CN203219622U - Resin hole plugging tool for printed circuit board - Google Patents
Resin hole plugging tool for printed circuit board Download PDFInfo
- Publication number
- CN203219622U CN203219622U CN 201320194121 CN201320194121U CN203219622U CN 203219622 U CN203219622 U CN 203219622U CN 201320194121 CN201320194121 CN 201320194121 CN 201320194121 U CN201320194121 U CN 201320194121U CN 203219622 U CN203219622 U CN 203219622U
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- Prior art keywords
- plate
- printed circuit
- resin
- circuit board
- aeroscopic plate
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Abstract
The utility model is applied to the field of the manufacture of a printed circuit board and provides a simple tool for resin hole plugging of the printed circuit board. The tool comprises a rectangular aeroscopic plate, wherein a plurality of air guide holes are drilled on the aeroscopic plate; and the plurality of air guide holes correspond to the perforates of a to-be-resin-hole-plugged production board respectively, the diameter of each air guide hole being bigger than that of the respective perforate on the production plate. The provided tool has a simple structure; compared to a conventional manual resin hole plugging tool in the prior art, the provided tool helps to solve the problem of partially filled hole plugging and prevent generation of voids; and compared to a special-purpose vacuum resin hole plugging device, the provided tool has the advantages of low cost, easy operation and improved productivity.
Description
Technical field
The utility model belongs to the processing procedure field of printed circuit board (PCB), relates in particular to a kind of easy, the frock that can carry out filling holes with resin to printed circuit board (PCB).
Background technology
(Printed Circuit Board PCB) is the carrying person that electronic devices and components are electrically connected to printed circuit board.According to the difference of the circuit number of plies, printed circuit board (PCB) can be divided into single sided board, double sided board and multi-layer sheet.Common multi-layer sheet is generally 4 laminates or 6 laminates, and complicated multi-layer sheet can reach tens layers.
Along with miniaturization and the microminiaturized development of assembling components and parts, the wiring area of printed circuit board (PCB), the design area also reduces thereupon.The filling holes with resin technology namely is to cooperate this kind trend to produce, in current printed circuit board (PCB), particularly multi-layer sheet by more and more widely application.
Traditional filling holes with resin implementation is to adopt the manual filling holes with resin of realizing, this kind mode can not cause consent full or have a generation of cavity.Be directed to this, prior art generally adopts the vacuum consent equipment of specialty to realize filling holes with resin, but this kind mode requires to use professional equipment, half tone and aluminium flake etc., and cost height and production efficiency are low.
Summary of the invention
The purpose of this utility model is to provide a kind of filling holes with resin frock of printed circuit board (PCB), when being intended to solve vacuum consent equipment that prior art adopts specialty and realizing filling holes with resin, has cost height, problem that production efficiency is low.
The utility model is achieved in that a kind of filling holes with resin frock of printed circuit board (PCB), and described frock comprises:
The aeroscopic plate of rectangle is drilled with a plurality of gas ports on the described aeroscopic plate, described a plurality of gas ports are corresponding one by one with position of opening on the production plate for the treatment of filling holes with resin, and the diameter of each described gas port is all greater than the diameter of corresponding perforate on the described production plate.
Wherein, on described aeroscopic plate, the boundary position place of described aeroscopic plate can have at least one location hole.
Further, on described aeroscopic plate, the left border position of described aeroscopic plate can have first location hole and second location hole; On described aeroscopic plate, the right side boundary position of described aeroscopic plate can have the 3rd location hole.
In the filling holes with resin frock of above-mentioned printed circuit board (PCB), described aeroscopic plate can be the FR-4 printed circuit plate substrate of thickness more than or equal to 1.0mm, the arbitrary limit of described aeroscopic plate is with respect to the corresponding sides extension 5mm of described production plate, and the diameter of each described gas port is all greater than the diameter 1mm of corresponding perforate on the described production plate on the described aeroscopic plate.
The filling holes with resin tool structure of the printed circuit board (PCB) that the utility model provides is simple, with respect to traditional manual filling holes with resin technology, can solve the not full problem of consent and avoid the generation of cavity; With respect to special-purpose vacuum resin consent equipment, cost is low, and is simple to operate, thereby improved productivity ratio.
Description of drawings
Fig. 1 is the structure chart of the filling holes with resin frock of the printed circuit board (PCB) that provides of the utility model embodiment;
Fig. 2 is the filling holes with resin frock of using the printed circuit board (PCB) that the utility model embodiment the provides schematic diagram when printed circuit board (PCB) is carried out filling holes with resin.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structure of the filling holes with resin frock of the printed circuit board (PCB) that the utility model embodiment provides.
The filling holes with resin frock of the printed circuit board (PCB) that the utility model first embodiment provides comprises: the aeroscopic plate 1 of rectangle, be drilled with a plurality of gas ports on the aeroscopic plate 1, these a plurality of gas ports are corresponding one by one with position of opening on the production plate for the treatment of filling holes with resin, and the diameter of each gas port is all greater than the diameter of producing corresponding perforate on the plate.
Further, on aeroscopic plate 1, have at least one location hole near the boundary position place of aeroscopic plate 1.Preferably, on aeroscopic plate 1, have first location hole 2 and second location hole 3 near the left border position of aeroscopic plate 1; On aeroscopic plate 1, have the 3rd location hole 4 near the right side boundary position of aeroscopic plate 1.
Further, aeroscopic plate 1 be thickness more than or equal to the FR-4 printed circuit plate substrate of 1.0mm, aeroscopic plate 1 arbitrary limit is with respect to the corresponding sides extension 5mm that produces plate.
Further, on the aeroscopic plate 1 diameter of each gas port all greater than the diameter 1mm that produces corresponding perforate on the plate.
When this frock of application is carried out filling holes with resin to printed circuit board (PCB), as shown in Figure 2, to produce plate by being fixed on the aeroscopic plate 1 by the PIN nail, plug socket resin directly is poured on the production plate on a small quantity, the scraper that with hardness is 75 ° prints three to five times back and forth producing on the plate, till there was the bleed phenomenon at the back side that produces plate, it was full to illustrate that the hole has been gorged.In illustrated in figures 1 and 2, stain is in order to characterize perforate.
The filling holes with resin tool structure of the printed circuit board (PCB) that the utility model provides is simple, with respect to traditional manual filling holes with resin technology, can solve the not full problem of consent and avoid the generation of cavity; With respect to special-purpose vacuum resin consent equipment, cost is low, and is simple to operate, thereby improved productivity ratio.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1. the filling holes with resin frock of a printed circuit board (PCB) is characterized in that, described frock comprises:
The aeroscopic plate of rectangle is drilled with a plurality of gas ports on the described aeroscopic plate, described a plurality of gas ports are corresponding one by one with position of opening on the production plate for the treatment of filling holes with resin, and the diameter of each described gas port is all greater than the diameter of corresponding perforate on the described production plate.
2. the filling holes with resin frock of printed circuit board (PCB) as claimed in claim 1 is characterized in that, on described aeroscopic plate, the boundary position place of described aeroscopic plate has at least one location hole.
3. the filling holes with resin frock of printed circuit board (PCB) as claimed in claim 2 is characterized in that, on described aeroscopic plate, the left border position of described aeroscopic plate has first location hole and second location hole; On described aeroscopic plate, the right side boundary position of described aeroscopic plate has the 3rd location hole.
4. as the filling holes with resin frock of each described printed circuit board (PCB) of claim 1 to 3, it is characterized in that, described aeroscopic plate is that thickness is more than or equal to the FR-4 printed circuit plate substrate of 1.0mm, the arbitrary limit of described aeroscopic plate is with respect to the corresponding sides extension 5mm of described production plate, and the diameter of each described gas port is all greater than the diameter 1mm of corresponding perforate on the described production plate on the described aeroscopic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320194121 CN203219622U (en) | 2013-04-17 | 2013-04-17 | Resin hole plugging tool for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320194121 CN203219622U (en) | 2013-04-17 | 2013-04-17 | Resin hole plugging tool for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203219622U true CN203219622U (en) | 2013-09-25 |
Family
ID=49209122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320194121 Expired - Fee Related CN203219622U (en) | 2013-04-17 | 2013-04-17 | Resin hole plugging tool for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203219622U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763871A (en) * | 2014-02-18 | 2014-04-30 | 无锡江南计算技术研究所 | Printed board open hole printing ink filling method and hole filling breathable board |
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN110785024A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
-
2013
- 2013-04-17 CN CN 201320194121 patent/CN203219622U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103763871A (en) * | 2014-02-18 | 2014-04-30 | 无锡江南计算技术研究所 | Printed board open hole printing ink filling method and hole filling breathable board |
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN110785024A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
| CN110785024B (en) * | 2019-10-31 | 2021-05-07 | 珠海精毅电路有限公司 | Circuit board resin hole plugging process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20150417 |
|
| EXPY | Termination of patent right or utility model |