CN110418513B - Laser uncapping method and device, storage medium and laser uncapping equipment - Google Patents
Laser uncapping method and device, storage medium and laser uncapping equipment Download PDFInfo
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- CN110418513B CN110418513B CN201810404717.0A CN201810404717A CN110418513B CN 110418513 B CN110418513 B CN 110418513B CN 201810404717 A CN201810404717 A CN 201810404717A CN 110418513 B CN110418513 B CN 110418513B
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- laser
- laser etching
- scanning
- etching scanning
- uncapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Abstract
The invention relates to the technical field of laser uncapping equipment, and discloses a laser uncapping method and device, a storage medium and laser uncapping equipment. The method comprises the following steps: dividing an area of a workpiece to be uncapped into a plurality of laser etching scanning areas; planning a processing path for the plurality of laser etching scanning areas; acquiring the thickness of an uncapping layer of the workpiece and the precision value of laser etching scanning; calculating the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value; and performing laser etching scanning on the plurality of laser etching scanning areas, wherein the theoretical scanning boundary of two adjacent laser etching scanning areas is separated from the interval during laser etching scanning. The laser etching scanning light bars in the two adjacent laser etching scanning areas are not overlapped during laser etching scanning, so that the circuit of a workpiece is prevented from being damaged by laser, and the yield of the workpiece during laser uncapping is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of laser uncapping equipment, and discloses a laser uncapping method, a laser uncapping device, a storage medium and laser uncapping equipment.
Background
When failure analysis or other applications are performed on electronic components such as chips and PCB boards (printed circuit boards), it is necessary to open a cover (also referred to as unsealing) to remove a structure such as a sealant. The laser cover opening device is a device which is frequently used when electronic elements such as chips, PCBs and the like are opened.
In the process of researching the invention, the inventor finds that the laser uncapping method used by the laser uncapping equipment in the prior art is easy to over-etch the boundary of two adjacent laser etching scanning areas, and further damages the circuits of electronic components such as chips, PCBs and the like.
Disclosure of Invention
The technical scheme disclosed by the invention can at least solve the following technical problems: in the prior art, the laser uncapping method used by the laser uncapping device is easy to excessively etch the junction of two adjacent laser etching scanning areas, so that circuits of electronic components such as chips, Printed Circuit Boards (PCB) and the like are damaged.
One or more embodiments of the invention disclose a laser uncapping method, which is applied to laser uncapping equipment and comprises the following steps: dividing an area of a workpiece to be uncapped into a plurality of laser etching scanning areas; planning a processing path for the plurality of laser etching scanning areas; acquiring the thickness of an uncapping layer of the workpiece and the precision value of laser etching scanning; calculating the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value; and performing laser etching scanning on the plurality of laser etching scanning areas, wherein the theoretical scanning boundary of two adjacent laser etching scanning areas is separated from the interval during laser etching scanning.
In one or more embodiments of the invention, the spacing is positively correlated with the thickness of the capping layer, and the spacing is greater than or equal to zero.
In one or more embodiments of the invention, the precision value is calculated based on the precision of the laser etch scanning system and the precision of the drive system.
In one or more embodiments of the invention, the thickness of the opening layer is less than or equal to 100 μm; in the same laser etching scanning area, the depth of the laser etching scanning is 1/2-2/3 of the thickness of the opening layer.
One or more embodiments of the invention disclose a device for opening a cover by laser, which is applied to a laser cover opening device and comprises: the area dividing module is used for dividing an area of the workpiece to be uncapped into a plurality of laser etching scanning areas; the path planning module is used for planning processing paths of the laser etching scanning areas; the acquisition module is used for acquiring the thickness of the uncapping layer of the workpiece and the precision value of laser etching scanning; the distance calculation module is used for calculating the distance of a theoretical scanning boundary of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value; and the control module is used for controlling the laser etching scanning of the plurality of laser etching scanning areas and controlling the interval between theoretical scanning boundaries of two adjacent laser etching scanning areas during the laser etching scanning.
In one or more embodiments of the present invention, the pitch calculated by the pitch calculation module is positively correlated with the thickness of the capping layer, and the pitch is greater than or equal to zero.
In one or more embodiments of the invention, the acquisition module calculates the precision value based on a precision of a laser etch scanning system and a precision of a drive system.
In one or more embodiments of the invention, the thickness of the opening layer is less than or equal to 100 μm; in the same laser etching scanning area, the control module controls the depth of the laser etching scanning to be 1/2-2/3 of the thickness of the opening layer.
One or more embodiments of the present invention disclose a non-transitory computer readable storage medium having stored therein computer instructions adapted to be loaded by a processor to implement any one of the above-described methods of laser decapping.
One or more embodiments of the invention disclose a laser uncapping device, which comprises a laser etching scanning system and a driving system, wherein the driving system drives the laser etching scanning system to perform laser etching scanning on a region to be uncapped of a workpiece, and the laser uncapping device realizes any one of the above laser uncapping methods.
Compared with the prior art, the technical scheme disclosed by the invention mainly has the following beneficial effects:
in an embodiment of the present invention, the laser decapping method includes: dividing an area of a workpiece to be uncapped into a plurality of laser etching scanning areas; planning a processing path for the plurality of laser etching scanning areas; acquiring the thickness of an uncapping layer of the workpiece and the precision value of laser etching scanning; calculating the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value; and performing laser etching scanning on the plurality of laser etching scanning areas, wherein the theoretical scanning boundary of two adjacent laser etching scanning areas is separated from the interval during laser etching scanning. According to the laser uncapping method, the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning is calculated according to the thickness of the uncapping layer and the precision value, the laser etching scanning is carried out on the plurality of laser etching scanning areas, then the theoretical scanning boundaries of the two adjacent laser etching scanning areas are spaced at the distance during laser etching scanning, so that laser etching scanning optical strips of the two adjacent laser etching scanning areas are not overlapped during laser etching scanning, the uncapping layer of a workpiece at the boundary of the two adjacent laser etching scanning areas is prevented from being excessively etched by laser, a circuit of the workpiece is prevented from being damaged by the laser, and the laser uncapping method is beneficial to improving the yield of the workpiece during laser uncapping.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a schematic diagram of a laser uncapping method according to an embodiment of the invention;
FIG. 2 is a schematic view of an area of a workpiece to be uncapped and a processing path in accordance with an embodiment of the present invention;
FIG. 3 is a diagram illustrating a variation range of precision values according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating boundary line breakdown between two adjacent laser-etched scan regions according to an embodiment of the present invention;
FIG. 5 is a schematic view of an embodiment of the present invention after adjusting the theoretical scan boundaries of the laser-etched scanning light bar and the laser-etched scanning light bar during laser-etched scanning in two adjacent laser-etched scanning areas;
FIG. 6 is a schematic diagram of a PCB board according to an embodiment of the present invention;
FIG. 7 is a schematic illustration of the thickness of a layer of uncapped material as a function of depth of laser etch scanning in an embodiment of the present invention;
FIG. 8 is a schematic view of a laser uncapping apparatus according to an embodiment of the invention;
FIG. 9 is a diagram of an electronic device for calibrating laser power according to an embodiment of the present invention.
Description of reference numerals:
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The embodiment of the invention discloses a laser uncapping method. The laser uncapping method is applied to laser uncapping equipment. Specifically, the laser uncapping device uncaps (also referred to as unsealing) electronic components such as chips and PCBs (printed circuit boards) according to the laser uncapping method to remove structures such as sealants.
Fig. 1 is a schematic diagram of a laser uncapping method according to an embodiment of the present invention. As illustrated in fig. 1, the laser uncapping method includes:
step 1: and dividing the area of the workpiece to be uncapped into a plurality of laser etching scanning areas.
Step 2: and planning a processing path of the plurality of laser etching scanning areas.
And step 3: and acquiring the thickness of the uncapping layer of the workpiece and the precision value of laser etching scanning.
And 4, step 4: and calculating the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value.
And 5: and performing laser etching scanning on the plurality of laser etching scanning areas, wherein the theoretical scanning boundary of two adjacent laser etching scanning areas is separated from the interval during laser etching scanning.
According to the laser uncapping method, the distance between the theoretical scanning boundaries of the two adjacent laser etching scanning areas during laser etching scanning is calculated according to the thickness of the uncapping layer and the precision value, the laser etching scanning is carried out on the plurality of laser etching scanning areas, then the theoretical scanning boundaries of the two adjacent laser etching scanning areas are spaced at the distance during laser etching scanning, so that laser etching scanning optical stripes of the two adjacent laser etching scanning areas are not overlapped during laser etching scanning, the uncapping layer of a workpiece at the boundary of the two adjacent laser etching scanning areas is prevented from being excessively etched by laser, a circuit of the workpiece is prevented from being damaged by the laser, and the laser uncapping method is beneficial to improving the yield of the workpiece during laser uncapping.
Referring to fig. 2, a schematic diagram of an area 10 to be uncapped and a processing path of a workpiece according to an embodiment of the present invention is shown. As illustrated in fig. 2, the area 10 of the workpiece to be uncapped demarcates 9 laser-etched scanning areas 11. The laser uncapping device will etch and scan the 9 laser etching scanning areas 11 one by one. The multiple arrows in fig. 2 illustrate the processing path to the 9 laser etched scan areas 11. It should be understood that the area 10 of the workpiece to be uncapped and the processing path illustrated in fig. 2 are but one of many. Those skilled in the art can design a plurality of laser etching scanning areas and processing paths different from the case of fig. 2 without any inventive work beyond the scope of the present application, and the essence of the corresponding technical solution does not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Referring to fig. 3, a diagram illustrating a variation range of the precision value p according to an embodiment of the invention is shown. As illustrated in fig. 3, the laser-etching scanning light bar 21 and the laser-etching scanning light bar 22 correspond to two extreme positions of the variation of the precision value p. In this embodiment of the present invention, the coordinate value corresponding to the boundary line of the two laser etching scanning areas 11 is taken as the origin of coordinates 0, and the variation range of the precision value p is-20 μm to 20 μm. Typically the precision value p is affected by the precision of the laser etch scanning system and the precision of the drive system. Due to the precision value p, the laser etching scanning light bar emitted by the laser etching scanning system to the laser etching scanning area 11 does not exactly fall within the laser etching scanning area 11, and generally crosses the boundary line of the adjacent laser etching scanning area 11. Therefore, the laser emitted by the laser etching scanning system to the laser etching scanning area 11 will etch a partial area adjacent to the laser etching scanning area 11.
In one or more embodiments of the invention, the precision value is calculated based on the precision of the laser etch scanning system and the precision of the drive system. For example, the precision value p is obtained by superposing the precision of the laser etching scanning system and the precision of the driving system. Those skilled in the art can calculate the precision value by other calculation methods without departing from the spirit and scope of the technical solutions of the embodiments of the present application.
Referring to fig. 4, a boundary line breakdown between two adjacent laser-etched scanning areas 11 is schematically illustrated in an embodiment of the present invention. As illustrated in fig. 4, if the theoretical scanning boundaries of laser-etching scanning light bar 31 and laser-etching scanning light bar 32 during laser-etching scanning of two adjacent laser-etching scanning areas 11 are not adjusted, the traveling paths of laser-etching scanning light bar 31 and laser-etching scanning light bar 32 are overlapped to form laser-etching overlapped area 12. The laser etching scanning light bar 31 advances in the direction indicated by the arrow i, the laser etching scanning light bar 32 advances in the direction indicated by the arrow ii, and the laser etching scanning light bar 31 and the laser etching scanning light bar 32 are overlapped at the boundary between two adjacent laser etching scanning areas 11. There is a high probability that the laser will over-etch the uncapped layer of the workpiece in the laser-etched overlap region 12, thereby damaging the remaining portions of the workpiece. The remaining portion of the workpiece includes circuits and electronic components and the like inside the workpiece.
Referring to fig. 5, a schematic diagram of the laser-etching scanning light bar 31 and the laser-etching scanning light bar 32 after adjusting the theoretical scanning boundaries during the laser-etching scanning of two adjacent laser-etching scanning areas 11 according to an embodiment of the present invention is shown. As illustrated in fig. 5, assuming that the distance between the theoretical scanning boundaries of two adjacent laser etching scanning areas 11 during laser etching scanning is calculated to be k according to the thickness and precision of the opening layer, the laser etching scanning light bar 31 moves by the distance k in the direction of arrow iii to obtain a laser etching scanning light bar 33, and the laser etching scanning light bar 32 moves by the distance k in the direction of arrow iv to obtain a laser etching scanning light bar 34. The laser-etching scanning light bar 33 and the laser-etching scanning light bar 34 do not overlap at the boundary of the adjacent two laser-etching scanning areas 11. Therefore, the laser does not excessively etch the uncapped layer of the workpiece in the laser etching overlapping area 12, that is, the laser energy of two adjacent laser etching scanning areas 11 in the laser etching overlapping area 12 is not overlapped. For one point of the laser etched overlap region 12, the entire cap layer is not broken down by the overlap of laser energy.
In one or more embodiments of the invention, the spacing k is positively correlated with the thickness of the uncapped layer, and the spacing k is greater than or equal to zero.
Fig. 6 is a schematic diagram of a PCB board according to an embodiment of the invention. As illustrated in fig. 6, the top of one type of PCB board is an open cover layer 41. Below the opening cover 41 is a flexible board layer 42 of the PCB board. The remaining structure of the PCB panel is omitted for convenience of description of the embodiments of the present invention. The top surface of the opening layer 41 is an area to be uncovered, and the top surface of the opening layer 41 is divided into a plurality of laser etching scanning areas.
Referring to fig. 7, a relationship between the thickness of the cap-opening layer 41 and the depth of the laser etching scan in an embodiment of the invention is schematically shown. As illustrated in fig. 7, the thickness d of the opening layer 41 is less than or equal to 100 μm. In the same laser etching scanning area, the depth h of the laser etching scanning is 1/2-2/3 of the thickness d of the opening layer.
The corresponding pitch k to the thickness d of the different opening layers 41 in one embodiment of the present invention will be shown in table form below.
| d | k |
| 40μm | 40μm |
| 50μm | 30μm |
| 75μm | 20μm |
| 100μm | 0μm |
The thickness d and the interval k of the uncapping layer 41 in the above table are only used to illustrate the technical solution of the present invention, and those skilled in the art can calculate and obtain the thickness d and the corresponding interval k of the remaining uncapping layers 41 according to actual needs or obtain the thickness d and the corresponding interval k through experiments, without any creative work beyond the protection scope of the present application, and the essence of the corresponding technical solution does not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Another embodiment of the invention discloses a laser uncapping device. The laser uncapping device is applied to laser uncapping equipment.
Fig. 8 is a schematic diagram of a laser uncapping apparatus according to an embodiment of the present invention. As illustrated in fig. 8, the laser uncapping apparatus includes:
the area dividing module 100 is used for dividing an area of a workpiece to be uncapped into a plurality of laser etching scanning areas;
a path planning module 200, configured to plan a processing path for the plurality of laser etching scanning areas;
the acquiring module 300 is used for acquiring the thickness of the uncapping layer of the workpiece and the precision value of laser etching scanning;
the distance calculation module 400 is configured to calculate a distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value;
and the control module 500 is configured to control the laser etching scanning on the plurality of laser etching scanning areas, and control a theoretical scanning boundary of two adjacent laser etching scanning areas to be spaced by the distance during the laser etching scanning.
According to the laser uncapping device, the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning is calculated through the distance calculation module 400 according to the thickness of the uncapping layer and the precision value, the control module 500 controls the laser etching scanning of the laser etching scanning areas, and then the distance between the theoretical scanning boundaries of the two adjacent laser etching scanning areas during laser etching scanning is controlled, so that laser etching scanning optical strips of the two adjacent laser etching scanning areas are not overlapped during laser etching scanning, the uncapping layer of a workpiece at the boundaries of the two adjacent laser etching scanning areas is prevented from being excessively etched by laser, a circuit of the workpiece is prevented from being damaged by the laser, and the laser uncapping yield of the workpiece is improved.
In one or more embodiments of the present invention, the distance calculated by the distance calculation module 400 is positively correlated with the thickness of the capping layer, and the distance is greater than or equal to zero.
In one or more embodiments of the invention, the acquisition module 300 calculates the precision value based on the precision of the laser etch scanning system and the precision of the drive system.
In one or more embodiments of the invention, the thickness of the opening layer is less than or equal to 100 μm; in the same laser etching scanning area, the control module 500 controls the depth of the laser etching scanning to be 1/2 to 2/3 of the thickness of the opening layer.
Referring to fig. 9, an embodiment of the present invention discloses an electronic device for correcting laser power, including: at least one processor 201, at least one memory 202, at least one input device 203, and at least one output device 204. The processor 201, memory 202, input device 203, and output device 204 are connected by a bus 205. The electronic device is used for realizing any one of the laser uncapping methods.
An embodiment of the present invention discloses a non-transitory computer-readable storage medium, in which computer instructions are stored, and the computer instructions are suitable for being loaded by a processor to implement any one of the above methods for laser uncapping.
The embodiment of the invention discloses a laser uncapping device which comprises a laser etching scanning system and a driving system, wherein the driving system drives the laser etching scanning system to perform laser etching scanning on an area to be uncapped of a workpiece, and the laser uncapping device realizes any one of the above laser uncapping methods.
When the techniques in the various embodiments described above are implemented using software, the computer instructions and/or data to implement the various embodiments described above may be stored on a computer-readable medium or transmitted as one or more instructions or code on a readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that a computer can store. Taking this as an example but not limiting: computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Further, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium.
Finally, it should be noted that: the above examples are only for illustrating the technical solutions of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A laser uncapping method is applied to laser uncapping equipment and is characterized by comprising the following steps:
dividing an area of a workpiece to be uncapped into a plurality of laser etching scanning areas;
planning a processing path for the plurality of laser etching scanning areas;
acquiring the thickness of an uncapping layer of the workpiece and the precision value of laser etching scanning;
calculating the distance between theoretical scanning boundaries of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value;
and carrying out laser etching scanning on the plurality of laser etching scanning areas, wherein the interval of theoretical scanning boundaries of two adjacent laser etching scanning areas is the interval during laser etching scanning.
2. The laser decapping method according to claim 1, wherein the pitch is positively correlated with a thickness of the capping layer, and the pitch is greater than or equal to zero.
3. The laser door uncapping method of claim 1, wherein the accuracy value is calculated based on an accuracy of a laser etching scanning system and an accuracy of a driving system.
4. The laser decapping method according to any one of claims 1 to 3, wherein the thickness of the cap layer is less than or equal to 100 μm; in the same laser etching scanning area, the depth of the laser etching scanning is 1/2-2/3 of the thickness of the opening layer.
5. The utility model provides a device that laser uncapped, is applied to laser equipment of uncapping which characterized in that includes:
the area dividing module is used for dividing an area of the workpiece to be uncapped into a plurality of laser etching scanning areas;
the path planning module is used for planning processing paths of the laser etching scanning areas;
the acquisition module is used for acquiring the thickness of the uncapping layer of the workpiece and the precision value of laser etching scanning;
the distance calculation module is used for calculating the distance of a theoretical scanning boundary of two adjacent laser etching scanning areas during laser etching scanning according to the thickness of the opening layer and the precision value;
and the control module is used for controlling the laser etching scanning of the plurality of laser etching scanning areas and controlling the theoretical scanning boundary interval of two adjacent laser etching scanning areas to be the interval during the laser etching scanning.
6. The laser uncapping apparatus according to claim 5, wherein the pitch calculated by the pitch calculation module is positively correlated with the thickness of the opening layer, and the pitch is greater than or equal to zero.
7. The laser uncapping apparatus of claim 5, wherein said obtaining module calculates said precision value based on the precision of a laser etching scanning system and the precision of a driving system.
8. The laser decapping apparatus according to any one of claims 5 to 7, wherein the thickness of the cap layer is less than or equal to 100 μm; in the same laser etching scanning area, the control module controls the depth of the laser etching scanning to be 1/2-2/3 of the thickness of the opening layer.
9. A non-transitory computer readable storage medium having stored thereon computer instructions adapted to be loaded by a processor to perform the method of laser decapping of any one of claims 1-4.
10. A laser uncapping device comprises a laser etching scanning system and a driving system, wherein the driving system drives the laser etching scanning system to perform laser etching scanning on an area to be uncapped of a workpiece, and the laser uncapping device is characterized by realizing the laser uncapping method according to any one of claims 1 to 4.
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| CN201810404717.0A CN110418513B (en) | 2018-04-28 | 2018-04-28 | Laser uncapping method and device, storage medium and laser uncapping equipment |
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| CN201810404717.0A CN110418513B (en) | 2018-04-28 | 2018-04-28 | Laser uncapping method and device, storage medium and laser uncapping equipment |
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| CN110418513B true CN110418513B (en) | 2020-12-04 |
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| CN113814571A (en) * | 2021-09-13 | 2021-12-21 | 温州快刻科技有限公司 | Integrated control method for laser engraving image transfer and pattern detection |
| CN113960076A (en) * | 2021-10-20 | 2022-01-21 | 深圳市东方聚成科技有限公司 | Method and system for nondestructive uncovering and packaging test recycling of electronic device |
| CN114029623B (en) * | 2021-11-08 | 2023-06-09 | 上海理工大学 | Laser unsealing method for plastic cover of plastic sealed cavity power electronic device |
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| JPH11267860A (en) * | 1998-03-23 | 1999-10-05 | Olympus Optical Co Ltd | Marking device |
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| EP2177302B1 (en) * | 2008-10-15 | 2013-01-23 | Zentrum für Sonnenenergie- und Wasserstoff-Forschung Baden-Württemberg Gemeinnützige Stiftung | Method of removing layered material of a layered construction with a laser beam, with a preliminary grooving step and a removing step |
| CN103551746A (en) * | 2000-09-13 | 2014-02-05 | 浜松光子学株式会社 | Laser beam machining method and laser beam machining device |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
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2018
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|---|---|---|---|---|
| JPH11267860A (en) * | 1998-03-23 | 1999-10-05 | Olympus Optical Co Ltd | Marking device |
| CN103551746A (en) * | 2000-09-13 | 2014-02-05 | 浜松光子学株式会社 | Laser beam machining method and laser beam machining device |
| CN1373500A (en) * | 2001-02-08 | 2002-10-09 | 株式会社东芝 | Laser machining method and apparatus |
| EP2177302B1 (en) * | 2008-10-15 | 2013-01-23 | Zentrum für Sonnenenergie- und Wasserstoff-Forschung Baden-Württemberg Gemeinnützige Stiftung | Method of removing layered material of a layered construction with a laser beam, with a preliminary grooving step and a removing step |
| CN104582309A (en) * | 2013-10-14 | 2015-04-29 | 北大方正集团有限公司 | Rigid-flex circuit board and production method thereof |
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