CN105530770A - Manufacturing method of PCB - Google Patents
Manufacturing method of PCB Download PDFInfo
- Publication number
- CN105530770A CN105530770A CN201511029255.1A CN201511029255A CN105530770A CN 105530770 A CN105530770 A CN 105530770A CN 201511029255 A CN201511029255 A CN 201511029255A CN 105530770 A CN105530770 A CN 105530770A
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- CN
- China
- Prior art keywords
- resistance glue
- resigning hole
- manufacture method
- prepreg
- ink
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a PCB. The manufacturing method comprises the following steps: S10, providing a pored inner layer core plate and a prepreg, and laminating the pored inner layer core plate and the prepreg to form a sub-plate; S20, forming an avoidance hole in the sub-plate; S30, manufacturing a rubber blocking bulge on the end surface of the sub-plate and at the position of the edge of the avoidance hole; and S40, providing a non-pored core plate and a prepreg, and laminating the non-pored core plate, the prepreg and the sub-plate to form a laminating plate with a sealing cavity. In the scheme, through twice laminating forming, firstly the pored inner layer core plate is laminated to form the sub-plate, and the avoidance hole is integrally formed in the sub-plate, so that the smoothness of inner wall shape of the avoidance hole is guaranteed; and then the rubber blocking bulge is arranged at the edge of the avoidance hole, and the sub-plate and the non-pored core plate are laminated to form the laminating plate, so that internal gumming of the sealing cavity can be effectively controlled, the integrality of the inner wall shape is guaranteed; and meanwhile, the application of high-frequency and high-speed materials in the PCB is widened, and the quality and speed of signal transmission are promoted.
Description
Technical field
The present invention relates to PCB production technical field, particularly relate to the manufacture method of a kind of PCB.
Background technology
Electronic product is the modern life and the indispensable instrument of work, and people are more and more higher for the performance requirement of electronic product, and the reduction of the quickening of signaling rate, process loss is the major demands of current electronic product.At present, improve signal velocity and the method that reduces the wastage to mainly contain and reduce material dielectric constant, improve the approach such as lamination, line design.For meeting the high request of electronic product for signal quality, the high-end designs imbedding enclosed cavity in PCB inside both can improve the signaling rate of wiring board, can reduce again the loss of signal further.
Imbed enclosed cavity in PCB inside and there is certain difficulty, current in order to control the inner gummosis of enclosed cavity and cavity shape, the semi-solid preparation P sheet that great majority design employing is not flowed or fluidity is low carries out pressing, but the semi-solid preparation P sheet of the type does not belong to high-frequency high-speed material, certain loss is had, simultaneously above-mentioned design constraints high-frequency high-speed and the use in the pcb of conventional P sheet material to signal.Therefore, optimize the manufacture method of burying cavity PCB, effectively control cavity inside gummosis, cavity profile, expand the major way that high-frequency high-speed material is current promotion signal transmission quality in the utilization of burying cavity PCB.
Summary of the invention
One object of the present invention is: the manufacture method providing a kind of PCB, effectively controls inside gummosis and the inner wall shape of enclosed cavity, promotion signal transmission quality, reduces the wastage, and improves signaling rate simultaneously.
Another object of the present invention is: the manufacture method providing a kind of PCB, expands the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed.
For reaching this object, the present invention by the following technical solutions:
A manufacture method of PCB, comprises the following steps:
S10, provide and need perforate core material and prepreg, need perforate core material and prepreg pressing to form daughter board by described;
S20, on described daughter board, offer resigning hole;
S30, at the end face of described daughter board and to make resistance glue protruding at the edge being positioned at described resigning hole;
S40, provide non-perforate central layer and prepreg, described non-perforate central layer, prepreg and daughter board pressing are formed the force fit plate possessing enclosed cavity.
Preferably, after the step s 40, further comprising the steps of:
S50, force fit plate to be holed, and carry out boring reprocessing;
S60, electroless copper plating and electroplating processes are carried out to force fit plate, realize hole metallization;
S70, force fit plate makes outer graphics and carries out welding resistance process;
S80, surface treatment is carried out to force fit plate, form PCB finished product.
Preferably, in step s 50, carry out boring reprocessing and specifically comprise plasma treatment and desmearing process.
This programme is by twice pressing and forming, the pressing of perforate core material first will be needed to form daughter board, and entirety offers resigning hole on daughter board, ensure that the inner wall shape of resigning hole is smooth and intact, it is protruding that then resistance glue is set at the edge of resigning hole, and daughter board and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, inside gummosis and the guarantee inner wall shape of effective control enclosed cavity are intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed simultaneously.
As the preferred technical scheme of one, in step s 30, make resistance glue projection specifically to comprise the following steps:
S301A, edge inkjet inks at described resigning hole;
S302A, employing ultraviolet light irradiate ink, make ink solidification form resistance glue protruding.
Preferably, in step S301A, ink adopts UV cured printing ink.
As the preferred technical scheme of one, in step s 30, make resistance glue projection specifically to comprise the following steps:
S301B, edge ink for screen printing at described resigning hole;
S302B, according to the design configuration of resistance glue projection, exposure-processed is carried out to ink;
S303B, development treatment is carried out to ink, the ink beyond the design configuration removing resistance glue projection;
S304B, ink carried out to baking process, make ink solidification form resistance glue protruding.
Preferably, in step S301B, ink adopts thermo-cured ink.
As the preferred technical scheme of one, make the alignment system that resistance glue projection adopts in step S30 identical with offering the alignment system that resigning hole adopts in step S20.
As the preferred technical scheme of one, the height of described resistance glue projection equals the thickness after the prepreg pressing in step S40.
As the preferred technical scheme of one, described non-perforate central layer comprises outer central layer and non-perforate core material; Or described non-perforate central layer is outer central layer.
As the preferred technical scheme of one, before step S10, further comprising the steps of:
S05, on core material, make inner figure.
As the preferred technical scheme of one, after step S20, further comprising the steps of:
S25, super roughening treatment is carried out to daughter board.
As the preferred technical scheme of one, the width of described resistance glue projection is at below 8mil.
Preferably, the width of described resistance glue projection is 1mil or 2mil or 3mil or 4mil or 5mil or 6mil or 7mil or 8mil.
As the preferred technical scheme of one, in step S20, the dimensional tolerance of described resigning hole is ± 3mil, ensures that resigning hole inwall is without cured resin particles.
Beneficial effect of the present invention is: the manufacture method providing a kind of PCB, by twice pressing and forming, the pressing of perforate core material first will be needed to form daughter board, and entirety offers resigning hole on daughter board, ensure that the inner wall shape of resigning hole is smooth and intact, it is protruding that then resistance glue is set at the edge of resigning hole, and daughter board and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, effectively can control the inside gummosis of enclosed cavity and ensure that inner wall shape is intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity simultaneously, promotion signal transmission quality and speed.
Accompanying drawing explanation
According to drawings and embodiments the present invention is described in further detail below.
Fig. 1 is the FB(flow block) of the manufacture method of the PCB described in embodiment;
Fig. 2 is the manufacturing process schematic diagram of the PCB described in embodiment one;
Fig. 3 is the manufacturing process schematic diagram of the PCB described in embodiment two;
Fig. 4 is the manufacturing process schematic diagram of the PCB described in embodiment three;
Fig. 5 is the manufacturing process schematic diagram of the PCB described in embodiment four.
In Fig. 1 to Fig. 5:
1, outer central layer; 2, daughter board; 21, perforate core material is needed; 22, resigning hole; 3, non-perforate core material; 4, glue is hindered protruding; 5, prepreg.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.
Embodiment one:
As depicted in figs. 1 and 2, the manufacture method of a kind of PCB, comprises the following steps:
S05, on core material, make inner figure;
S10, provide and need perforate core material 21 and prepreg 5, need perforate core material 21 and prepreg 5 pressing to form daughter board 2 by described;
S20, on described daughter board 2, offer resigning hole 22;
S25, super roughening treatment is carried out to daughter board 2;
S30, described daughter board 2 end face and the edge being positioned at described resigning hole 22 makes resistance glue projection 4;
S40, provide non-perforate central layer and prepreg 5, described non-perforate central layer, prepreg 5 and daughter board 2 pressing are formed the force fit plate possessing enclosed cavity;
S50, force fit plate to be holed, and carry out boring reprocessing;
S60, electroless copper plating and electroplating processes are carried out to force fit plate, realize hole metallization;
S70, force fit plate makes outer graphics and carries out welding resistance process;
S80, surface treatment is carried out to force fit plate, form PCB finished product.
This programme is by twice pressing and forming, perforate core material 21 pressing first will be needed to form daughter board 2, and entirety offers resigning hole 22 on daughter board 2, ensure that the inner wall shape of resigning hole 22 is smooth and intact, then resistance glue projection 4 is set at the edge of resigning hole 22, and daughter board 2 and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, inside gummosis and the guarantee inner wall shape of effective control enclosed cavity are intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed simultaneously.
In the present embodiment, described enclosed cavity is multi-layer cavity.Wherein, multi-layer cavity refers to that enclosed cavity is offered by the adjacent inner layer central layer of two or more different levels that resigning hole 22 is superimposed to be made.Particularly, in the present embodiment, described enclosed cavity is offered by the adjacent inner layer central layer of two different levels that resigning hole 22 is superimposed to be made.
In the present embodiment, PCB needs making enclosed cavity, described enclosed cavity runs through whole core material, and described non-perforate central layer only comprises outer central layer 1, described core material is all need perforate core material 21, and namely described resigning hole 22 runs through whole described core material.
In the present embodiment, in step S20, the dimensional tolerance of described resigning hole 22 is ± 3mil, ensures that resigning hole 22 inwall is without cured resin particles.
In the present embodiment, in step s 30, make resistance glue projection 4 specifically to comprise the following steps:
S301A, edge inkjet inks at described resigning hole 22;
S302A, employing ultraviolet light irradiate ink, make ink solidification form resistance glue projection 4.
Wherein, ink adopts UV cured printing ink.
In the present embodiment, make alignment system that resistance glue protruding 4 adopts in step S30 identical with offering the alignment system that resigning hole 22 adopts in step S20.The height of described resistance glue projection 4 equals the thickness after prepreg 5 pressing in step S40.The width of described resistance glue projection 4 is 8mil.
In the present embodiment, in step s 50, carry out boring reprocessing and specifically comprise plasma treatment and desmearing process.
Embodiment two:
As shown in figures 1 and 3, the manufacture method of a kind of PCB, comprises the following steps:
S05, on core material, make inner figure.
S10, provide and need perforate core material 21 and prepreg 5, need perforate core material 21 and prepreg 5 pressing to form daughter board 2 by described;
S20, on described daughter board 2, offer resigning hole 22;
S25, super roughening treatment is carried out to daughter board 2.
S30, described daughter board 2 end face and the edge being positioned at described resigning hole 22 makes resistance glue projection 4;
S40, provide non-perforate central layer and prepreg 5, described non-perforate central layer, prepreg 5 and daughter board 2 pressing are formed the force fit plate possessing enclosed cavity.
S50, force fit plate to be holed, and carry out boring reprocessing;
S60, electroless copper plating and electroplating processes are carried out to force fit plate, realize hole metallization;
S70, force fit plate makes outer graphics and carries out welding resistance process;
S80, surface treatment is carried out to force fit plate, form PCB finished product.
This programme is by twice pressing and forming, perforate core material 21 pressing first will be needed to form daughter board 2, and entirety offers resigning hole 22 on daughter board 2, ensure that the inner wall shape of resigning hole 22 is smooth and intact, then resistance glue projection 4 is set at the edge of resigning hole 22, and daughter board 2 and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, inside gummosis and the guarantee inner wall shape of effective control enclosed cavity are intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed simultaneously.
In the present embodiment, described enclosed cavity is multi-layer cavity.Wherein, multi-layer cavity refers to that enclosed cavity is offered by the adjacent inner layer central layer of two or more different levels that resigning hole 22 is superimposed to be made.Particularly, in the present embodiment, described enclosed cavity is offered by the adjacent inner layer central layer of two different levels that resigning hole 22 is superimposed to be made.
In the present embodiment, PCB needs making enclosed cavity, described enclosed cavity runs through whole core material, and described non-perforate central layer only comprises outer central layer 1, described core material is all need perforate core material 21, and namely described resigning hole 22 runs through whole described core material.
In the present embodiment, in step S20, the dimensional tolerance of described resigning hole 22 is ± 3mil, ensures that resigning hole 22 inwall is without cured resin particles.
In the present embodiment, in step s 30, make resistance glue projection 4 specifically to comprise the following steps:
S301B, edge ink for screen printing at described resigning hole 22;
S302B, according to the design configuration of resistance glue projection 4, exposure-processed is carried out to ink;
S303B, development treatment is carried out to ink, the ink beyond the design configuration removing resistance glue projection 4;
S304B, ink carried out to baking process, make ink solidification form resistance glue projection 4.
Wherein, ink adopts thermo-cured ink.
In the present embodiment, make alignment system that resistance glue protruding 4 adopts in step S30 identical with offering the alignment system that resigning hole 22 adopts in step S20.The height of described resistance glue projection 4 equals the thickness after prepreg 5 pressing in step S40.The width of described resistance glue projection 4 is 6mil.
In the present embodiment, in step s 50, carry out boring reprocessing and specifically comprise plasma treatment and desmearing process.
Embodiment three:
As shown in Figure 1 and Figure 4, the manufacture method of a kind of PCB, comprises the following steps:
S05, on core material, make inner figure.
S10, provide and need perforate core material 21 and prepreg 5, need perforate core material 21 and prepreg 5 pressing to form daughter board 2 by described;
S20, on described daughter board 2, offer resigning hole 22;
S25, super roughening treatment is carried out to daughter board 2.
S30, described daughter board 2 end face and the edge being positioned at described resigning hole 22 makes resistance glue projection 4;
S40, provide non-perforate central layer and prepreg 5, described non-perforate central layer, prepreg 5 and daughter board 2 pressing are formed the force fit plate possessing enclosed cavity.
S50, force fit plate to be holed, and carry out boring reprocessing;
S60, electroless copper plating and electroplating processes are carried out to force fit plate, realize hole metallization;
S70, force fit plate makes outer graphics and carries out welding resistance process;
S80, surface treatment is carried out to force fit plate, form PCB finished product.
This programme is by twice pressing and forming, perforate core material 21 pressing first will be needed to form daughter board 2, and entirety offers resigning hole 22 on daughter board 2, ensure that the inner wall shape of resigning hole 22 is smooth and intact, then resistance glue projection 4 is set at the edge of resigning hole 22, and daughter board 2 and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, inside gummosis and the guarantee inner wall shape of effective control enclosed cavity are intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed simultaneously.
In the present embodiment, described enclosed cavity is multi-layer cavity.Wherein, multi-layer cavity refers to that enclosed cavity is offered by the adjacent inner layer central layer of two or more different levels that resigning hole 22 is superimposed to be made.Particularly, in the present embodiment, described enclosed cavity is offered by the adjacent inner layer central layer of two different levels that resigning hole 22 is superimposed to be made.
In the present embodiment, PCB needs making enclosed cavity, described enclosed cavity through part core material, described non-perforate central layer comprises outer central layer 1 and non-perforate core material 3, and described core material comprises needs perforate core material 21 and non-perforate core material 3.
In the present embodiment, in step S20, the dimensional tolerance of described resigning hole 22 is ± 3mil, ensures that resigning hole 22 inwall is without cured resin particles.
In the present embodiment, in step s 30, make resistance glue projection 4 specifically to comprise the following steps:
S301A, edge inkjet inks at described resigning hole 22;
S302A, employing ultraviolet light irradiate ink, make ink solidification form resistance glue projection 4.
Wherein, ink adopts UV cured printing ink.
In the present embodiment, make alignment system that resistance glue protruding 4 adopts in step S30 identical with offering the alignment system that resigning hole 22 adopts in step S20.The height of described resistance glue projection 4 equals the thickness after prepreg 5 pressing in step S40.The width of described resistance glue projection 4 is 4mil.
In the present embodiment, in step s 50, carry out boring reprocessing and specifically comprise plasma treatment and desmearing process.
Embodiment four:
As shown in Figure 1 and Figure 5, the manufacture method of a kind of PCB, comprises the following steps:
S05, on core material, make inner figure.
S10, provide and need perforate core material 21 and prepreg 5, need perforate core material 21 and prepreg 5 pressing to form daughter board 2 by described;
S20, on described daughter board 2, offer resigning hole 22;
S25, super roughening treatment is carried out to daughter board 2.
S30, described daughter board 2 end face and the edge being positioned at described resigning hole 22 makes resistance glue projection 4;
S40, provide non-perforate central layer and prepreg 5, described non-perforate central layer, prepreg 5 and daughter board 2 pressing are formed the force fit plate possessing enclosed cavity.
S50, force fit plate to be holed, and carry out boring reprocessing;
S60, electroless copper plating and electroplating processes are carried out to force fit plate, realize hole metallization;
S70, force fit plate makes outer graphics and carries out welding resistance process;
S80, surface treatment is carried out to force fit plate, form PCB finished product.
This programme is by twice pressing and forming, perforate core material 21 pressing first will be needed to form daughter board 2, and entirety offers resigning hole 22 on daughter board 2, ensure that the inner wall shape of resigning hole 22 is smooth and intact, then resistance glue projection 4 is set at the edge of resigning hole 22, and daughter board 2 and the pressing of non-perforate central layer are formed the force fit plate with enclosed cavity, inside gummosis and the guarantee inner wall shape of effective control enclosed cavity are intact, expand the utilization of high-frequency high-speed material in the PCB with enclosed cavity, promotion signal transmission quality and speed simultaneously.
In the present embodiment, described enclosed cavity is multi-layer cavity.Wherein, multi-layer cavity refers to that enclosed cavity is offered by the adjacent inner layer central layer of two or more different levels that resigning hole 22 is superimposed to be made.Particularly, in the present embodiment, described enclosed cavity is offered by the adjacent inner layer central layer of two different levels that resigning hole 22 is superimposed to be made.
In the present embodiment, PCB needs making two enclosed cavities, described non-perforate central layer only comprises outer central layer 1, and described core material is all need perforate core material 21, described core material offers two resigning holes 22.
In the present embodiment, in step S20, the dimensional tolerance of described resigning hole 22 is ± 3mil, ensures that resigning hole 22 inwall is without cured resin particles.
In the present embodiment, in step s 30, make resistance glue projection 4 specifically to comprise the following steps:
S301A, edge inkjet inks at described resigning hole 22;
S302A, employing ultraviolet light irradiate ink, make ink solidification form resistance glue projection 4.
Wherein, ink adopts UV cured printing ink.
In the present embodiment, make alignment system that resistance glue protruding 4 adopts in step S30 identical with offering the alignment system that resigning hole 22 adopts in step S20.The height of described resistance glue projection 4 equals the thickness after prepreg 5 pressing in step S40.The width of described resistance glue projection 4 is 2mil.
In the present embodiment, in step s 50, carry out boring reprocessing and specifically comprise plasma treatment and desmearing process.
It is to be understood that; above-mentioned embodiment is only preferred embodiment of the present invention and institute's application technology principle; in technical scope disclosed in this invention, the change that any those skilled in the art of being familiar with easily expect or replacement, all should be encompassed in protection scope of the present invention.
Claims (10)
1. a manufacture method of PCB, is characterized in that, comprises the following steps:
S10, provide and need perforate core material and prepreg, need perforate core material and prepreg pressing to form daughter board by described;
S20, on described daughter board, offer resigning hole;
S30, at the end face of described daughter board and to make resistance glue protruding at the edge being positioned at described resigning hole;
S40, provide non-perforate central layer and prepreg, described non-perforate central layer, prepreg and daughter board pressing are formed the force fit plate possessing enclosed cavity.
2. the manufacture method of a kind of PCB according to claim 1, is characterized in that, in step s 30, makes resistance glue projection and specifically comprises the following steps:
S301A, edge inkjet inks at described resigning hole;
S302A, employing ultraviolet light irradiate ink, make ink solidification form resistance glue protruding.
3. the manufacture method of a kind of PCB according to claim 1, is characterized in that, in step s 30, makes resistance glue projection and specifically comprises the following steps:
S301B, edge ink for screen printing at described resigning hole;
S302B, according to the design configuration of resistance glue projection, exposure-processed is carried out to ink;
S303B, development treatment is carried out to ink, the ink beyond the design configuration removing resistance glue projection;
S304B, ink carried out to baking process, make ink solidification form resistance glue protruding.
4. the manufacture method of a kind of PCB according to claim 1, is characterized in that, makes the alignment system that resistance glue projection adopts identical with offering the alignment system that resigning hole adopts in step S20 in step S30.
5. the manufacture method of a kind of PCB according to claim 1, is characterized in that, the height of described resistance glue projection equals the thickness after the prepreg pressing in step S40.
6. the manufacture method of a kind of PCB according to claim 1, is characterized in that, described non-perforate central layer comprises outer central layer and non-perforate core material; Or described non-perforate central layer is outer central layer.
7. the manufacture method of a kind of PCB according to claim 1, is characterized in that, before step S10, further comprising the steps of:
S05, on core material, make inner figure.
8. the manufacture method of a kind of PCB according to claim 1, is characterized in that, after step S20, further comprising the steps of:
S25, super roughening treatment is carried out to daughter board.
9. the manufacture method of a kind of PCB according to claim 1, is characterized in that, the width of described resistance glue projection is at below 8mil.
10. the manufacture method of a kind of PCB according to claim 1, is characterized in that, the dimensional tolerance of described resigning hole is ± 3mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029255.1A CN105530770B (en) | 2015-12-30 | 2015-12-30 | A kind of production method of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029255.1A CN105530770B (en) | 2015-12-30 | 2015-12-30 | A kind of production method of PCB |
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| CN105530770A true CN105530770A (en) | 2016-04-27 |
| CN105530770B CN105530770B (en) | 2019-01-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN114501861A (en) * | 2022-01-19 | 2022-05-13 | 昆山沪利微电有限公司 | Prepreg tape-out control method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188610A (en) * | 2001-12-18 | 2003-07-04 | Mitsubishi Electric Corp | High frequency circuit |
| CN201317154Y (en) * | 2009-04-10 | 2009-09-30 | 深圳市博敏电子有限公司 | Peelable solder mask ink bushing plate printing device |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
| CN201674724U (en) * | 2010-03-08 | 2010-12-15 | 深南电路有限公司 | High-frequency circuit board |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN102948266A (en) * | 2010-04-22 | 2013-02-27 | 施韦策电子公司 | Printed circuit board with cavity |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN204069491U (en) * | 2014-04-09 | 2014-12-31 | 魏晓敏 | Printed substrate |
-
2015
- 2015-12-30 CN CN201511029255.1A patent/CN105530770B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003188610A (en) * | 2001-12-18 | 2003-07-04 | Mitsubishi Electric Corp | High frequency circuit |
| CN201317154Y (en) * | 2009-04-10 | 2009-09-30 | 深圳市博敏电子有限公司 | Peelable solder mask ink bushing plate printing device |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN201674724U (en) * | 2010-03-08 | 2010-12-15 | 深南电路有限公司 | High-frequency circuit board |
| CN101820730A (en) * | 2010-03-30 | 2010-09-01 | 梅州博敏电子有限公司 | Method for preparing printed wiring board by selectively plating gold |
| CN102948266A (en) * | 2010-04-22 | 2013-02-27 | 施韦策电子公司 | Printed circuit board with cavity |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
| CN204069491U (en) * | 2014-04-09 | 2014-12-31 | 魏晓敏 | Printed substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN114501861A (en) * | 2022-01-19 | 2022-05-13 | 昆山沪利微电有限公司 | Prepreg tape-out control method |
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| Publication number | Publication date |
|---|---|
| CN105530770B (en) | 2019-01-25 |
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