TWI566646B - A flexible printed circuit board, a connector assembly and an electronic device - Google Patents

A flexible printed circuit board, a connector assembly and an electronic device Download PDF

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TWI566646B
TWI566646B TW104132777A TW104132777A TWI566646B TW I566646 B TWI566646 B TW I566646B TW 104132777 A TW104132777 A TW 104132777A TW 104132777 A TW104132777 A TW 104132777A TW I566646 B TWI566646 B TW I566646B
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terminal
speed differential
line
differential signal
layer
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TW104132777A
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TW201714496A (en
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戴宏杰
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挺暉工業股份有限公司
戴宏杰
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Priority to CN201620015090.6U priority patent/CN205385651U/en
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柔性印刷電路板、連接器組件及電子裝置 Flexible printed circuit board, connector assembly and electronic device

本創作係有關一種印刷電路板,尤指一種多層柔性印刷電路板。 This creation relates to a printed circuit board, especially a multilayer flexible printed circuit board.

柔性印刷電路板(Flexible Printed Circuit Board,FPC)係用柔性的絕緣基材製成的印刷電路,具有許多硬性印刷電路板不具備的優點。例如它可以自由彎曲、捲繞、折疊,可依照空間佈局要求任意安排,並在三維空間任意移動和伸縮,從而達到元器件裝配和導線連接一體化。利用柔性印刷電路板可大大縮小電子產品的體積,適用電子裝置向高密度、小型化、高可靠方向發展的需要,因此,柔性印刷電路板在航太、軍事、移動通訊、手提電腦、電腦週邊、PDA、數位相機等領域或產品上得到了廣泛的應用。 Flexible Printed Circuit Board (FPC) is a printed circuit made of a flexible insulating substrate that has many advantages that are not provided by rigid printed circuit boards. For example, it can be freely bent, wound, folded, can be arbitrarily arranged according to the spatial layout requirements, and can be arbitrarily moved and expanded in a three-dimensional space, thereby achieving integration of component assembly and wire connection. The use of flexible printed circuit boards can greatly reduce the size of electronic products, and is suitable for the development of electronic devices in the direction of high density, miniaturization, and high reliability. Therefore, flexible printed circuit boards are used in aerospace, military, mobile communications, laptop computers, and computer peripherals. , PDA, digital camera and other fields or products have been widely used.

柔性印刷電路板有單面、雙面和多層板之分。所採用的基材以聚醯亞胺覆銅板為主。此種材料耐熱性高、尺寸穩定性好,與兼有機械保護和良好電氣絕緣性能的覆蓋膜通過壓制而成最終產品。聚醯亞胺樹脂係以由含氧層基和無水苯均四酸的反應產生的聚苯均四酸亞胺為代表,擁有亞胺五負環的耐熱型樹脂的通稱。柔性印刷電路板用的導體都是薄箔狀的銅,就是所謂的銅箔,其製法可分為電解銅箔及壓延銅箔,其中又以壓 延銅箔為主流。此外,雙面、多層印製線路板的表層和內層導體通過金屬化實現內外層電路的電性連接。 Flexible printed circuit boards are available in single, double and multi-layer boards. The substrate used is mainly polyimide-copper-clad laminate. The material has high heat resistance and good dimensional stability, and is formed into a final product by pressing with a cover film having both mechanical protection and good electrical insulation properties. The polyimine resin is a general term for a heat-resistant resin having a penta-nine ring of an imine, represented by polyphenyltetramethylene imide produced by the reaction of an oxygen-containing layer and anhydrous pyromellitic acid. The conductors for flexible printed circuit boards are thin foil-like copper, which is a so-called copper foil. The preparation method can be divided into electrolytic copper foil and rolled copper foil, in which pressure is applied. Copper foil is the mainstream. In addition, the surface layer and the inner layer conductor of the double-sided, multilayer printed wiring board are electrically connected to each other by metallization.

專利公開號WO2011/018862A1已揭示一種多層柔性印刷電 路板的製造方法,其可達到在多層多層柔性印刷電路板中實現表面佈線層之微細電路化,從而不阻礙高密度安裝。 A multilayer flexible printed circuit has been disclosed in the patent publication No. WO 2011/018862 A1. A method of manufacturing a road board, which can achieve fine circuitization of a surface wiring layer in a multilayer multilayer flexible printed circuit board, thereby preventing high-density mounting.

然而,柔性印刷電路板可應用在低性能、低操作頻率環境, 亦可應用在高性能、高操作頻率環境。為了適用於較高操作頻率環境使用,柔性印刷電路板的結構設計及製造程序相對地較為困難且高成本。這是因為在同一膜層上的訊號線路之間,以及相鄰膜層上的訊號線路之間彼此的電磁干擾(Electromagnetic interference,EMI)將變得明顯,進而影響訊號傳輸品質。 However, flexible printed circuit boards can be used in low performance, low operating frequency environments. It can also be used in high performance, high operating frequency environments. In order to be suitable for use in a higher operating frequency environment, the structural design and manufacturing process of a flexible printed circuit board is relatively difficult and costly. This is because the electromagnetic interference (EMI) between the signal lines on the same film layer and the signal lines on the adjacent film layers will become apparent, which will affect the signal transmission quality.

有鑑於此,本創作人有感於上述之不方便,乃潛心研究並配合學理運用及結合多年之經驗,構思一種設計合理且能有效改善之本創作。 In view of this, the creator feels that the above-mentioned inconvenience is to study and cooperate with the use of theory and combine years of experience to conceive a creative design that can be effectively improved.

本創作之一目的,在於柔性印刷電路板具有較少的堆疊層,即可傳輸高速差動訊號、低速差動訊號、其它訊號、接地訊號及電源訊號等多種訊號,同時訊號線之間及堆疊層與堆疊層之間均具有良好的屏蔽效果,以降低電磁干擾。 One of the purposes of this creation is that the flexible printed circuit board has fewer stacked layers, and can transmit various signals such as high-speed differential signals, low-speed differential signals, other signals, ground signals, and power signals, and between signal lines and stacking. Both the layer and the stacked layer have a good shielding effect to reduce electromagnetic interference.

為達上述目的,本創作提供一種柔性印刷電路板,包括:電纜本體、位於該電纜本體一端的第一端子部及位於該電纜本體另一端的第二端子部,該第一端子部具有沿寬度方向依序排列的一第一其它訊號端子、一第一高速差動訊號端子、一第一接地端子、一第二高速差動訊號端 子、一第二接地端子、一第三高速差動訊號端子、一第一電源端子、一第四高速差動訊號端子、一第二電源端子、一第二其它訊號端子、一第一低速差動訊號端子、一第三電源端子、一第二低速差動訊號端子、一第三其它訊號端子、一第四電源端子、一第五高速差動訊號端子、一第五電源端子、一第六高速差動訊號端子、一第三接地端子、一第七高速差動訊號端子、一第四接地端子、一第八高速差動訊號端子及一第四其它訊號端子。 To achieve the above object, the present invention provides a flexible printed circuit board comprising: a cable body, a first terminal portion at one end of the cable body, and a second terminal portion at the other end of the cable body, the first terminal portion having a width along the width a first other signal terminal, a first high speed differential signal terminal, a first ground terminal, and a second high speed differential signal terminal arranged in sequence a second grounding terminal, a third high speed differential signal terminal, a first power terminal, a fourth high speed differential signal terminal, a second power terminal, a second other signal terminal, and a first low speed difference a signal terminal, a third power terminal, a second low speed differential signal terminal, a third other signal terminal, a fourth power terminal, a fifth high speed differential signal terminal, a fifth power terminal, and a sixth a high speed differential signal terminal, a third ground terminal, a seventh high speed differential signal terminal, a fourth ground terminal, an eighth high speed differential signal terminal and a fourth other signal terminal.

在一實施例中,其中該電纜本體包括:電源層、訊號線層及 接地層,該訊號線層介於該電源層及該接地層之間,該訊號線層包含有電源線及接地線,該電源線與該電源層形成電性導通,該接地線與該接地層形成電性導通。 In an embodiment, the cable body includes: a power layer, a signal line layer, and a ground layer, the signal line layer is between the power layer and the ground layer, the signal line layer includes a power line and a ground line, and the power line is electrically connected to the power layer, the ground line and the ground layer Electrical conduction is formed.

在一實施例中,其中該訊號線層的該接地線係一第一接地線 及一第二接地線,該第一接地線一端電連接該第一端子部的該第二接地端子,該第二接地線一端電連接該第一端子部的該第三接地端子。 In an embodiment, the ground line of the signal line layer is a first ground line And a second grounding wire, the first grounding wire is electrically connected to the second grounding terminal of the first terminal portion, and the second grounding wire is electrically connected to the third grounding terminal of the first terminal portion.

在一實施例中,其中該訊號線層的該電源線係一第一電源線 及一第二電源線,該第一電源線一端電連接該第一端子部的該第二電源端子,該第二電源線一端電連接該第一端子部的該第四電源端子。 In an embodiment, the power line of the signal line layer is a first power line And a second power line, one end of the first power line is electrically connected to the second power terminal of the first terminal portion, and one end of the second power line is electrically connected to the fourth power terminal of the first terminal portion.

在一實施例中,其中該訊號線層的該接地線係一第一接地線 及一第二接地線,該第一接地線及該第二接地線同時電性連接該接地層及該第一端子部的該第一至第四接地端子。 In an embodiment, the ground line of the signal line layer is a first ground line And a second ground line, the first ground line and the second ground line are electrically connected to the ground layer and the first to fourth ground terminals of the first terminal portion at the same time.

在一實施例中,其中該訊號線層的該電源線係一第一電源線 及一第二電源線,該第一電源線及該第二電源線同時電性連接該電源層及該第一端子部的該第一至第五電源端子。 In an embodiment, the power line of the signal line layer is a first power line And a second power line, the first power line and the second power line are electrically connected to the power layer and the first to fifth power terminals of the first terminal.

在一實施例中,其中該訊號線層更包含四對高速差動訊號 線、一對低速差動訊號線及四個其他訊號線,相鄰的兩對該高速差動訊號線之間以至少一個該接地線隔開,且在與至少一個該接地線相反的一側設有至少一個該電源線或至少一個該其他訊號線。 In an embodiment, the signal line layer further comprises four pairs of high speed differential signals. a line, a pair of low-speed differential signal lines, and four other signal lines, the adjacent two of the high-speed differential signal lines being separated by at least one of the ground lines, and on a side opposite to the at least one of the ground lines At least one of the power lines or at least one of the other signal lines is provided.

在一實施例中,其中該四對高速差動訊號線係一第一高速差 動訊號線、一第二高速差動訊號線、一第三高速差動訊號線、一第四高速差動訊號線、一第五高速差動訊號線、一第六高速差動訊號線、一第七高速差動訊號線及一第八高速差動訊號線,該一對低速差動訊號線係一第一低速差動訊號線及一第二低速差動訊號線,該四個其他訊號線係一第一其他訊號線、一第二其他訊號線、一第三其他訊號線及一第四其他訊號線,該訊號線層沿寬度方向依序排列有該第一其他訊號線、該第一高速差動訊號線、該第二高速差動訊號線、該第一接地線、該第三高速差動訊號線、該第四高速差動訊號線、該第一電源線、該第二其他訊號線、該第一低速差動訊號線、該第二低速差動訊號線、該第三其他訊號線、該第二電源線、該第五高速差動訊號線、該第六高速差動訊號線、該第二接地線、該第七高速差動訊號線、該第八高速差動訊號線及該第四其他訊號線。 In an embodiment, wherein the four pairs of high speed differential signal lines have a first high speed difference a signal line, a second high-speed differential signal line, a third high-speed differential signal line, a fourth high-speed differential signal line, a fifth high-speed differential signal line, a sixth high-speed differential signal line, and a a seventh high speed differential signal line and an eighth high speed differential signal line, the pair of low speed differential signal lines being a first low speed differential signal line and a second low speed differential signal line, the four other signal lines a first other signal line, a second other signal line, a third other signal line, and a fourth other signal line, the signal line layer sequentially arranging the first other signal line along the width direction, the first a high speed differential signal line, the second high speed differential signal line, the first ground line, the third high speed differential signal line, the fourth high speed differential signal line, the first power line, and the second other signal a first low-speed differential signal line, the second low-speed differential signal line, the third other signal line, the second power line, the fifth high-speed differential signal line, and the sixth high-speed differential signal line The second ground line, the seventh high-speed differential signal line, and the eighth high Fourth differential signal lines and the other signal line.

本創作另提供一種連接器組件,包括:前述柔性印刷電路板;以及一與該柔性印刷電路板電連接的連接器。 The present invention further provides a connector assembly comprising: the aforementioned flexible printed circuit board; and a connector electrically connected to the flexible printed circuit board.

本創作又提供一種連接器組件,一種電子裝置,包括:一具有一主機板的本體,以及前述連接器組件,該連接器組件裝設於該本體內,且與該主機板形成電性連接。 The present invention further provides a connector assembly, an electronic device comprising: a body having a motherboard, and the connector assembly, the connector assembly being mounted in the body and electrically connected to the motherboard.

本創作具有以下有益效果: This creation has the following beneficial effects:

一、柔性印刷電路板具有較少的堆疊層,即可傳輸高速差動訊號、低速差動訊號、其它訊號、接地訊號及電源訊號等多種訊號,同時訊號線之間及堆疊層與堆疊層之間均具有良好的屏蔽效果,以降低電磁干擾(EMI)。 1. The flexible printed circuit board has fewer stacking layers, and can transmit various signals such as high-speed differential signals, low-speed differential signals, other signals, grounding signals, and power signals, and between signal lines and stacked layers and stacked layers. Both have a good shielding effect to reduce electromagnetic interference (EMI).

二、藉由位於訊號線層上方的第一導電隔離層(或稱接地層)與位於訊號線層下方的第二導電隔離層(或稱電源層)共同包覆訊號線層,以抑制堆疊層與堆疊層之間的電磁干擾。再者,訊號層中相鄰的二對高速差動訊號線之間以接地線隔開,且在與接地線相反的一側設有電源線或至少一個其它訊號線,以減少相鄰的二對高速差動訊號線之間彼此互相干擾。此外,訊號線層的每對高速差動訊號線或每對低速差動訊號線均介於電源線、接地線、其它訊號線或其組合之間,亦可抑制高速差動訊號或低速差動訊號傳輸時的電磁干擾。 2. The signal layer is covered by a first conductive isolation layer (or ground layer) located above the signal line layer and a second conductive isolation layer (or power layer) under the signal line layer to suppress the stacked layers. Electromagnetic interference with stacked layers. Furthermore, adjacent two pairs of high-speed differential signal lines in the signal layer are separated by a ground line, and a power line or at least one other signal line is disposed on a side opposite to the ground line to reduce the adjacent two The high-speed differential signal lines interfere with each other. In addition, each pair of high-speed differential signal lines or each pair of low-speed differential signal lines in the signal line layer is interposed between power lines, ground lines, other signal lines, or a combination thereof, and can also suppress high-speed differential signals or low-speed differentials. Electromagnetic interference during signal transmission.

三、第二端子部的第一至第四接地端子以並聯的方式與訊號線層的第一接地線及第二接地線電性連接,同時第二端子部的第一至第四接地端子亦以並聯的方式與接地層電性連接,使得電磁干擾的抑制得以同時藉由訊號層的接地線及接地層來解決,提高訊號傳輸的品質。 The first to fourth ground terminals of the second terminal portion are electrically connected in parallel to the first ground line and the second ground line of the signal line layer, and the first to fourth ground terminals of the second terminal portion are also The electrical connection is electrically connected in parallel with the grounding layer, so that the suppression of electromagnetic interference can be solved by the grounding wire and the grounding layer of the signal layer at the same time, thereby improving the quality of the signal transmission.

四、第二端子部的第一至第四電源端子以並聯的方式與訊號線層的第一電源線及第二電源線電性連接,同時第二端子部的第一至第四電源端子亦以並聯的方式與電源層電性連接,以分流的原理來傳輸電源,得以承載較大的電源。 4. The first to fourth power terminals of the second terminal portion are electrically connected in parallel to the first power line and the second power line of the signal line layer, and the first to fourth power terminals of the second terminal portion are also The power supply layer is electrically connected in parallel, and the power is transmitted by the principle of shunting to carry a large power source.

10‧‧‧柔性印刷電路板 10‧‧‧Flexible printed circuit board

12‧‧‧電纜本體 12‧‧‧ Cable body

1201‧‧‧第一表面 1201‧‧‧ first surface

1202‧‧‧第二表面 1202‧‧‧ second surface

1203‧‧‧彎折部 1203‧‧‧Bend

1204‧‧‧平坦部 1204‧‧‧flat

121‧‧‧訊號線層 121‧‧‧Signal layer

1211‧‧‧高速差動訊號線 1211‧‧‧High speed differential signal line

1211a~1211h‧‧‧第一至第八高速差動訊號線 1211a~1211h‧‧‧1st to 8th high speed differential signal lines

1212‧‧‧低速差動訊號線 1212‧‧‧Low speed differential signal line

1212a~1212b‧‧‧第一至第二低速差動訊號線 1212a~1212b‧‧‧1st to 2nd low speed differential signal line

1213‧‧‧其它訊號線 1213‧‧‧Other signal lines

1213a~1213d‧‧‧第一至第四其它訊號線 1213a~1213d‧‧‧1st to 4th other signal lines

1214‧‧‧接地線 1214‧‧‧ Grounding wire

1214a~1214b‧‧‧第一至第二接地線 1214a~1214b‧‧‧first to second grounding wire

1215‧‧‧電源線 1215‧‧‧Power cord

1215a~1215b‧‧‧第一至第二電源線 1215a~1215b‧‧‧first to second power cords

122‧‧‧第一導電隔離層/接地層 122‧‧‧First Conductive Isolation Layer/Ground Layer

123‧‧‧第二導電隔離層/電源層 123‧‧‧Second conductive isolation layer / power layer

124‧‧‧第一導通孔 124‧‧‧First via hole

125‧‧‧第二導通孔 125‧‧‧Second via

126‧‧‧第一穿孔 126‧‧‧First perforation

127‧‧‧第二穿孔 127‧‧‧Second perforation

14‧‧‧第一端子部 14‧‧‧First terminal section

141‧‧‧高速差動訊號端子 141‧‧‧High speed differential signal terminal

141a~141h‧‧‧第一至第八高速差動訊號端子 141a~141h‧‧‧1st to 8th high speed differential signal terminals

142‧‧‧低速差動訊號端子 142‧‧‧Low speed differential signal terminal

142a~142b‧‧‧第一至第二低速差動訊號端子 142a~142b‧‧‧1st to 2nd low speed differential signal terminals

143‧‧‧其它訊號端子 143‧‧‧Other signal terminals

143a~143d‧‧‧第一至第四其它訊號端子 143a~143d‧‧‧First to fourth other signal terminals

144‧‧‧接地端子 144‧‧‧ Grounding terminal

144a~144d‧‧‧第一至第四接地端子 144a~144d‧‧‧first to fourth grounding terminals

145‧‧‧電源端子 145‧‧‧Power terminal

145a~145e‧‧‧第一至第五電源端子 145a~145e‧‧‧first to fifth power terminals

16‧‧‧第二端子部 16‧‧‧Second terminal section

161‧‧‧高速差動訊號端子 161‧‧‧High speed differential signal terminal

161a~161h‧‧‧第一至第八高速差動訊號端子 161a~161h‧‧‧1st to 8th high speed differential signal terminals

162‧‧‧低速差動訊號端子 162‧‧‧Low speed differential signal terminal

162a~162d‧‧‧第一至第四低速差動訊號端子 162a~162d‧‧‧1st to 4th low speed differential signal terminals

163‧‧‧其它訊號端子 163‧‧‧Other signal terminals

163a~163d‧‧‧第一至第四其它訊號端子 163a~163d‧‧‧First to fourth other signal terminals

164‧‧‧接地端子 164‧‧‧ Grounding terminal

164a~164d‧‧‧第一至第四接地端子 164a~164d‧‧‧first to fourth grounding terminals

165‧‧‧電源端子 165‧‧‧Power terminal

165a~165d‧‧‧第一至第四電源端子 165a~165d‧‧‧first to fourth power terminals

166‧‧‧第一排訊號端子 166‧‧‧First row of signal terminals

167‧‧‧第二排訊號端子 167‧‧‧Second row of signal terminals

168‧‧‧端子導通孔 168‧‧‧Terminal vias

20‧‧‧第一連接器 20‧‧‧First connector

30‧‧‧第二連接器 30‧‧‧Second connector

40‧‧‧電子裝置 40‧‧‧Electronic devices

42‧‧‧本體 42‧‧‧Ontology

44‧‧‧主機板 44‧‧‧ motherboard

第一圖為本創作連接器組件的立體圖。 The first figure is a perspective view of the authoring connector assembly.

第二圖為本創作連接器組件的立體分解圖。 The second figure is an exploded perspective view of the authoring connector assembly.

第三圖為本創作柔性印刷電路板的立體分解圖。 The third figure is an exploded perspective view of the flexible printed circuit board.

第四圖為本創作訊號線層的高速差動訊號線、低速差動訊號線、其它訊號線、接地線及電源線的立體分解圖。 The fourth figure is an exploded view of the high-speed differential signal line, low-speed differential signal line, other signal lines, grounding lines and power lines of the creative signal line layer.

第五圖為本創作訊號線層的各訊號線及第一端子部的上視圖。 The fifth figure is a top view of each signal line and the first terminal portion of the creative signal line layer.

第六圖為本創作柔性印刷電路板的下視圖。 The sixth figure is a bottom view of the inventive flexible printed circuit board.

第七圖為本創作第一端子部的各訊號端子及傳輸訊號的示意圖。 The seventh figure is a schematic diagram of each signal terminal and transmission signal of the first terminal part of the creation.

第八圖為本創作柔性印刷電路板的上視圖。 The eighth figure is a top view of the creative flexible printed circuit board.

第九圖為本創作第二端子部的各訊號端子及傳輸訊號的示意圖。 The ninth figure is a schematic diagram of each signal terminal and transmission signal of the second terminal part of the creation.

第十圖為本創作另一種第二端子部的各訊號端子及傳輸訊號的示意圖。 The tenth figure is a schematic diagram of each signal terminal and transmission signal of another second terminal part.

第十一圖為本創作柔性印刷電路板的接地訊號迴路的示意圖。 The eleventh figure is a schematic diagram of the ground signal circuit of the flexible printed circuit board.

第十二圖為本創作柔性印刷電路板的電源訊號迴路的示意圖。 The twelfth figure is a schematic diagram of the power signal loop of the flexible printed circuit board.

第十三圖為本創作連接器組件與電子裝置電性連接的示意圖。 The thirteenth diagram is a schematic diagram of the electrical connection between the authoring connector component and the electronic device.

第十四A圖為本創作另一種柔性印刷電路板的上視圖。 Figure 14A is a top view of another flexible printed circuit board of the present invention.

第十四B圖為本創作另一種柔性印刷電路板的下視圖。 Figure 14B is a bottom view of another flexible printed circuit board of the present invention.

第十四C圖為本創作另一種柔性印刷電路板與第一連接器及第二連接器電性連接的示意圖。 FIG. 14C is a schematic view showing another flexible printed circuit board electrically connected to the first connector and the second connector.

請參閱第一圖、第二圖及第三圖,本創作連接器組件包括柔性印刷電路板10及第一連接器20,第一連接器20以貼片式(SMT)或插板式(DIP)的方式與柔性印刷電路板10形成電性連接,用以傳輸電訊號。在一實施例中,第一連接器20係USB Type-C連接器。 Referring to the first, second and third figures, the authoring connector assembly comprises a flexible printed circuit board 10 and a first connector 20, the first connector 20 being in the form of a patch (SMT) or a plug-in board (DIP) The manner is electrically connected to the flexible printed circuit board 10 for transmitting electrical signals. In an embodiment, the first connector 20 is a USB Type-C connector.

柔性印刷電路板10包含有電纜本體12、位於電纜本體12一端 的第二端子部16及位於電纜本體12另一端的第一端子部14。電纜本體12具有第一表面1201及與第一表面1201相反方向的第二表面1202,第一端子部14顯露於電纜本體12的第二表面1202,第二端子部16顯露於電纜本體12的第一表面1201。藉此,第一連接器20以貼片式(SMT)或插板式(DIP)的方式與顯露於電纜本體12的第一表面1201的第二端子部16形成電性連接,顯露於電纜本體12的第二表面1202且相對於第二端子部16而位於電纜本體12另一端的第一端子部14可進一步與電子裝置40(參閱第十三圖)形成電性連接。 The flexible printed circuit board 10 includes a cable body 12 at one end of the cable body 12 The second terminal portion 16 and the first terminal portion 14 at the other end of the cable body 12. The cable body 12 has a first surface 1201 and a second surface 1202 opposite to the first surface 1201. The first terminal portion 14 is exposed on the second surface 1202 of the cable body 12, and the second terminal portion 16 is exposed on the cable body 12. A surface 1201. Thereby, the first connector 20 is electrically connected to the second terminal portion 16 of the first surface 1201 of the cable body 12 in a patch-on-chip (SMT) or plug-in board (DIP) manner, and is exposed on the cable body 12 . The second surface 1202 and the first terminal portion 14 located at the other end of the cable body 12 with respect to the second terminal portion 16 may further be electrically connected to the electronic device 40 (see FIG. 13).

電纜本體12包含有訊號線層121、第一導電隔離層122及第二 導電隔離層123,訊號線層121介於第一導電隔離層122與第二導電隔離層123之間。換句話說,位於訊號線層121上方的第一導電隔離層122與位於訊號線層121下方的第二導電隔離層123共同包覆訊號線層121,藉此抑制堆疊層與堆疊層之間的電磁干擾。在一實施例中,第一導電隔離層122係為接地層,且第二導電隔離層123係為電源層,有助於減少訊號傳輸時的電容耦合、電感耦合等電磁干擾。訊號線層121包括有高速差動訊號線1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215,接地線1214與接地層122形成電性導通,電源線1215與電源層123形成電性導通。接地層122包括第一導通孔124及第一穿孔126,第一導通孔124的位置對應訊號線層121的接地線1214的位置(請參閱第十一圖),因為第一導通孔124沿著訊號線排列,所以接地線1214可藉由第一導通孔124與接地層122形成電性導通。電源層123包括第二導通孔125及第二穿孔127,第二導通孔125的位 置對應訊號線層121的電源線1215的位置(請參閱第十一圖),因為第二導通孔125沿著電源線1215排列,所以電源線1215可藉由第二導通孔125與電源層123形成電性導通。此外,位於接地層122的第一穿孔126沿著訊號線層121的電源線1215排列,且第一穿孔126與位於電源層123的第二導通孔125呈一對一的對應關係,使得電源線1215與電源層123藉由第二導通孔125形成電性導通的同時,電源線1215不會與接地層122形成電性導通。位於電源層123的第二穿孔127沿著訊號線層121的接地線1214排列,且第二穿孔127與位於接地層122的第一導通孔124呈一對一的對應關係,使得接地線1214與接地層122藉由第一導通孔124形成電性導通的同時,接地線1214不會與電源層123形成電性導通。再者,訊號線層121的高速差動訊號線1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215的一端與同樣位於訊號線層121的第一端子部14形成電性導通,例如但不限於高速差動訊號線1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215的一端係以連續地延伸形成第一端子部14的方式進行電性導通。 訊號線層121的高速差動訊號線1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215的另一端與位於接地層122的第二端子部16形成電性導通,例如但不限於訊號線層121的高速差動訊號線1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215的另一端係以端子導通孔168的方式與第二端子部16形成電性導通。 The cable body 12 includes a signal line layer 121, a first conductive isolation layer 122, and a second The conductive isolation layer 123 and the signal line layer 121 are interposed between the first conductive isolation layer 122 and the second conductive isolation layer 123. In other words, the first conductive isolation layer 122 located above the signal line layer 121 and the second conductive isolation layer 123 under the signal line layer 121 together wrap the signal line layer 121, thereby suppressing the between the stacked layer and the stacked layer. Electromagnetic interference. In one embodiment, the first conductive isolation layer 122 is a ground layer, and the second conductive isolation layer 123 is a power supply layer, which helps to reduce electromagnetic interference such as capacitive coupling and inductive coupling during signal transmission. The signal line layer 121 includes a high-speed differential signal line 1211, a low-speed differential signal line 1212, other signal lines 1213, a ground line 1214, and a power line 1215. The ground line 1214 is electrically connected to the ground layer 122, and the power line 1215 and the power source Layer 123 forms electrical conduction. The ground layer 122 includes a first via hole 124 and a first via hole 126. The position of the first via hole 124 corresponds to the position of the ground line 1214 of the signal line layer 121 (refer to FIG. 11) because the first via hole 124 is along The signal lines are arranged, so the ground line 1214 can be electrically connected to the ground layer 122 through the first via holes 124. The power supply layer 123 includes a second via hole 125 and a second via hole 127, and the bit of the second via hole 125 The position of the power line 1215 corresponding to the signal line layer 121 (refer to FIG. 11), because the second via hole 125 is arranged along the power line 1215, the power line 1215 can pass through the second via hole 125 and the power layer 123. Electrical conduction is formed. In addition, the first through holes 126 of the grounding layer 122 are arranged along the power line 1215 of the signal line layer 121, and the first through holes 126 are in a one-to-one correspondence with the second conductive holes 125 of the power supply layer 123, so that the power lines When the power supply layer 123 is electrically connected to the power supply layer 123 through the second via hole 125, the power supply line 1215 does not electrically conduct with the ground layer 122. The second through holes 127 are disposed along the ground line 1214 of the signal line layer 121, and the second through holes 127 are in a one-to-one correspondence with the first via holes 124 of the ground layer 122, so that the ground lines 1214 and The ground layer 122 is electrically conductive by the first via hole 124, and the ground line 1214 is not electrically connected to the power source layer 123. Furthermore, one end of the high-speed differential signal line 1211, the low-speed differential signal line 1212, the other signal line 1213, the ground line 1214, and the power line 1215 of the signal line layer 121 is formed with the first terminal portion 14 also located in the signal line layer 121. Electrical conduction, such as but not limited to, a high speed differential signal line 1211, a low speed differential signal line 1212, other signal lines 1213, a ground line 1214, and one end of the power line 1215 are continuously extended to form the first terminal portion 14. Electrically conductive. The other ends of the high-speed differential signal line 1211, the low-speed differential signal line 1212, the other signal line 1213, the ground line 1214, and the power line 1215 of the signal line layer 121 are electrically connected to the second terminal portion 16 of the ground layer 122. For example, but not limited to, the high-speed differential signal line 1211, the low-speed differential signal line 1212, the other signal line 1213, the ground line 1214, and the other end of the power line 1215 of the signal line layer 121 are in the manner of the terminal via 168 and the second terminal. The portion 16 is electrically conductive.

在一實施例中,電纜本體12中的訊號線層121、接地層122 及電源層123彼此之間的堆疊順序及堆疊數目可作適當地變化,例如但不限於由下而上依序堆疊接地層122、訊號線層121及電源層123;或者是由下而 上依序堆疊電源層123、接地層122、訊號線層121及接地層122;或者是由下而上依序堆疊電源層123、訊號線層121、電源層123及接地層122。亦即,容許在訊號線層121、接地層122及電源層123的疊與疊之間增加訊號線層121、接地層122或電源層123其中之一或多種組合,而實質上仍為本創作的概念所涵蓋。此外,亦容許將訊號線層121、接地層122及電源層123其中之一或多個以一分為二的方式延生新的堆疊層,而實質上仍為本創作的概念所涵蓋,例如但不限於由下而上依序堆疊電源層123、訊號線層121、訊號線層121及接地層122。 In an embodiment, the signal line layer 121 and the ground layer 122 in the cable body 12 And the stacking order and the number of stacks of the power layer 123 may be appropriately changed, for example, but not limited to, sequentially stacking the ground layer 122, the signal line layer 121, and the power layer 123 from bottom to top; or The power layer 123, the ground layer 122, the signal line layer 121, and the ground layer 122 are stacked in sequence; or the power layer 123, the signal line layer 121, the power layer 123, and the ground layer 122 are sequentially stacked from bottom to top. That is, one or more combinations of the signal line layer 121, the ground layer 122, or the power layer 123 are allowed to be added between the stack of the signal line layer 121, the ground layer 122, and the power layer 123, and substantially remain the same. Covered by the concept. In addition, one or more of the signal line layer 121, the ground layer 122, and the power layer 123 are allowed to be extended into a new stacked layer, which is substantially covered by the concept of the creation, for example, The power layer 123, the signal line layer 121, the signal line layer 121, and the ground layer 122 are not limited to being stacked from bottom to top.

在一實施例中,訊號線層121、第一導電隔離層122及第二導 電隔離層123亦可通稱為膜層。其中訊號線層121係用以傳送柔性印刷電路板10的訊號的導電層,訊號線層121中的各訊號線可以傳輸相同或不相同的訊號,訊號線層121亦可稱為線路層,而各訊號線亦可稱為線路。本創作所屬領域具有通常知識者可知,膜層亦可包括絕緣層,絕緣層可夾於膜層與膜層之間以作為絕緣之用途,亦可覆蓋於最外層的膜層以作為保護之用途。因此,電纜本體12至少包括訊號線層121、第一導電隔離層122及第二導電隔離層123,且可適當地增加不同用途的絕緣層以形成具有較多膜層的電纜本體12。 In an embodiment, the signal line layer 121, the first conductive isolation layer 122, and the second guide Electrical isolation layer 123 may also be referred to as a film layer. The signal line layer 121 is used to transmit the conductive layer of the signal of the flexible printed circuit board 10. The signal lines in the signal line layer 121 can transmit the same or different signals. The signal line layer 121 can also be referred to as a circuit layer. Each signal line can also be called a line. It is known to those skilled in the art that the film layer may also include an insulating layer which may be sandwiched between the film layer and the film layer for insulation purposes or may be applied to the outermost film layer for protection purposes. . Therefore, the cable body 12 includes at least the signal line layer 121, the first conductive isolation layer 122, and the second conductive isolation layer 123, and the insulating layer for different purposes can be appropriately added to form the cable body 12 having more film layers.

請參閱第四圖及第五圖,在一實施例中,訊號線層121包含 四對高速差動訊號線1211、一對低速差動訊號線1212、四個其它訊號線1213、二個接地線1214及二個電源線1215。四對高速差動訊號線1211係由第一高速差動訊號線1211a、第二高速差動訊號線1211b、第三高速差動訊號線1211c、第四高速差動訊號線1211d、第五高速差動訊號線1211e、第六高 速差動訊號線1211f、第七高速差動訊號線1211g及第八高速差動訊號線1211h所構成。一對低速差動訊號線1212係由第一低速差動訊號線1212a及第二低速差動訊號線1212b所構成。四個其它訊號線1213係由第一其它訊號線1213a、第二其它訊號線1213b、第三其它訊號線1213c及第四其它訊號線1213d所構成。二個接地線1214係由第一接地線1214a及第二接地線1214b所構成。二個電源線1215係由第一電源線1215a及第二電源線1215b所構成。 因此,訊號線層121沿寬度方向依序排列有第一其它訊號線1213a、第一高速差動訊號線1211a、第二高速差動訊號線1211b、第一接地線1214a、第三高速差動訊號線1211c、第四高速差動訊號線1211d、第一電源線1215a、第二其它訊號線1213b、第一低速差動訊號線1212a、第二低速差動訊號線1212b、第三其它訊號線1213c、第二電源線1215b、第五高速差動訊號線1211e、第六高速差動訊號線1211f、第二接地線1214b、第七高速差動訊號線1211g、第八高速差動訊號線1211h及第四它他訊號線1213d。因此,訊號層的各訊號線之間的排列關係得以抑制電磁干擾(EMI)。藉由訊號線層121中相鄰的二對高速差動訊號線1211之間以接地線1214隔開,且在與接地線1214相反的一側設有電源線1215或至少一個其它訊號線1213,以減少相鄰的二對高速差動訊號線1211之間彼此互相干擾。再者,訊號線層121的每對高速差動訊號線1211或每對低速差動訊號線1212均介於電源線1215、接地線1214、其它訊號線1213或其組合之間,亦可抑制高速差動訊號或低速差動訊號傳輸時的電磁干擾。 Referring to the fourth and fifth figures, in an embodiment, the signal line layer 121 includes Four pairs of high speed differential signal lines 1211, a pair of low speed differential signal lines 1212, four other signal lines 1213, two ground lines 1214 and two power lines 1215. The four pairs of high speed differential signal lines 1211 are composed of a first high speed differential signal line 1211a, a second high speed differential signal line 1211b, a third high speed differential signal line 1211c, a fourth high speed differential signal line 1211d, and a fifth high speed difference. Motion signal line 1211e, sixth high The speed difference signal line 1211f, the seventh high speed differential signal line 1211g and the eighth high speed differential signal line 1211h are formed. A pair of low speed differential signal lines 1212 are formed by a first low speed differential signal line 1212a and a second low speed differential signal line 1212b. The four other signal lines 1213 are composed of a first other signal line 1213a, a second other signal line 1213b, a third other signal line 1213c, and a fourth other signal line 1213d. The two ground lines 1214 are composed of a first ground line 1214a and a second ground line 1214b. The two power lines 1215 are composed of a first power line 1215a and a second power line 1215b. Therefore, the signal line layer 121 sequentially arranges the first other signal line 1213a, the first high-speed differential signal line 1211a, the second high-speed differential signal line 1211b, the first ground line 1214a, and the third high-speed differential signal in the width direction. Line 1211c, fourth high speed differential signal line 1211d, first power line 1215a, second other signal line 1213b, first low speed differential signal line 1212a, second low speed differential signal line 1212b, third other signal line 1213c, The second power line 1215b, the fifth high speed differential signal line 1211e, the sixth high speed differential signal line 1211f, the second ground line 1214b, the seventh high speed differential signal line 1211g, the eighth high speed differential signal line 1211h, and the fourth It has a signal line 1213d. Therefore, the arrangement relationship between the signal lines of the signal layer suppresses electromagnetic interference (EMI). The two adjacent pairs of high-speed differential signal lines 1211 in the signal line layer 121 are separated by a ground line 1214, and a power line 1215 or at least one other signal line 1213 is disposed on a side opposite to the ground line 1214. To reduce the mutual interference between the adjacent two pairs of high-speed differential signal lines 1211. Furthermore, each pair of high-speed differential signal lines 1211 or each pair of low-speed differential signal lines 1212 of the signal line layer 121 are interposed between the power line 1215, the ground line 1214, the other signal lines 1213, or a combination thereof, and can also suppress high speed. Electromagnetic interference when differential signals or low-speed differential signals are transmitted.

請參閱第五圖、第六圖及第七圖,在一實施例中,顯露於電 纜本體12的第二表面1202的第一端子部14包括八個高速差動訊號端子 141、二個低速差動訊號端子142、四個其它訊號端子143、四個接地端子144及五個電源端子145。八個高速差動訊號端子141係由第一高速差動訊號端子141a、第二高速差動訊號端子141b、第三高速差動訊號端子141c、第四高速差動訊號端子141d、第五高速差動訊號端子141e、第六高速差動訊號端子141f、第七高速差動訊號端子141g及第八高速差動訊號端子141h構成。二個低速差動訊號端子142係由第一低速差動訊號端子142a及第二低速差動訊號端子142b構成。四個其它訊號端子143係由第一其它訊號端子143a、第二其它訊號端子143b、第三其它訊號端子143c及第四其它訊號端子143d構成。四個接地端子144係由第一接地端子144a、第二接地端子144b、第三接地端子144c及第四接地端子144d構成。五個電源端子145係由第一電源端子145a、第二電源端子145b、第三電源端子145c、第四電源端子145d及第五電源端子145e構成。因此,如第七圖所示,當電纜本體12位於圖中第一端子部14下方時,第一端子部14沿寬度方向、由右至左依序排列有二十三根端子,二十三根端子依序分別為第一其它訊號端子143a、第一高速差動訊號端子141a、第一接地端子144a、第二高速差動訊號端子141b、第二接地端子144b、第三高速差動訊號端子141c、第一電源端子145a、第四高速差動訊號端子141d、第二電源端子145b、第二其它訊號端子143b、第一低速差動訊號端子142a、第三電源端子145c、第二低速差動訊號端子142b、第三其它訊號端子143c、第四電源端子145d、第五高速差動訊號端子141e、第五電源端子145e、第六高速差動訊號端子141f、第三接地端子144c、第七高速差動訊號端子141g、第四接地端子144d、第八高速差動訊號端子141h及第四其它訊號端子143d。再者,設有第一端子部14的柔性印刷電路板10的一端可插 接至第二連接器30(請參閱第十三圖)以形成電性連接,使第一端子部14的二十三根端子依序傳輸(請參閱第七圖)SBU2、RX1+、GND、RX1-、GND、TX1+、VBUS、TX1-、VBS、VBS、CC1、D1+、VBUS、D1-、SBU1、VBUS、VBUS、RX2-、VBUS、RX2+、GND、TX2-、GND、TX2+及VCONN訊號(前述各訊號種類的定義請參閱協會規範書「Universal Serial Bus Type-C Cable and Connector Specification Release 1.1」)。在一實施例中,第二連接器30係FPC連接器。 Please refer to the fifth, sixth and seventh figures. In an embodiment, it is exposed to electricity. The first terminal portion 14 of the second surface 1202 of the cable body 12 includes eight high speed differential signal terminals 141. Two low-speed differential signal terminals 142, four other signal terminals 143, four ground terminals 144, and five power terminals 145. The eight high-speed differential signal terminals 141 are composed of a first high-speed differential signal terminal 141a, a second high-speed differential signal terminal 141b, a third high-speed differential signal terminal 141c, a fourth high-speed differential signal terminal 141d, and a fifth high-speed difference. The signal terminal 141e, the sixth high-speed differential signal terminal 141f, the seventh high-speed differential signal terminal 141g, and the eighth high-speed differential signal terminal 141h are formed. The two low speed differential signal terminals 142 are composed of a first low speed differential signal terminal 142a and a second low speed differential signal terminal 142b. The four other signal terminals 143 are composed of a first other signal terminal 143a, a second other signal terminal 143b, a third other signal terminal 143c, and a fourth other signal terminal 143d. The four ground terminals 144 are composed of a first ground terminal 144a, a second ground terminal 144b, a third ground terminal 144c, and a fourth ground terminal 144d. The five power supply terminals 145 are composed of a first power supply terminal 145a, a second power supply terminal 145b, a third power supply terminal 145c, a fourth power supply terminal 145d, and a fifth power supply terminal 145e. Therefore, as shown in the seventh figure, when the cable body 12 is located below the first terminal portion 14 in the drawing, the first terminal portion 14 has twenty-three terminals arranged in the width direction from right to left, twenty-three. The root terminal is respectively the first other signal terminal 143a, the first high speed differential signal terminal 141a, the first ground terminal 144a, the second high speed differential signal terminal 141b, the second ground terminal 144b, and the third high speed differential signal terminal. 141c, first power terminal 145a, fourth high speed differential signal terminal 141d, second power terminal 145b, second other signal terminal 143b, first low speed differential signal terminal 142a, third power terminal 145c, second low speed differential The signal terminal 142b, the third other signal terminal 143c, the fourth power terminal 145d, the fifth high speed differential signal terminal 141e, the fifth power terminal 145e, the sixth high speed differential signal terminal 141f, the third ground terminal 144c, and the seventh high speed The differential signal terminal 141g, the fourth ground terminal 144d, the eighth high speed differential signal terminal 141h, and the fourth other signal terminal 143d. Furthermore, one end of the flexible printed circuit board 10 provided with the first terminal portion 14 can be inserted. Connected to the second connector 30 (refer to the thirteenth figure) to form an electrical connection, the twenty-three terminals of the first terminal portion 14 are sequentially transmitted (refer to the seventh figure) SBU2, RX1+, GND, RX1 -, GND, TX1+, VBUS, TX1-, VBS, VBS, CC1, D1+, VBUS, D1-, SBU1, VBUS, VBUS, RX2-, VBUS, RX2+, GND, TX2-, GND, TX2+, and VCONN signals (previously For the definition of each signal type, please refer to the association specification "Universal Serial Bus Type-C Cable and Connector Specification Release 1.1". In an embodiment, the second connector 30 is an FPC connector.

此外,第一端子部14與訊號線層121的高速差動訊號線 1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215形成電性導通,請參閱第五圖,第一其它訊號線1213a一端電連接第一端子部14的第一其它訊號端子143a,第一高速差動訊號線1211a一端電連接第一端子部14的第一高速差動訊號端子141a,第二高速差動訊號線1211b一端電連接第一端子部14的第二高速差動訊號端子141b,第一接地線1214a一端電連接第一端子部14的第二接地端子144b,第三高速差動訊號線1211c一端電連接第一端子部14的第三高速差動訊號端子141c,第四高速差動訊號線1211d一端電連接第一端子部14的第四高速差動訊號端子141d,第一電源線1215a一端電連接第一端子部14的第二電源端子145b,第二其它訊號線1213b一端電連接第一端子部14的第二其它訊號端子143b,第一低速差動訊號線1212a一端電連接第一端子部14的第一低速差動訊號端子142a,第二低速差動訊號線1212b一端電連接第一端子部14的第二低速差動訊號端子142b,第三其它訊號線1213c一端電連接第一端子部14的第三其它訊號端子143c,第二電源線1215b一端電連接第一端子部14的第四電源端子145d,第 五高速差動訊號線1211e一端電連接第一端子部14的第五高速差動訊號端子141e,第六高速差動訊號線1211f一端電連接第一端子部14的第六高速差動訊號端子141f,第二接地線1214b一端電連接第一端子部14的第三接地端子144c,第七高速差動訊號線1211g一端電連接第一端子部14的第七高速差動訊號端子141g,第八高速差動訊號線1211h一端電連接第一端子部14的第八高速差動訊號端子141h,第四其它訊號線1213d一端電連接第一端子部14的第四其它訊號端子143d。 In addition, the high-speed differential signal line of the first terminal portion 14 and the signal line layer 121 1211. The low-speed differential signal line 1212, the other signal line 1213, the ground line 1214, and the power line 1215 are electrically connected. Referring to FIG. 5, the first other signal line 1213a is electrically connected to the first terminal portion 14 at one end. The signal terminal 143a has one end of the first high-speed differential signal line 1211a electrically connected to the first high-speed differential signal terminal 141a of the first terminal portion 14, and one end of the second high-speed differential signal line 1211b is electrically connected to the second high-speed of the first terminal portion 14. The differential signal terminal 141b has one end of the first grounding wire 1214a electrically connected to the second grounding terminal 144b of the first terminal portion 14, and one end of the third high-speed differential signal wire 1211c is electrically connected to the third high-speed differential signal terminal of the first terminal portion 14. 141c, a fourth high-speed differential signal line 1211d is electrically connected to a fourth high-speed differential signal terminal 141d of the first terminal portion 14, and one end of the first power supply line 1215a is electrically connected to the second power terminal 145b of the first terminal portion 14, and the second The other signal line 1213b is electrically connected to the second other signal terminal 143b of the first terminal portion 14. The first low speed differential signal line 1212a is electrically connected to the first low speed differential signal terminal 142a of the first terminal portion 14, and the second One end of the differential signal line 1212b is electrically connected to the second low-speed differential signal terminal 142b of the first terminal portion 14, and one end of the third other signal line 1213c is electrically connected to the third other signal terminal 143c of the first terminal portion 14, and the second power line One end of 1215b is electrically connected to the fourth power terminal 145d of the first terminal portion 14, The fifth high-speed differential signal line 1211e is electrically connected to the fifth high-speed differential signal terminal 141e of the first terminal portion 14, and the sixth high-speed differential signal line 1211f is electrically connected to the sixth high-speed differential signal terminal 141f of the first terminal portion 14. The first grounding wire 1214b is electrically connected to the third grounding terminal 144c of the first terminal portion 14, and the seventh high-speed differential signal wire 1211g is electrically connected to the seventh high-speed differential signal terminal 141g of the first terminal portion 14. One end of the differential signal line 1211h is electrically connected to the eighth high-speed differential signal terminal 141h of the first terminal portion 14, and one end of the fourth other signal line 1213d is electrically connected to the fourth other signal terminal 143d of the first terminal portion 14.

參閱第五圖、第八圖及第九圖,在一實施例中,顯露於電纜 本體12的第一表面1201的第二端子部16包括八個高速差動訊號端子161、四個低速差動訊號端子162、四個其它訊號端子163、四個接地端子164及四個電源端子165。八個高速差動訊號端子161係由第一高速差動訊號端子161a、第二高速差動訊號端子161b、第三高速差動訊號端子161c、第四高速差動訊號端子161d、第五高速差動訊號端子161e、第六高速差動訊號端子161f、第七高速差動訊號端子161g及第八高速差動訊號端子161h構成。四個低速差動訊號端子162係由第一低速差動訊號端子162a、第二低速差動訊號端子162b、第三低速差動訊號端子162c及第四低速差動訊號端子162d構成。四個其它訊號端子163係由第一其它訊號端子163a、第二其它訊號端子163b、第三其它訊號端子163c及第四其它訊號端子163d構成。四個接地端子164係由第一接地端子164a、第二接地端子164b、第三接地端子164c及第四接地端子164d構成。四個電源端子165係由第一電源端子165a、第二電源端子165b、第三電源端子165c及第四電源端子165d構成。因此,如第九圖所示,當電纜本體12位於圖中第二端子部16上方時,第二端子部16包括第 一排訊號端子166及第二排訊號端子167,第一排訊號端子166沿寬度方向、由左至右依序排列有十二根端子,第一排訊號端子166的十二根端子依序分別為第一接地端子164a、第一高速差動訊號端子161a、第二高速差動訊號端子161b、第一電源端子165a、第一其它訊號端子163a、第一低速差動訊號端子162a、第二低速差動訊號端子162b、第二其它訊號端子163b、第二電源端子165b、第三高速差動訊號端子161c、第四高速差動訊號端子161d及第二接地端子164b。第二排訊號端子167沿寬度方向、由右至左依序排列有十二根端子,第二排訊號端子167的十二根端子依序分別為第三接地端子164c、第五高速差動訊號端子161e、第六高速差動訊號端子161f、第三電源端子165c、第三其它訊號端子163c、第三低速差動訊號端子162c、第四低速差動訊號端子162d、第四其它訊號端子163d、第四電源端子165d、第七高速差動訊號端子161g、第八高速差動訊號端子161h及第四接地端子164d。 再者,當第二端子部16可與第一連接器20形成電性連接,例如但不限於第一排訊號端子166及第二排訊號端子167均以貼片式(SMT)與第二連接器30電性連接(請參閱第九圖),或者第一排訊號端子166以貼片式(SMT)而第二排訊號端子167以插板式(DIP)與第二連接器30電性連接(請參閱第十圖)。第一排訊號端子166的十二根端子沿寬度方向、由左至右依序傳輸GND、TX1+、TX1-、VBUS、CC1、D1+、D1-、SBU1、VBUS、RX2-、RX2+及GND訊號,且第二排訊號端子167的十二根端子沿寬度方向、由右至左依序傳輸GND、TX2+、TX2-、VBUS、VCONN、D2+、D2-、SBU2、VBUS、RX1-、RX1+及GND訊號。 Referring to the fifth, eighth and ninth figures, in one embodiment, exposed to the cable The second terminal portion 16 of the first surface 1201 of the body 12 includes eight high-speed differential signal terminals 161, four low-speed differential signal terminals 162, four other signal terminals 163, four ground terminals 164, and four power terminals 165. . The eight high-speed differential signal terminals 161 are composed of a first high-speed differential signal terminal 161a, a second high-speed differential signal terminal 161b, a third high-speed differential signal terminal 161c, a fourth high-speed differential signal terminal 161d, and a fifth high-speed difference. The signal terminal 161e, the sixth high-speed differential signal terminal 161f, the seventh high-speed differential signal terminal 161g, and the eighth high-speed differential signal terminal 161h are configured. The four low-speed differential signal terminals 162 are composed of a first low-speed differential signal terminal 162a, a second low-speed differential signal terminal 162b, a third low-speed differential signal terminal 162c, and a fourth low-speed differential signal terminal 162d. The four other signal terminals 163 are composed of a first other signal terminal 163a, a second other signal terminal 163b, a third other signal terminal 163c, and a fourth other signal terminal 163d. The four ground terminals 164 are composed of a first ground terminal 164a, a second ground terminal 164b, a third ground terminal 164c, and a fourth ground terminal 164d. The four power supply terminals 165 are composed of a first power supply terminal 165a, a second power supply terminal 165b, a third power supply terminal 165c, and a fourth power supply terminal 165d. Therefore, as shown in the ninth figure, when the cable body 12 is located above the second terminal portion 16 in the drawing, the second terminal portion 16 includes the A row of signal terminals 166 and a second row of signal terminals 167, the first row of signal terminals 166 are arranged in the width direction, from left to right, twelve terminals are arranged in order, and the twelve terminals of the first row of signal terminals 166 are sequentially The first ground terminal 164a, the first high speed differential signal terminal 161a, the second high speed differential signal terminal 161b, the first power terminal 165a, the first other signal terminal 163a, the first low speed differential signal terminal 162a, and the second low speed The differential signal terminal 162b, the second other signal terminal 163b, the second power terminal 165b, the third high speed differential signal terminal 161c, the fourth high speed differential signal terminal 161d, and the second ground terminal 164b. The second row of signal terminals 167 are arranged in the width direction, and there are twelve terminals arranged in order from right to left. The twelve terminals of the second row of signal terminals 167 are respectively the third ground terminal 164c and the fifth high speed differential signal. The terminal 161e, the sixth high-speed differential signal terminal 161f, the third power supply terminal 165c, the third other signal terminal 163c, the third low-speed differential signal terminal 162c, the fourth low-speed differential signal terminal 162d, and the fourth other signal terminal 163d, The fourth power supply terminal 165d, the seventh high speed differential signal terminal 161g, the eighth high speed differential signal terminal 161h, and the fourth ground terminal 164d. Furthermore, when the second terminal portion 16 can be electrically connected to the first connector 20, for example, but not limited to, the first row of signal terminals 166 and the second row of signal terminals 167 are both in a patch (SMT) and a second connection. The device 30 is electrically connected (refer to FIG. 9), or the first row of signal terminals 166 is in a chip type (SMT) and the second row of signal terminals 167 is electrically connected to the second connector 30 in a plug-in type (DIP) ( Please refer to the tenth figure). The twelve terminals of the first row of signal terminals 166 sequentially transmit GND, TX1+, TX1-, VBUS, CC1, D1+, D1-, SBU1, VBUS, RX2-, RX2+, and GND signals in the width direction from left to right. And the twelve terminals of the second row of signal terminals 167 sequentially transmit GND, TX2+, TX2-, VBUS, VCONN, D2+, D2-, SBU2, VBUS, RX1-, RX1+, and GND signals in the width direction from right to left. .

此外,第二端子部16與訊號線層121的高速差動訊號線 1211、低速差動訊號線1212、其它訊號線1213、接地線1214及電源線1215形成電性導通,請參閱第五圖及第八圖,第一其它訊號線1213a電連接第二端子部16的第三其它訊號端子163c,第一高速差動訊號線1211a電連接第二端子部16的第五高速差動訊號端子161e,第二高速差動訊號線1211b電連接第二端子部16的第六高速差動訊號端子161f,第一接地線1214a同時電連接第二端子部16的第一接地端子164a、第二接地端子164b、第三接地端子164c及第四接地端子164d,第三高速差動訊號線1211c電連接第二端子部16的第四高速差動訊號端子161d,第四高速差動訊號線1211d電連接第二端子部16的第三高速差動訊號端子161c,第一電源線1215a電連接第二端子部16的第二電源端子165b,第二其它訊號線1213b電連接第二端子部16的第二其它訊號端子163b,第一低速差動訊號線1212a同時電連接第二端子部16的第二低速差動訊號端子162b及第四低速差動訊號端子162d,第二低速差動訊號線1212b同時電連接第二端子部16的第一低速差動訊號端子162a及第三低速差動訊號端子162c,第三其它訊號線1213c電連接第二端子部16的第一其它訊號端子163a,第二電源線1215b電連接第二端子部16的第一電源端子165a,第五高速差動訊號線1211e電連接第二端子部16的第二高速差動訊號端子161b,第六高速差動訊號線1211f電連接第二端子部16的第一高速差動訊號端子161a,第二接地線1214b同時電連接第二端子部16的第一接地端子164a、第二接地端子164b、第三接地端子164c及第四接地端子164d,第七高速差動訊號線1211g電連接第二端子部16的第七高速差動訊號端子161g,第八高速差動訊號線1211h電連接第二端子部16的第八高速差動訊號端子161h,第四其它訊號線1213d電連接第二端子部16的第四其它訊號端子 163d。藉此,第二端子部16的第一低速差動訊號端子162a與第三低速差動訊號端子162c以串聯方式電性連接,第二端子部16的第二低速差動訊號端子162b與第四低速差動訊號端子162d亦以串聯方式電性連接,進而使第二端子部16的第一至第四低速差動訊號端子162a~162d(亦即二對低速差動訊號端子)再與訊號線層121的第一低速差動訊號線1212a及第二低速差動訊號線1212b(亦即一對低速差動訊號線)以並聯方式電性連接,用以降低訊號線數量。 In addition, the high-speed differential signal line of the second terminal portion 16 and the signal line layer 121 1211. The low-speed differential signal line 1212, the other signal line 1213, the ground line 1214, and the power line 1215 are electrically connected. Referring to the fifth and eighth figures, the first other signal line 1213a is electrically connected to the second terminal portion 16. The third high-speed differential signal line 171c, the first high-speed differential signal line 1211a is electrically connected to the fifth high-speed differential signal terminal 161e of the second terminal portion 16, and the second high-speed differential signal line 1211b is electrically connected to the sixth of the second terminal portion 16. The high-speed differential signal terminal 161f, the first grounding wire 1214a is electrically connected to the first grounding terminal 164a, the second grounding terminal 164b, the third grounding terminal 164c, and the fourth grounding terminal 164d of the second terminal portion 16, and the third high-speed differential The signal line 1211c is electrically connected to the fourth high-speed differential signal terminal 161d of the second terminal portion 16, and the fourth high-speed differential signal line 1211d is electrically connected to the third high-speed differential signal terminal 161c of the second terminal portion 16, the first power line 1215a. The second power supply terminal 165b of the second terminal portion 16 is electrically connected, and the second other signal line 1213b is electrically connected to the second other signal terminal 163b of the second terminal portion 16. The first low-speed differential signal line 1212a is electrically connected to the second terminal portion. 16 The second low-speed differential signal terminal 162b and the fourth low-speed differential signal terminal 162d, and the second low-speed differential signal line 1212b are electrically connected to the first low-speed differential signal terminal 162a and the third low-speed differential signal of the second terminal portion 16 at the same time. The terminal 162c, the third other signal line 1213c is electrically connected to the first other signal terminal 163a of the second terminal portion 16, and the second power line 1215b is electrically connected to the first power terminal 165a of the second terminal portion 16, and the fifth high-speed differential signal line. 1211e is electrically connected to the second high-speed differential signal terminal 161b of the second terminal portion 16, and the sixth high-speed differential signal line 1211f is electrically connected to the first high-speed differential signal terminal 161a of the second terminal portion 16, and the second grounding wire 1214b is simultaneously charged. The first ground terminal 164a, the second ground terminal 164b, the third ground terminal 164c, and the fourth ground terminal 164d of the second terminal portion 16 are connected, and the seventh high-speed differential signal line 1211g is electrically connected to the seventh high speed of the second terminal portion 16. The differential signal terminal 161g, the eighth high-speed differential signal line 1211h is electrically connected to the eighth high-speed differential signal terminal 161h of the second terminal portion 16, and the fourth other signal line 1213d is electrically connected to the fourth other signal terminal of the second terminal portion 16. 163d. Thereby, the first low-speed differential signal terminal 162a of the second terminal portion 16 and the third low-speed differential signal terminal 162c are electrically connected in series, and the second low-speed differential signal terminal 162b and the fourth terminal portion 16 are connected to the fourth low-speed differential signal terminal 162b. The low-speed differential signal terminals 162d are also electrically connected in series, so that the first to fourth low-speed differential signal terminals 162a-162d of the second terminal portion 16 (that is, two pairs of low-speed differential signal terminals) are further connected to the signal line. The first low-speed differential signal line 1212a and the second low-speed differential signal line 1212b (ie, a pair of low-speed differential signal lines) of the layer 121 are electrically connected in parallel to reduce the number of signal lines.

請參閱第十一圖,用以說明本創作柔性印刷電路板10的接地 訊號迴路。位於訊號線層121的接地線1214一端電性連接第一端子部14的接地端子144,另一端電性連接第二端子部16的接地端子164,訊號線層121的接地線1214藉由接地層122(或稱第一導電隔離層)的第一導通孔124而同時與接地層122電性連接。藉此,電磁干擾(EMI)的抑制得以同時藉由訊號層的接地線1214及接地層122來解決,提高訊號傳輸的品質。在一實施例中,訊號線層121的接地線1214係由第一接地線1214a及第二接地線1214b構成,第一接地線1214a及第二接地線1214b同時電性連接接地層122、第一端子部14的第一至第四接地端子144a~144d及第二端子部16的第一至第四接地端子164a~164d。因此,第二端子部16的第一至第四接地端子164a~164d以並聯的方式與訊號線層121的第一接地線1214a及第二接地線1214b電性連接,同時第二端子部16的第一至第四接地端子164a~164d亦以並聯的方式與接地層122電性連接。同理,第一端子部14的第一至第四接地端子144a~144d與訊號線層121的第一接地線1214a及第二接地線1214b並聯,亦與接地層122並聯。 Please refer to the eleventh figure for explaining the grounding of the flexible printed circuit board 10 of the present invention. Signal loop. One end of the grounding wire 1214 of the signal line layer 121 is electrically connected to the grounding terminal 144 of the first terminal portion 14, and the other end is electrically connected to the grounding terminal 164 of the second terminal portion 16, and the grounding wire 1214 of the signal line layer 121 is grounded. The first via 124 of the 122 (or the first conductive isolation layer) is electrically connected to the ground layer 122 at the same time. Thereby, the electromagnetic interference (EMI) suppression can be simultaneously solved by the ground layer 1214 of the signal layer and the ground layer 122, thereby improving the quality of the signal transmission. In one embodiment, the grounding wire 1214 of the signal line layer 121 is composed of a first grounding wire 1214a and a second grounding wire 1214b. The first grounding wire 1214a and the second grounding wire 1214b are electrically connected to the grounding layer 122 at the same time. The first to fourth ground terminals 144a to 144d of the terminal portion 14 and the first to fourth ground terminals 164a to 164d of the second terminal portion 16. Therefore, the first to fourth ground terminals 164a-164d of the second terminal portion 16 are electrically connected in parallel to the first ground line 1214a and the second ground line 1214b of the signal line layer 121, while the second terminal portion 16 is The first to fourth ground terminals 164a-164d are also electrically connected to the ground layer 122 in parallel. Similarly, the first to fourth ground terminals 144a to 144d of the first terminal portion 14 are connected in parallel with the first ground line 1214a and the second ground line 1214b of the signal line layer 121, and are also connected in parallel with the ground layer 122.

請參閱第十一圖及第十二圖,用以說明本創作柔性印刷電路 板10的電源訊號迴路。位於訊號線層121的電源線1215一端電性連接第一端子部14的電源端子145,另一端電性連接第二端子部16的電源端子165,訊號線層121的電源線1215藉由電源層123(或稱第二導電隔離層)的第二導通孔125而同時與電源層123電性連接。藉此,電磁干擾(EMI)的抑制得以同時藉由訊號層的電源線1215及電源層123來解決,提高訊號傳輸的品質。 此外,具有較大傳輸面積的電源層123亦可承載較大的電源。在一實施例中,訊號線層121的電源線1215係由第一電源線1215a及第二電源線1215b構成,第一電源線1215a及第二電源線1215b同時電性連接電源層123、第一端子部14的第一至第五電源端子145a~145e及第二端子部16的第一至第四電源端子165a~165d。因此,第二端子部16的第一至第四電源端子165a~165d以並聯的方式與訊號線層121的第一電源線1215a及第二電源線1215b電性連接,同時第二端子部16的第一至第四電源端子165a~165d亦以並聯的方式與電源層123電性連接,以分流的原理來傳輸電源。同理,第一端子部14的第一至第五電源端子145a~145e與訊號線層121的第一電源線1215a及第二電源線1215b並聯,亦與電源層123並聯,以分流的原理來傳輸電源。 Please refer to the eleventh and twelfth drawings for explaining the flexible printed circuit of the present invention. The power signal loop of board 10. One end of the power line 1215 of the signal line layer 121 is electrically connected to the power terminal 145 of the first terminal portion 14, the other end is electrically connected to the power terminal 165 of the second terminal portion 16, and the power line 1215 of the signal line layer 121 is provided by the power layer. The second via 125 of the 123 (or the second conductive isolation layer) is electrically connected to the power layer 123 at the same time. Thereby, the suppression of electromagnetic interference (EMI) can be simultaneously solved by the power line 1215 of the signal layer and the power layer 123, thereby improving the quality of the signal transmission. In addition, the power layer 123 having a large transmission area can also carry a large power source. In one embodiment, the power line 1215 of the signal line layer 121 is composed of a first power line 1215a and a second power line 1215b. The first power line 1215a and the second power line 1215b are electrically connected to the power layer 123 at the same time. The first to fifth power supply terminals 145a to 145e of the terminal portion 14 and the first to fourth power supply terminals 165a to 165d of the second terminal portion 16. Therefore, the first to fourth power terminals 165a to 165d of the second terminal portion 16 are electrically connected in parallel to the first power line 1215a and the second power line 1215b of the signal line layer 121 while the second terminal portion 16 is The first to fourth power supply terminals 165a to 165d are also electrically connected to the power supply layer 123 in parallel, and the power is transmitted by the principle of shunting. Similarly, the first to fifth power supply terminals 145a-145e of the first terminal portion 14 are connected in parallel with the first power supply line 1215a and the second power supply line 1215b of the signal line layer 121, and are also connected in parallel with the power supply layer 123, according to the principle of shunting. Transmission power.

請參閱第十三圖,本創作連接器組件可與電子裝置40形成電 性連接,電子裝置40包括具有主機板44的本體42,主機板44設有第二連接器30,將連接器組件裝設於本體42內,使柔性印刷電路板10的第一端子部14插接於第二連接器30,以形成電性連接。 Referring to the thirteenth figure, the authoring connector assembly can be electrically connected to the electronic device 40. The electronic device 40 includes a body 42 having a motherboard 44. The motherboard 44 is provided with a second connector 30. The connector assembly is mounted in the body 42 to insert the first terminal portion 14 of the flexible printed circuit board 10. Connected to the second connector 30 to form an electrical connection.

請參閱第十四A圖、第十四B圖及第十四C圖,本創作電纜 本體12的構形可作不同的變化設計,其差異在於:電纜本體12包括有彎折 部1203及平坦部1204,彎折部1203兩端分別延伸形成平坦部1204,並分別與第一端子部14及第二端子部16電性連接。藉此,第一端子部14可用以與電子裝置40的第二連接器30電性連接,第二端子部16可用以與第一連接器20電性連接。 Please refer to Figure 14A, Figure 14B and Figure 14C for the creation cable. The configuration of the body 12 can be designed in different variations, the difference being that the cable body 12 includes a bend In the portion 1203 and the flat portion 1204 , the flat portions 1204 are respectively formed at both ends of the bent portion 1203 , and are electrically connected to the first terminal portion 14 and the second terminal portion 16 , respectively. Thereby, the first terminal portion 14 can be electrically connected to the second connector 30 of the electronic device 40, and the second terminal portion 16 can be used to be electrically connected to the first connector 20.

綜上所述,本創作具有以下有益效果: In summary, this creation has the following beneficial effects:

一、柔性印刷電路板10具有較少的堆疊層,即可傳輸高速差動訊號、低速差動訊號、其它訊號、接地訊號及電源訊號等多種訊號,同時訊號線之間及堆疊層與堆疊層之間均具有良好的屏蔽效果,以降低電磁干擾(EMI)。 1. The flexible printed circuit board 10 has fewer stacked layers, and can transmit various signals such as high-speed differential signals, low-speed differential signals, other signals, ground signals, and power signals, and between signal lines and stacked layers and stacked layers. There is good shielding between them to reduce electromagnetic interference (EMI).

二、藉由位於訊號線層121上方的第一導電隔離層122(或稱接地層)與位於訊號線層121下方的第二導電隔離層123(或稱電源層)共同包覆訊號線層121,以抑制堆疊層與堆疊層之間的電磁干擾。再者,訊號層中相鄰的二對高速差動訊號線1211之間以接地線1214隔開,且在與接地線1214相反的一側設有電源線1215或至少一個其它訊號線1213,以減少相鄰的二對高速差動訊號線1211之間彼此互相干擾。此外,訊號線層121的每對高速差動訊號線1211或每對低速差動訊號線1212均介於電源線1215、接地線1214、其它訊號線1213或其組合之間,亦可抑制高速差動訊號或低速差動訊號傳輸時的電磁干擾。 2. The signal line layer 121 is coated by the first conductive isolation layer 122 (or the ground layer) located above the signal line layer 121 and the second conductive isolation layer 123 (or the power layer) under the signal line layer 121. To suppress electromagnetic interference between the stacked layer and the stacked layer. Furthermore, the adjacent two pairs of high-speed differential signal lines 1211 in the signal layer are separated by a ground line 1214, and a power line 1215 or at least one other signal line 1213 is disposed on a side opposite to the ground line 1214 to The adjacent two pairs of high speed differential signal lines 1211 are reduced from each other. In addition, each pair of high-speed differential signal lines 1211 or each pair of low-speed differential signal lines 1212 of the signal line layer 121 are interposed between the power line 1215, the ground line 1214, the other signal lines 1213, or a combination thereof, and the high speed difference can also be suppressed. Electromagnetic interference when transmitting a signal or low-speed differential signal.

三、第二端子部16的第一至第四接地端子164a~164d以並聯的方式與訊號線層121的第一接地線1214a及第二接地線1214b電性連接,同時第二端子部16的第一至第四接地端子164a~164d亦以並聯的方式與接地層122電性連接,使得電磁干擾的抑制得以同時藉由訊號層的接地線1214及 接地層122來解決,提高訊號傳輸的品質。 The first to fourth ground terminals 164a-164d of the second terminal portion 16 are electrically connected in parallel to the first ground line 1214a and the second ground line 1214b of the signal line layer 121, while the second terminal portion 16 is The first to fourth ground terminals 164a-164d are also electrically connected to the ground layer 122 in a parallel manner, so that the electromagnetic interference is suppressed by the ground line 1214 of the signal layer. The ground layer 122 is used to solve the problem of improving the quality of the signal transmission.

四、第二端子部16的第一至第四電源端子165a~165d以並聯的方式與訊號線層121的第一電源線1215a及第二電源線1215b電性連接,同時第二端子部16的第一至第四電源端子165a~165d亦以並聯的方式與電源層123電性連接,以分流的原理來傳輸電源,得以承載較大的電源。 The first to fourth power terminals 165a-165d of the second terminal portion 16 are electrically connected in parallel to the first power line 1215a and the second power line 1215b of the signal line layer 121, while the second terminal portion 16 is The first to fourth power terminals 165a-165d are also electrically connected to the power layer 123 in a parallel manner, and the power is transmitted by the principle of shunting to carry a large power source.

五、第二端子部16的第一低速差動訊號端子162a與第三低速差動訊號端子162c以串聯方式電性連接,第二端子部16的第二低速差動訊號端子162b與第四低速差動訊號端子162d亦以串聯方式電性連接,進而使第二端子部16的第一至第四低速差動訊號端子162a~162d(亦即二對低速差動訊號端子)再與訊號線層121的第一低速差動訊號線1212a及第二低速差動訊號線1212b(亦即一對低速差動訊號線)以並聯方式電性連接,用以降低訊號線數量。 5. The first low-speed differential signal terminal 162a of the second terminal portion 16 and the third low-speed differential signal terminal 162c are electrically connected in series, and the second low-speed differential signal terminal 162b of the second terminal portion 16 and the fourth low-speed The differential signal terminals 162d are also electrically connected in series, and the first to fourth low-speed differential signal terminals 162a-162d of the second terminal portion 16 (that is, two pairs of low-speed differential signal terminals) are further connected to the signal line layer. The first low-speed differential signal line 1212a and the second low-speed differential signal line 1212b (that is, a pair of low-speed differential signal lines) of 121 are electrically connected in parallel to reduce the number of signal lines.

惟,以上所述,僅為本創作最佳之一的具體實施例之詳細說明與圖式,惟本創作之特徵並不侷限於此,並非用以限制本創作,本創作之所有範圍應以申請專利範圍為準,凡合於本創作申請專利範圍之精神與其類似變化之實施例,皆應包含於本創作之範疇中,任何熟悉該項技藝者在本創作之領域內,可輕易思及之變化或修飾皆可涵蓋在本案之專利範圍。 However, the above description is only a detailed description and a drawing of a specific embodiment of the present invention, but the features of the present invention are not limited thereto, and are not intended to limit the creation, and all the scope of the creation should be The scope of the patent application shall prevail. The embodiments of the spirit of the patent application scope and similar changes shall be included in the scope of this creation. Anyone familiar with the art may easily think of it in the field of this creation. Any changes or modifications may be covered by the patent in this case.

12‧‧‧電纜本體 12‧‧‧ Cable body

14‧‧‧第一端子部 14‧‧‧First terminal section

141a~141h‧‧‧第一至第八高速差動訊號端子 141a~141h‧‧‧1st to 8th high speed differential signal terminals

142a~142b‧‧‧第一至第二低速差動訊號端子 142a~142b‧‧‧1st to 2nd low speed differential signal terminals

143a~143d‧‧‧第一至第四其它訊號端子 143a~143d‧‧‧First to fourth other signal terminals

144a~144d‧‧‧第一至第四接地端子 144a~144d‧‧‧first to fourth grounding terminals

145a~145e‧‧‧第一至第四電源端子 145a~145e‧‧‧first to fourth power terminals

Claims (10)

一種柔性印刷電路板,包括:電纜本體、位於該電纜本體一端的第一端子部及位於該電纜本體另一端的第二端子部,該第一端子部具有沿寬度方向依序排列的一第一其它訊號端子、一第一高速差動訊號端子、一第一接地端子、一第二高速差動訊號端子、一第二接地端子、一第三高速差動訊號端子、一第一電源端子、一第四高速差動訊號端子、一第二電源端子、一第二其它訊號端子、一第一低速差動訊號端子、一第三電源端子、一第二低速差動訊號端子、一第三其它訊號端子、一第四電源端子、一第五高速差動訊號端子、一第五電源端子、一第六高速差動訊號端子、一第三接地端子、一第七高速差動訊號端子、一第四接地端子、一第八高速差動訊號端子及一第四其它訊號端子。 A flexible printed circuit board comprising: a cable body; a first terminal portion at one end of the cable body; and a second terminal portion at the other end of the cable body, the first terminal portion having a first order in the width direction Other signal terminals, a first high speed differential signal terminal, a first ground terminal, a second high speed differential signal terminal, a second ground terminal, a third high speed differential signal terminal, a first power terminal, and a a fourth high speed differential signal terminal, a second power supply terminal, a second other signal terminal, a first low speed differential signal terminal, a third power terminal, a second low speed differential signal terminal, and a third other signal a terminal, a fourth power terminal, a fifth high-speed differential signal terminal, a fifth power terminal, a sixth high-speed differential signal terminal, a third ground terminal, a seventh high-speed differential signal terminal, and a fourth The grounding terminal, an eighth high speed differential signal terminal and a fourth other signal terminal. 如申請專利範圍第1項所述之柔性印刷電路板,其中該電纜本體包括:電源層、訊號線層及接地層,該訊號線層介於該電源層及該接地層之間,該訊號線層包含有電源線及接地線,該電源線與該電源層形成電性導通,該接地線與該接地層形成電性導通。 The flexible printed circuit board of claim 1, wherein the cable body comprises: a power layer, a signal line layer and a ground layer, the signal line layer being interposed between the power layer and the ground layer, the signal line The layer includes a power line and a ground line, and the power line is electrically connected to the power layer, and the ground line is electrically connected to the ground layer. 如申請專利範圍第2項所述之柔性印刷電路板,其中該訊號線層的該接地線係一第一接地線及一第二接地線,該第一接地線一端電連接該第一端子部的該第二接地端子,該第二接地線一端電連接該第一端子部的該第三接地端子。 The flexible printed circuit board of claim 2, wherein the grounding wire of the signal line layer is a first grounding wire and a second grounding wire, and one end of the first grounding wire is electrically connected to the first terminal portion. The second ground terminal is electrically connected to the third ground terminal of the first terminal portion. 如申請專利範圍第3項所述之柔性印刷電路板,其中該訊號線層的該電源線係一第一電源線及一第二電源線,該第一電源線一端電連接該第一端子部的該第二電源端子,該第二電源線一端電連接該第一端子部的該第 四電源端子。 The flexible printed circuit board of claim 3, wherein the power line of the signal line layer is a first power line and a second power line, and one end of the first power line is electrically connected to the first terminal portion. The second power terminal, the one end of the second power line is electrically connected to the first portion of the first terminal portion Four power terminals. 如申請專利範圍第2項所述之柔性印刷電路板,其中該訊號線層的該接地線係一第一接地線及一第二接地線,該第一接地線及該第二接地線同時電性連接該接地層及該第一端子部的該第一至第四接地端子。 The flexible printed circuit board of claim 2, wherein the ground line of the signal line layer is a first ground line and a second ground line, and the first ground line and the second ground line are simultaneously The ground layer and the first to fourth ground terminals of the first terminal portion are connected. 如申請專利範圍第5項所述之柔性印刷電路板,其中該訊號線層的該電源線係一第一電源線及一第二電源線,該第一電源線及該第二電源線同時電性連接該電源層及該第一端子部的該第一至第五電源端子。 The flexible printed circuit board of claim 5, wherein the power line of the signal line layer is a first power line and a second power line, and the first power line and the second power line are simultaneously powered. The power supply layer and the first to fifth power supply terminals of the first terminal portion are connected. 如申請專利範圍第4項或第6項所述之柔性印刷電路板,其中該訊號線層更包含四對高速差動訊號線、一對低速差動訊號線及四個其他訊號線,相鄰的兩對該高速差動訊號線之間以至少一個該接地線隔開,且在與至少一個該接地線相反的一側設有至少一個該電源線或至少一個該其他訊號線。 The flexible printed circuit board of claim 4, wherein the signal line layer further comprises four pairs of high speed differential signal lines, a pair of low speed differential signal lines and four other signal lines adjacent to each other. The two high-speed differential signal lines are separated by at least one of the ground lines, and at least one of the power lines or at least one of the other signal lines are disposed on a side opposite to the at least one of the ground lines. 如申請專利範圍第7項所述之柔性印刷電路板,其中該四對高速差動訊號線係一第一高速差動訊號線、一第二高速差動訊號線、一第三高速差動訊號線、一第四高速差動訊號線、一第五高速差動訊號線、一第六高速差動訊號線、一第七高速差動訊號線及一第八高速差動訊號線,該一對低速差動訊號線係一第一低速差動訊號線及一第二低速差動訊號線,該四個其他訊號線係一第一其他訊號線、一第二其他訊號線、一第三其他訊號線及一第四其他訊號線,該訊號線層沿寬度方向依序排列有該第一其他訊號線、該第一高速差動訊號線、該第二高速差動訊號線、該第一接地線、該第三高速差動訊號線、該第四高速差動訊號線、該第一電源線、該第二其他訊號線、該第一低速差動訊號線、該第二低速差動訊號 線、該第三其他訊號線、該第二電源線、該第五高速差動訊號線、該第六高速差動訊號線、該第二接地線、該第七高速差動訊號線、該第八高速差動訊號線及該第四其他訊號線。 The flexible printed circuit board of claim 7, wherein the four pairs of high speed differential signal lines are a first high speed differential signal line, a second high speed differential signal line, and a third high speed differential signal. a line, a fourth high speed differential signal line, a fifth high speed differential signal line, a sixth high speed differential signal line, a seventh high speed differential signal line and an eighth high speed differential signal line, the pair The low-speed differential signal line is a first low-speed differential signal line and a second low-speed differential signal line, and the four other signal lines are a first other signal line, a second other signal line, and a third other signal. And a fourth other signal line, the signal line layer sequentially arranging the first other signal line, the first high speed differential signal line, the second high speed differential signal line, and the first ground line in a width direction The third high speed differential signal line, the fourth high speed differential signal line, the first power line, the second other signal line, the first low speed differential signal line, and the second low speed differential signal a line, the third other signal line, the second power line, the fifth high speed differential signal line, the sixth high speed differential signal line, the second ground line, the seventh high speed differential signal line, the first Eight high speed differential signal lines and the fourth other signal line. 一種連接器組件,包括:一如請求項1至請求項8任一項所述之柔性印刷電路板;以及一與該柔性印刷電路板電連接的連接器。 A connector assembly comprising: a flexible printed circuit board as claimed in any one of claims 1 to 8; and a connector electrically connected to the flexible printed circuit board. 一種電子裝置,包括:一具有一主機板的本體,以及一如請求項9所述之連接器組件,該連接器組件裝設於該本體內,且與該主機板形成電性連接。 An electronic device comprising: a body having a motherboard, and a connector assembly as claimed in claim 9, wherein the connector assembly is mounted in the body and electrically connected to the motherboard.
TW104132777A 2015-10-06 2015-10-06 A flexible printed circuit board, a connector assembly and an electronic device TWI566646B (en)

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Citations (4)

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US6246014B1 (en) * 1996-01-05 2001-06-12 Honeywell International Inc. Printed circuit assembly and method of manufacture therefor
US20130056250A1 (en) * 2010-04-02 2013-03-07 Haeun Chemtec Co., Ltd. Method for Manufacturing a Double-Sided Printed Circuit Board
TW201509260A (en) * 2013-05-08 2015-03-01 Inktec Co Ltd Method for making printed circuit board and printed circuit board
TWM505145U (en) * 2014-01-24 2015-07-11 Zhen Ding Technology Co Ltd Flexible printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246014B1 (en) * 1996-01-05 2001-06-12 Honeywell International Inc. Printed circuit assembly and method of manufacture therefor
US20130056250A1 (en) * 2010-04-02 2013-03-07 Haeun Chemtec Co., Ltd. Method for Manufacturing a Double-Sided Printed Circuit Board
TW201509260A (en) * 2013-05-08 2015-03-01 Inktec Co Ltd Method for making printed circuit board and printed circuit board
TWM505145U (en) * 2014-01-24 2015-07-11 Zhen Ding Technology Co Ltd Flexible printed circuit board

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