CN204833297U - Fingerprint identification module - Google Patents
Fingerprint identification module Download PDFInfo
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- CN204833297U CN204833297U CN201520452151.0U CN201520452151U CN204833297U CN 204833297 U CN204833297 U CN 204833297U CN 201520452151 U CN201520452151 U CN 201520452151U CN 204833297 U CN204833297 U CN 204833297U
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- circuit board
- fingerprint recognition
- metal frame
- recognition module
- opening
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Abstract
The utility model provides a fingerprint identification module, include: circuit board, fingerprint identification chip and metal framework, the fingerprint identification chip be arranged in the metal framework and with circuit board electricity is connected, the bottom of metal framework has the contact surface of laminating mutually with the circuit board, on the circuit board with the corresponding subregion of contact surface is equipped with the mucigel in order pasting the metal framework on the circuit board, the circuit board with the corresponding surplus region of contact surface is equipped with the conducting layer so that the metal framework is connected with circuit board electricity. This fingerprint identification module, the regional setting mucigel and the conducting layer that contact with the metal framework on the circuit board not only can be difficult for firm the fixing on the circuit board of metal framework to come off, have good electric conductive property in addition.
Description
Technical field
The utility model belongs to fingerprint recognition field, particularly relates to a kind of fingerprint recognition module.
Background technology
In existing fingerprint recognition module, becket is a crucial driver part of fingerprint recognition module, and when finger touches fingerprint recognition chip surface and becket could form a closed-loop path simultaneously, the recognition function of fingerprint recognition module could start.If becket electric conductivity is bad or come off and all directly can cause the disabler of fingerprint recognition module.Current fingerprint recognition module majority adopt tin cream by fixing for becket on a printed circuit, but adopt tin cream welding electric conductivity not good, and fixed effect between becket and printed circuit board (PCB) is also not ideal enough, easily comes off.
Utility model content
The utility model, for one of solving the problems of the technologies described above, provides a kind of fingerprint recognition module, and in this fingerprint recognition module, between metal frame and circuit board, electric conductivity is excellent, and good fixing effect, difficult drop-off.
The utility model provides a kind of fingerprint recognition module, comprising: circuit board, fingerprint recognition chip and metal frame; Described fingerprint recognition chip is arranged in metal frame and is electrically connected with described circuit board; The bottom of described metal frame has the surface of contact fitted with circuit board, subregion corresponding with described surface of contact on described circuit board is provided with mucigel metal frame to be pasted on circuit boards, and the circuit board remaining area corresponding with described surface of contact is provided with conductive layer and is electrically connected with circuit board to make metal frame.
Preferably, described mucigel is epoxy resin.
Preferably, described conductive layer is elargol.
Preferably, described metal frame is square, and described surface of contact comprises first side, the second side be connected with first side and four side, three side relative with first side.
Preferably, region corresponding with first side, second side and four side on described circuit board is provided with mucigel, and region corresponding with the 3rd side on described circuit board is provided with conductive layer.
Preferably, described metal frame comprises near the first opening of circuit board and the second opening away from circuit board.
Preferably, the size of described first opening and the second opening and fingerprint recognition chip adapt.
Preferably, size and the fingerprint recognition chip of described first opening adapt, and the size of described second opening is less than described fingerprint recognition chip.
The fingerprint recognition module that the utility model provides, the region contacted with metal frame on circuit boards arranges mucigel and conductive layer, not only metal frame firmly can be fixed on circuit boards, difficult drop-off, and have excellent electric conductivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fingerprint recognition module that the utility model provides;
Fig. 2 is the circuit board vertical view of the fingerprint recognition module that the utility model provides.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
As shown in Figure 1 and Figure 2, the utility model provides a kind of fingerprint recognition module, comprising: circuit board 1; Fingerprint recognition chip 2, described fingerprint recognition chip 2 is arranged in metal frame 3 and is electrically connected with described circuit board 1; Metal frame 3, the bottom of described metal frame 3 has the surface of contact fitted with circuit board 1, on described circuit board 1, the subregion corresponding with described surface of contact is provided with mucigel 11 to paste on the circuit card 1 by metal frame 3, and circuit board 1 remaining area corresponding with described surface of contact is provided with conductive layer 12 and is electrically connected with circuit board 1 to make metal frame 3.
By finding out above, the fingerprint recognition module that the utility model provides, the region contacted with metal frame 2 on the circuit card 1 arranges mucigel 11 and conductive layer 12, not only metal frame 3 firmly can be fixed on the circuit card 1, difficult drop-off, and there is excellent electric conductivity.
In an embodiment of the present utility model, described circuit board 1 is flexible PCB (FPC), and the mucigel 11 on circuit board 1 is epoxy resin, and epoxy resin has good bounding force, metal frame 3 firmly can be fixed on the circuit card 1; Described conductive layer 12 is elargol, and elargol has excellent electric conductivity, is conducive to the signal transmission between metal frame 3 and circuit board 1.
Described metal frame 3 is square, and described surface of contact comprises first side 31, the second side 32 be connected with first side 31 and four side 34, three side 33 relative with first side 31.The region that circuit board 1 is affixed with surface of contact four sides arranges mucigel 11 and conductive layer 12, general, at least arranges mucigel 11 in the region that two sides are corresponding, does not come off on the circuit card 1 to ensure that metal frame 3 is fixing.Preferably, region corresponding with first side 31, second side 32 and four side 34 on the circuit card 1 arranges mucigel 11, and region corresponding with the 3rd side 33 on the circuit card 1 arranges conductive layer 12.
Described metal frame 3 comprises near the first opening 35 of circuit board 1 and the second opening 36 away from circuit board 1, size and the fingerprint recognition chip 2 of described first opening 35 and the second opening 36 adapt, and fingerprint recognition chip 2 is placed in metal frame 3 just.
In another embodiment of the present utility model, size and the fingerprint recognition chip 2 of described first opening 35 adapt, the size of described second opening 36 is less than described fingerprint recognition chip 2, design like this, because the second opening 36 is slightly less than fingerprint recognition chip 2, make metal frame 3 cover on fingerprint recognition chip 2 as a cover, line identification chip 2 is placed in wherein, strengthens the fixed effect of chip.
The fingerprint recognition module group assembling process that the utility model provides is as follows: weld on the circuit card 1 by fingerprint recognition chip 2, then epoxy resin and elargol is smeared successively with glue spreader on the circuit card 1, the region that epoxy resin covers on the circuit card 1 is the region of metal frame first side 31, second side 32 and four side 34 correspondence, and the region that elargol covers on the circuit card 1 is the region of metal frame the 3rd side 33 correspondence; Subsequently metal frame 3 is placed on the circuit card 1 by above-mentioned predetermined position, so, by epoxy resin, metal frame 3 is fixed on the circuit card 1, realize the signal transmission between metal frame 3 and circuit board 1 by elargol.
In sum, the fingerprint recognition module that the utility model provides, the region contacted with metal frame on circuit boards arranges mucigel and conductive layer, not only metal frame firmly can be fixed on circuit boards, difficult drop-off, and there is excellent electric conductivity.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.In addition, the different embodiment described in this instructions or example can carry out engaging and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.
Claims (8)
1. a fingerprint recognition module, is characterized in that, comprising: circuit board, fingerprint recognition chip and metal frame; Described fingerprint recognition chip is arranged in metal frame and is electrically connected with described circuit board; The bottom of described metal frame has the surface of contact fitted with circuit board, subregion corresponding with described surface of contact on described circuit board is provided with mucigel metal frame to be pasted on circuit boards, and the circuit board remaining area corresponding with described surface of contact is provided with conductive layer and is electrically connected with circuit board to make metal frame.
2. fingerprint recognition module as claimed in claim 1, it is characterized in that, described mucigel is epoxy resin.
3. fingerprint recognition module as claimed in claim 1, it is characterized in that, described conductive layer is elargol.
4. fingerprint recognition module as claimed in claim 1, it is characterized in that, described metal frame is square, and described surface of contact comprises first side, the second side be connected with first side and four side, three side relative with first side.
5. fingerprint recognition module as claimed in claim 4, it is characterized in that, region corresponding with first side, second side and four side on described circuit board is provided with mucigel, and region corresponding with the 3rd side on described circuit board is provided with conductive layer.
6. fingerprint recognition module as claimed in claim 1, is characterized in that, described metal frame comprises near the first opening of circuit board and the second opening away from circuit board.
7. fingerprint recognition module as claimed in claim 6, it is characterized in that, size and the fingerprint recognition chip of described first opening and the second opening adapt.
8. fingerprint recognition module as claimed in claim 6, it is characterized in that, size and the fingerprint recognition chip of described first opening adapt, and the size of described second opening is less than described fingerprint recognition chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520452151.0U CN204833297U (en) | 2015-06-29 | 2015-06-29 | Fingerprint identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520452151.0U CN204833297U (en) | 2015-06-29 | 2015-06-29 | Fingerprint identification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204833297U true CN204833297U (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520452151.0U Active CN204833297U (en) | 2015-06-29 | 2015-06-29 | Fingerprint identification module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204833297U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105893983A (en) * | 2016-05-03 | 2016-08-24 | 湖北三赢兴电子科技有限公司 | Fingerprint recognition module group |
| CN106855938A (en) * | 2015-12-08 | 2017-06-16 | 安徽昌硕光电子科技有限公司 | A kind of structure of fingerprint identification module |
| WO2018032880A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing input assembly, input assembly and terminal |
-
2015
- 2015-06-29 CN CN201520452151.0U patent/CN204833297U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106855938A (en) * | 2015-12-08 | 2017-06-16 | 安徽昌硕光电子科技有限公司 | A kind of structure of fingerprint identification module |
| CN105893983A (en) * | 2016-05-03 | 2016-08-24 | 湖北三赢兴电子科技有限公司 | Fingerprint recognition module group |
| WO2018032880A1 (en) * | 2016-08-16 | 2018-02-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing input assembly, input assembly and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191226 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |