WO2015154242A1

WO2015154242A1 - Printed circuit board

Info

Publication number: WO2015154242A1
Application number: PCT/CN2014/074957
Authority: WO
Inventors: 魏晓敏
Original assignee: 魏晓敏
Priority date: 2014-04-09
Filing date: 2014-04-09
Publication date: 2015-10-15
Also published as: CN204069491U

Abstract

A printed circuit board (PCB), comprising: a core board (1) and copper clad boards (3) adhered by means of colloids (2) to the upper and lower surfaces of the core board. The core board (1) comprises: a substrate (11) and copper foils (12) formed on the substrate. The core board (1) is provided with a slot (13) that penetrates the core board. Provided at the edge of the slot on the core board are stoppers (14) formed on the copper foils. The slot is filled with polytetrafluoroethylene (15). Filling the slot provided on the core board with polytetrafluoroethylene enables the control of the signal quality of high-frequency PCB and enhances the transmission quality of high-frequency signals in a PCB.

Description

Printed circuit board

[0001] The present application relates to the field of circuits, and in particular, to a printed circuit board.

Background technique

[0002] With the development of electronic products in the direction of miniaturization, digitization, and high frequency, the application of high frequency circuits has become more widespread. At present, high-frequency printed circuit boards used in high-frequency circuits often have hollow slots for high-frequency signal transmission and high-speed logic signal transmission in the circuit board. However, the signal quality of the high frequency printed circuit board cannot be improved because the hollow slot causes a high signal loss.

Summary of the invention

The present application aims to solve at least one of the above technical problems at least to some extent.

[0004] The present application provides a printed wiring board, comprising: a core board and a copper clad board attached to a lower surface of the core board by a glue, the core board comprising: a substrate and a copper foil formed on the substrate, The core plate is provided with a through groove penetrating the core plate, and the core plate is provided at the edge of the through groove with a stopper formed on the copper foil, and the through groove is filled with polytetrafluoroethylene.

[0005] Further, the through groove is filled with powdered or solid polytetrafluoroethylene.

The beneficial effects of the present application are:

By providing a printed circuit board, comprising: a core board and a copper clad board attached to the lower surface of the core board by a glue, the core board comprising: a substrate and a copper foil formed on the substrate, the core board being opened a through groove penetrating the core plate, wherein the core plate is provided with a stopper formed on the copper foil at an edge of the through groove, and the through groove is filled with polytetrafluoroethylene. In this way, the through grooves formed in the core board are filled with polytetrafluoroethylene, thereby controlling the signal quality of the high frequency printed wiring board and improving the transmission quality of the high frequency signal in the printed wiring board.

DRAWINGS

1 is a schematic structural view of a printed wiring board according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative, and are not to be construed as limiting.

[0009] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "previous"","after","left","right","vertical","horizontal","top","bottom" The orientation or positional relationship of "inside", "outside", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, for convenience of description of the present application and simplified description, rather than indication It is to be understood that the device or elements referred to have a particular orientation, are constructed and operated in a particular orientation and are therefore not to be construed as limiting.

In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first", "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless specifically defined otherwise.

[0011] In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be, for example, a fixed connection or a Removable connection, or integral connection; can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, which can be the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

[0012] In the present application, the first feature is "on" or "on" the second feature, unless otherwise explicitly stated and defined.

"Bottom" may include direct contact of the first and second features, and may also include that the first and second features are not in direct contact but are contacted by additional features therebetween. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is less than the second feature.

[0013] The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1, the present application provides a printed wiring board comprising: a core board 1 and a copper clad board 3 attached to the upper and lower surfaces of the core board 1 via a colloid 2. The core board 1 includes: a substrate 11 and a copper foil 12 formed on the substrate 11. The core plate 1 is provided with a through groove 13 penetrating the core plate 1. A stopper 14 formed on the copper foil 12 is disposed on the core plate 1 at the edge of the through groove 13. The through groove 13 is filled with polytetrafluoroethylene 15. The through groove 13 is filled with a powdery or solid polytetrafluoroethylene 15.

[0015] Thus, the through grooves formed in the core board are filled with polytetrafluoroethylene, so that the signal quality of the high frequency printed wiring board can be controlled, and the transmission quality of the high frequency signal in the printed wiring board can be improved. In addition, since the stopper 14 can be made of copper and electroformed on the copper foil, the flow of the colloid 2 can be blocked, and the flow of the colloid 2 into the through groove 13 can be prevented from affecting the signal quality.

[0016] In the description of the present specification, the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" are referred to. The descriptions of the equivalents, such as the specific features, structures, materials or features described in connection with the embodiments or examples, are included in at least one embodiment or example of the present application. In this In the specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0017] The above is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For those skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

claims

1. A printed circuit board, characterized in that it includes: a core board and a copper-clad board attached to the upper and lower surfaces of the core board through colloid, the core board includes: a substrate and a copper foil formed on the substrate, The core board is provided with a through groove penetrating the core board. The core board is provided with a stopper formed on the copper foil at the edge of the through groove. The through groove is filled with polytetrafluoroethylene.

2. The printed circuit board of claim 1, wherein the through groove is filled with powdered or solid polytetrafluoroethylene.