CN207083283U - A kind of FPC plates of low-loss high flexibility high-frequency transmission - Google Patents
A kind of FPC plates of low-loss high flexibility high-frequency transmission Download PDFInfo
- Publication number
- CN207083283U CN207083283U CN201720196948.8U CN201720196948U CN207083283U CN 207083283 U CN207083283 U CN 207083283U CN 201720196948 U CN201720196948 U CN 201720196948U CN 207083283 U CN207083283 U CN 207083283U
- Authority
- CN
- China
- Prior art keywords
- layer
- transmission
- loss
- fpc plates
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of FPC plates of low-loss high flexibility high-frequency transmission, including FPC plate bodies, the FPC plates body cross-section structure includes the first solder mask successively from top to bottom, first screen layer, first medium layer, tack coat, transmission line layer, second dielectric layer, secondary shielding layer, second solder mask, the first medium layer and second dielectric layer are made by polytetrafluoroethylene (PTFE) or liquid crystal polymer, the transmission line layer is made using smooth copper foil, the transmission line layer includes the multiple short signal wires set on central axis, the transmission region symmetrical along signal wire, spacing is provided between signal wire and between signal wire and transmission region.The FPC plates of the low-loss high flexibility high-frequency transmission do dielectric layer using polytetrafluoroethylene (PTFE) or liquid crystal polymer, meanwhile, loss is further reduced using short transmission line, is made under 10GHz high frequency, transmission signal is complete, and loss is less than 2DB.
Description
Technical field
A kind of flexible circuit board design technical field is the utility model is related to, specially a kind of low-loss high flexibility height is kept pouring in
Defeated FPC plates.
Background technology
With the miniaturization, digitlization, Highgrade integration of electronic product, and high frequency, the high speed of its signal transmission
The development of change, signal integrity is just becoming important all the more, for printed circuit board, signal transmission characteristic frequency GHz with
When upper, it is no longer only simple " support plate of support component ", and is more counted as electricity Jie of " transmission electric signal carrier "
Plastid, to reach the characteristic requirements of " signal transmssion line ", not only by wire characteristic (such as conductor width, precision and conductor thickness)
Control, it is more important also relevant with substrate medium characteristic, therefore, high-frequency high-speed development to the material and design of printed board
Manufacture proposes higher requirement.
The material of current flex plate is based on polyimide base material, but polyimide base material water absorption rate is big, dielectric constant and
Dielectric loss factor is relatively also larger, and product of the working frequency more than 10GHz is had a great influence, thus, work out and both meet height
Frequency demand meet again the high frequency flexible material of high flexibility requirement be significantly, it is and very important.
Utility model content
The purpose of this utility model is to provide a kind of FPC plates of low-loss high flexibility high-frequency transmission, low-loss Gao Rou
Property high-frequency transmission FPC plates dielectric layer is done using polytetrafluoroethylene (PTFE) or liquid crystal polymer, meanwhile, it is further using short transmission line
Loss is reduced, is made under 10GHz high frequency, transmission signal is complete, and loss is less than 2DB.
To achieve the above object, the utility model provides following technical scheme：A kind of low-loss high flexibility high-frequency transmission
FPC plates, including FPC plate bodies, the FPC plates body cross-section structure include the first solder mask, the first screen successively from top to bottom
Cover layer, first medium layer, tack coat, transmission line layer, second dielectric layer, secondary shielding layer, the second solder mask, the first medium
Layer and second dielectric layer be made by polytetrafluoroethylene (PTFE) or liquid crystal polymer, the transmission line layer using smooth copper foil make and
Multiple short signal wires for including setting on central axis into, the transmission line layer, along the symmetrical transmission region of signal wire, letter
Spacing is provided between number line and between signal wire and transmission region.
Preferably, first solder mask is formed with the second solder mask by flexible bend-resistance printing ink to manufacture, first screen
Cover layer and secondary shielding layer pressure is prolonged by copper foil and form, the tack coat is made by low-k resin material.
Favourable, penetrating via is formed between the first screen layer and secondary shielding layer, the via extends through
Transmission region.
Suitably, some pads are provided with first solder mask, electronic device is welded with the pad.
Preferably, the second solder mask lower surface increases with being provided with strengthening course on the electronic device correspondence position
The operability of FPC plates, and do not influence integrated level.
Preferably, the FPC plates include bending region and non-bending region, the pad avoid the bending region.
Preferably, the thickness design of the first medium layer, the thickness of tack coat and second dielectric layer ensures signal transmission
Dielectric loss it is symmetrical.
Compared with prior art, the beneficial effects of the utility model are：
(1) in all resin materials, the dielectric constant and dielectric loss angle tangent of polytetrafluoroethylene (PTFE) are minimum, most suitable
High frequency substrate material is done in conjunction, and the dielectric loss factor of liquid crystal polymer is close with the dielectric loss factor of polytetrafluoroethylene (PTFE), also fits
High frequency substrate material is done in conjunction, and the utility model does dielectric layer using polytetrafluoroethylene (PTFE) or liquid crystal polymer, reduces high-frequency biography
Loss under defeated.
(2) transmission signal is influenceed except the property by baseplate material, is also influenceed by conductor nature, sharp in the utility model
Transmission line layer is made with smooth copper foil, reduces conductor losses.Meanwhile conductor losses is directly proportional to conductor lines length, conductor lines are longer,
Conductor losses is higher, therefore, signal is transmitted using the short signal wire of multistage in the utility model, reduces conductor losses.
Brief description of the drawings
Fig. 1 is cross-sectional view of the present utility model；
In figure：The solder masks of 1- first, 2- first screen layers, 2-1- vias, 3- first medium layers, 4- tack coats, 5- transmission
Line layer, 5-1- signal wires, 5-2- transmission regions, 5-3- spacing, 6- second dielectric layer, 7- secondary shielding layers, the welding resistances of 8- second
Layer, 9- electronic devices, 10- strengthening courses, 11- pads.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, the utility model provides a kind of technical scheme：A kind of FPC plates of low-loss high flexibility high-frequency transmission,
Including FPC plate bodies, the FPC plates body cross-section structure from top to bottom successively include the first solder mask 1, first screen layer 2,
First medium layer 3, tack coat 4, transmission line layer 5, second dielectric layer 6, secondary shielding layer 7, the second solder mask 8, described first is situated between
Matter layer 3 and second dielectric layer 6 are made by polytetrafluoroethylene (PTFE) or liquid crystal polymer, and the transmission line layer 5 uses smooth copper foil
It is made, the transmission line layer 5 includes the multiple short signal wire 5-1, symmetrical along signal wire 5-1 set on central axis
Transmission region 5-2, be provided with spacing 5-3 between signal wire 5-1 and between signal wire 5-1 and transmission region 5-2.
In the present embodiment, first solder mask 1 is formed with the second solder mask 8 by flexible bend-resistance printing ink to manufacture, institute
State first screen layer 2 and secondary shielding layer 7 is prolonged pressure by copper foil and formed, the tack coat 4 is made by low-k resin material
Form.
In the present embodiment, penetrating via 2-1 is formed between the first screen layer 2 and secondary shielding layer 7, it is described
Via 2-1 extends through transmission region 5-2.
In the present embodiment, some pads 11 are provided with first solder mask 1, electronics is welded with the pad 11
Device 9.
In the present embodiment, the lower surface of the second solder mask 8 on the correspondence position of electronic device 9 with being provided with reinforcement
Layer 10, increases the operability of FPC plates, and does not influence integrated level.
In the present embodiment, the FPC plates include bending region and non-bending region, the pad 11 avoid the bending
Region.
In the present embodiment, the first medium layer 3, the thickness of tack coat 4 and the thickness design of second dielectric layer 6 ensure
The dielectric loss of signal transmission is symmetrical, and the thickness of the first medium layer 3 is 20um, and the thickness of tack coat 4 is 11um, and described the
The thickness of second medium layer 6 is 31um.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of FPC plates of low-loss high flexibility high-frequency transmission, including FPC plate bodies, the FPC plates body cross-section structure is certainly
Include the first solder mask (1), first screen layer (2), first medium layer (3), tack coat (4), transmission line layer under above successively
(5), second dielectric layer (6), secondary shielding layer (7), the second solder mask (8), it is characterised in that the first medium layer (3) and
Second dielectric layer (6) is made by polytetrafluoroethylene (PTFE) or liquid crystal polymer, and the transmission line layer (5) is made using smooth copper foil
Form, the transmission line layer (5) include central axis on set multiple short signal wires (5-1), along signal wire (5-1) symmetrically point
The transmission region (5-2) of cloth, spacing is provided between signal wire (5-1) and between signal wire (5-1) and transmission region (5-2)
(5-3), first solder mask (1) are formed with the second solder mask (8) by flexible bend-resistance printing ink to manufacture, the first screen layer
(2) pressure is prolonged by copper foil and formed with secondary shielding layer (7), the tack coat (4) is made by low-k resin material, institute
State and some pads (11) are provided with the first solder mask (1), electronic device (9) is welded with the pad (11).
2. the FPC plates of a kind of low-loss high flexibility high-frequency transmission according to claim 1, it is characterised in that described first
Penetrating via (2-1) is formed between screen layer (2) and secondary shielding layer (7), the via (2-1) extends through transmission region
(5-2)。
3. the FPC plates of a kind of low-loss high flexibility high-frequency transmission according to claim 1, it is characterised in that described second
Solder mask (8) lower surface is with being provided with strengthening course (10) on the electronic device (9) correspondence position.
A kind of 4. FPC plates of low-loss high flexibility high-frequency transmission according to claim 1, it is characterised in that the FPC plates
The bending region is avoided including bending region and non-bending region, the pad (11).
5. the FPC plates of a kind of low-loss high flexibility high-frequency transmission according to claim 1, it is characterised in that described first
Dielectric layer (3), the thickness of tack coat (4) and the thickness design of second dielectric layer (6) ensure that the dielectric loss of signal transmission is symmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720196948.8U CN207083283U (en) | 2017-03-02 | 2017-03-02 | A kind of FPC plates of low-loss high flexibility high-frequency transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720196948.8U CN207083283U (en) | 2017-03-02 | 2017-03-02 | A kind of FPC plates of low-loss high flexibility high-frequency transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207083283U true CN207083283U (en) | 2018-03-09 |
Family
ID=61435854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720196948.8U Expired - Fee Related CN207083283U (en) | 2017-03-02 | 2017-03-02 | A kind of FPC plates of low-loss high flexibility high-frequency transmission |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207083283U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050466A (en) * | 2019-12-31 | 2020-04-21 | 安捷利（番禺）电子实业有限公司 | PCB with low insertion loss and high peeling strength and manufacturing method thereof |
| CN111883923A (en) * | 2020-07-29 | 2020-11-03 | 安捷利电子科技（苏州）有限公司 | Flexible radio frequency transmission antenna and electronic equipment |
| CN112730480A (en) * | 2020-12-25 | 2021-04-30 | 北京航星机器制造有限公司 | CT detection device based on capacitive coupling type antenna and antenna manufacturing method |
| CN113540730A (en) * | 2020-04-17 | 2021-10-22 | 江苏嘉华通讯科技有限公司 | Flexible light and thin multi-channel transmission line |
| US11549035B2 (en) | 2020-12-16 | 2023-01-10 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
| US11596064B2 (en) | 2020-07-28 | 2023-02-28 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
-
2017
- 2017-03-02 CN CN201720196948.8U patent/CN207083283U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050466A (en) * | 2019-12-31 | 2020-04-21 | 安捷利（番禺）电子实业有限公司 | PCB with low insertion loss and high peeling strength and manufacturing method thereof |
| CN113540730A (en) * | 2020-04-17 | 2021-10-22 | 江苏嘉华通讯科技有限公司 | Flexible light and thin multi-channel transmission line |
| US11596064B2 (en) | 2020-07-28 | 2023-02-28 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
| US11805600B2 (en) | 2020-07-28 | 2023-10-31 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
| CN111883923A (en) * | 2020-07-29 | 2020-11-03 | 安捷利电子科技（苏州）有限公司 | Flexible radio frequency transmission antenna and electronic equipment |
| US11549035B2 (en) | 2020-12-16 | 2023-01-10 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
| US12049577B2 (en) | 2020-12-16 | 2024-07-30 | Versiv Composites Limited | Dielectric substrate and method of forming the same |
| CN112730480A (en) * | 2020-12-25 | 2021-04-30 | 北京航星机器制造有限公司 | CT detection device based on capacitive coupling type antenna and antenna manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207083283U (en) | A kind of FPC plates of low-loss high flexibility high-frequency transmission | |
| JP4825830B2 (en) | Flexible printed circuit board with metal reinforcement | |
| CN206525017U (en) | Adhesive-spill-preventing circuit board | |
| US9648753B2 (en) | Flexible printed circuit board and method for manufacturing same | |
| CN107846779A (en) | Preparation method, flexible PCB and the mobile terminal of flexible PCB | |
| CN111849250A (en) | Conductive ink and electronic device | |
| CN208158981U (en) | Heavy copper circuit board | |
| JP2011023547A (en) | Circuit board | |
| CN105848409A (en) | FPC with low-loss high-flexibility high-frequency transmission | |
| CN102480838A (en) | Printed circuit board with composite through holes | |
| CN207491321U (en) | A kind of high frequency printed circuit boards of dielectric glass fibre cloth | |
| CN207625864U (en) | FPC plates | |
| CN206181556U (en) | Electronic device | |
| CN207744231U (en) | Circuit board | |
| CN206118158U (en) | Single flexible circuit board | |
| JP2016162935A (en) | Method of manufacturing wiring board and wiring board | |
| CN108901123A (en) | A kind of circuit board and electronic equipment | |
| CN207911124U (en) | A kind of flexible printed circuit board | |
| KR20140123434A (en) | Digitizer and Method for manufacturing digitizer | |
| US10869389B2 (en) | Printed circuit board and method for producing the same | |
| CN211063852U (en) | Laminated structure of flexible circuit board | |
| CN207340283U (en) | High-frequency multilayer printed wiring board is used in one kind communication | |
| CN110312364A (en) | It is a kind of to bury resistance technique and resistance pcb board is buried using technique production | |
| CN207897217U (en) | A kind of high reliability carbon ink wiring board | |
| CN205622979U (en) | FPC board of low -loss high flexibility high frequency transmission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180309 Termination date: 20200302 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |