CN206380176U - A kind of composite printed circuit board - Google Patents
A kind of composite printed circuit board Download PDFInfo
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- CN206380176U CN206380176U CN201621396218.4U CN201621396218U CN206380176U CN 206380176 U CN206380176 U CN 206380176U CN 201621396218 U CN201621396218 U CN 201621396218U CN 206380176 U CN206380176 U CN 206380176U
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- core plate
- convex high
- printed circuit
- circuit board
- high core
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Abstract
The utility model is applied to printed-board technology field, and the composite printed circuit board includes：Core plate, printed circuit is provided with its surface；Convex high core plate, the solder joint for carrying out metal welding in core plate surface formation；And tack coat, the core plate, convex high core plate are provided with stress projection and/or stress groove in the mating surface contacted with the tack coat.The utility model is by setting tack coat, stress projection and stress groove, make the core plate and the convex high core plate tightly be adhesively fixed, the situation for causing convex high core plate to come off because of collision will not be also produced in handling process, so as to effectively prevent convex high core plate from coming off.
Description
Technical field
The utility model belongs to printed-board technology field, more particularly to a kind of composite printed circuit board.
Background technology
The convex high-tech of pad is born exclusively for highly dense pad printed circuit board (PCB) is tested.The convex high-tech of pad is main
It is the needle-bar that testing jig is replaced using raised pad, the minimum convex high point of raised pad can reach 0.1MM, minimum spacing
0.2MM can be reached, this is that current common test frame institute is inaccessiable.In addition, raised pad can reach 0.05MM lines
Wide routing capabilities so that high intensity wiring becomes a reality.
At present, the concrete technology flow process of traditional making composite printed circuit board is as follows：
First, enter the making of row line welding resistance, then welding resistance is solidified, then carry out the making of the heavy copper of whole plate, reuse
2mil thickness dry films will need convex high parcel plating, and because thickness of dry film only has 50um thickness, pad plating needs to make line twice
Road and electroplate twice.Then carry out removing membrane operations, finally remove it the copper on welding resistance surface using chemical method.
However, the composite printed circuit board made using above-mentioned technological process, pad height has limitation, most
Height can only achieve 70um or so, and convex high point is smaller；In addition, in manufacturing process solder joint between core plate and pad occur friction or
It is very easy to come off during collision, causes not reaching convex high effect.
Therefore, it is necessary to develop a kind of new composite printed circuit board, the confinement problems of pad height are solved,
Ensure the stabilized structure of printed circuit board (PCB) simultaneously, with asking for the easy solder joint that comes off that solves to collide or rub in the prior art
Topic.
The content of the invention
The purpose of this utility model is to provide a kind of composite printed circuit board, it is intended to solve present in prior art
The problem of convex high insufficient height height and solder joint easily come off.
The utility model is achieved in that a kind of composite printed circuit board, including：
Core plate, printed circuit is provided with its surface；
Convex high core plate, the solder joint for carrying out metal welding in core plate surface formation；And
Tack coat, is arranged between core plate and convex high core plate, for connecting the core plate and the convex high core plate, the core
Plate, convex high core plate are provided with stress projection and/or stress groove in the mating surface contacted with the tack coat.
Preferably, the core plate, convex high core plate are provided with stress groove, institute in the mating surface contacted with the tack coat
The width for stating stress groove is less than or equal to 0.2mm.
Preferably, the stress groove is the annular groove being arranged in the mating surface of core plate or convex high core plate.
Preferably, the stress groove is outer narrow interior wealthy rhombus groove.
Preferably, the core plate, convex high core plate are provided with stress projection, institute in the mating surface contacted with the tack coat
It is to process the rigid projections to be formed by extruding, welding, clamping to state stress projection.
Preferably, the tack coat is pure glue prepreg.
Preferably, the convex high core plate is one or more, and one or more convex high core plates are respectively by described viscous
Knot layer is connected with the core plate；Wherein, when the convex high core plate is multiple, multiple convex high core plates are arranged at intervals at described
On core plate surface.
Preferably, the convex high core plate is glass-epoxy copper-clad plate, and the height of the convex high core plate is
0.6mm。
Preferably, the composite printed circuit board also includes：One pad；The pad is arranged at the convex high core plate table
Face.
The preparation method of the composite printed circuit board, comprises the following steps：
Step 100 is provided with step groove bore region, to the platform of the convex high core plate there is provided convex high core plate on the convex high core plate
The periphery in rank slotted eye region carries out control depths reason；In the mating surface of convex high core plate by extruding, welding, clamping process to be formed by
Power is raised, and/or, output stress groove in the mating surface of convex high core plate；
Step 200 includes convex high region there is provided core plate, the core plate；In the mating surface of the core plate by extruding, welding,
Clamping processes to form stress projection, and/or, stress groove is outputed in the mating surface of core plate；
Step 300, the region beyond the convex high region on the core plate completes welding resistance covering；
Step 400, core plate and convex high core plate are laminated using pure glue prepreg so that the core plate with it is described convex
High core plate be adhesively fixed, makes pure glue prepreg and mating surface, and stress is raised and/or stress groove is combined closely
Together；
Step 500, the second secondary control depths reason is carried out to the periphery of the step groove bore region of convex high core plate；
Step 600, pad is set on the convex high core plate in convex high region；
Step 700, profile processing is carried out to composite printed circuit board, that is, obtains finished product.
In the utility model, by setting tack coat between core plate and convex high core plate so that the core plate with it is described
Convex high core plate tightly be adhesively fixed, also will not be because core plate collides and causes convex Gao Xin in handling process
The problem of plate comes off, the utility model is due to being provided with tack coat so as to effectively prevent convex high core plate from coming off.Due to convex high core plate
With certain thickness, therefore increase on certain procedures the convex high height of printed circuit board (PCB).Further, since being provided with stress
Raised and/or stress groove so that tack coat and the stable connection of mating surface, can bear frictional force or the extruding of all directions
Power so that the structure of printed circuit board (PCB) is more consolidated, meanwhile, processing is simple, is conducive to large-scale production.
Brief description of the drawings
Fig. 1 and Fig. 2 are the structural representations for the composite printed circuit board that the utility model embodiment is provided；
Fig. 3 is the structural representation for the FR-4 plates that the utility model embodiment is provided；
Fig. 4 is the structural representation that the FR-4 plates that the utility model embodiment is provided are combined with core plate；
Fig. 5 is the structural representation that the FR-4 plates that the utility model embodiment is provided carry out the second secondary control depths reason.
Embodiment
In order that the purpose of this utility model, technical scheme and beneficial effect are more clearly understood, below in conjunction with accompanying drawing and
Embodiment, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only used to
The utility model is explained, is not used to limit the utility model.
Referring to Fig. 1, the structural representation for the composite printed circuit board that Fig. 1 provides for the utility model embodiment.For
It is easy to explanation, illustrate only the part related to the utility model embodiment.The composite printed circuit board includes：Core plate
100th, tack coat 200 and convex high core plate 300.The tack coat 200 is arranged at the core plate 100 and the convex high core plate 300
Between, so that the core plate 100 and the convex high be adhesively fixed of core plate 300.The core plate 100, convex high core plate 300 exist
Be provided with that stress is raised and/or stress groove in the mating surface contacted with the tack coat 200, thus improve tack coat 200 with
The adhesion of mating surface, improves the stability of composite printed circuit board.
Preferably, the core plate 100, convex high core plate 300 be provided with the mating surface contacted with the tack coat 200 by
Power groove, the width of the stress groove is less than or equal to 0.2mm, and width limitation enables tack coat 200 effectively, reliably
Combined with the side of stress groove, while not influenceing the structural strength of core plate 100 or convex high core plate 300.
Preferably, in order to improve between core plate 100 or convex high core plate 300 and tack coat 200 along plane any direction limit
The adhesion of relative displacement, the stress groove is the annular groove being arranged in the mating surface of core plate or convex high core plate so that core
Between plate 100 or convex high core plate 300 and tack coat 200, two planes are restricted with respect to position toward during any direction relative translation
The adhesion of shifting.
Preferably, in order to which the normal direction for improving vertical direction between core plate 100 or convex high core plate 300 and tack coat 200 is combined
Power, the stress groove is outer narrow interior wealthy rhombus groove, processing is also more convenient using the rhombus groove, using with lozenge shape cross-section
The tool sharpening of structure.
Preferably, the core plate 100, convex high core plate 300 be provided with the mating surface contacted with the tack coat 200 by
Power is raised, and the stress projection is to process the rigid projections to be formed by extruding, welding, clamping, and the stress is raised and stress is recessed
Groove can increase the contact surface of mating surface and tack coat 300, while complex printed-circuit board more direction can be improved, in dimension
Adhesion, make its structure more consolidate.Processed, process is simple, and processability is good, be applicable by extruding, welding or clamping
In industrial production.
In the utility model embodiment, the surface of core plate 100 is provided with printed circuit；The convex high core plate 300
The solder joint of metal welding is carried out for being formed on the surface of core plate 100.In the present embodiment, convex high core plate 300 it is also contemplated that
It is solder joint.
Preferably, the core plate 100 includes convex high region, and the tack coat 200 is located at the convex height of the core plate 100
Region, the length of the tack coat 200 is less than the length of the core plate 100, or, the length of the tack coat 200 is equal to institute
State the length of convex high core plate 300.
In the utility model embodiment, when the core plate 100, the tack coat 200 and the convex high core plate 300
When being connected together as the composite printed circuit board of entirety, the thickness of the composite printed circuit board without departing from
6.0mm.That is, described core plate 100, the tack coat 200 and the total thickness of the convex high core plate 300 are less than or equal to 6.0mm.
In the utility model embodiment, the height of the convex high core plate 300 is in 0.5mm between 0.7mm.Preferably,
The height of the convex high core plate 300 is 0.6mm.
In the utility model embodiment, tack coat 200 is that gummosis amount is less than the pure of 2mil (1mil is equal to 0.0254mm)
Glue prepreg.Because the gummosis amount of tack coat 200 is smaller, butt welding will not be caused to practice midwifery because of trickle gummosis and give birth to influence.
In the utility model embodiment, it is preferable that the material that the convex high core plate 300 is used is FR-4 plate, i.e. glass
Glass fibrous epoxy resin copper-clad plate.It is understood, however, that the convex high core plate 300 can also be made using other material
Make, all any modifications, equivalent substitutions and improvements made within spirit of the present utility model and principle etc. should be included in this
Within the protection domain of utility model.
As another embodiment of the utility model, as shown in Fig. 2 the composite printed circuit board also includes：One pad
400, the pad 400 is arranged at the convex high surface of core plate 300.
It is understood, however, that according to actual requirement, one or more convex Gao Xin can be set on the surface of core plate 100
Plate 300, the one or more convex high core plate 300 is connected by tack coat 200 with core plate 100 respectively.Multiple convex high core plates 300 can
To be arranged at intervals on the surface of core plate 100.It is understood, however, that multiple convex high core plates 300 can be according between actual requirement
Every being arranged on the surface of core plate 100.The pad 400 is respectively provided with each convex high surface of core plate 300.
The implementation process for how making above-mentioned composite printed circuit board is described below in detail.
Step 100 is there is provided a FR-4 plates 30, and the FR-4 plates 30 include a step groove bore region, to FR-4 plates
The periphery of 30 step groove bore region carries out control depths reason (grooving processing), the i.e. surrounding to slotted eye region and carries out control depths reason,
The groove depth of wherein grooving processing is the 1/3 to 2/3 of the thickness of FR-4 plates 30, and the groove depth of preferably grooving processing is a gong cutter spacing
Size, as shown in Figure 3.Process to form stress projection by extruding, welding, clamping in the mating surface of FR-4 plates 30, and/
Or, stress groove is outputed in the mating surface of FR-4 plates 30；
Step 200 is the core plate 20 for having been completed circuit welding there is provided core plate 20, the core plate 20, and the core plate 20 includes
Convex high region；Process to form stress projection by extruding, welding, clamping in the mating surface of the core plate 20, and/or, in core plate
Mating surface on output stress groove；
Step 300, the region beyond the convex high region on core plate 20 completes welding resistance covering；
Step 400, core plate 20 and FR-4 plates 30 are laminated using pure glue prepreg 10, so that the core plate 20
With the be adhesively fixed of FR-4 plates 30, make pure glue prepreg 10 and mating surface, and stress projection and/or stress
Groove is closely linked, wherein, pure glue prepreg 10 includes convex high region.To the convex high region of pure glue prepreg 10 with
Outer position carries out windowing processing, and windowing is than the convex high unilateral small 2mil of surrounding, and pure glue prepreg 10 is not gummosis PP, pure glue half
The gummosis amount of cured sheets 10 is can be controlled within 2mil, because gel content is low, therefore will not cause butt welding because of trickle gummosis
Life of practicing midwifery influences, as shown in Figure 4.
Step 500, then, the second secondary control depths reason is carried out to the periphery of the step groove bore region of FR-4 plates 30, that is, led to
The groove for forming periphery grooving processing is crossed to get through to remove the FR-4 plates 30 outside step groove bore region.Here first is ensured
The depth sum that secondary control depths is managed and the second secondary control depths is managed is more than or equal to the thickness of FR-4 plates 30, while will not also be damaged to
The circuit of step groove bore region on FR-4 plates 30.So can be by outside step groove bore region by the second secondary control depths reason
FR-4 plates 30 remove, expose the FR-4 plates 30 of convex high part, the FR-4 plates 30 of the convex high part as solder joint so that
Composite printed circuit board is obtained, as shown in Figure 5.
Step 600, a pad is set on the FR-4 plates 30 of convex high part.
Step 700, finally to composite printed circuit board after profile processing is carried out, that is, whole combined type printing is completed
The manufacturing process of circuit board, the composite printed circuit board after making is as shown in Figure 2.
In summary, the utility model embodiment between core plate and convex high core plate by setting tack coat, so that described
Core plate and the convex high core plate tightly be adhesively fixed, also will not be because core plate collides in handling process
The problem of convex high core plate comes off is caused, the utility model is due to being provided with tack coat so as to effectively prevent convex high core plate from coming off.Separately
Outside, because convex high core plate has certain thickness, therefore the convex high height of printed circuit board (PCB) is increased on certain procedures.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (9)
1. a kind of composite printed circuit board, it is characterised in that including：
Core plate, printed circuit is provided with its surface；
Convex high core plate, the solder joint for carrying out metal welding in core plate surface formation；And
Tack coat, is arranged between core plate and convex high core plate, for connecting the core plate and the convex high core plate, the core plate,
Convex high core plate is provided with stress projection and/or stress groove in the mating surface contacted with the tack coat.
2. composite printed circuit board as claimed in claim 1, it is characterised in that the core plate, convex high core plate with it is described
Stress groove is provided with the mating surface of tack coat contact, the width of the stress groove is less than or equal to 0.2mm.
3. composite printed circuit board as claimed in claim 2, it is characterised in that the stress groove for be arranged in core plate or
Annular groove in the mating surface of convex high core plate.
4. composite printed circuit board as claimed in claim 2 or claim 3, it is characterised in that the stress groove is outer narrow interior wealthy
Rhombus groove.
5. composite printed circuit board as claimed in claim 1, it is characterised in that the core plate, convex high core plate with it is described
Stress is provided with the mating surface of tack coat contact raised, the stress is raised to be processed and to be formed by extruding, welding, clamping
Rigid projections.
6. composite printed circuit board as claimed in claim 1, it is characterised in that the tack coat is pure glue prepreg.
7. composite printed circuit board as claimed in claim 1, it is characterised in that the convex high core plate be it is one or more,
One or more convex high core plates are connected by the tack coat with the core plate respectively；Wherein, when the convex high core plate is
When multiple, multiple convex high core plates are arranged at intervals on the core plate surface.
8. composite printed circuit board as claimed in claim 1, it is characterised in that the convex high core plate is glass fibre epoxy
Resin copper-clad plate, the height of the convex high core plate is 0.6mm.
9. composite printed circuit board as claimed in claim 1, it is characterised in that the composite printed circuit board is also wrapped
Include：One pad；
The pad is arranged at the convex high core plate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396218.4U CN206380176U (en) | 2016-12-19 | 2016-12-19 | A kind of composite printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621396218.4U CN206380176U (en) | 2016-12-19 | 2016-12-19 | A kind of composite printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN206380176U true CN206380176U (en) | 2017-08-04 |
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ID=59406665
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621396218.4U Active CN206380176U (en) | 2016-12-19 | 2016-12-19 | A kind of composite printed circuit board |
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| Country | Link |
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| CN (1) | CN206380176U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714451A (en) * | 2016-12-19 | 2017-05-24 | 长沙牧泰莱电路技术有限公司 | Composite printed circuit board and manufacturing method thereof |
-
2016
- 2016-12-19 CN CN201621396218.4U patent/CN206380176U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714451A (en) * | 2016-12-19 | 2017-05-24 | 长沙牧泰莱电路技术有限公司 | Composite printed circuit board and manufacturing method thereof |
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