CN201682694U - High-frequency circuit board - Google Patents
High-frequency circuit board Download PDFInfo
- Publication number
- CN201682694U CN201682694U CN2010201399942U CN201020139994U CN201682694U CN 201682694 U CN201682694 U CN 201682694U CN 2010201399942 U CN2010201399942 U CN 2010201399942U CN 201020139994 U CN201020139994 U CN 201020139994U CN 201682694 U CN201682694 U CN 201682694U
- Authority
- CN
- China
- Prior art keywords
- frequency
- circuit board
- hollow groove
- frequency circuit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a high-frequency circuit board, which comprises a base plate, wherein a hollow groove is arranged on the base plate, and high-frequency materials are filled in the hollow groove. The high-frequency circuit board provided by the utility model is provided with the hollow groove in the base plate, and at the same time, the high-frequency materials with good high-frequency propagating performance can be filled into the hollow groove, so the signal propagating loss can be controlled through the filled high-frequency materials, the cost is low, and the practicability is strong.
Description
Technical field
The utility model relates to circuit board manufacturing technology field, more particularly, relates to a kind of high-frequency circuit board.
Background technology
Along with the direction of electronic product to miniaturization, digitlization, high frequencyization develops gradually, the application of high-frequency circuit also more and more widely.At present, the high-frequency circuit board that is applied to high-frequency circuit is to adopt the material with good high frequency electrical performance to make mostly, as polytetrafluoroethylene etc.Though these circuit boards are made by the material with high frequency electrical performance, its propagation for the control high-frequency signal still has limitation.
The utility model content
Technical problem to be solved in the utility model be to provide a kind of cost low, be easy to make and prodigiosin is effectively controlled the high-frequency circuit board that high-frequency signal is propagated.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of high-frequency circuit board is provided, comprises a substrate, be provided with hollow groove in the described substrate, be full of high frequency material in the described hollow groove.
Further, described high frequency material is solid-state packed layer.
Perhaps, described high frequency material is Powdered packed layer.
Particularly, described high frequency material is a polytetrafluoroethylene.
The high-frequency circuit board that the utility model provides is provided with hollow groove in substrate, simultaneously the well behaved high frequency material of high-frequency propagation is filled into hollow groove, the loss that comes control signal to propagate by the high frequency material of filling like this, and cost is low, and is practical.
Description of drawings
Fig. 1 is the cross-sectional schematic of the high-frequency circuit board that provides of the utility model.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Please refer to Fig. 1, the cross-sectional schematic of the high-frequency circuit board that provides for the utility model.
Described high-frequency circuit board comprises a substrate 1 and is covered in the top plate 2 and the lower plywood 3 of substrate 1 upper surface and lower surface that described substrate 1 is provided with hollow groove 11, is full of high frequency material 4 in the described hollow groove 11.Described high frequency material 4 can be solid-state packed layer and also can be pulverous packed layer, high frequency material described in the present embodiment is polytetrafluoroethylene (Teflon), it has good high frequency characteristics, certainly resin or the polymer that also can select to have different high frequency characteristicses according to the needs of actual signal frequencies of propagation.
In the present embodiment, the top plate 2 that is covered in substrate 1 upper surface also is polytetrafluoroethylene floor, though polytetrafluoroethylene has good high frequency electrical performance, also is the lower material of a kind of hardness simultaneously.The lower plywood 3 that is covered in substrate 1 lower surface is generally the material layer of the FR-4 grade with high frequency performance.When top plate 2, when substrate 1 and lower plywood 3 pass through the anchor clamps pressing, between top plate 2 and substrate 1, place some semi-solid preparation PP (prepreg) sheet, and on the semi-solid preparation PP of hollow groove 11 correspondences sheet, be provided with another chamber groove that is full of high frequency material 4, after the anchor clamps pressing, semi-solid preparation PP sheet gummosis, moulding is bonded between top plate 2 and the substrate 1, high frequency material 4 is pressed in the hollow groove 11, filling effect by high frequency material 4, when pressing, avoid hollow groove 11 effect of being stressed and produced the defective that groove face caves in, be filled in the high frequency material 4 in the hollow groove 11 simultaneously because high frequency performance is good, the effectively loss of control signal frequencies of propagation, thus guaranteed that signal is stable in hollow groove 11, propagate reliably.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1. a high-frequency circuit board comprises a substrate, it is characterized in that: be provided with hollow groove in the described substrate, be full of high frequency material in the described hollow groove.
2. a kind of high-frequency circuit board as claimed in claim 1 is characterized in that: described high frequency material is solid-state packed layer.
3. a kind of high-frequency circuit board as claimed in claim 1 is characterized in that: described high frequency material is Powdered packed layer.
4. as claim 2 or 3 described a kind of high-frequency circuit boards, it is characterized in that: described high frequency material is a polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201399942U CN201682694U (en) | 2010-03-22 | 2010-03-22 | High-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201399942U CN201682694U (en) | 2010-03-22 | 2010-03-22 | High-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201682694U true CN201682694U (en) | 2010-12-22 |
Family
ID=43347725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201399942U Expired - Lifetime CN201682694U (en) | 2010-03-22 | 2010-03-22 | High-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201682694U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015154242A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
-
2010
- 2010-03-22 CN CN2010201399942U patent/CN201682694U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015154242A1 (en) * | 2014-04-09 | 2015-10-15 | 魏晓敏 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101222 |