CN102649329A - Uniform temperature and thermal insulation thin film material - Google Patents
Uniform temperature and thermal insulation thin film material Download PDFInfo
- Publication number
- CN102649329A CN102649329A CN2011100431761A CN201110043176A CN102649329A CN 102649329 A CN102649329 A CN 102649329A CN 2011100431761 A CN2011100431761 A CN 2011100431761A CN 201110043176 A CN201110043176 A CN 201110043176A CN 102649329 A CN102649329 A CN 102649329A
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- heat
- air
- plane
- film material
- thermal conductivity
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Abstract
The invention discloses a thin film material with excellent planar uniform temperature (namely higher plane thermal coefficient) and heat insulating (low and longitudinal thermal coefficient) functions, and the thin film material is characterized in that the material comprises a high thermal coefficient planar heat-conducting layer (100) with the thickness of 0.1 to 0.3 mm, and an air heat insulation layer (200) with the thickness of 0.1 to 0.3 mm; and the air heat insulation layer (200) in the middle comprises a glass fiber mesh (201) and air (202).
Description
Technical field
The present invention has announced a kind of samming, thermal insulation film material.
Background technology
The plane of existing samming, heat-barrier material on the market and vertical thermal conductivity factor difference is big (for example graphite all has only tens times of left and right sides differences) inadequately, and its samming, effect of heat insulation are unsatisfactory; And the plane thermal conductivity factor of heat-barrier materials such as asbestos, glass is too little, does not have the effect of samming basically.
Use novel content
The invention reside in provides a kind of have fine plane samming (promptly having high plane thermal conductivity factor), heat insulation (low vertical thermal conductivity factor) thin-film material, and its main feature is to utilize the metal (copper, aluminium etc.) with outstanding heat conductivility to carry out the samming of in-plane; It is vertically heat insulation to utilize the best air of effect of heat insulation to carry out simultaneously, thereby plane and vertical samming, the heat-barrier material of thermal conductivity ratio up to tens thousand of times are provided.In addition, this invention material also has thin thickness (0.2mm-1mm), good, the production and with low cost easily of pliability, and can be widely used in the surface needs heat insulation, samming processing electronic product.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a kind of application structure sketch map of the present invention;
Fig. 3 is a heat insulation air layer structural representation of the present invention.
Claims (6)
1. the present invention has announced a kind of have fine plane samming (promptly having high plane thermal conductivity factor), heat insulation (low vertical thermal conductivity factor) thin-film material, and it is characterized in that: this material is that the plane heat-conducting layer (100) of the high hot coefficient of 0.1-0.3mm, the air heat-insulation layer (200) that one deck is 0.1-0.3mm are formed by a layer thickness.
2. this material also can be formed by three layers, wherein two-layer be the high hot coefficient of thickness 0.1-0.3mm plane heat-conducting layer (100), middlely be the air heat-insulation layer of 0.1-0.5mm (200).
3. heat-conducting layer according to claim 1 is the metal copper foil/aluminium foil of (100) high thermal conductivity coefficient.
4. heat-conducting layer according to claim 1 (100) is for having the graphite film of high plane thermal conductivity factor.
5. air heat-insulation layer according to claim 1 (200) is made up of glass mesh net (201) and air (202).
6. air heat-insulation layer according to claim 1 (200) is made up of other foaming substance (for example sponge, Sponge etc.) and air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100431761A CN102649329A (en) | 2011-02-23 | 2011-02-23 | Uniform temperature and thermal insulation thin film material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100431761A CN102649329A (en) | 2011-02-23 | 2011-02-23 | Uniform temperature and thermal insulation thin film material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102649329A true CN102649329A (en) | 2012-08-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100431761A Pending CN102649329A (en) | 2011-02-23 | 2011-02-23 | Uniform temperature and thermal insulation thin film material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102649329A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009684A (en) * | 2012-12-26 | 2013-04-03 | 天津冰华科技发展有限公司 | Novel cold insulation material |
| CN105711196A (en) * | 2016-01-27 | 2016-06-29 | 太仓捷公精密金属材料有限公司 | Heat insulation metal material |
| CN108501465A (en) * | 2017-02-28 | 2018-09-07 | 松下知识产权经营株式会社 | Heat insulating member and the insulated structure of the heat insulating member and the manufacturing method of the heat insulating member are used |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2608806Y (en) * | 2003-02-19 | 2004-03-31 | 吴坤祐 | Polyethylene thermal insulating material adhered aluminium foil structure |
| CN2712624Y (en) * | 2003-12-15 | 2005-07-27 | 耿洪彪 | Aluminum foil gas bubble composite reflective insulation material |
| US20060188730A1 (en) * | 2005-02-24 | 2006-08-24 | Pilington North America, Inc. | Anti-reflective, thermally insulated glazing articles |
| CN2937305Y (en) * | 2006-07-21 | 2007-08-22 | 钟上柱 | Sunshade heat insulation film |
-
2011
- 2011-02-23 CN CN2011100431761A patent/CN102649329A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2608806Y (en) * | 2003-02-19 | 2004-03-31 | 吴坤祐 | Polyethylene thermal insulating material adhered aluminium foil structure |
| CN2712624Y (en) * | 2003-12-15 | 2005-07-27 | 耿洪彪 | Aluminum foil gas bubble composite reflective insulation material |
| US20060188730A1 (en) * | 2005-02-24 | 2006-08-24 | Pilington North America, Inc. | Anti-reflective, thermally insulated glazing articles |
| CN2937305Y (en) * | 2006-07-21 | 2007-08-22 | 钟上柱 | Sunshade heat insulation film |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009684A (en) * | 2012-12-26 | 2013-04-03 | 天津冰华科技发展有限公司 | Novel cold insulation material |
| CN103009684B (en) * | 2012-12-26 | 2016-05-25 | 天津瀛德科技有限公司 | A kind of novel cold insulation material |
| CN105711196A (en) * | 2016-01-27 | 2016-06-29 | 太仓捷公精密金属材料有限公司 | Heat insulation metal material |
| CN108501465A (en) * | 2017-02-28 | 2018-09-07 | 松下知识产权经营株式会社 | Heat insulating member and the insulated structure of the heat insulating member and the manufacturing method of the heat insulating member are used |
| US11293583B2 (en) | 2017-02-28 | 2022-04-05 | Panasonic Intellectual Property Management Co., Ltd. | Heat-insulation material, heat-insulation structure using same, and process for producing same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Room 7, building 8 blue light technology C-801 Nanshan District Pine Hill New West Shenzhen City, Guangdong province 518057 Applicant after: Shenzhen City Chuangzhicheng Technology Co., Ltd. Address before: West Industrial Zone, Nanshan District science and Technology Park in Shenzhen city of Guangdong province 518057 Keyuan 25 Building 2 West 5 floor Applicant before: Shenzhen City Chuangzhicheng Technology Co., Ltd. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120829 |