CN110708890A - Manufacturing method of rigid-flex printed circuit board - Google Patents
Manufacturing method of rigid-flex printed circuit board Download PDFInfo
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- CN110708890A CN110708890A CN201910898264.6A CN201910898264A CN110708890A CN 110708890 A CN110708890 A CN 110708890A CN 201910898264 A CN201910898264 A CN 201910898264A CN 110708890 A CN110708890 A CN 110708890A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for manufacturing a rigid-flex printed circuit board, which comprises the following steps: s1: manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides in the middle of the inner-layer soft board; s2: further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein a gap formed by the slotting treatment extends to a leakage area of the inner-layer soft board; s3: arranging outer-layer hard boards after cutting treatment on two sides of the prepreg; s4: stacking the inner-layer soft board and the outer-layer hard board to obtain a soft and hard combined board, and S5: pressing the rigid-flexible board 5; according to the invention, the steps of baking and plasma cleaning are added to the existing pressing process step, and the specific parameters in the steps of plasma cleaning and pressing are adjusted, so that the situation that the rigid-flex combination plate is damaged and scrapped due to forced separation of the rigid material and the flexible material which are completely combined together after pressing is avoided.
Description
Technical Field
The invention relates to the technical field of manufacturing of circuit boards, in particular to a method for manufacturing a rigid-flex printed circuit board.
Background
In recent years, communication technologies (such as automation control, computers, communicators, instruments, medical instruments, military and aerospace) are rapidly developed. The micro-electronic technology which is rapidly developed along with the micro-electronic technology, miniaturization and multi-functionalization of electronic equipment, reduction of the assembly size and weight of electronic products, avoidance of connection errors, increase of assembly flexibility, improvement of reliability, realization of three-dimensional assembly under different assembly conditions, and the inevitable requirement for increasingly developing electronic products. The rigid-flex printed circuit board is used as a circuit board with the superior characteristics of thinness, lightness, flexibility and the like, can meet the interconnection technology of three-dimensional assembly, and is widely applied and valued in the electronic and communication industries.
Compared with the common rigid-flex board, the thickness of the ultrathin rigid-flex board is thinner, generally not more than 0.4mm, and under the aforementioned market trend, the demand for the ultrathin rigid-flex board is more and more increased.
At present, a lamination pressing technology is adopted in the manufacturing process of the ultrathin rigid-flexible combined plate, but problems exist in the aspects of selection and manufacturing method of an adhesive, use amount control of the adhesive, selection of pressing parameters, lamination design and the like, the quality of a final product is influenced, the rejection rate is high in the using process, and the efficiency and the cost are influenced, so that the further development of the ultrathin rigid-flexible combined plate is restricted.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of an embodiment of the present invention is to provide a method for manufacturing a flex-rigid board, which can manufacture an ultra-thin flex-rigid board and facilitate layering of a rigid material and a flexible material.
The technical scheme adopted by the embodiment of the invention is as follows:
in a first aspect, a method for manufacturing an ultra-thin rigid-flex printed circuit board includes:
manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides of the middle of the inner-layer soft board;
further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein gaps formed by the slotting treatment extend to the leakage area of the inner-layer soft board;
arranging outer-layer hard boards after cutting treatment on two sides of the prepreg;
stacking the inner-layer soft board and the outer-layer hard board to obtain a rigid-flexible board;
and pressing the rigid-flexible board.
Further, the notch extends to the soft board leakage area and is increased by 0.45mm-0.55mm on the reference surface of the board leakage area.
Further, the inner layer soft board is an H/H oz soft board with copper thickness of 20-30 μm, and the thickness of the covering film is 40-60 μm.
Further, the outer-layer hard board is a single-face hard board with the thickness of 0.025-0.75 mm.
Further, the pressing of the rigid-flex board specifically comprises:
baking the rigid-flexible board;
carrying out plasma cleaning on the baked rigid-flexible printed circuit board;
the three-in-one release film, the release film and the steel plate are sequentially arranged on two sides of the soft and hard combined plate;
and pressing by using a movable full-pressing machine.
Further, the temperature for baking the rigid-flexible printed circuit board is 120-180 ℃, and the baking time is 0.5-2 h. The plasma cleaning process is divided into three sections, and the cleaning gas comprises one or more of oxygen, nitrogen, argon and carbon tetrafluoride.
Further, the pressing step comprises a hot pressing process and a cold pressing process, the cold pressing process is performed after the hot pressing process, and the hot pressing process is performed under a vacuum condition.
Further, the hot-pressing process time is 30-50min, and the cold-pressing process time is 30-50 min.
Furthermore, the pressing temperature is 100-.
The invention has the beneficial effects that:
the invention can manufacture the ultrathin rigid-flex printed circuit board by adopting a lamination manufacturing process method, and can avoid the situation that the rigid-flex printed circuit board is damaged and scrapped due to the fact that rigid materials and flexible materials are completely combined together after lamination and are separated forcibly by controlling the cutting size of the prepreg, adding steps of baking and plasma cleaning on the existing lamination process steps and adjusting parameters (such as participation in gas, temperature, power and processing time) of the plasma cleaning step and specific parameters (such as temperature, material pressure, time and the like) in the lamination step.
Drawings
FIG. 1 is a schematic structural view of a rigid-flex printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic view showing an increased size of a leakage area of a flexible board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of pressing a rigid-flex printed circuit board according to an embodiment of the invention.
Reference numerals
1. An inner layer soft board; 2. covering the film; 3. a prepreg; 4. an outer hard board; 5. a rigid-flex board; 6. a three-in-one release film; 7. a release film; 8. and (3) a steel plate.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
For better understanding of the technical solution of the present invention, the technical terms referred to in the present application are defined as follows:
FR-4 is a code of a flame-resistant material grade, which means a material specification that a resin material must be self-extinguished after being burned, and it is not a material name but a material grade, so that there are very many kinds of FR-4 grade materials currently used for general circuit boards, but most of them are composite materials made of so-called tetra-functional (terra-Function) epoxy resin plus Filler (Filler) and glass fiber;
prepreg, pp sheet (Prepreg is the english abbreviation of Pre-pregant), is a sheet-like bonding material synthesized by resin and carrier; it will dissolve during the pressing process to serve as a bonding function.
Trinity from type tectorial membrane, trinity from type tectorial membrane three-layer structure design, the intermediate level is 150 mu m has the packing to hinder the flexible macromolecular material that glues and cushion, and upper and lower two-layer high temperature is from type macromolecular material, has both possessed traditional material buffering advantage before, has possessed higher gluey efficiency of hindering again, can provide great pressfitting pressure buffering and better filler effect.
Example 1:
referring to fig. 1, the present embodiment provides a method for manufacturing a rigid-flex printed circuit board, including the following steps:
s1: manufacturing a circuit on the inner-layer soft board 1, and attaching covering films 2 to two sides of the middle of the inner-layer soft board 1;
s2: further arranging prepregs on two sides of the inner-layer soft board 1, and performing grooving treatment on the prepregs 3, wherein a gap formed by the grooving treatment extends to a leakage area of the inner-layer soft board;
s3: arranging outer-layer hard plates 4 subjected to cutting treatment on two sides of the prepreg 3;
s4: stacking the inner-layer soft board 1 and the outer-layer hard board 4 to obtain a rigid-flexible board 5;
s5: and pressing the rigid-flexible board 5.
In the step S1, the inner soft board 1 is an H/H oz soft board with a copper thickness of 20-30 μm, and the cover film 2 has a size of 40-60 μm;
in the step S2, the prepreg 3 is 106 prepregs 3 without leaving glue, the prepregs 3 cover both sides of the inner-layer flexible printed circuit board, and serve as bonding agents for bonding, so as to ensure that the inner-layer flexible printed circuit board 1 has an exposed area, and prevent the outer-layer rigid printed circuit board 4 from being bonded to the inner-layer flexible printed circuit board 1 after being bonded together, and therefore, the semi-cured sheets 3 need to be hollowed, that is, the step of slotting in the step S2 is performed, so that the outer-layer rigid printed circuit board 4 is removed before being finally manufactured into a finished product. The size and edge alignment of the grooving process (also called opening window) for the semi-cured sheet 3 directly results in the quality of the rigid-flex printed circuit board after lamination.
In a specific embodiment, referring to fig. 2, the prepreg 3 is produced by laser cutting, and in order to control the glue flow of the prepreg 3, ensure that the adhesive glue does not flow into the exposed area of the inner layer flexible board 1 during pressing, the size of the gap of the prepreg 3 is increased, specifically, the gap extends to the leakage area of the inner layer flexible board 1 and is increased by 0.45mm to 0.55mm on the reference surface of the leakage area of the inner layer flexible board 1. (i.e., increased by 0.5mm and controlled to within plus or minus 0.05 mm).
In the step S3, the single-sided hard board with the outer layer hard board thickness of 0.025-0.75mm, the existing ultra-thin rigid-flex printed board is formed by laminating a copper foil on the upper and lower layers of the core board of the soft board to form a four-layer board, due to the structural design, the copper foil is only 18um thick and is directly laminated with the soft board, and the outer surface wrinkles after lamination to cause the rejection of the whole board, and the hard board used in the step S3 is actually added with the hard board on the basis of the original copper foil, so that the problems are avoided.
In step S4, the inner-layer flexible printed circuit board 1, the prepreg 3, and the outer-layer rigid printed circuit board 4 are stacked in the aforementioned order to obtain the rigid-flex board 5, which facilitates the subsequent pressing step.
Rigid-flex printed circuit board combines rigid material and flexible material together, this is the material of two different systems, if according to conventional pressfitting manufacturing technique, hardly ensure rigid material and flexible material after the pressfitting and combine together completely, have the condition that separated risk leads to scrapping to take place, and the cohesion is not good simultaneously and end user end can appear losing efficacy and take place to lead to the compensation in the use.
In the embodiment, the outer-layer hard board 4 and the inner-layer soft board 1 are laminated and then subjected to plasma cleaning, parameters of the plasma cleaning machine are adjusted, plasma cleaning is added to the rigid board (the outer-layer hard board 4) and the flexible board (the inner-layer soft board 1), and parameters of a plasma front baking board are adjusted and increased, so that the coarsening and the water cleaning performance of the surfaces of the hard board material and the flexible material are improved, and the rigid material and the flexible material are well combined together fully under the action of the adhesive.
In this embodiment, referring to fig. 3, S51-S54 specifically illustrate the pressing step of the rigid-flex board 5, and specifically includes the following steps:
s51: baking the rigid-flexible board 5;
s52: carrying out plasma cleaning on the baked rigid-flexible printed circuit board 5;
s53: a three-in-one release film 6, a release film 7 and a steel plate 8 are sequentially arranged on two sides of the rigid-flex board 5;
s54: and pressing by using a movable full-pressing machine.
In step S51, baking the rigid-flex board 5 by an oven at the baking temperature of 120-;
in step S52, the plasma cleaning process is divided into three sections, and the cleaning gas includes one or more of oxygen, nitrogen, argon, and carbon tetrafluoride. In one embodiment, the parameters associated with the plasma cleaning step are set forth in the following table, wherein sccm represents gas flow units (full name: standard cubic center meter per minute)
In step S53, the two sides of the rigid-flex board 5 are sequentially provided with a three-in-one release film 6, a release film 7 and a steel plate 8, as before, the three-in-one release type film three-layer structure design is adopted, the middle layer is 150um and is provided with a filling glue-blocking and buffering flexible high polymer material, the upper layer and the lower layer are provided with a high-temperature release high polymer material, the buffering advantages of the traditional materials before are achieved, the high-resistance glue-blocking effect is achieved, and the laminating pressure buffering and the glue-filling can be well achieved.
And in the step S54, a live full press is adopted for pressing, the pressing step is divided into a hot pressing process and a cold pressing process, the cold pressing process is carried out after the hot pressing process, the hot pressing process is carried out under the vacuum condition, and eight layers are arranged in each box according to double-spliced row plates.
Further, in step S54, the hot pressing process time is 30-50min, and the cold pressing process time is 30-50 min.
Further, in step S54, the pressing temperature is 100-.
The hot pressing process is that under the action of certain temperature and pressure, the prepreg is melted to combine the rigid plate and the flexible plate together, and the vacuum action is to draw out air in the rigid plate and the flexible plate during pressing so as to combine the rigid plate and the flexible plate more tightly. And the cold pressing is to reduce the pressing temperature and keep the pressure state so as to solidify the semi-curing adhesive.
Example 2
The manufacturing method of the rigid-flex printed circuit board and the specific steps of pressing the rigid-flex printed circuit board 5 in the embodiment 2 are substantially the same as those in the embodiment, and the differences from the embodiment 1 are as follows:
in step S1, the inner layer soft board 1 is an H/H oz soft board with a copper thickness of 20 μm, and the cover film 2 is 40 μm in size;
in step S3, the outer layer hard sheet 4 is a single-sided hard sheet with a thickness of 0.025 mm;
in step S4, the notch extends to the soft board leakage area and increases by 0.45mm on the reference plane of the board leakage area.
In step S51, baking the rigid-flex board 5 with an oven at 120 ℃ for 2 hours;
in step S54, the hot pressing process time is 30min, and the cold pressing process time is 30 min.
In step S54, the pressing temperature is 100 ℃, the pressing pressure is 100psi, and the pressing time is 10 min.
Example 3
The manufacturing method of the rigid-flex printed circuit board and the specific steps of pressing the rigid-flex printed circuit board 5 in the embodiment 3 are substantially the same as those in the embodiment, and the differences from the embodiment 1 are as follows:
in step S1, the inner layer soft board 1 is an H/H oz soft board with a copper thickness of 25 μm, and the cover film 2 is 50 μm in size;
in step S3, the outer layer hard sheet 4 is a single-sided hard sheet with a thickness of 0.5 mm;
in step S4, the notch extends to the soft board leakage area and increases by 0.5mm on the reference plane of the board leakage area.
In step S51, baking the rigid-flex board 5 with an oven at 150 ℃ for 1 hour;
in step S54, the hot pressing process time is 40min, and the cold pressing process time is 40 min.
In step S54, the pressing temperature is 120 ℃, the pressing pressure is 300psi, and the pressing time is 25 min.
Example 4
The manufacturing method of the rigid-flex printed circuit board and the specific steps of pressing the rigid-flex printed circuit board 5 in the embodiment 4 are substantially the same as those in the embodiment, and the differences from the embodiment 1 are as follows:
in step S1, the inner layer soft board 1 is an H/H oz soft board with a copper thickness of 30 μm, and the cover film 2 is 60 μm in size;
in step S3, the outer layer hard sheet 4 is a single-sided hard sheet with a thickness of 0.75 mm;
in step S4, the notch extends to the soft board leakage area and increases by 0.55mm on the reference plane of the board leakage area.
In step S51, baking the rigid-flex board 5 with an oven at 180 ℃ for 0.5 hour;
in step S54, the hot pressing process time is 50min, and the cold pressing process time is 50 min.
In step S54, the pressing temperature is 150 ℃, the pressing pressure is 140psi, and the pressing time is 2 min.
Example 5
The method of manufacturing the rigid-flex printed circuit board and the steps of pressing the rigid-flex printed circuit board 5 in example 5 are substantially the same as those in example, and the differences among step S1, step S3, step S4, and step S54 are the same as those in examples 2 to 4.
Example 5 differs from the above examples in the parameters for a live full press, see in particular the table below, where the pressing pressures and times corresponding to temperatures of 100, 120, 150 have been listed in examples 2 to 4, respectively.
| Temperature/. degree.C | 100 | 120 | 150 | 180 | 195 | 195 | 195 |
| Lamination pressure/psi | 100 | 300 | 140 | 215 | 355 | 500 | 500 |
| Time/min | 10 | 25 | 2 | 2 | 3 | 45 | 50 |
Through the adjustment of the process and the selection of the working parameters of the active full press, the produced ultrathin rigid-flex printed circuit board with the thickness less than 0.4mm completely meets various performance tests, such as: the rigid plate and the flexible plate are combined without layering and foaming.
The invention can manufacture the ultrathin rigid-flex printed circuit board by adopting a lamination manufacturing process method, and can avoid the situation that the rigid-flex printed circuit board is damaged and scrapped due to the fact that rigid materials and flexible materials are completely combined together after lamination and are separated forcibly by controlling the cutting size of the prepreg, adding steps of baking and plasma cleaning on the existing lamination process steps and adjusting parameters (such as participation in gas, temperature, power and processing time) of the plasma cleaning step and specific parameters (such as temperature, lamination pressure and time) in the lamination step.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A manufacturing method of a rigid-flex printed circuit board is characterized by comprising the following steps:
manufacturing a circuit on the inner-layer soft board, and attaching covering films to two sides of the middle of the inner-layer soft board;
further arranging prepregs on two sides of the inner-layer soft board, and performing slotting treatment on the prepregs, wherein gaps formed by the slotting treatment extend to the leakage area of the inner-layer soft board;
arranging outer-layer hard boards after cutting treatment on two sides of the prepreg;
stacking the inner-layer soft board and the outer-layer hard board to obtain a rigid-flexible board;
and pressing the rigid-flexible board.
2. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the notch extends to the soft board leakage area and is increased by 0.45mm-0.55mm on the reference surface of the inner layer soft board leakage area.
3. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the inner layer soft board is an H/H oz soft board with the copper thickness of 20-30 mu m, and the thickness of the covering film is 40-60 mu m.
4. The method for manufacturing a rigid-flex printed circuit board according to claim 1, wherein: the outer-layer hard board is a single-side hard board with the thickness of 0.025-0.75 mm.
5. The method of manufacturing a rigid-flex printed circuit board according to any one of claims 1 to 4, wherein: the step of pressing the rigid-flex board specifically comprises the following steps:
baking the rigid-flexible board;
carrying out plasma cleaning on the baked rigid-flexible printed circuit board;
the three-in-one release film, the release film and the steel plate are sequentially arranged on two sides of the soft and hard combined plate;
and pressing by using a movable full-pressing machine.
6. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: the baking temperature of the soft and hard combination board is 120-180 ℃, and the baking time is 0.5-2 h.
7. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: the plasma cleaning process is divided into three sections, and the cleaning gas comprises one or more of oxygen, nitrogen, argon and carbon tetrafluoride.
8. The method for manufacturing a rigid-flex printed circuit board according to claim 5, wherein: and in the pressing step, the hot pressing process and the cold pressing process are divided, the cold pressing process is carried out after the hot pressing process, and the hot pressing process is carried out under the vacuum condition.
9. The method for manufacturing a rigid-flex printed circuit board according to claim 8, wherein: the hot-pressing process time is 30-50min, and the cold-pressing process time is 30-50 min.
10. The method for manufacturing a rigid-flex printed circuit board according to claim 8 or 9, wherein: the pressing temperature is 100-.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
| CN102946687A (en) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof |
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN106686916A (en) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | Method for laminating high-density ultra-thin rigid-flex laminated panels |
| CN106993383A (en) * | 2017-04-21 | 2017-07-28 | 广东依顿电子科技股份有限公司 | The circuit board producing method of different plate mixed pressures |
| CN107889378A (en) * | 2017-10-20 | 2018-04-06 | 泰州市博泰电子有限公司 | A kind of preparation method of multilayer printed circuit board for millimeter wave hybrid circuit |
-
2019
- 2019-09-23 CN CN201910898264.6A patent/CN110708890A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201957328U (en) * | 2011-01-12 | 2011-08-31 | 广州兴森快捷电路科技有限公司 | Rigid-flexible multi-layer printed circuit board |
| CN102946687A (en) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof |
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN106686916A (en) * | 2017-02-27 | 2017-05-17 | 深圳市仁创艺电子有限公司 | Method for laminating high-density ultra-thin rigid-flex laminated panels |
| CN106993383A (en) * | 2017-04-21 | 2017-07-28 | 广东依顿电子科技股份有限公司 | The circuit board producing method of different plate mixed pressures |
| CN107889378A (en) * | 2017-10-20 | 2018-04-06 | 泰州市博泰电子有限公司 | A kind of preparation method of multilayer printed circuit board for millimeter wave hybrid circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179596A (en) * | 2021-04-21 | 2021-07-27 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN113179596B (en) * | 2021-04-21 | 2023-11-28 | 深圳市祺利电子有限公司 | Manufacturing method of rigid-flex printed circuit board and rigid-flex printed circuit board |
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Application publication date: 20200117 |