CN105578739A - Circuit board and terminal - Google Patents

Circuit board and terminal Download PDF

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Publication number
CN105578739A
CN105578739A CN201610105399.9A CN201610105399A CN105578739A CN 105578739 A CN105578739 A CN 105578739A CN 201610105399 A CN201610105399 A CN 201610105399A CN 105578739 A CN105578739 A CN 105578739A
Authority
CN
China
Prior art keywords
circuit board
cabling
substrate
land
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610105399.9A
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Chinese (zh)
Inventor
曾元清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201610105399.9A priority Critical patent/CN105578739A/en
Publication of CN105578739A publication Critical patent/CN105578739A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/058Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09227Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a circuit board, which comprises a flexible board main body. The flexible board main body has a first surface and a second surface which are opposite; the first surface is provided with multiple first wires; the second surface is provided with multiple second wires; and the positive projection of each first wire on the second surface falls between adjacent two second wires. The flexible board main body of the circuit board has high wiring uniformity, the stress applied to each part of the flexible board main body has a small difference, breaking is not likely to happen, and the service life of the circuit board can be prolonged. The invention also discloses a terminal.

Description

Circuit board and terminal
Technical field
The present invention relates to circuit field, particularly relate to a kind of circuit board and there is the terminal of this circuit board.
Background technology
Along with the development of science and technology, every field all needs various electric apparatus equipment, and circuit board becomes a part very important in market and life, is widely used in every field, such as, and the field such as consumer electronics, space flight and aviation, medical treatment, office.Circuit board comprises rigid circuit board, flexible PCB and Rigid Flex.Wherein, flexible PCB (FlexiblePrintedCircuit, FPC) be take flexible material as base material and obtained circuit board, have that wiring density is high, quality is light, thickness is thin and the advantage such as made of soft, it is flexible, winding and folding wherein, therefore, be widely used in the conducting system of modern various electronic product.And Rigid Flex is more favored because it has the advantage of rigid circuit board (PrintedCircuitBoards, PCB) and flexible PCB concurrently.Rigid Flex is suppressed by rigid circuit board and flexible PCB and is formed, finished product comprises rigid region and flex region, rigid region is the requirement of the conductive component for certain bearing capacity of satisfying the demand, flexible portion is then the requirement of the conductive component for the activity of satisfying the demand or bending, is also called kink.
No matter be flexible PCB or Rigid Flex, all there is kink, can through bending many times in application process, this just requires that kink has good bending, to extend the life-span of flexible PCB or Rigid Flex.But the distribution of usually the ignoring cabling impact for bending property of connecting up in prior art, especially two-layer cabling skewness on kink of double sided board, causes kink easily to rupture, and shortens the life-span of flexible PCB or Rigid Flex.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of circuit board, and the flexible board main body wiring uniformity of described circuit board is high, and suffered by each position of flexible board main body, stress difference is little, and not easy fracture can extend the useful life of described circuit board.
In order to solve the problems of the technologies described above, the present invention by the following technical solutions:
On the one hand, the invention provides a kind of circuit board, described circuit board comprises flexible board main body, described flexible board main body has relative first surface and second surface, described first surface is provided with many first cablings, described second surface is provided with many second cablings, and the orthographic projection of the first cabling on described second surface described in every bar drops between adjacent two described second cablings.
Wherein, the second cabling described in one or more is provided with between the orthographic projection of adjacent two described first cablings on described second surface.
Wherein, described in every bar, the orthographic projection of the first cabling on described second surface is positioned at the centre of two described second cablings.
Wherein, described circuit board also comprises the first rigid plate, and described flexible board main body comprises connected land and bent area, and described first cabling and described second cabling are across described land and described bent area, described first rigid plate is arranged at described land, and overlaps with described land.
Wherein, the position that described first surface corresponds to described land is provided with the first adjustment line, described first adjustment line is connected with described first cabling, described first adjustment line is in order to adjust the bearing of trend of described first cabling, the position that described second surface corresponds to described land is provided with the second adjustment line, described second adjustment line is connected with described second cabling, and described second adjustment line is in order to adjust the bearing of trend of described second cabling.
Wherein, described flexible board main body comprises overlapping first substrate and second substrate, the position corresponding to described land of described first substrate and the position corresponding to described land of described second substrate fit, one end away from described land of described first substrate and one end away from described land of described second substrate fit, the position corresponding to described bent area of described first substrate and the position corresponding to described bent area of described second substrate are separated from each other, described first surface overlaps with the surface away from described second substrate of described first substrate, described second surface overlaps with the surface away from described first substrate of described second substrate.
Wherein, described first rigid plate is single layer board, double-layer circuit board, multilayer circuit board or stiffening plate.
On the other hand, the invention provides a kind of terminal, described terminal comprises the circuit board described in above any one.
Compared with prior art, technical scheme of the present invention at least has following beneficial effect:
In the inventive solutions, described circuit board comprises flexible board main body, described flexible board main body has relative first surface and second surface, described first surface is provided with many first cablings, described second surface is provided with many second cablings, and the orthographic projection of the first cabling on described second surface described in every bar drops between adjacent two described second cablings;
Because the orthographic projection of the first cabling on described second surface described in every bar drops between adjacent two described second cablings, and described first cabling is arranged at described first surface, therefore, the first cabling on described first surface and the second cabling on second surface stagger and arrange, namely the first cabling on described first surface and the second cabling on second surface are not overlap in described flexible board main body, the thickness of described first cabling and described second cabling is avoided to stack up and reduce bending, simultaneously, described first cabling and described second cabling stagger and arrange, improve the wiring uniformity of described flexible board main body, the otherness of stress suffered by each position of described flexible board main body is reduced, thus not easy fracture, extend the life-span of described circuit board.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic top plan view of circuit board in first embodiment of the invention;
Fig. 2 is the schematic cross-section of circuit board A-A along the line in Fig. 1;
Fig. 3 is the schematic cross-section of circuit board in another execution mode of first embodiment of the invention;
Fig. 4 is the schematic top plan view of circuit board in second embodiment of the invention; And
Fig. 5 is the structural representation of circuit board in third embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In addition, the explanation of following embodiment is with reference to additional diagram, can in order to the specific embodiment implemented in order to illustrate the present invention.The direction term mentioned in the present invention, such as, " on ", D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., it is only the direction with reference to annexed drawings, therefore, the direction term used be in order to better, be illustrated more clearly in and understand the present invention, instead of instruction or infer the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; It can be mechanical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition above-mentioned term concrete meaning in the present invention can be understood.
In addition, in describing the invention, except as otherwise noted, the implication of " multiple " is two or more.If there is the term of " operation " in this specification, it not only refers to independently operation, when cannot clearly distinguish with other operation, as long as the effect that can realize desired by this operation is then also included within this term.In addition, refer to by the number range that "-" represents the scope that the numerical value recorded before and after "-" is included as minimum value and maximum in this specification.In the accompanying drawings, structural similarity or the identical label of identical unit represent.
See also Fig. 1 and Fig. 2, Fig. 1 is the schematic top plan view of circuit board in first embodiment of the invention; Fig. 2 is the schematic cross-section of circuit board A-A along the line in Fig. 1.In the first embodiment of the present invention, described circuit board comprises flexible board main body 100, described flexible board main body 100 has relative first surface 110 and second surface 120, described first surface 110 is provided with many first cablings 200, described second surface is provided with many second cablings 300, and the orthographic projection of the first cabling 200 on described second surface 120 described in every bar drops between adjacent two described second cablings 300.That is: the first cabling 200 on the first surface 110 of described flexible board main body 100 staggers with the second cabling 300 on second surface 120 and arranges, avoid the first cabling 200 overlapping with the second cabling 300, thus avoid the thickness of described first cabling 200 and described second cabling 300 in the same position superposition of described flexible board main body 100.Described flexible board main body 100 can be base material polyimides.The surface do not covered by conductor of described first cabling 200, described second cabling 300 and flexible board main body 100 all covers one deck route protection film (not shown), such as, coverlay.
Further, between the orthographic projection of adjacent two described first cablings 200 on described second surface 120, described second cabling 300 can be only set, thus the wiring uniformity improved on described first surface 110 and described second surface 120, thus the stress difference suffered by each position of the flexible board main body of described circuit board is diminished, make described flexible board main body 100, first cabling 200 and the second cabling 300 not easy fracture, extend the useful life of described circuit board.
Preferably, in one embodiment, when design condition allows, the orthographic projection of the first cabling 200 on described second surface 120 described in every bar is positioned at the centre of two described second cablings 300, thus make the first cabling 200 described in every bar equal to the distance of adjacent two described second cablings 300, wiring uniformity on the described first surface of further raising 110 and described second surface 120, make described flexible board main body 100, first cabling 200 and the second cabling 300 not easy fracture, extend the useful life of described circuit board further.
Refer to Fig. 3, Fig. 3 is the schematic cross-section of circuit board in another execution mode of first embodiment of the invention.In another execution mode of the first embodiment, between the orthographic projection of adjacent two described first cablings 200 on described second surface 120, many described second cablings 300 can be provided with.So, bending property can be taken into account and electrically design needs, such as, when designing multipair differential lines, also can improve the wiring uniformity on the first surface 110 of flexible board main body 100 and second surface 120.
Refer to Fig. 4, Fig. 4 is the schematic top plan view of circuit board in second embodiment of the invention, and Fig. 1 is consulted in combination.The structure of the circuit board in the present embodiment (the second embodiment) is substantially identical with the structure of circuit board described in the first embodiment, difference is: circuit board described in the present embodiment also comprises the first rigid plate 400, described flexible board main body 100 comprises connected land 130 and bent area 140, described first cabling 200 and described second cabling 300 are all across described land 130 and described bent area 140, described first rigid plate 400 is arranged at described land 130, and overlap with described land 130, that is described first rigid plate 400 is arranged on the coverlay in the scope of described land 130.One end of described first cabling 200 and one end of described second cabling 300 are positioned at the scope of described land 130, and cover by described first rigid plate 400, make described circuit board formed Rigid Flex, make described circuit board have mechanical load-bearing capability.
Refer to Fig. 5, Fig. 5 is the structural representation of circuit board in third embodiment of the invention.The structure of the circuit board in the present embodiment (the 3rd embodiment) is substantially identical with the structure of circuit board described in the first embodiment, difference is: the position that the described first surface 110 of the flexible board main body of circuit board described in the present embodiment corresponds to described land 130 is provided with the first adjustment line 500, described first adjustment line 500 is connected with described first cabling 200, described first adjustment line 500 is in order to adjust the bearing of trend of described first cabling 200, the position that described second surface 120 corresponds to described land 130 is provided with the second adjustment line (not shown), described second adjustment line is connected with described second cabling 300, described second adjustment line is in order to adjust the bearing of trend of described second cabling 300.Such as, the bearing of trend of described first cabling 200 is adjusted to and is connected with through hole 510 by the first adjustment line 500, thus the cabling of itself and other lamination is conducted.
In the present embodiment, because the position described first surface of the flexible board main body of described circuit board corresponding to described land is provided with the first adjustment line, the position described second surface corresponding to described land is provided with the second adjustment line, therefore, the bearing of trend of described first cabling and described second cabling can be adjusted in described land, again due to described flexible board main body within the scope of described land without the need to bending, therefore, described first adjustment line within the scope of described land and described second adjustment line can not consider the impact of uniformity on bending property of connecting up, and the first cabling 200 in the scope of described bent area 140 and the second cabling 300 can consider emphatically to connect up the impact of uniformity on bending property, described first adjustment line and described second adjustment line can be adopted to adjust the bearing of trend of described first cabling 200 and described second cabling 300, thus while the bending of the bent area of described circuit board can be ensured, ensure the final bearing of trend of cabling.
In an embodiment of the invention, described flexible board main body can comprise overlapping first substrate and second substrate, the position corresponding to described land of described first substrate and the position corresponding to described land of described second substrate fit, one end away from described land of described first substrate and one end away from described land of described second substrate fit, the position corresponding to described bent area of described first substrate and the position corresponding to described bent area of described second substrate are separated from each other, described first surface overlaps with the surface away from described second substrate of described first substrate, described second surface overlaps with the surface away from described first substrate of described second substrate.Thus increase described first substrate and the degree of freedom of described second substrate within the scope of bent area, improve the bending of bent area.
Be in embodiment in the present invention, described first rigid plate can be single layer board, double-layer circuit board, multilayer circuit board or stiffening plate.
Embodiments of the invention also provide a kind of terminal, and described terminal comprises the circuit board described in above any embodiment or execution mode, and described terminal refers to but is not limited to the products such as mobile phone, laptop computer, panel computer, POS and vehicle-mounted computer.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.

Claims (8)

1. a circuit board, it is characterized in that, described circuit board comprises flexible board main body, described flexible board main body has relative first surface and second surface, described first surface is provided with many first cablings, described second surface is provided with many second cablings, and the orthographic projection of the first cabling on described second surface described in every bar drops between adjacent two described second cablings.
2. circuit board as claimed in claim 1, is characterized in that, be provided with the second cabling described in one or more between the orthographic projection of adjacent two described first cablings on described second surface.
3. circuit board as claimed in claim 1, it is characterized in that, the orthographic projection of the first cabling on described second surface described in every bar is positioned at the centre of two described second cablings.
4. the circuit board as described in any one of claims 1 to 3, it is characterized in that, described circuit board also comprises the first rigid plate, described flexible board main body comprises connected land and bent area, described first cabling and described second cabling are across described land and described bent area, described first rigid plate is arranged at described land, and overlaps with described land.
5. circuit board as claimed in claim 4, it is characterized in that, the position that described first surface corresponds to described land is provided with the first adjustment line, described first adjustment line is connected with described first cabling, described first adjustment line is in order to adjust the bearing of trend of described first cabling, the position that described second surface corresponds to described land is provided with the second adjustment line, and described second adjustment line is connected with described second cabling, and described second adjustment line is in order to adjust the bearing of trend of described second cabling.
6. circuit board as claimed in claim 4, it is characterized in that, described flexible board main body comprises overlapping first substrate and second substrate, the position corresponding to described land of described first substrate and the position corresponding to described land of described second substrate fit, one end away from described land of described first substrate and one end away from described land of described second substrate fit, the position corresponding to described bent area of described first substrate and the position corresponding to described bent area of described second substrate are separated from each other, described first surface overlaps with the surface away from described second substrate of described first substrate, described second surface overlaps with the surface away from described first substrate of described second substrate.
7. circuit board as claimed in claim 4, it is characterized in that, described first rigid plate is single layer board, double-layer circuit board, multilayer circuit board or stiffening plate.
8. a terminal, is characterized in that, described terminal comprises the circuit board described in any one of claim 1 to 7.
CN201610105399.9A 2016-02-25 2016-02-25 Circuit board and terminal Pending CN105578739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610105399.9A CN105578739A (en) 2016-02-25 2016-02-25 Circuit board and terminal

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Application Number Priority Date Filing Date Title
CN201610105399.9A CN105578739A (en) 2016-02-25 2016-02-25 Circuit board and terminal

Publications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107801295A (en) * 2017-10-16 2018-03-13 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal
CN113690649A (en) * 2021-08-25 2021-11-23 锐捷网络股份有限公司 Connector assembly
CN114630489A (en) * 2022-03-22 2022-06-14 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment

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US20110094790A1 (en) * 2009-10-27 2011-04-28 Advanced Flexible Circuits Co., Ltd. Flexible flat circuit cable with gapped section
CN103152980A (en) * 2013-03-23 2013-06-12 广州安费诺诚信软性电路有限公司 Bookend type hard-soft combined circuit board and manufacturing method thereof
CN103545028A (en) * 2012-07-11 2014-01-29 易鼎股份有限公司 Differential mode signal transmission module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144534A (en) * 1990-02-05 1992-09-01 Horst Kober Method for manufacturing rigid-flexible circuit boards and products thereof
EP0693866A1 (en) * 1994-07-21 1996-01-24 The Whitaker Corporation Flexible printed circuit harness device and flexible circuit used thereof
JP2004088020A (en) * 2002-08-29 2004-03-18 Toshiba Corp Electronic equipment provided with flexible printed circuit board and the substrate
JP2005150660A (en) * 2003-11-20 2005-06-09 Nikon Corp Both-side flexible wiring plate
JP2006324406A (en) * 2005-05-18 2006-11-30 Sharp Corp Flexible/rigid multilayer printed circuit board
JP2007123743A (en) * 2005-10-31 2007-05-17 Sony Corp Flex-rigid board, optical transmission/reception module and optical transmission/reception device
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107801295A (en) * 2017-10-16 2018-03-13 广东欧珀移动通信有限公司 Flexible PCB and mobile terminal
CN113690649A (en) * 2021-08-25 2021-11-23 锐捷网络股份有限公司 Connector assembly
CN114630489A (en) * 2022-03-22 2022-06-14 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment
CN114630489B (en) * 2022-03-22 2024-01-26 广东湾区智能终端工业设计研究院有限公司 Flexible circuit board, folding assembly and electronic equipment

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Application publication date: 20160511