The circuit board among the prior art does not possess the concatenation function, when needs expand, often need to trade a new circuit board, causes the waste, and current circuit board can produce a large amount of heats in the use, and the heat piles up and causes the circuit board to damage easily.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a concatenation formula printed circuit board can realize the concatenation of circuit board and use, and has good radiating effect, and the heat is piled up in a large number when can avoiding using, increases the life of circuit board.
The above technical purpose of the present invention can be achieved by the following technical solutions: a spliced printed circuit board comprises a plurality of unit circuit boards, wherein each side wall of each unit circuit board is provided with a half butterfly mortise, the half butterfly mortises on the left side and the right side of each unit circuit board are symmetrical to each other, and the half butterfly mortises on the front side and the back side of each unit circuit board are symmetrical to each other; butterfly tenons are embedded and installed in two corresponding half butterfly mortises on the connecting edges of two adjacent unit circuit boards; the unit circuit board comprises an upper cover plate, a circuit board main body and a lower cover plate which are sequentially arranged from top to bottom, wherein an upper heat conduction layer is arranged at the top of the circuit board main body, and a lower heat conduction layer is arranged at the bottom of the circuit board main body; the top of the upper heat conduction layer is provided with a first radiating fin; the bottom of the lower heat conduction layer is provided with a second radiating fin; and a plurality of heat dissipation holes are formed in the upper cover plate and the lower cover plate.
By adopting the technical scheme, when the spliced printed circuit board is used, two adjacent circuit boards are conveniently connected through the half butterfly mortise and the butterfly tenon, so that the circuit boards are conveniently and flexibly used; the circuit board main body is protected conveniently through the upper cover plate and the lower cover plate; the upper heat conduction layer and the lower heat conduction layer are convenient for quickly conducting heat generated on the circuit board main body to the first radiating fin and the second radiating fin, so that heat accumulation on the circuit board main body is convenient to avoid; through the first radiating fin and the second radiating fin, heat can be quickly released to the air conveniently; the heat dissipation holes facilitate the heat dissipation to the outside; through the concatenation formula printed circuit board of constituteing by a plurality of unit circuit boards, can realize the concatenation of circuit board and use, and have good radiating effect, the heat piles up in a large number when can avoiding using, increases the life of circuit board.
The utility model discloses further set up to: an upper shockproof layer is arranged at the bottom of the upper cover plate; and a lower shockproof layer is arranged at the top of the lower cover plate.
By adopting the technical scheme, the shock resistance of the circuit board is increased conveniently through the upper shock-proof layer and the lower shock-proof layer, so that the influence of shock on the work of the circuit board is avoided.
The utility model discloses further set up to: the top end of the first radiating fin penetrates through the upper shockproof layer to be connected with the bottom of the upper cover plate.
The utility model discloses further set up to: and the bottom end of the second radiating fin penetrates through the lower shockproof layer and is connected with the top of the lower cover plate.
The utility model discloses further set up to: each side wall of the unit circuit board is provided with two half butterfly mortises.
To sum up, the utility model discloses following beneficial effect has: the two adjacent circuit boards are conveniently connected through the half butterfly mortise and the butterfly tenon, so that the circuit boards are conveniently and flexibly used; the circuit board main body is protected conveniently through the upper cover plate and the lower cover plate; the upper heat conduction layer and the lower heat conduction layer are convenient for quickly conducting heat generated on the circuit board main body to the first radiating fin and the second radiating fin, so that heat accumulation on the circuit board main body is convenient to avoid; through the first radiating fin and the second radiating fin, heat can be quickly released to the air conveniently; the heat dissipation holes facilitate the heat dissipation to the outside; through the concatenation formula printed circuit board who constitutes by a plurality of unit circuit boards, can realize the concatenation of circuit board and use, and have good radiating effect, the heat piles up in a large number when can avoiding using, increases the life of circuit board.
Drawings
Fig. 1 is a schematic structural diagram in an embodiment of the present invention;
fig. 2 is a sectional view of a unit circuit board according to an embodiment of the present invention.
In the figure: 1. a unit circuit board; 2. a half butterfly mortise; 3. butterfly tenons; 4. an upper cover plate; 5. a circuit board main body; 6. a lower cover plate; 7. an upper heat conducting layer; 8. a lower heat conducting layer; 9. a first heat sink; 10. a second heat sink; 11. heat dissipation holes; 12. an upper shockproof layer; 13. and a lower shockproof layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying fig. 1-2.
Example (b): a spliced printed circuit board is shown in figures 1 and 2 and comprises a plurality of unit circuit boards 1, wherein each side wall of each unit circuit board 1 is provided with a half butterfly mortise 2, the half butterfly mortises 2 on the left side and the right side of each unit circuit board 1 are mutually symmetrical, and the half butterfly mortises 2 on the front side and the back side of each unit circuit board 1 are mutually symmetrical; butterfly tenons 3 are embedded in two corresponding half butterfly mortises 2 on the connecting edges of two adjacent unit circuit boards 1; the unit circuit board 1 comprises an upper cover plate 4, a circuit board main body 5 and a lower cover plate 6 which are sequentially arranged from top to bottom, wherein an upper heat conduction layer 7 is bonded at the top of the circuit board main body 5, and a lower heat conduction layer 8 is bonded at the bottom of the circuit board main body 5; the top of the upper heat conduction layer 7 is provided with a first radiating fin 9; the bottom of the lower heat conduction layer 8 is provided with a second radiating fin 10; a plurality of heat dissipation holes 11 are arranged on the upper cover plate 4 and the lower cover plate 6.
In the embodiment, when the spliced printed circuit board is used, two adjacent circuit boards are conveniently connected through the half butterfly mortise 2 and the butterfly tenon 3, so that the circuit boards are conveniently and flexibly used; the circuit board main body 5 is protected conveniently through the upper cover plate 4 and the lower cover plate 6; the upper heat conduction layer 7 and the lower heat conduction layer 8 are used for conveniently and rapidly conducting heat generated on the circuit board main body 5 to the first heat dissipation plate 9 and the second heat dissipation plate 10, so that heat accumulation on the circuit board main body 5 is avoided; the first radiating fin 9 and the second radiating fin 10 are used for facilitating the quick release of heat into the air; the heat dissipation to the outside is facilitated through the heat dissipation holes 11; through the concatenation formula printed circuit board of constituteing by a plurality of unit circuit boards 1, can realize the concatenation of circuit board and use, and have good radiating effect, the heat piles up in a large number when can avoiding using, increases the life of circuit board.
The bottom of the upper cover plate 4 is provided with an upper shockproof layer 12; the top of the lower cover plate 6 is provided with a lower shockproof layer 13.
In this embodiment, the upper anti-vibration layer 12 and the lower anti-vibration layer 13 facilitate increasing the anti-vibration capability of the circuit board, thereby preventing the work of the circuit board from being affected by vibration.
The top end of the first radiating fin 9 passes through the upper shockproof layer 12 to be connected with the bottom of the upper cover plate 4.
The bottom end of the second heat sink 10 passes through the lower anti-vibration layer 13 and is connected with the top of the lower cover plate 6.
Each side wall of the unit circuit board 1 is provided with two half butterfly mortises 2.
The working principle is as follows: when the spliced printed circuit board is used, two adjacent circuit boards are conveniently connected through the half butterfly mortise 2 and the butterfly tenon 3, so that the circuit boards are conveniently and flexibly used; the circuit board main body 5 is protected conveniently through the upper cover plate 4 and the lower cover plate 6; the upper heat conduction layer 7 and the lower heat conduction layer 8 are used for conveniently and rapidly conducting heat generated on the circuit board main body 5 to the first heat dissipation plate 9 and the second heat dissipation plate 10, so that heat accumulation on the circuit board main body 5 is avoided; the first radiating fin 9 and the second radiating fin 10 are used for facilitating the quick release of heat into the air; the heat dissipation to the outside is facilitated through the heat dissipation holes 11; through the concatenation formula printed circuit board of constituteing by a plurality of unit circuit boards 1, can realize the concatenation of circuit board and use, and have good radiating effect, the heat piles up in a large number when can avoiding using, increases the life of circuit board.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (5)
1. The utility model provides a concatenation formula printed circuit board, characterized by: the butterfly-shaped circuit board structure comprises a plurality of unit circuit boards (1), wherein semi-butterfly mortises (2) are formed in each side wall of each unit circuit board (1), the semi-butterfly mortises (2) on the left side and the right side of each unit circuit board (1) are mutually symmetrical, and the semi-butterfly mortises (2) on the front side and the rear side of each unit circuit board (1) are mutually symmetrical; butterfly tenons (3) are embedded in two corresponding half butterfly mortises (2) on the connecting edges of two adjacent unit circuit boards (1); the unit circuit board (1) comprises an upper cover plate (4), a circuit board main body (5) and a lower cover plate (6) which are sequentially arranged from top to bottom, an upper heat conduction layer (7) is arranged at the top of the circuit board main body (5), and a lower heat conduction layer (8) is arranged at the bottom of the circuit board main body (5); the top of the upper heat conduction layer (7) is provided with a first radiating fin (9); the bottom of the lower heat conduction layer (8) is provided with a second radiating fin (10); the upper cover plate (4) and the lower cover plate (6) are provided with a plurality of heat dissipation holes (11).
2. The tiled printed circuit board of claim 1, wherein: an upper shockproof layer (12) is arranged at the bottom of the upper cover plate (4); and a lower shockproof layer (13) is arranged at the top of the lower cover plate (6).
3. The tiled printed circuit board of claim 1, wherein: the top end of the first radiating fin (9) penetrates through the upper shockproof layer (12) to be connected with the bottom of the upper cover plate (4).
4. The tiled printed circuit board of claim 1, wherein: the bottom end of the second radiating fin (10) penetrates through the lower shockproof layer (13) to be connected with the top of the lower cover plate (6).
5. The tiled printed circuit board of claim 1, wherein: each side wall of the unit circuit board (1) is provided with two half butterfly mortises (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123390553.7U CN217693866U (en) | 2021-12-31 | 2021-12-31 | Concatenation formula printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123390553.7U CN217693866U (en) | 2021-12-31 | 2021-12-31 | Concatenation formula printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693866U true CN217693866U (en) | 2022-10-28 |
Family
ID=83727853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123390553.7U Active CN217693866U (en) | 2021-12-31 | 2021-12-31 | Concatenation formula printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693866U (en) |
-
2021
- 2021-12-31 CN CN202123390553.7U patent/CN217693866U/en active Active
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