CN203859939U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN203859939U CN203859939U CN201490000030.6U CN201490000030U CN203859939U CN 203859939 U CN203859939 U CN 203859939U CN 201490000030 U CN201490000030 U CN 201490000030U CN 203859939 U CN203859939 U CN 203859939U
- Authority
- CN
- China
- Prior art keywords
- metal screw
- film resistor
- application
- conductive layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a printed circuit board. A thin-film resistor can be embedded in a groove body of a base plate by adopting an adhesion board, so that the thin-film resistor of a part cut from a whole plate is applied to the printed circuit board, and the whole thin-film resistor material is unnecessary to be embedded in the printed circuit board, as a result, the thin-film resistor material is saved, in addition, owing to the arrangement of an electrical connection structure, the electric connection of the thin-film resistor on the adhesion board is achieved.
Description
Technical field
The application relates to circuit field, relates in particular to a kind of printed substrate.
Background technology
Printed substrate is the supporter of electronic devices and components.Electronic product, constantly towards light, thin, little future development, makes the application of the film resistor that volume is little more and more extensive now.
Because being generally imbeds whole film resistor material in circuit board, and can not respectively part film resistor material be imbedded, and application time only can be used the part of film resistor material, causes the waste of film resistor material.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
The application provides a kind of printed substrate, comprise: substrate and lamina affixad, on described substrate, offer cell body, this cell body surface is covered with the first conductive layer, on described lamina affixad, be provided with the second conductive layer and be mounted on the film resistor on this lamina affixad, the electrode of this film resistor is electrically connected to described the second conductive layer, on described substrate, offer the first metal screw being electrically connected to described the first conductive layer, on described lamina affixad, offer the second metal screw being electrically connected to described the second conductive layer, described the first metal screw fixes by metal screw and described the second metal screw.
Further, the quantity of described the first metal screw, the second metal screw and metal screw all matches with the number of electrodes of described film resistor.
Further, described the first metal screw, the second metal screw and metal screw all adopt copper material.
The application's beneficial effect is:
By a kind of printed substrate is provided, adopt lamina affixad film resistor can be imbedded in the cell body of substrate, thereby can realize in whole plate and cut gained part film resistor in the application of printed substrate, and imbed printed substrate without whole film resistor material, saved film resistor material, in addition, by electric connection structure, arrange, realize the electrical connection of lamina affixad upper film resistance.
Accompanying drawing explanation
Fig. 1 is that the printed substrate of the embodiment of the present application assembles the structural representation before metal screw.
Fig. 2 is that the printed substrate of the embodiment of the present application assembles the structural representation after metal screw.
Embodiment
The embodiment of DETAILED DESCRIPTION The present application below, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, be intended to for explaining the application, and can not be interpreted as the restriction to the application.
In the application's description, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of indications such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as the restriction to the application.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In the application's description, the implication of " a plurality of " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be above-mentioned term concrete meaning in this application.
In this application, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but contact by the other feature between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is less than Second Characteristic.
Below by embodiment, by reference to the accompanying drawings the application is described in further detail.
Please refer to Fig. 1-2, the present embodiment provides a kind of printed substrate, comprise: substrate 1 and lamina affixad 2, on substrate 1, offer cell body 11, these cell body 11 surfaces are covered with the first conductive layer 12, on lamina affixad 2, be provided with the second conductive layer 21 and be mounted on the film resistor 3 on this lamina affixad 2, the electrode of this film resistor 3 is electrically connected to the second conductive layer 21, on substrate 1, offer the first metal screw 121 being electrically connected to the first conductive layer 12, on lamina affixad 2, offer the second metal screw 211 being electrically connected to the second conductive layer 21, the first metal screw 121 fixes by metal screw 4 and the second metal screw 211.The quantity of the first metal screw 121, the second metal screw 211 and metal screw 4 all matches with the number of electrodes of film resistor 3.The first metal screw 121, the second metal screw 211 and metal screw 4 all adopt copper material.
Like this, adopt lamina affixad film resistor can be imbedded in the cell body of substrate, thereby can realize in whole plate and cut gained part film resistor in the application of printed substrate, and imbed printed substrate without whole film resistor material, saved film resistor material, in addition, by electric connection structure, arrange, realize the electrical connection of lamina affixad upper film resistance.
In the description of this specification, the description of reference term " execution mode ", " some execution modes ", " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment or example of the application in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
Above content is the further description of the application being done in conjunction with concrete execution mode, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.
Claims (3)
1. a printed substrate, it is characterized in that, comprise: substrate and lamina affixad, on described substrate, offer cell body, this cell body surface is covered with the first conductive layer, on described lamina affixad, be provided with the second conductive layer and be mounted on the film resistor on this lamina affixad, the electrode of this film resistor is electrically connected to described the second conductive layer, on described substrate, offer the first metal screw being electrically connected to described the first conductive layer, on described lamina affixad, offer the second metal screw being electrically connected to described the second conductive layer, described the first metal screw fixes by metal screw and described the second metal screw.
2. printed substrate as claimed in claim 1, is characterized in that, the quantity of described the first metal screw, the second metal screw and metal screw all matches with the number of electrodes of described film resistor.
3. printed substrate as claimed in claim 1, is characterized in that, described the first metal screw, the second metal screw and metal screw all adopt copper material.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/074844 WO2015149369A1 (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203859939U true CN203859939U (en) | 2014-10-01 |
Family
ID=51609782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000030.6U Expired - Fee Related CN203859939U (en) | 2014-04-04 | 2014-04-04 | Printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203859939U (en) |
| WO (1) | WO2015149369A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI303542B (en) * | 2006-03-21 | 2008-11-21 | Ind Tech Res Inst | Film resistor embedded in a multiple-layer circuit board and manufacturing thereof |
| CN101853840B (en) * | 2009-04-01 | 2012-10-31 | 日月光半导体制造股份有限公司 | Structure of embedded line substrate and manufacturing method thereof |
| CN201733517U (en) * | 2010-06-18 | 2011-02-02 | 深南电路有限公司 | Circuit board |
| CN202111940U (en) * | 2011-07-15 | 2012-01-11 | 深圳市星之光实业有限公司 | Embedded type component circuit board |
| CN103188882B (en) * | 2011-12-31 | 2015-12-16 | 深南电路有限公司 | A kind of circuit board and preparation method thereof |
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
-
2014
- 2014-04-04 WO PCT/CN2014/074844 patent/WO2015149369A1/en active Application Filing
- 2014-04-04 CN CN201490000030.6U patent/CN203859939U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015149369A1 (en) * | 2014-04-04 | 2015-10-08 | 魏晓敏 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015149369A1 (en) | 2015-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141001 Termination date: 20160404 |