TWI583280B - Method for making printed circuit board and printed circuit board - Google Patents

Description

Printed circuit board manufacturing method and printed circuit board

The present invention relates to a method of manufacturing a printed circuit board and a printed circuit board, and more particularly to a method of manufacturing a printed circuit board capable of forming a circuit pattern having fine and excellent conductive characteristics while saving material and shortening process and the like And printed circuit boards.

Generally, a Printed Circuit Board is an electronic component in the form of a substrate that loads and electrically connects various electronic components.

The printed circuit board is classified into two types, a rigid printed circuit board (Rigid Printed Circuit Board) and a flexible printed circuit board (Flexible Circuit Board), according to the hard and soft material of the substrate, and recently, a hard and soft composite printed circuit board has appeared.

At the beginning of the application of printed circuit boards, products with a relatively simple structure in which printed circuits are formed on one side have become mainstream, but with the weight reduction, miniaturization, multi-function and composite function of electronic products, flexible circuit boards There is also a trend toward increasing circuit density and complexity of its structure, and developing into a multi-layer product.

The printed circuit board has various types such as a single layer, a double layer, and a multi-layer type according to a circuit pattern layer of a circuit structure, and a printed circuit board suitable for the electronic device is designed and manufactured according to the structure and function of the electronic device and used on the product.

In particular, the flexible printed circuit board can realize miniaturization and weight reduction of an electronic product, and has excellent flexibility and flexibility, so that the functions of the printed circuit board can be performed while freely connecting two circuits or components that are not adjacent to each other. The advantages are not only used in electronic devices such as mobile phones, MP3s, video cameras, printers, and displays, but also in general industrial machinery including medical equipment and military equipment. In particular, with the increase in products requiring bending characteristics of circuit boards such as mobile phones, video cameras, notebook computers, and displays, the demand for flexible circuit boards has also increased.

In such a printed circuit board, a general manufacturing method of a double-sided printed circuit board is exemplified by a double-sided flexible printed circuit board as follows. A double-sided copper clad laminate (CCL; Copper Clad Laminate) film material in which a copper (Cu) film is laminated on both sides of an insulating film such as a Polyimide Film or a Polyester film. Thereafter, in order to electrically connect the copper (Cu) layer to the portion where the circuit pattern is to be formed, after the via hole is formed by a drill or the like at a predetermined position of the CCL film, the via hole is plated to electrically connect the copper (Cu) layers to each other. connection. Thereafter, by using a photosensitive film or a photosensitive liquid on the copper (Cu) layer on both sides of the CCL film, each copper (Cu) layer is processed into a predetermined circuit pattern by exposure, development, etching, and lift-off processes. The method is to fabricate a double-sided flexible circuit board. In particular, the copper clad laminate film is divided into three layers of materials and two layers of materials, wherein the adhesive layer is coated on the polythene film, and the three layers of the copper foil are laminated, in the intermediate adhesive layer and copper. The thickness of the foil layer is not easy to adjust, so that it has the disadvantage that it is difficult to cope with the film type double-sided printed circuit board. For the two-layer material, the casting method of casting a polyimide varnish on a copper foil and using a vacuum plasma ( Plasma) A sputtering method produced by ionizing a target metal (Ionized) in which an additional heating device is required for the fused casting method, and an oxidation problem of the copper foil is generated at a high temperature process. Moreover, the thickness of the copper foil layer is also difficult to adjust.

The sputtering method has a physical strength which is weak compared with other manufacturing methods, and particularly has a disadvantage of causing environmental pollution due to the use of chromium or cobalt. At the same time, in the etching process, it is necessary to separately apply the copper foil layer, The nickel layer and the chromium layer are etched, and even if etching is performed separately, the residue of the nickel layer remains, which may cause deterioration in electrical characteristics.

Although the conventional manufacturing method has the advantage of being able to form a fine pattern, the manufacturing process is complicated and the loss of raw materials is severe, and environmental pollution problems are caused. Recently, with the development of printed electronic technology, a manufacturing method of a printed circuit board using a printing method is being developed, but current printing technology has certain limitations on the line width of a printed circuit.

Further, a method of manufacturing a double-sided flexible printed circuit board using the etching method described above is disclosed in Japanese Laid-Open Patent Publication No. Hei 06-224528.

The manufacturing method relates to a method of coating a metal foil on a whole surface of one side of a film substrate while forming a through hole on a portion where an electrical connection is required between the front and back surfaces of the film substrate, and passing it in a prescribed pattern. The etching process removes the metal foil to form a circuit conductor portion, and forms a sealing plate that blocks a portion of the through hole. The conductive paste is applied on the opposite side of the film substrate by a printing method to form a printed circuit conductor portion, and the conductive paste is filled in the through hole, and the circuit conductor portion formed by the etching process and the printing method are passed through the conductive paste. The formed printed circuit conductor portions are electrically connected to each other to manufacture a double-sided flexible circuit board.

However, this method requires a conductive paste to be formed in the through hole by the conductive paste by the printing method, but the printing method of forming the conductive portion of the printed circuit by forming the protruding conductive paste by filling the through hole is extremely limited. It is difficult for the conductive paste which easily forms the conductive portion of the printed circuit to be filled in the through hole to form a protrusion. Further, the flexible printed circuit board manufactured by this method has a drawback that the connection portion formed in the through hole is likely to be broken or broken under thermal or physical impact and is highly broken, and in the process, it is necessary to further increase the process. The disadvantage is that the process forms an additional closed plate portion for preventing leakage of the conductive paste filled in the through holes, so the reality is that it is not utilized in the industry. Further, since the adhesion of the conductive paste layer to the substrate is insufficient, the boundary between the printed circuit formed by the conductive paste and the connecting conductor portion forming the protrusion of the through hole Since the phenomenon of surface separation or detachment increases, it is substantially unutilized.

Accordingly, an object of the present invention is to provide a method of manufacturing a printed circuit board and a printed circuit board, which can overcome the conventional pass, in order to solve the above conventional problems. The limitation of the fine circuit pattern existing in the circuit forming process performed by the printing method and the poor electrical characteristics, and improve the precision and electrical characteristics of the circuit pattern realized by the conventional lithography process, and can save raw materials, shorten the process, and Improve productivity.

This object is achieved by a method of fabricating a printed circuit board of the present invention, characterized in that it comprises the steps of: forming a first coating layer, forming a first coating from a conductive ink on one side of the substrate a second coating forming step of forming a second coating layer on the other side of the substrate by a conductive ink; and a perforating step of perforating the first coating layer, the substrate and the second coating layer to form a through hole; And a plating step of plating the first coating layer, the second coating layer and the inner wall surface of the through hole to form a plating layer.

In addition, the plating step may include: performing electroless plating on the first coating layer, the second coating layer, and the inner wall surface of the through hole; and performing electrolytic plating on the inner wall surface of the electroless plated through hole The step of forming a plating layer.

Further, the object is achieved by the method of manufacturing a printed circuit board of the present invention, characterized in that the method of manufacturing the circuit board comprises the steps of: forming a first coating layer, forming a first layer of conductive ink on one side of the substrate a coating layer; a second coating layer forming step of forming a second coating layer on the other side of the substrate by a conductive ink; and a perforating step of perforating the first coating layer, the substrate and the second coating layer to form a pass a step of forming a conductive layer, forming a conductive layer on an inner wall surface of the through hole to electrically connect the first coating layer and the second coating layer; and a plating step, the first coating layer, the second layer The coating and the conductive layer are plated to form a plating layer.

In addition, the step of forming the conductive layer may include the steps of: filling a conductive ink inside the through hole; and performing a heat treatment step of shrinking the conductive ink filled inside the through hole along the pass The inner wall surface of the hole forms a conductive layer.

In addition, the method further includes the following steps: a step of bonding the temporary sealing layer, bonding a temporary sealing layer on at least one of the first coating layer or the second coating layer to block the through hole, thereby preventing The conductive ink filled in the forming step of the conductive layer is detached from the through hole; and the step of removing the temporary sealing layer, the temporary sealing layer is removed after the forming step of the conductive layer.

Furthermore, the method further includes the steps of: bonding the reinforcing layer, bonding the reinforcing layer on the first coating and the second coating; and removing the reinforcing layer, removing the reinforcing layer after the forming step of the conductive layer And in the punching step, the reinforcing layer, the first coating layer, the substrate and the second coating layer are perforated to form a through hole.

Further, the object is achieved by the method of manufacturing a printed circuit board of the present invention, characterized in that the method of manufacturing the circuit board comprises the steps of: forming a first coating layer, forming a first layer of conductive ink on one side of the substrate a second coating layer formed on the other side of the substrate by a conductive ink; a plating step, the first coating layer and the second coating layer are plated to form a plating layer; a step of perforating, forming a through hole by perforating the first coating layer, the substrate, the second coating layer and the plating layer; and forming a conductive layer, forming a conductive layer on an inner wall surface of the through hole, thereby making the first layer A coating and the second coating are electrically connected.

In addition, the step of forming the conductive layer may include the steps of: filling a conductive ink inside the through hole; and heat-treating the conductive ink inside the through hole to electrically conductively fill the inside of the through hole. The ink shrinks to form a conductive layer along the inner wall surface of the through hole, thereby electrically connecting the plating layer plated on the first coating layer and the plating layer plated on the second coating layer to each other.

Further, the object is achieved by the method of manufacturing a printed circuit board of the present invention, characterized in that the method of manufacturing the circuit board comprises the steps of: forming a first coating layer, forming a first layer of conductive ink on one side of the substrate a coating; a perforating step of perforating the substrate and the first coating to form a through hole; a second coating forming step of forming a second coating on the other side of the substrate by a conductive ink material, and The inner wall surface of the through hole forms a conductive layer to electrically connect the first coating layer and the second coating layer; and the plating step, the first coating layer, the second coating layer and the conductive layer are plated A plating layer is formed.

Furthermore, the step of forming the second coating layer may include the steps of: coating the substrate with a conductive ink material, and filling the inside of the through hole with a conductive ink; and performing a heat treatment step to heat-fill the film The conductive ink inside the through hole contracts and forms a conductive layer along the inner wall surface of the through hole.

Further, the object is achieved by the method of manufacturing a printed circuit board of the present invention, characterized in that it comprises the steps of: a perforating step of perforating the substrate to form a through hole; and a step of forming the first coating layer Forming a first coating layer on one side of the substrate with a conductive ink, and filling at least a portion of the inside of the through hole with a conductive ink; and forming a second coating layer on the other side of the substrate by a conductive ink At the same time as the second coating, the inside of the through hole is completely filled by the conductive ink, so that the first coating layer and the second coating layer are connected to each other; and the heat treatment step is performed to heat-fill the inside of the through hole. The conductive ink shrinks and forms a conductive layer along the inner wall surface of the through hole; and a plating step of plating the first coating layer, the second coating layer and the conductive layer to form a plating layer.

Additionally, a circuit pattern can be formed on the first coating and the plating plated on the first coating or on the second coating and the plating on the second coating.

Further, in the forming step of the first coating layer or the forming step of the second coating layer, a conductive ink may be printed on the substrate to form a circuit pattern.

Furthermore, the method further includes the step of forming a circuit pattern by patterning the first coating layer or the second coating layer by photolithography to form the circuit pattern.

In addition, the method further includes the steps of: forming a circuit pattern, after the plating step, photolithographically coating the first coating layer and the plating layer on the first coating layer or the second coating layer and The plating laminated on the second coating is patterned to form a circuit pattern.

In addition, the method further includes the following steps: a bonding step of the protective layer, bonding a protective layer on the plating layer to protect the plating layer before the forming step of the circuit pattern; and a removing step of the protective layer, in the forming step of the circuit pattern Thereafter, the protective layer is removed.

Further, the object is achieved by the printed circuit board of the present invention, characterized in that the printed circuit board comprises: a substrate formed with a through hole; a first coating layer formed on one side of the substrate; and a second coating layer formed on The other side of the substrate; a plating layer plated on the inner surface of the first coating layer, the second coating layer and the through hole for connecting the first coating layer and the second coating layer.

Further, the object is achieved by the printed circuit board of the present invention, characterized in that the printed circuit board comprises: a substrate formed with a through hole; a first coating layer formed on one side of the substrate; and a second coating layer formed on The other side of the substrate; a conductive layer formed on an inner wall surface of the through hole for interconnecting the first coating layer and the second coating layer; and a plating layer plated on the first coating layer and the second coating layer On the floor.

Additionally, the plating layer may be plated on the first coating layer, the second coating layer, and the conductive layer.

Further, a circuit pattern may be formed on the first coating layer and the plating layer plated on the first coating layer or on the second coating layer and the plating layer plated on the second coating layer.

According to the present invention, there is provided a method of manufacturing a printed circuit board capable of producing a printed circuit board having precise and excellent electrical conductivity.

Further, both surfaces of the substrate through which the through holes are formed are coated with a material having conductivity, and the substrate is plated, whereby the layers formed on both surfaces of the substrate can be electrically connected to each other.

Further, the thickness of the plating layer formed on the substrate can be easily adjusted by plating, so that cost can be saved, and a printed circuit board having desired characteristics can be produced.

Further, the one end portion of the through hole is sealed by the temporary sealing layer, so that leakage of the conductive ink filled through the other open end portion can be prevented.

Further, after the reinforcing layer is formed on the first coating layer and the second coating layer, the through holes are formed by perforation, so that the perforation can be stably performed.

Further, in the first coating layer or the second coating layer, the remaining coating layer is patterned only in a state in which the protective layer is bonded to the coating layer on which the circuit pattern is formed, so that damage of the formed circuit pattern can be prevented.

Further, by forming a conductive ink on the substrate and plating the upper surface to form a plating layer, the conductive ink and the plating layer can be simultaneously patterned by a photolithography process, so that the process can be shortened.

Further, the first coating layer or the second coating layer is formed on the substrate by printing the conductive ink, so that the circuit pattern can be easily formed without an additional additional process.

In addition, the circuit pattern can be selectively formed using a photolithography process or a printing process, so that the advantages of the photolithography process or the printing process can be simultaneously achieved, thereby enabling an efficient process to be constructed.

10‧‧‧Substrate

11‧‧‧through hole

20‧‧‧First coating

30‧‧‧Second coating

40‧‧‧ plating

41‧‧‧Electroless copper plating

42‧‧‧ copper

50‧‧‧ Conductive layer

60‧‧‧ Temporary sealing layer

70‧‧‧ Strengthening layer

80‧‧ ‧ protective layer

S100, S200, S300, S400, S500, S600, S700, S800‧‧‧ manufacturing method of printed circuit board

Steps for forming the first coating layer of S110, S210, S310, S410, S510, S610, S710, S820‧‧

Steps for forming the second coating layer of S120, S220, S320, S420, S520, S630, S730, S830‧‧

S130, S230, S330, S440, S540, S620, S720, S810‧‧‧ piercing steps

S140, S250, S370, S470, S530, S640, S740, S850‧‧‧ plating steps

S150, S260, S380, S480, S560, S650, S760, S860‧‧‧ circuit pattern forming steps

S240, S350, S450, S550‧‧‧ conductive layer formation steps

S340‧‧‧Joining step of temporary sealing layer

S360‧‧‧ Removal step of temporary sealing layer

S430‧‧‧ bonding step of the reinforcement layer

S460‧‧‧Removal layer removal step

S750‧‧‧ bonding step of the protective layer

S770‧‧‧Removal layer removal steps

S840‧‧‧ Heat treatment steps

1 is a process flow diagram of a method of manufacturing a printed circuit board according to a first embodiment of the present invention, and FIG. 2 is a schematic view of a second embodiment of the present invention FIG. 3 is a flow chart showing a modification of a method of manufacturing a printed circuit board according to a second embodiment of the present invention, and FIG. 4 is a schematic view showing a process flow chart of a method for manufacturing a printed circuit board. FIG. A process flow chart of a method of manufacturing a printed circuit board according to a third embodiment of the present invention, and FIG. 5 is a process flow chart of a method of manufacturing a printed circuit board according to a fourth embodiment of the present invention, which is schematically shown, and FIG. 6 is a schematic view A process flow diagram of a method of manufacturing a printed circuit board according to a fifth embodiment of the present invention, and FIG. 7 is a flow chart showing a process of manufacturing a printed circuit board according to a sixth embodiment of the present invention. 8 is a flow chart showing a modification of a method of manufacturing a printed circuit board according to a sixth embodiment of the present invention, and FIG. 9 is a view schematically showing a method of manufacturing a printed circuit board according to a seventh embodiment of the present invention. FIG. 10 is a process flow diagram of a method of manufacturing a printed circuit board according to an eighth embodiment of the present invention, which is schematically shown.

Before the present invention is described, it is to be noted that, in the various embodiments, the same reference numerals are used for the members having the same structure, and representative descriptions are made in the first embodiment, and in other embodiments, A different structure of an embodiment will be described.

First embodiment

Fig. 1 is a flow chart showing the process of manufacturing a printed circuit board according to a first embodiment of the present invention.

As shown in FIG. 1, a method S100 for manufacturing a printed circuit board according to a first embodiment of the present invention includes a first coating forming step S110, a second coating forming step S120, a punching step S130, a plating step S140, and The circuit pattern is formed in step S150.

The first coating forming step S110 and the second coating forming step S120 are steps of applying the first coating layer 20 and the second coating layer 30 on the upper surface and the lower surface of the substrate 10, respectively. Further, as the substrate 10 in this step, a polyimide film (PI: PolyImide Film) is used. But it is not limited to this.

A conductive ink is applied on the prepared substrate 10 to form a first coating layer 20 and a second coating layer 30. In this case, silver (Ag), copper (Cu), nickel (Ni), or aluminum (Al) is used as the conductive ink. Here, the material having excellent electrical conductivity is not limited thereto.

In addition, in this step, the first coating layer 20 and the second coating layer 30 formed on the substrate 10 can pass through flexo printing, flat screen, gravure printing, and slit type. Extrusion coating, comma coating or rotary screens are applied by methods well known in the art.

At this time, the first coating layer 20 and the second coating layer 30 coated on the substrate 10 by the various processes described above can be shrunk by heat treatment process curing and firing, and the first coating layer 20 is processed by the heat treatment process. The thickness of the second coating layer 30 can be adjusted to a size of several tens of nanometers to several tens of micrometers, and the thicknesses of the first coating layer 20 and the second coating layer 30 are preferably determined in consideration of surface flatness and electrical characteristics.

The punching step S130 is a step of forming a through hole 11 of the first coating layer 20 and the second coating layer 30 which are completely penetrated through the substrate 10 and laminated on both surfaces of the substrate. The perforation step S130 is performed on the substrate 10 by a CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching, etc., in a process well known in the art.

This plating step S140 is a step of forming the plating layer 40 by plating the inner wall surface of the through hole 11 and the outer surfaces of the first coating layer 20 and the second coating layer 30.

In this step, after the conductive film is first exposed to a conductive aqueous solution, a pre-plating treatment process is performed. Next, an electroless copper plating film 41 is formed by electroless copper plating in a region where the electroconductive thin film is formed by electroless plating.

Next, the inner wall surface of the through hole 11 and the first coating are utilized by electrolytic reaction of copper. The 20 and the second coating layer 30 are plated with copper 42 as a conductive metal to form a plating layer 40 (S142).

The circuit pattern forming step S150 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a desired shape. Circuit pattern.

In the present embodiment, the step S150 of forming the circuit pattern is described as being performed after the plating step S140, but in the modification of the embodiment, the first coating layer 20 or the first layer 20 may be performed after the process of the punching step S130. A printed circuit board is produced by forming a circuit pattern on the second coating layer 30 and then performing a plating step S140.

Further, in another modification of the embodiment, the step of forming the additional circuit pattern may not be performed, but the printing process may be performed in the forming step S110 of the first coating layer or the forming step S120 of the second coating layer. A conductive ink is printed to form a circuit pattern.

Further, in another modification, one of the first coating layer 20 or the second coating layer 30 may form a circuit pattern by performing a printing process, and the remaining one of the coating layers may be subjected to an additional circuit pattern forming step. The patterning process forms a circuit pattern.

Therefore, according to the present invention, it is possible to selectively produce a printed circuit by directly using a direct printing process for forming a circuit pattern while performing coating such as inkjet printing or an indirect printing process for forming a circuit pattern after coating, such as a photolithography process. Boards to enable efficient process construction.

Second embodiment

Fig. 2 is a flow chart showing the process of manufacturing a printed circuit board according to a second embodiment of the present invention.

As shown in Fig. 2, the manufacturer of the printed circuit board of the second embodiment of the present invention The method S200 includes a first coating forming step S210, a second coating forming step S220, a punching step S230, a conductive layer forming step S240, a plating step S250, and a circuit pattern forming step S260.

The first coating forming step S210 and the second coating forming step S220 are steps of applying the first coating layer 20 and the second coating layer 30 on the upper surface and the lower surface of the substrate 10, respectively. Further, as the substrate 10 in this step, a polyimide film (PI: PolyImide Film) can be used, but it is not limited thereto.

A conductive ink is applied to both surfaces of the prepared substrate 10 to form a first coating layer 20 and a second coating layer 30. In this case, silver (Ag), copper (Cu), nickel (Ni), or aluminum (Al) is used as the conductive ink. Here, the material having excellent electrical conductivity is not limited thereto.

In addition, in this step, the first coating layer 20 and the second coating layer 30 formed on the substrate 10 can pass through flexo printing, flat screen, gravure printing, and slit type. Extrusion coating, comma coating, and rotary screens are applied by methods well known in the art.

At this time, the first coating layer 20 and the second coating layer 30 coated on the substrate 10 by the plurality of processes described above can be shrunk by heat treatment process curing and firing, and the first coating layer 20 is processed by the heat treatment process. And the thickness of the second coating layer 30 can be adjusted to a size of several tens of nanometers to several tens of micrometers. Further, the thicknesses of the first coating layer 20 and the second coating layer 30 may preferably be determined in consideration of surface flatness and electrical characteristics.

The punching step S230 is a step of forming a through hole 11 of the first coating layer 20 and the second coating layer 30 which are completely penetrated through the substrate 10 and laminated on both surfaces of the substrate. This perforating step S230 is performed on the substrate 10 by a process known in the art such as CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching.

The step S240 of forming the conductive layer is to form a conductive layer on the inner wall surface of the through hole 11. 50 steps.

In this step, first, the inside of the through hole 11 is filled with a conductive ink of the same material as the first coating layer 20 and the second coating layer 30 (S231). At this time, the amount of the conductive ink filled in the inside of the through hole 11 is sufficient to electrically connect the first coating layer 20 and the second coating layer 30 to each other. Further, the conductive ink used in this step is described as being the same material used in the first coating layer 20 and the second coating layer 30, but is not limited to the same material, and may be selected from the group having excellent electrical conductivity. Any of the materials.

In a state where the conductive ink is filled in the inside of the through hole 11, the conductive ink is heat-treated, and the conductive ink can be shrunk to form the conductive layer 50 along the inner wall surface of the through hole 11 (S242).

Therefore, when this step is performed, the conductive layer 50 connecting the first coating layer 20 and the second coating layer 30 is formed along the inner wall surface of the through hole 11.

The plating step S250 is a step of plating the first coating layer 20, the second coating layer 30, and the conductive layer 50 to form a plating layer 40 on the outer surface thereof.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are subjected to electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is preferably determined in consideration of the amount of current applied to the finally formed printed circuit board.

The circuit pattern forming step S260 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a desired shape. Circuit pattern.

Figure 3 is a schematic view of a printed circuit board of a second embodiment of the present invention A process flow diagram of a variation of the manufacturing method.

In the present embodiment, the circuit pattern forming step S260 is described as being performed after the plating step S250, but as shown in FIG. 3, in the modification of the embodiment, it may be performed after the process of the punching step S230. A printed circuit board is produced by forming a circuit pattern on the first coating layer 20 or the second coating layer 30 and then performing a plating step S250.

Further, in another modification of the embodiment, the step of forming the additional circuit pattern may not be performed, and the conductive printing may be printed by a printing process in the forming step of the first coating layer or the forming step of the second coating layer. The ink forms a circuit pattern.

Further, in another modification, one of the first coating layer or the second coating layer may form a circuit pattern by performing a printing process, and the other one of the coating layers may be subjected to a patterning process by an additional circuit pattern forming step. A circuit pattern is formed.

Third embodiment

Fig. 4 is a flow chart showing the process of manufacturing a printed circuit board according to a third embodiment of the present invention.

As shown in FIG. 4, the manufacturing method S300 of the printed circuit board according to the third embodiment of the present invention includes a first coating forming step S310, a second coating forming step S320, a punching step S330, and a temporary sealing layer. The bonding step S340, the conductive layer forming step S350, the temporary blocking layer removing step S360, the plating step S370, and the circuit pattern forming step S380.

The first coating forming step S310 and the second coating forming step S320 are steps of applying the first coating layer 20 and the second coating layer 30 on the upper surface and the lower surface of the substrate 10, respectively. Further, as the substrate 10 in this step, a polyimide film (PI: PolyImide Film) can be used, but it is not limited thereto.

The punching step S330 is formed to completely penetrate the substrate 10 on both sides of the substrate The steps of laminating the first coating 20 and the through hole 11 of the second coating 30. This perforating step S330 is performed on the substrate by a process known in the art such as CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching.

The joining step S340 of the temporary sealing layer is a step of joining the temporary sealing layer 60 on the first coating layer 20 to block the end portion of the through hole 11 that is pierced.

That is, the temporary sealing layer 60 is bonded to the first coating layer 20, thereby preventing the conductive ink filled in the inside of the through hole 11 from leaking to the outside of the first coating layer 20 in the step S350 of forming the conductive layer to be described later. Excessive consumption of the first coating 20 or conductive ink.

At this time, a polyethylene terephthalate (PET) film may be used as the material of the temporary plugging layer joined to the first coating layer 20, but is not limited thereto. In addition, instead of bonding the temporary sealing layer 60 on the first coating layer 20, the conductive ink is prevented from passing from the inside of the through hole 11 to the second coating by bonding the temporary sealing layer 60 on the second coating layer 30. The outside of layer 30 leaks.

The step S350 of forming the conductive layer is a step of forming the conductive layer 50 on the inner wall surface of the through hole 11.

In this step, first, the same material as the first coating layer 20 and the second coating layer 30 is filled to the inside of the through hole 11 through the side that is not blocked by the temporary sealing layer 60, that is, through the open side. Conductive ink (S351).

At this time, it is possible to prevent the conductive ink from being exposed to the outside by blocking the temporary sealing layer 60 of the through hole 11.

Then, the conductive ink is heat-treated in a state where the conductive ink is filled in the inside of the through hole 11, and the conductive ink can be shrunk to form the conductive layer 50 applied along the inner wall surface of the through hole 11 (S352). .

Therefore, through this step, the conductive layer 50 that electrically connects the first coating layer 20 and the second coating layer 30 to each other is formed along the inner wall surface of the through hole 11.

The temporary sealing layer removing step S360 is a step of removing the temporary sealing layer 60 that blocks the through hole 11 from the first coating layer 20.

The plating step S370 is a step of forming a plating layer 40 on the outer surfaces of the first coating layer 20, the second coating layer 30, and the conductive layer 50.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are subjected to electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The circuit pattern forming step S380 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer, the second coating layer, and the plating layer plated thereon are patterned by a photolithography process well known in the art to form a circuit pattern of a desired shape.

Therefore, with the present embodiment, the temporary blocking layer 60 is bonded to block the end portion of the through hole 11, so that the conductive ink filled inside the through hole 11 can be prevented from leaking from the opposite side to contaminate the first coating layer 20. Or the second coating layer 30 can also prevent excessive consumption of the conductive ink.

Fourth embodiment

Fig. 5 is a flow chart showing the process of manufacturing a printed circuit board according to a fourth embodiment of the present invention.

As shown in FIG. 5, a method S400 for manufacturing a printed circuit board according to a fourth embodiment of the present invention includes a first coating forming step S410, a second coating forming step S420, and strengthening. The layer bonding step S430, the punching step S440, the conductive layer forming step S450, the reinforcing layer removing step S460, the plating step S470, and the circuit pattern forming step S480.

The first coating forming step S410 and the second coating forming step S420 are steps of applying the first coating layer 20 and the second coating layer 30 on the upper surface and the lower surface of the substrate 10, respectively. Further, as the substrate 10 in this step, a polyimide film (PI: PolyImide Film) can be used, but it is not limited thereto.

The bonding step S430 of the reinforcing layer is a step of bonding an additional reinforcing layer 70 on the first coating layer 20 and the second coating layer 30.

That is, in this step, the reinforcing layer 70 is bonded to the first coating layer 20 and the second coating layer 30, so that the durability of the first coating layer 20 and the third coating layer 30 coated on the substrate 10 as a film can be improved. The through hole 11 can be stably processed in the punching step S440 which will be described later.

Further, by the reinforcing layer 70 formed in this step, it is possible to prevent the conductive ink filled in the inside of the through hole 11 from leaking to the outside of the first coating layer 20 in the step of forming the conductive layer to be described later, thereby enabling the phenomenon Improve the precision of the resulting circuit pattern.

At this time, a polyethylene terephthalate (PET) film is used as the material of the reinforcing layer 70 joined to the first coating layer 20 and the second coating layer 30, but is not limited thereto.

The punching step S440 is a step of forming a through hole 11 of the first coating layer 20, the second coating layer 30, and the reinforcing layer 70 which are completely penetrated through the substrate 10 and laminated on both surfaces of the substrate. This perforating step S440 is performed on the substrate 10 by a process known in the art such as CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching.

In this step, the substrate 10, the first coating layer 20, and the second coating layer 30 are processed in a state where the overall durability is enhanced by the reinforcing layer 70, so that the through holes 11 can be stably formed.

The step S450 of forming the conductive layer is a step of forming the conductive layer 50 on the inner wall surface of the through hole 11.

In this step, first, the inside of the through hole 11 is filled with a conductive ink of the same material as the first coating layer 20 and the second coating layer 30 (S451). At this time, the reinforcing layer 70 can prevent the conductive ink from flowing to the outside of the first coating layer 20 and the second coating layer 30, thereby ensuring a uniform first coating layer as compared with filling the conductive ink without the reinforcing layer. 20 and a second coating 30.

Then, the conductive ink is heat-treated in a state where the conductive ink is filled in the inside of the through hole 11, and the conductive ink can be shrunk to form the conductive layer 50 along the inner wall surface of the through hole 11 (S452).

Therefore, through this step, the conductive layer 50 that electrically connects the first coating layer 20 and the second coating layer 30 to each other is formed along the inner wall surface of the through hole 11.

That is, as schematically shown in "A" of Fig. 5, when an additional reinforcing layer is not laminated, a conductive ink is laminated on the first coating layer 20 and the second coating layer 30, and thus has unevenness. The problem of the surface, on the contrary, laminates the reinforcing layer 70 in this embodiment, thereby preventing the conductive ink from flowing between the substrate 10 and the first coating layer 20 or between the substrate 10 and the second coating layer 30, thereby enabling the first coating The surfaces of layer 20 and second coating 30 are planarized.

The step of removing the reinforcing layer S460 is a step of removing the reinforcing layer 70 from the first coating layer 20 and the second coating layer 30.

The plating step S470 is a step of forming a plating layer 40 on the outer surfaces of the first coating layer 20, the second coating layer 30, and the conductive layer 50.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are subjected to electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The circuit pattern forming step S480 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a desired shape. Circuit pattern.

Fifth embodiment

Fig. 6 is a flow chart showing the process of manufacturing a printed circuit board according to a fifth embodiment of the present invention.

As shown in FIG. 6, the manufacturing method S500 of the printed circuit board according to the fifth embodiment of the present invention includes a first coating forming step S510, a second coating forming step S520, a plating step S530, a punching step S540, Step S550 of forming a conductive layer and step S560 of forming a circuit pattern.

The first coating forming step S510 and the second coating forming step S520 are steps of applying the first coating layer 20 and the second coating layer 30 on the upper surface and the lower surface of the substrate 10, respectively. Further, a polyimide film (PI: PolyImide Film) is used as the substrate 10 in this step, but is not limited thereto.

The plating step S530 is a step of forming a plating layer 40 on the outer surfaces of the first coating layer 20 and the second coating layer 30.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are subjected to electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The punching step S540 is a step of forming a through hole 11 of the first coating layer 20 and the second coating layer 30 which are completely penetrated through the substrate 10 and laminated on both surfaces of the substrate. Wear this The hole step S330 is performed on the substrate by a CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching, etc., in a process well known in the art.

At this time, in the present embodiment, the plating layer 40 is plated on the first coating layer 20 and the second coating layer 30, thereby being compared with the case where only the first coating layer 20 or the second coating layer 30 is separately formed on the substrate 10. The perforation process of this step is realized in a state in which rigidity and durability are further enhanced, so that the through hole 11 can be further stably formed.

The step S550 of forming the conductive layer is a step of forming the conductive layer 50 on the inner wall surface of the through hole 11.

In this step, first, the inside of the through hole 11 is filled with a conductive ink of the same material as the first coating layer 20 and the second coating layer 30 (S551).

Then, the conductive ink is heat-treated in a state where the conductive ink is filled in the inside of the through hole 11, and the conductive ink can be shrunk to form the conductive layer 50 along the inner wall surface of the through hole 11 (S552).

Therefore, through this step, the conductive layer 50 that connects the first coating layer 20, the second coating layer 30, and the plating layer 40 to each other is formed along the inner wall surface of the through hole 11.

The circuit pattern forming step S560 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a desired shape. Circuit pattern.

Therefore, according to the present embodiment, the plating layer 40 is first formed on the first coating layer 20 and the second coating layer 30, and the durability of the whole is first strengthened, and then the through hole 11 is bored, so that a further stable piercing operation can be performed.

Sixth embodiment

Fig. 7 is a flow chart showing the process of manufacturing a printed circuit board according to a sixth embodiment of the present invention.

As shown in FIG. 7, the manufacturing method S600 of the printed circuit board according to the sixth embodiment of the present invention includes a first coating forming step S610, a punching step S620, a second coating forming step S630, a plating step S640, and a circuit. The pattern forming step S650.

The first coating forming step S610 is a step of applying the first coating layer 20 on one side of the substrate 10. Further, a polyimide film (PI: PolyImide Film) is used as the substrate 10 in this step, but is not limited thereto.

This punching step S620 is a step of forming a through hole 11 of the first coating layer 20 which is completely penetrated through the substrate 10 and laminated on both sides of the substrate. This perforating step S620 is performed on the substrate by a CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching, etc., in a process well known in the art.

The second coating forming step S630 is a step of forming the conductive layer 50 on the inner wall surface of the through hole 11 while forming the second coating layer 30 on the other surface of the substrate 10. That is, unlike the second coating layer 30 which is simply applied in the forming step of the second coating layer of the embodiment described above, the second coating layer 30 is applied in the forming step S630 of the second coating layer of the present embodiment. The conductive layer 50 is formed at the same time.

First, after the substrate 10 is reversed so that the second coating layer 30 faces the upper side, the lower surface of the substrate 10 is coated with a conductive ink material to form the second coating layer 30, and the inside of the through hole 11 is filled with conductive ink ( S631).

Next, the first coating layer 20, the second coating layer 30, and the conductive ink filled in the inside of the through hole 11 coated on the substrate 10 by the above-described process are subjected to heat treatment (S632). by The heat treatment process hardens the first coating layer 20 and the second coating layer 30, and the conductive ink inside the through hole 11 also hardens and contracts, thereby forming the conductive layer 50 along the inner wall surface of the through hole 11.

Therefore, by this step, the conductive layer 50 which connects the first coating layer 20 and the second coating layer 30 to each other is formed along the inner wall surface of the through hole 11 while forming the second coating layer 30.

The plating step S640 is a step of forming the plating layer 40 by plating the first coating layer 20, the second coating layer 30, and the conductive layer 50.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are formed by electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The circuit pattern forming step S650 is a step of patterning the first coating layer 20 and the plating layer 40, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20 and the plating layer 40, the second coating layer 30, and the plating layer 40 plated thereon are applied by a photolithography process well known in the art. Patterning is performed to form a circuit pattern of a desired shape.

In addition, in this step, the first coating layer 20 and the plating layer 40, the second coating layer 30, and the plating layer 40 plated thereon are simultaneously patterned to form a circuit pattern, thereby improving process efficiency.

However, as shown in the processing flowchart of the modification of the manufacturing method of the printed circuit board according to the sixth embodiment of the present invention, as shown in Fig. 8, in the modification of the embodiment, the first coating layer may be sequentially performed. 20 and a process S651 for patterning the plated layer 40 thereon and a process 652 for patterning the second layer 30 and the plated layer 40 plated thereon.

Seventh embodiment

Fig. 9 is a flow chart showing the process of manufacturing a printed circuit board according to a seventh embodiment of the present invention.

As shown in FIG. 9, the manufacturing method S700 of the printed circuit board according to the seventh embodiment of the present invention includes a first coating forming step S710, a punching step S720, a second coating forming step S730, a plating step S740, and protection. The bonding step S750 of the layer, the forming step S760 of the circuit pattern, and the removing step S770 of the protective layer.

The first coating forming step S710 is a step of applying the first coating layer 20 on one side of the substrate 10. Further, a polyimide film (PI: PolyImide Film) is used as the substrate 10 in this step, but is not limited thereto.

This punching step S720 is a step of forming a through hole 11 that completely penetrates the substrate 10 and the first coating layer 20 laminated on the upper surface of the substrate 10. This perforating step S720 is performed on the substrate by a CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching, etc., in a process well known in the art.

The second coating layer forming step S730 is a step of forming the conductive layer 50 on the inner wall surface of the through hole 11 while forming the second coating layer 30 on the other surface of the substrate 10.

First, for the convenience of the process, the substrate 10 is reversed so that the second coating layer 30 faces the upper side.

After the upper and lower sides of the substrate 10 are reversed, the lower surface of the substrate 10 is coated with a conductive ink material to form the second coating layer 30, and the inside of the through hole 11 is filled with conductive ink (S731). At this time, in the present embodiment, the second coating layer 30 is formed by printing a conductive ink on the substrate 10, thereby forming a circuit pattern on the second coating layer 30.

Next, the first coating layer 20, the second coating layer 30, and the conductive ink filled in the inside of the through hole 11 coated on the substrate 10 by the above-described process are subjected to heat treatment (S732). by The heat treatment process hardens the first coating layer 20 and the second coating layer 30, and the conductive ink inside the through hole 11 also hardens and contracts, thereby forming the conductive layer 50 along the inner wall surface of the through hole 11. Therefore, the conductive layer 50 formed along the inner wall surface of the through hole 11 connects the first coating layer 20 and the second coating layer 30 to each other.

The plating step S740 is a step of forming the plating layer 40 by plating the first coating layer 20, the second coating layer 30, and the conductive layer 50.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are formed by electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The bonding step S750 of the protective layer is to protect the second coating layer 30 in the formation of the first coating layer 20 in the circuit pattern forming step S760 to be described later, in the second coating layer 30 and the plating layer on which the circuit pattern has been formed. The step of bonding the protective layer 80 on 40.

That is, the protective layer 80 is bonded on the plating layer 40 formed on the second coating layer 30, thereby preventing damage which may occur on the second coating layer 30 during the photolithography process in the circuit pattern forming step S760.

At this time, as the material of the protective layer 80 bonded to the second coating layer 30, a polyethylene terephthalate (PET) film can be used, but it is not limited thereto.

The circuit pattern forming step S760 is a step of patterning the first coating layer 20 and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20 and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a circuit pattern of a desired shape.

The step S770 of removing the protective layer is a step of removing the protective layer 80 temporarily bonded to the plating layer 40.

Therefore, with the present embodiment, an additional protective layer 80 is bonded on the second coating layer 30 on which the circuit pattern has been formed, thereby preventing damage that may occur on the second coating layer 30 when the first coating layer 20 is patterned. Thus, it is possible to stably produce a printed circuit board having an accurate circuit pattern.

Eighth embodiment

Fig. 10 is a flow chart showing the process of the method for manufacturing a printed circuit board according to the eighth embodiment of the present invention.

As shown in FIG. 10, the manufacturing method S800 of the printed circuit board according to the eighth embodiment of the present invention includes a punching step S810, a first coating forming step S820, a second coating forming step S830, a heat treatment step S840, and plating. Step S850 and circuit pattern forming step S860.

This punching step S810 is a step of piercing the substrate 10 to form a through hole 11 that completely penetrates the substrate 10. This perforating step S810 is performed on the substrate by a CNC electric drill, UV laser, YAG laser, CO2 laser or roll-to-roll punching, etc., in a process well known in the art.

Further, as the substrate 10 in this step, a polyimide film (PI: PolyImide Film) is used, but it is not limited thereto.

The first coating layer forming step S820 is a step of filling at least a part of the inside of the through hole 11 formed on the substrate with conductive ink while forming the first coating layer 20 on the other surface of the substrate 10.

The second coating forming step S830 is to pass the inside of the through hole 11 partially filled in the forming step S820 of the first coating layer while forming the second coating layer 30 on the other surface of the substrate 10. The opening portion on the side is completely filled with a conductive ink.

That is, through the forming step S820 of the first coating layer and the shape of the second coating layer In step S830, while the first coating layer 20 and the second coating layer 30 are formed on both sides of the substrate 10, the inside of the through hole 11 is completely filled with the conductive ink.

This heat treatment step S840 is a step of heat-treating the first coating layer 20, the second coating layer 30, and the conductive ink filled inside the through hole 11.

In this step, the first coating layer 20 and the second coating layer 30 coated on the substrate 10 by the above various processes are hardened and fired by the heat treatment process to shrink. At the same time, the conductive ink filled in the inside of the through hole 11 also forms the conductive layer 50 along the inner wall surface of the through hole 11 as the heat treatment is hardened and shrunk. These conductive layers 50 will be formed on the both sides of the substrate 10 first. The coating 20 and the second coating 30 are electrically connected.

The plating step S850 is a step of forming a plating layer 40 on the outer surfaces of the first coating layer 20, the second coating layer 30, and the conductive layer 50.

In this step, the first coating layer 20, the second coating layer 30, and the conductive layer 50 made of a conductive ink material are subjected to electroless copper plating or electrolytic copper plating to form a plating layer 40. At this time, the thickness of the plating layer 40 is determined in consideration of the amount of current applied to the finally formed printed circuit board.

The circuit pattern forming step S860 is a step of patterning the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon to form a circuit pattern.

In this step, the first coating layer 20, the second coating layer 30, and the plating layer 40 plated thereon are patterned by a photolithography process well known in the art to form a desired shape. Circuit pattern.

The scope of the invention is not limited to the embodiments described above, but can be embodied in various forms within the scope of the appended claims. The various ranges in which the person having ordinary knowledge in the art to which the present invention pertains can be modified are also within the scope of the present invention without departing from the spirit and scope of the invention as claimed.

10‧‧‧Substrate

11‧‧‧through hole

20, 30‧‧‧ coating

40‧‧‧ plating

41‧‧‧Electroless copper plating

42‧‧‧ copper

S100‧‧‧Manufacturing method of printed circuit board

S110‧‧‧Step of forming the first coating

S120‧‧‧Step of forming the second coating

S130‧‧‧ piercing steps

S140‧‧‧ plating step

S150‧‧‧ Circuit pattern forming steps

Claims (15)

A method of manufacturing a printed circuit board, comprising the steps of: forming a first coating layer, forming a first coating layer on one side of the substrate by a conductive ink; forming a second coating layer on the substrate The other side is formed of a conductive ink to form a second coating; a perforating step of perforating the first coating, the substrate and the second coating to form a through hole; and a plating step, the a coating layer, the second coating layer and the inner wall surface of the through hole are plated to form a plating layer, wherein the first coating layer and the plating layer plated on the first coating layer or a second coating layer and a plating pattern plated on the second coating layer are formed with a circuit pattern, the method further comprising: a bonding step of the protective layer, in order to protect the plating layer before forming the circuit pattern The step of removing the protective layer on the plating layer; and removing the protective layer, after the circuit pattern is formed, removing the protective layer. The method of manufacturing a printed circuit board according to claim 1, wherein the plating step comprises: inner wall surfaces of the first coating layer, the second coating layer, and the through hole The step of performing electroless plating; and the step of forming a plating layer by electrolytic plating on the inner wall surface of the electroless plated through hole. A method of manufacturing a printed circuit board, comprising the steps of: forming a first coating layer, forming a first coating layer on one side of the substrate by a conductive ink; forming a second coating layer on the substrate The other side is formed of a conductive ink to form a second coating; a perforating step of perforating the first coating, the substrate and the second coating to form a through hole; a step of forming a conductive layer, forming a conductive layer on an inner wall surface of the through hole, thereby electrically connecting the first coating layer and the second coating layer; and a plating step, the first coating layer, the The second coating layer and the conductive layer are plated to form a plating layer, wherein the first coating layer and the plating layer plated on the first coating layer or the second coating layer and the Forming a circuit pattern on the plating plated on the two coatings, the method further comprising: a bonding step of the protective layer, bonding a protective layer on the plating layer to protect the plating layer before forming the circuit pattern; The step of removing the protective layer, after forming the circuit pattern, removing the protective layer. The method for manufacturing a printed circuit board according to claim 3, wherein the step of forming the conductive layer comprises the steps of: filling a conductive ink inside the through hole; and performing a heat treatment step. The heat treatment is performed to contract the conductive ink filled inside the through hole and form a conductive layer along the inner wall surface of the through hole. The method of manufacturing a printed circuit board according to claim 4, further comprising the step of: a step of bonding the temporary sealing layer, in the first coating layer or the second coating layer Bonding a temporary sealing layer on at least one of the coating layers to block the through holes, thereby preventing the conductive ink filled in the forming step of the conductive layer from being detached from the through holes; and removing the temporary sealing layer Removing the temporary plugging layer after the forming step of the conductive layer. The method of manufacturing a printed circuit board according to claim 4, further comprising the step of: bonding the reinforcing layer, bonding the reinforcing layer to the first coating layer and the second coating layer ;and a step of removing the reinforcing layer, removing the reinforcing layer after the forming step of the conductive layer, and in the step of punching, the reinforcing layer, the first coating layer, the substrate, and the second The coating is perforated to form a through hole. A method of manufacturing a printed circuit board, comprising the steps of: forming a first coating layer, forming a first coating layer on one side of the substrate by a conductive ink; forming a second coating layer on the substrate The other side is formed of a conductive ink to form a second coating layer; a plating step, plating the first coating layer and the second coating layer to form a plating layer; and a perforating step for the first coating layer Forming a through hole by perforating the substrate, the second coating layer and the plating layer; and forming a conductive layer, forming a conductive layer on an inner wall surface of the through hole, thereby making the first coating layer and the first coating layer The second coating is electrically connected, wherein the first coating layer and the plating layer plated on the first coating layer or the plating layer formed on the second coating layer and the second coating layer are formed a circuit pattern, the method further comprising: a bonding step of the protective layer, bonding a protective layer on the plating layer to protect the plating layer before forming the circuit pattern; and a removing step of the protective layer, forming the After the circuit pattern, the protection is removed . The method for manufacturing a printed circuit board according to claim 7, wherein the step of forming the conductive layer comprises the steps of: filling a conductive ink in the interior of the through hole; The conductive ink inside the hole is heat-treated to shrink the conductive ink filled inside the through hole and form a conductive layer along the inner wall surface of the through hole, thereby plating the first coating layer The step of plating and plating plating on the second coating are electrically connected to each other. A manufacturing method of a printed circuit board, comprising the steps of: forming a first coating layer, forming a first coating layer on one side of the substrate by a conductive ink; and performing a punching step, the substrate and the first The coating layer is perforated to form a through hole; the second coating layer is formed by forming a conductive layer on the inner wall surface of the through hole while forming a second coating layer from the conductive ink material on the other side of the substrate, thereby And electrically plating the first coating layer and the second coating layer; and plating a step of plating the first coating layer, the second coating layer and the conductive layer to form a plating layer, wherein Forming a circuit pattern on the first coating layer and a plating layer plated on the first coating layer or a plating layer plating on the second coating layer and the second coating layer, the method further comprising a bonding step of the protective layer, bonding a protective layer on the plating layer to protect the plating layer before forming the circuit pattern; and a removing step of the protective layer, after removing the protective layer after forming the circuit pattern . The method of manufacturing a printed circuit board according to claim 9, wherein the forming step of the second coating layer comprises the step of: coating the substrate by a conductive ink material while conducting electricity a step of filling the inside of the through hole by the ink; and a heat treatment step of performing heat treatment to shrink the conductive ink filled inside the through hole and form a conductive layer along the inner wall surface of the through hole. A manufacturing method of a printed circuit board, comprising the steps of: perforating a step of perforating a substrate to form a through hole; forming a first coating layer, forming a first coating layer on the one side of the substrate by a conductive ink At the same time, at least a portion of the inside of the through hole is filled with a conductive ink; a step of forming the second coating layer is completely filled with the conductive ink while the second coating layer is formed of the conductive ink on the other side of the substrate The inside of the through hole, thereby making the first a coating layer and the second coating layer are connected to each other; a heat treatment step of performing heat treatment to shrink a conductive ink filled inside the through hole and forming a conductive layer along an inner wall surface of the through hole; and a plating step, Plating the first coating layer, the second coating layer and the conductive layer to form a plating layer, wherein the first coating layer and the plating layer plated on the first coating layer or Forming a circuit pattern on the second coating layer and the plating layer plated on the second coating layer, the method further comprising: a bonding step of the protective layer, in order to protect the plating layer before forming the circuit pattern Bonding the protective layer on the plating layer; and removing the protective layer, after the circuit pattern is formed, removing the protective layer. The method of manufacturing a printed circuit board according to any one of claims 1 to 11, wherein the forming step of the first coating layer or the forming step of the second coating layer The conductive ink is printed on the substrate to form a circuit pattern. The method of manufacturing a printed circuit board according to any one of claims 1 to 11, further comprising the steps of: forming a circuit pattern, the first step by photolithography The coating or the second coating is patterned to form the circuit pattern. The method of manufacturing a printed circuit board according to any one of claims 1 to 11, further comprising the step of: forming a circuit pattern, after the plating step, Photolithography forms a circuit pattern by patterning the first coating layer and a plating layer laminated on the first coating layer or a plating layer laminated on the second coating layer and the second coating layer. A method of manufacturing a printed circuit board, comprising the steps of: forming a first coating layer, forming a first coating layer on one side of the substrate by a conductive ink; forming a second coating layer on the substrate The other side is formed by conductive ink a coating step of perforating the first coating layer, the substrate and the second coating layer to form a through hole; a step of forming a conductive layer, forming a conductive layer on an inner wall surface of the through hole, Electrically connecting the first coating layer and the second coating layer; and a plating step of plating the first coating layer, the second coating layer and the conductive layer to form a plating layer, The step of forming the conductive layer includes: a step of filling a conductive ink inside the through hole; and a heat treatment step of performing heat treatment to shrink the conductive ink filled inside the through hole and along the through hole The wall surface forms a conductive layer, the method further comprising: a bonding step of the reinforcing layer, bonding the reinforcing layer on the first coating layer and the second coating layer; and a removing step of the reinforcing layer, forming the conductive layer After the step, the reinforcing layer is removed, and in the punching step, the reinforcing layer, the first coating layer, the substrate, and the second coating layer are perforated to form a through hole.