CN204425770U - A kind of flexible print circuit board - Google Patents
A kind of flexible print circuit board Download PDFInfo
- Publication number
- CN204425770U CN204425770U CN201420848235.1U CN201420848235U CN204425770U CN 204425770 U CN204425770 U CN 204425770U CN 201420848235 U CN201420848235 U CN 201420848235U CN 204425770 U CN204425770 U CN 204425770U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- bent area
- print circuit
- flexible print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a kind of flexible print circuit board, and it comprises: substrate layer, is located at the some pads on described substrate layer, and is arranged on the epiphragma layer on substrate layer; Epiphragma opening is provided with in the position of the corresponding pad of described epiphragma layer; Described substrate layer comprises bent area and non-bent area, and described pad comprises the first pad being arranged on and closing on the non-bent area of bent area; The edge that described first pad closes on side, bent area is provided with the first solder mask; The second solder mask is provided with away from the edge of bent area at described first pad; Described first solder mask and described epiphragma layer are structure as a whole.Its resistance to bending performance of the flexible print circuit board that the utility model provides is strong, improves the toughness of flexible print circuit board, and makes element on flexible print circuit board reduce to the distance of bent area simultaneously, the space of increase flexible print circuit board.
Description
Technical field
The utility model relates to a kind of flexible print circuit board.
Background technology
FPC is the one the most complicated in wiring board product, purposes is maximum, particularly because it has the characteristics such as frivolous, flexible, low-voltage, low consumpting power, three-dimensional three-dimensional wiring can be carried out along with the size of electronic product inner space and shape, therefore, be widely used in the electronic products such as notebook computer, liquid crystal display, hard disk, printer and automobile.
In FPC manufacturing process, welding resistance problem between usual employing epiphragma opening solves compared with large bonding pad, generally speaking, the Anawgy accuracy of epiphragma requires that tolerance is at more than 0.1mm, the monolateral 0.1mm of dodging namely will reserve the space of 0.2mm, the punching precision of epiphragma mould is generally at more than 0.07mm, but for the pad position of smaller opening, even if mould can go out epiphragma opening, but by the impact of epiphragma Anawgy accuracy, adopt epiphragma opening between each pad, play welding resistance effect and be just difficult to reach requirement; Also have in the industry separately by carrying out welding resistance in the mode of epiphragma aperture position printing PSR ink, but the resistance to bending performance of PSR ink being poor, easily there is cracking in bending.
Summary of the invention
For one of solving the problems of the technologies described above, the utility model provides a kind of flexible print circuit board.
A kind of flexible print circuit board that the utility model provides, comprising: substrate layer, is located at the some pads on described substrate layer, and is arranged on the epiphragma layer on substrate layer; Epiphragma opening is provided with in the position of the corresponding pad of described epiphragma layer; Described substrate layer comprises bent area and non-bent area, and described pad comprises the first pad being arranged on and closing on the non-bent area of bent area; The edge that described first pad closes on side, bent area is provided with the first solder mask; The second solder mask is provided with away from the edge of bent area at described first pad; Described first solder mask and described epiphragma layer are structure as a whole.
Preferably, pad also comprises the second pad be arranged on away from bent area on non-bent area.
Preferably, the periphery of the second pad is provided with the first solder mask or the second solder mask;
Preferably, the pad of the first pad is at least one; Second pad is at least one.
Preferably, the first pad is square or trapezoidal, and the first pad comprises four limits, is provided with the first solder mask at the first pad near the limit of bent area; Three limits away from bent area are provided with the second solder mask.
Preferably, the second solder mask is insulating oil layer of ink.
Preferably, the second solder mask is PSR ink layer.
Preferably, the size of epiphragma opening is greater than the size of pad
Preferably, the second pad is square, circular or trapezoidal.
Preferably, flexible circuit board is single-layer flexible wiring board or composite-type flexible wiring board.
The utility model provides a kind of flexible print circuit board, arranges the first solder mask and the second solder mask by adopting the pad near bent area; Both can avoid the pliability improving FPC, and the cracking of solder mask can not have been caused, the spacing of bonding pad opening can be reduced again; Element on flexible print circuit board can be made to reduce to the distance of bent area, the space of increase flexible print circuit board simultaneously.
Accompanying drawing explanation
The schematic diagram of the flexible print circuit board that Fig. 1 provides for the utility model.
Fig. 2 is the schematic diagram of flexible print circuit board of the prior art.
Embodiment
The technical problem solved to make the utility model, technical scheme and beneficial effect are clearly understood, below in conjunction with drawings and Examples, are further elaborated to the utility model.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, unless otherwise clearly defined and limited, term " " center ", " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance.
In description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition the concrete meaning of above-mentioned term in the utility model can be understood.
Below in conjunction with drawings and Examples, the utility model is described further.
As shown in Figure 1, the utility model provides a kind of flexible print circuit board 1, comprising: substrate layer, is located at the some pads on described substrate layer, and is arranged on the epiphragma layer on substrate layer; Epiphragma opening is provided with in the position of the corresponding pad of described epiphragma layer; Described substrate layer comprises bent area 13 and non-bent area 12, and described pad comprises the first pad 14 being arranged on and closing on the non-bent area 12 of bent area 13; Described first pad 14 closes on side, bent area 13 and is provided with the first solder mask 16, at described first pad 14 away from the periphery of bent area being provided with the second solder mask 17; First solder mask 16 is structure as a whole with epiphragma layer.
Substrate layer can be flexible substrate layer, and also can be the combination of rigid substrate layer and flexible substrate layer, preferably it be flexible substrate layer, and substrate layer comprises bent area 13 and non-bent area 12; The bent area 13 of the utility model definition refers to flexible wires printed substrate in use, needs the region of bending; Non-bent area 12 refers to that flexible print circuit board does not need the region bent in use; Bent area 13 and non-bent area 12 can be structure as a whole, also can Split type structure; When bent area 13 and non-bent area 12 are Split type structure formula, the two adopts the connected mode in existing technology to connect; Preferably, the two is structure as a whole; The substrate layer that the utility model provides is any substrate layer in prior art; The flexible print circuit board that the utility model provides also comprises, and is arranged on the line layer on substrate layer; The utility model does not do particular/special requirement to line layer, as long as be applicable to line layer of the present utility model all can meet line layer of the present utility model.
The flexible print circuit board 1 that the utility model provides also comprises the epiphragma layer be arranged on substrate layer; The position that epiphragma layer is corresponding with pad is provided with epiphragma opening; The size of epiphragma opening is greater than the size of pad, can ensure when welding pad like this, can leave enough welding spaces, can not affect the welding to pad.
Substrate layer is provided with some pads, and pad comprises and is arranged on non-bent area 12 and closes on the first pad 14 of bent area 13; And to be arranged on non-bent area 12 and away from the second pad 15 of bent area 13; First pad 14 can be square or trapezoidal, and preferably it is square, and the first pad 14 comprises four limits, is provided with the first solder mask 16, is provided with the second solder mask 17 at the first pad 14 away from three limits of bent area 13 at the first pad 14 near bent area; Preferably, preferably, the first solder mask 16 is structure as a whole with epiphragma layer, and namely the first solder mask is the rete identical with epiphragma layer material, the integrative-structure of the utility model indication refers to that the two is for same material, one that is prepared by integral forming process overall rete.Adopt epiphragma layer can the flexibility of flexible print circuit board of ensuring coverage epiphragma layer and bending performance unaffected; Second solder mask 17 is insulating oil layer of ink, and further preferably the second solder mask is PSR ink layer; (Photoimageable Solder Resist Ink) adopts PSR ink better can play the effect of welding resistance, and PSR ink has the little feature of aperture pitch simultaneously, and what epiphragma opening can be made to open is very little, can improve the welding precision of pad like this; At the periphery of the first pad, epiphragma layer and PSR ink layer are set simultaneously; So both can ensure the flexibility of flexible print circuit board and bending performance impregnable while, can also ensure that the aperture pitch of epiphragma opening is reduced to 0.1mm, the welding precision of pad can be ensured like this; Can ensure that the element on flexible print circuit board is decreased to 0.5mm to the distance of bent area simultaneously, increase the space on flexible print circuit board; Preferably, the first pad 14 and the second pad 15 are all at least one to the utility model.
Preferred second pad 15 of the utility model is square, circular or trapezoidal; The first solder mask or the second solder mask is provided with at the periphery of the second pad 15; When the element on flexible print circuit board is more, and when flexible circuit board does not need bending part, be provided with the second solder mask at the periphery of the second pad 15; The aperture pitch of epiphragma layer opening and pad can be reduced like this; When the element on flexible print circuit board is less, and when needing bending part, be then provided with the first solder mask at the periphery of the second pad 15; The flexility of flexible print circuit board and resistance to bending performance can be ensured like this.
Further preferably, the flexible print circuit board that the utility model provides can be single-layer flexible printed substrate, also can be multi-layer flexible printed circuit board; The utility model does not do particular/special requirement to flexible print circuit board, all can as long as can be applicable to flexible print circuit board of the present utility model.
As shown in Figure 1, existing printing flexible circuit board 1 ', the welding resistance mode for pad 14 ' generally only has one, namely adopts dielectric ink welding resistance for pad, or adopts epiphragma welding resistance to pad; But due to bent area 12 ' non-above flexible print circuit board element get more and more, and from bent area 13 ' more and more close to, single welding resistance mode cannot meet the needs of properties of product; And the utility model provides flexible print circuit board 1, be provided with the first solder mask 16 by the side of the close bent area 13 at the first pad 14, be provided with the second solder mask 17 in the edge away from bent area 13; Adopt two kinds of different solder masks to carry out welding resistance to the first pad 14, both can ensure the pliability of pad and resistance to bending performance, the aperture pitch of epiphragma opening and pad can be reduced simultaneously, the welding precision of raising pad; Adopt said structure simultaneously, can ensure that the element be arranged on flexible print circuit board is decreased to 0.5mm to the region bent, and increases the space of flexible print circuit board.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. a flexible print circuit board, is characterized in that, it comprises: substrate layer, is located at the some pads on described substrate layer, and is arranged on the epiphragma layer on substrate layer; Epiphragma opening is provided with in the position of the corresponding pad of described epiphragma layer; Described substrate layer comprises bent area and non-bent area, and described pad comprises the first pad being arranged on and closing on the non-bent area of bent area; The edge that described first pad closes on side, bent area is provided with the first solder mask; The second solder mask is provided with away from the edge of bent area at described first pad; Described first solder mask and described epiphragma layer are structure as a whole.
2. flexible print circuit board as claimed in claim 1, is characterized in that: described pad also comprises the second pad be arranged on away from bent area on non-bent area.
3. flexible print circuit board as claimed in claim 2, is characterized in that: the periphery of described second pad is provided with the first solder mask or the second solder mask.
4. flexible print circuit board as claimed in claim 3, is characterized in that: the pad of described first pad is at least one; Described second pad is at least one.
5. flexible print circuit board as claimed in claim 4, it is characterized in that: described first pad is square or trapezoidal, described first pad comprises four limits, is provided with the first solder mask at described first pad near the limit of bent area; Three limits away from bent area are provided with the second solder mask.
6. the flexible print circuit board as described in claim 1-5 any one, is characterized in that: described second solder mask is insulating oil layer of ink.
7. flexible print circuit board as claimed in claim 6, is characterized in that: described second solder mask is PSR ink layer.
8. flexible print circuit board as claimed in claim 1, is characterized in that: the size of described epiphragma opening is greater than the size of described pad.
9. flexible print circuit board as claimed in claim 2, is characterized in that: described second pad is square, circular or trapezoidal.
10. flexible print circuit board as claimed in claim 1, is characterized in that: described flexible circuit board is single-layer flexible wiring board or composite-type flexible wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420848235.1U CN204425770U (en) | 2014-12-29 | 2014-12-29 | A kind of flexible print circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420848235.1U CN204425770U (en) | 2014-12-29 | 2014-12-29 | A kind of flexible print circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204425770U true CN204425770U (en) | 2015-06-24 |
Family
ID=53476094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420848235.1U Expired - Fee Related CN204425770U (en) | 2014-12-29 | 2014-12-29 | A kind of flexible print circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204425770U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
-
2014
- 2014-12-29 CN CN201420848235.1U patent/CN204425770U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
| CN112272445B (en) * | 2020-10-29 | 2022-09-06 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8076585B2 (en) | Printed circuit board | |
| CN206389608U (en) | A kind of wiring board with coil function | |
| US9059162B2 (en) | Chip on film (COF) substrate, COF package and display device including the same | |
| CN204425770U (en) | A kind of flexible print circuit board | |
| WO2017113472A1 (en) | Electronic terminal | |
| CN204425785U (en) | A kind of flexible print circuit board | |
| CN204539609U (en) | Fpc plate | |
| CN204482149U (en) | Flexible PCB | |
| CN105578739A (en) | Circuit board and terminal | |
| CN207305037U (en) | Position pore structure and flexible PCB | |
| US11219143B2 (en) | Control unit of display device and display device | |
| CN105430889A (en) | Flexible circuit board and terminal | |
| TW201528102A (en) | Fpc of capacitive touch screen and method for mounting fpc | |
| CN205847726U (en) | A kind of electronic equipment | |
| WO2017113798A1 (en) | Flexible circuit board wiring structure and mobile terminal | |
| CN204069491U (en) | Printed substrate | |
| CN203136347U (en) | Metal-core printed circuit board jointed plate sealing edge | |
| CN203720491U (en) | FPC (flexible printed circuit) structure of LCD (liquid crystal display) module | |
| CN201716631U (en) | Cabinet | |
| CN114967248B (en) | Display panel and display device | |
| CN203313517U (en) | Printed circuit board and touch screen induction module group including printed circuit board | |
| CN204442833U (en) | Abnormity rigid-flexible circuit board and there is its smart mobile phone | |
| CN203554784U (en) | Convex copper structure PCB | |
| CN103246399A (en) | Printed circuit board and touch screen induction module comprising same | |
| CN204069490U (en) | Printed substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119, A1 building, A11 building, BYD three stage, BYD Industrial Park, Kwai Chung Road, Longgang District, Shenzhen District, Guangdong, Yanan, China Patentee after: Shenzhen helitai photoelectric Co.,Ltd. Address before: 518119, A1 building, A11 building, BYD three stage, BYD Industrial Park, Kwai Chung Road, Longgang District, Shenzhen District, Guangdong, Yanan, China Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20211229 |