CN202945194U - Heat-conducting type adhesive tape for electronic product - Google Patents
Heat-conducting type adhesive tape for electronic product Download PDFInfo
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- CN202945194U CN202945194U CN 201220525203 CN201220525203U CN202945194U CN 202945194 U CN202945194 U CN 202945194U CN 201220525203 CN201220525203 CN 201220525203 CN 201220525203 U CN201220525203 U CN 201220525203U CN 202945194 U CN202945194 U CN 202945194U
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- layer
- heat
- adhesive tape
- knitting
- copper wires
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Abstract
The utility model discloses a heat-conducting type adhesive tape for an electronic product. The adhesive tape comprises a metal knitting layer formed by knitting first copper wires used as longitude lines and second copper wires used as latitude lines, wherein a first aluminum foil layer and a second aluminum foil layer are respectively bonded on the upper surface and lower surface of the metal knitting layer; an adhesive bonding layer is coated on the lower surface of the second aluminum foil layer; a release material layer is bonded on the other surface of the adhesive bonding layer; a plurality of graphite particles are evenly distributed in the adhesive bonding layer; the diameter range of each graphite particle is from 3 to 6 mu m; the knitting tightness of the first copper wires is as follows: 100 to 500 of the first copper wires are knitted per centimeter; and the knitting tightness of the second copper wires is as follows: 100 to 500 of the second copper wires are knitted per centimeter. The adhesive tape disclosed by the utility model is provided with a heat-conducting interface material with good heat conductivity, is convenient to use and can be tightly bonded with a heat source surface.
Description
Technical field
The utility model relates to a kind of heat-conducting type adhesive tape, relates in particular to a kind of heat-conducting type adhesive tape for electronic product.
Background technology
The acceleration of the continuous upgrading of electronic product, high integrated and high-performance electric subset growing, the work package volume size is more and more less, and speed and the efficient of work are more and more higher, and thermal value is increasing.At present, oneself is subjected to the restriction of its material and self heat conduction and heat radiation limit known metal species heat conduction and heat radiation assembly, must adopt advanced heat conduction and heat radiation technique and the heat conduction and heat radiation material of excellent performance to be defined as away heat, guarantee effective work of its electronic product, and the fan type radiating that adopted in the past, because volume is large, can produce the problems such as noise, eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material can satisfy the heat radiation of existing electronic devices and components well.
And in the market graphite paper heat radiation be many, but also there are some shortcomings in this, the processing more complicated will be passed through special processing, and thickness relatively thick (graphite material thickness is thicker, and radiating effect is poorer).
Summary of the invention
The utility model provides a kind of heat-conducting type adhesive tape for electronic product, and this graphite heat conducting adhesive tape has the heat-conducting interface material of thermal conductive resin; And easy to use, be convenient to be combined closely in thermal source surface and heat-conducting glue adhesive tape.
For achieving the above object, the technical solution adopted in the utility model is: a kind of heat-conducting type adhesive tape for electronic product, comprise a bonding braid, this bonding braid is by forming through knitting device as the first copper wire of warp and the second copper wire as parallel, the upper and lower surface of this bonding braid is covered with respectively the first aluminium foil layer, the second aluminium foil layer, this the second aluminium foil layer lower surface is coated with the heat radiation adhesive-layer, and this another surface label of heat radiation adhesive-layer is covered with the separated type material layer.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, the knitting tightness of described the first copper wire is 100500/cm, and the knitting tightness of the second copper wire is 100500/cm.
2. in such scheme, described separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model graphite heat conducting adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity, and has realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its heat radiation adhesive-layer inside is evenly distributed with several graphite granules, and is easy to use, after only needing the separate-type paper on surface is peeled off, covers respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Description of drawings
Accompanying drawing 1 is used for the heat-conducting type adhesive tape structure schematic diagram of electronic product for the utility model;
Accompanying drawing 2 is the utility model bonding braid structural representation.
In above accompanying drawing: 1, bonding braid; 11, the first copper wire; 12, the second copper wire; 2, heat radiation adhesive-layer; 3, separated type material layer; 4, graphite granule; 51, the first aluminium foil layer; 52, the second aluminium foil layer.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of heat-conducting type adhesive tape for electronic product, comprise a bonding braid 1, this bonding braid 1 is by forming through knitting device as the first copper wire 11 of warp and the second copper wire 12 as parallel, the upper and lower surface of this bonding braid 1 is covered with respectively the first aluminium foil layer 51, the second aluminium foil layer 52, these the second aluminium foil layer 52 lower surfaces are coated with heat radiation adhesive-layer 2, these heat radiation adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described heat radiation adhesive-layer 2 is for being embedded with the adhesive-layer of several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 3.8 microns.
The knitting tightness of above-mentioned the first copper wire 11 is 150/cm, and the knitting tightness of the second copper wire 12 is 355/cm.
Above-mentioned separated type material layer 3 is off-style paper layers.
Embodiment 2: a kind of heat-conducting type adhesive tape for electronic product, comprise a bonding braid 1, this bonding braid 1 is by forming through knitting device as the first copper wire 11 of warp and the second copper wire 12 as parallel, the upper and lower surface of this bonding braid 1 is covered with respectively the first aluminium foil layer 51, the second aluminium foil layer 52, these the second aluminium foil layer 52 lower surfaces are coated with heat radiation adhesive-layer 2, these heat radiation adhesive-layer 2 another surface labels are covered with separated type material layer 3, and described heat radiation adhesive-layer 2 is for being embedded with the adhesive-layer of several graphite granules 4.
The diameter range of above-mentioned graphite granule 4 is 6 microns.
The knitting tightness of above-mentioned the first copper wire 11 is 420/cm, and the knitting tightness of the second copper wire 12 is 200/cm.
Above-mentioned separated type material layer 3 is release film layers.
When adopting above-mentioned heat-conducting type adhesive tape for electronic product, it has guaranteed that length and thickness direction have all improved thermal conductivity, and realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its heat radiation adhesive-layer 2 inside are evenly distributed with several graphite granules 4, and are easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit change or modify, within all should being encompassed in protection domain of the present utility model.
Claims (3)
1. heat-conducting type adhesive tape that is used for electronic product, it is characterized in that: comprise a bonding braid (1), this bonding braid (1) is by forming through knitting device as first copper wire (11) of warp and the second copper wire (12) as parallel, the upper and lower surface of this bonding braid (1) is covered with respectively the first aluminium foil layer (51), the second aluminium foil layer (52), this the second aluminium foil layer (52) lower surface is coated with heat radiation adhesive-layer (2), and another surface label of this adhesive-layer (2) is covered with separated type material layer (3).
2. heat-conducting type adhesive tape according to claim 1, it is characterized in that: the knitting tightness of described the first copper wire (11) is 100500/cm, the knitting tightness of the second copper wire (12) is 100500/cm.
3. heat-conducting type adhesive tape according to claim 1, it is characterized in that: described separated type material layer (3) is release film layer or off-style paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525203 CN202945194U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting type adhesive tape for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525203 CN202945194U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting type adhesive tape for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202945194U true CN202945194U (en) | 2013-05-22 |
Family
ID=48420902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220525203 Expired - Lifetime CN202945194U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting type adhesive tape for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202945194U (en) |
-
2012
- 2012-10-15 CN CN 201220525203 patent/CN202945194U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130522 |
|
| CX01 | Expiry of patent term |