CN204069491U

CN204069491U - Printed substrate

Info

Publication number: CN204069491U
Application number: CN201490000036.3U
Authority: CN
Inventors: 魏晓敏
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-04-09
Filing date: 2014-04-09
Publication date: 2014-12-31
Anticipated expiration: 2024-04-09
Also published as: WO2015154242A1

Abstract

This application discloses a kind of printed substrate, comprise: central layer and be attached at the copper-clad plate of this central layer upper and lower surface by colloid, described central layer comprises: substrate and the Copper Foil be formed on this substrate, described central layer offers the groove of this central layer through, the edge described central layer being positioned at this groove is provided with the block be formed on described Copper Foil, is filled with polytetrafluoroethylene in described groove.Like this, in the groove that central layer is offered, be packed into polytetrafluoroethylene, thus the signal quality of high frequency printed circuit board can be controlled, improve the transmission quality of printed substrate high frequency signal.

Description

Printed substrate

Technical field

The application relates to circuit field, particularly relates to a kind of printed substrate.

Background technology

Along with electronic product is to the future development of miniaturization, digitlization, high frequency, the application of high-frequency circuit is also more and more extensive.At present, be applied to the high frequency printed circuit board of high-frequency circuit many in wiring board the built-in hollow groove for carrying out high-frequency signal transmission and high-speed logic signal transmission.But because hollow groove can cause higher loss of signal, therefore make the signal quality of high frequency printed circuit board to be improved.

Summary of the invention

The application is intended to one of solve the problems of the technologies described above at least to a certain extent.

The application provides a kind of printed substrate, comprise: central layer and be attached at the copper-clad plate of this central layer upper and lower surface by colloid, described central layer comprises: substrate and the Copper Foil be formed on this substrate, described central layer offers the groove of this central layer through, the edge described central layer being positioned at this groove is provided with the block be formed on described Copper Foil, is filled with polytetrafluoroethylene in described groove.

Further, Powdered or solid shape polytetrafluoroethylene is filled with in described groove.

The beneficial effect of the application is:

By providing a kind of printed substrate, comprise: central layer and be attached at the copper-clad plate of this central layer upper and lower surface by colloid, described central layer comprises: substrate and the Copper Foil be formed on this substrate, described central layer offers the groove of this central layer through, the edge described central layer being positioned at this groove is provided with the block be formed on described Copper Foil, is filled with polytetrafluoroethylene in described groove.Like this, in the groove that central layer is offered, be packed into polytetrafluoroethylene, thus the signal quality of high frequency printed circuit board can be controlled, improve the transmission quality of printed substrate high frequency signal.

Accompanying drawing explanation

Fig. 1 is the structural representation of the printed substrate of the embodiment of the present application.

Embodiment

Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.

In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.

In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.

In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.

In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.

By reference to the accompanying drawings the application is described in further detail below by embodiment.

Please refer to Fig. 1, the application provides a kind of printed substrate, comprising: central layer 1 and be attached at the copper-clad plate 3 of this central layer 1 upper and lower surface by colloid 2.Central layer 1 comprises: substrate 11 and the Copper Foil 12 be formed on this substrate 11.Central layer 1 offers the groove 13 of this central layer 1 through.Edge central layer 1 being positioned at this groove 13 is provided with the block 14 be formed on Copper Foil 12.Polytetrafluoroethylene 15 is filled with in groove 13.Powdered or solid shape polytetrafluoroethylene 15 is filled with in groove 13.

Like this, in the groove that central layer is offered, be packed into polytetrafluoroethylene, thus the signal quality of high frequency printed circuit board can be controlled, improve the transmission quality of printed substrate high frequency signal.In addition, because block 14 can adopt copper material, and electroplating formation is on Copper Foil, thus can stop the flowing of colloid 2, and avoiding colloid 2 to flow in groove 13 affects signal quality.

In the description of this specification, at least one embodiment that specific features, structure, material or feature that the description of reference term " execution mode ", " some execution modes ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.

Above content is the further description done the application in conjunction with concrete execution mode, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.

Claims

1. a printed substrate, it is characterized in that, comprise: central layer and be attached at the copper-clad plate of this central layer upper and lower surface by colloid, described central layer comprises: substrate and the Copper Foil be formed on this substrate, described central layer offers the groove of this central layer through, the edge described central layer being positioned at this groove is provided with the block be formed on described Copper Foil, is filled with polytetrafluoroethylene in described groove.

2. printed wiring board as claimed in claim 1, is characterized in that, be filled with Powdered or solid shape polytetrafluoroethylene in described groove.